JP2014011432A5 - - Google Patents

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Publication number
JP2014011432A5
JP2014011432A5 JP2012149414A JP2012149414A JP2014011432A5 JP 2014011432 A5 JP2014011432 A5 JP 2014011432A5 JP 2012149414 A JP2012149414 A JP 2012149414A JP 2012149414 A JP2012149414 A JP 2012149414A JP 2014011432 A5 JP2014011432 A5 JP 2014011432A5
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JP
Japan
Prior art keywords
substrate
polishing
holding surface
pressure chamber
contact portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2012149414A
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English (en)
Japanese (ja)
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JP5891127B2 (ja
JP2014011432A (ja
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Publication date
Application filed filed Critical
Priority to JP2012149414A priority Critical patent/JP5891127B2/ja
Priority claimed from JP2012149414A external-priority patent/JP5891127B2/ja
Priority to US13/932,062 priority patent/US9105516B2/en
Publication of JP2014011432A publication Critical patent/JP2014011432A/ja
Publication of JP2014011432A5 publication Critical patent/JP2014011432A5/ja
Application granted granted Critical
Publication of JP5891127B2 publication Critical patent/JP5891127B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012149414A 2012-07-03 2012-07-03 研磨装置および研磨方法 Active JP5891127B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012149414A JP5891127B2 (ja) 2012-07-03 2012-07-03 研磨装置および研磨方法
US13/932,062 US9105516B2 (en) 2012-07-03 2013-07-01 Polishing apparatus and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012149414A JP5891127B2 (ja) 2012-07-03 2012-07-03 研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2014011432A JP2014011432A (ja) 2014-01-20
JP2014011432A5 true JP2014011432A5 (enExample) 2015-10-08
JP5891127B2 JP5891127B2 (ja) 2016-03-22

Family

ID=50107815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012149414A Active JP5891127B2 (ja) 2012-07-03 2012-07-03 研磨装置および研磨方法

Country Status (1)

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JP (1) JP5891127B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6427131B2 (ja) 2016-03-18 2018-11-21 株式会社荏原製作所 研磨装置および研磨方法
JP2017185589A (ja) * 2016-04-06 2017-10-12 株式会社荏原製作所 基板処理装置
JP6990980B2 (ja) * 2017-03-31 2022-01-12 株式会社荏原製作所 基板処理装置
JP2021041485A (ja) 2019-09-10 2021-03-18 キオクシア株式会社 研磨装置
CN115847282A (zh) * 2022-12-05 2023-03-28 浙江晶盛机电股份有限公司 一种抛光设备的下片结构、抛光设备以及抛片下片方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3917384B2 (ja) * 2001-02-15 2007-05-23 大日本スクリーン製造株式会社 基板処理装置および基板洗浄装置
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法

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