JP2014006498A5 - - Google Patents
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- Publication number
- JP2014006498A5 JP2014006498A5 JP2013085450A JP2013085450A JP2014006498A5 JP 2014006498 A5 JP2014006498 A5 JP 2014006498A5 JP 2013085450 A JP2013085450 A JP 2013085450A JP 2013085450 A JP2013085450 A JP 2013085450A JP 2014006498 A5 JP2014006498 A5 JP 2014006498A5
- Authority
- JP
- Japan
- Prior art keywords
- test tube
- thermometer
- acid value
- tris
- butyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002253 acid Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N benzohydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-Benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- SEHSXHXBEYVCSI-UHFFFAOYSA-L 2,2-bis(2,2,6,6-tetramethylpiperidin-1-yl)decanedioate Chemical compound CC1(C)CCCC(C)(C)N1C(CCCCCCCC([O-])=O)(C([O-])=O)N1C(C)(C)CCCC1(C)C SEHSXHXBEYVCSI-UHFFFAOYSA-L 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-Butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N Cyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N Phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- 229950000688 Phenothiazine Drugs 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N TBHQ Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- -1 amine compounds Chemical class 0.000 description 1
- 230000000111 anti-oxidant Effects 0.000 description 1
- 230000003078 antioxidant Effects 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013085450A JP6240399B2 (ja) | 2012-05-29 | 2013-04-16 | 感光性組成物及びその硬化層を有するプリント配線板 |
| CN201380028583.2A CN104350421B (zh) | 2012-05-29 | 2013-05-08 | 感光性组合物及具有其固化层的印刷电路板 |
| PCT/JP2013/062951 WO2013179863A1 (fr) | 2012-05-29 | 2013-05-08 | Composition photosensible et carte de circuit imprimé comportant une couche durcie associée |
| KR1020147036115A KR102050126B1 (ko) | 2012-05-29 | 2013-05-08 | 감광성 조성물 및 그의 경화층을 갖는 프린트 배선판 |
| TW102117740A TWI620016B (zh) | 2012-05-29 | 2013-05-20 | 感光性組成物及具有其硬化層之印刷配線板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012122325 | 2012-05-29 | ||
| JP2012122325 | 2012-05-29 | ||
| JP2013085450A JP6240399B2 (ja) | 2012-05-29 | 2013-04-16 | 感光性組成物及びその硬化層を有するプリント配線板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014006498A JP2014006498A (ja) | 2014-01-16 |
| JP2014006498A5 true JP2014006498A5 (fr) | 2016-04-21 |
| JP6240399B2 JP6240399B2 (ja) | 2017-11-29 |
Family
ID=50104232
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013085451A Pending JP2014006499A (ja) | 2012-05-29 | 2013-04-16 | 感光性組成物及びその硬化層を有するプリント配線板 |
| JP2013085450A Active JP6240399B2 (ja) | 2012-05-29 | 2013-04-16 | 感光性組成物及びその硬化層を有するプリント配線板 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013085451A Pending JP2014006499A (ja) | 2012-05-29 | 2013-04-16 | 感光性組成物及びその硬化層を有するプリント配線板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP2014006499A (fr) |
| KR (1) | KR102050126B1 (fr) |
| CN (1) | CN104350421B (fr) |
| TW (1) | TWI620016B (fr) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106916262B (zh) * | 2015-12-25 | 2020-03-13 | 太阳油墨（苏州）有限公司 | 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板 |
| CN106916261B (zh) * | 2015-12-25 | 2020-05-19 | 太阳油墨（苏州）有限公司 | 孔穴填埋用固化性树脂组合物及其固化物、和印刷电路板 |
| JP6112691B1 (ja) * | 2016-03-16 | 2017-04-12 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及びプリント配線板 |
| JP5997860B1 (ja) | 2016-03-16 | 2016-09-28 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及びプリント配線板 |
| JP6967508B2 (ja) * | 2016-03-31 | 2021-11-17 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP6154942B1 (ja) * | 2016-07-11 | 2017-06-28 | 互応化学工業株式会社 | 液状ソルダーレジスト組成物及びプリント配線板 |
| JP7013666B2 (ja) * | 2017-03-29 | 2022-02-01 | 昭和電工マテリアルズ株式会社 | 感光性樹脂組成物、感光性エレメント、プリント配線板及びプリント配線板の製造方法 |
| JP6759323B2 (ja) * | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
| CN110317316B (zh) * | 2019-07-02 | 2021-11-30 | 戚玉侠 | 一种合成皮革用抗菌耐污聚氨酯的制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1266922B1 (fr) * | 2000-02-14 | 2005-01-12 | Taiyo Ink Manufacturing Co. Ltd | Composition photodurcissable/thermodurcissable permettant de produire un film mat |
| JP2004294882A (ja) * | 2003-03-27 | 2004-10-21 | Nippon Steel Chem Co Ltd | 感光性樹脂組成物及び硬化物 |
| JP2004359890A (ja) * | 2003-06-06 | 2004-12-24 | Japan U-Pica Co Ltd | 光硬化性樹脂組成物及び感光性熱硬化性樹脂組成物並びにその硬化物 |
| JP4449402B2 (ja) | 2003-08-25 | 2010-04-14 | 日立化成工業株式会社 | 永久レジスト用感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板 |
| TW200728379A (en) * | 2005-09-06 | 2007-08-01 | Taiyo Ink Mfg Co Ltd | Resin composition, cured product of the same, and printed circuit board made of the same |
| KR100883047B1 (ko) * | 2006-07-10 | 2009-02-11 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성ㆍ열 경화성 수지 조성물, 그의 경화물 및 인쇄배선판 |
| JP4994922B2 (ja) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | ソルダーレジスト組成物およびその硬化物 |
| JP4657358B2 (ja) * | 2008-12-12 | 2011-03-23 | 積水化学工業株式会社 | 感光性組成物及びソルダーレジスト組成物 |
| JP5338009B2 (ja) * | 2009-03-27 | 2013-11-13 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物及びその硬化物並びにそれらを用いたプリント配線板 |
| WO2011018907A1 (fr) * | 2009-08-10 | 2011-02-17 | 積水化学工業株式会社 | Composition photosensible et composition de réserve de brasage |
| JP5113298B2 (ja) * | 2012-01-10 | 2013-01-09 | 太陽ホールディングス株式会社 | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板 |
-
2013
- 2013-04-16 JP JP2013085451A patent/JP2014006499A/ja active Pending
- 2013-04-16 JP JP2013085450A patent/JP6240399B2/ja active Active
- 2013-05-08 CN CN201380028583.2A patent/CN104350421B/zh active Active
- 2013-05-08 KR KR1020147036115A patent/KR102050126B1/ko active IP Right Grant
- 2013-05-20 TW TW102117740A patent/TWI620016B/zh active
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