JP2014006498A5 - - Google Patents

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Publication number
JP2014006498A5
JP2014006498A5 JP2013085450A JP2013085450A JP2014006498A5 JP 2014006498 A5 JP2014006498 A5 JP 2014006498A5 JP 2013085450 A JP2013085450 A JP 2013085450A JP 2013085450 A JP2013085450 A JP 2013085450A JP 2014006498 A5 JP2014006498 A5 JP 2014006498A5
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JP
Japan
Prior art keywords
test tube
thermometer
acid value
tris
butyl
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JP2013085450A
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Japanese (ja)
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JP2014006498A (en
JP6240399B2 (en
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Priority claimed from JP2013085450A external-priority patent/JP6240399B2/en
Priority to JP2013085450A priority Critical patent/JP6240399B2/en
Priority to KR1020147036115A priority patent/KR102050126B1/en
Priority to CN201380028583.2A priority patent/CN104350421B/en
Priority to PCT/JP2013/062951 priority patent/WO2013179863A1/en
Priority to TW102117740A priority patent/TWI620016B/en
Publication of JP2014006498A publication Critical patent/JP2014006498A/en
Publication of JP2014006498A5 publication Critical patent/JP2014006498A5/ja
Publication of JP6240399B2 publication Critical patent/JP6240399B2/en
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Description

高分子材料の多くは、一度酸化が始まると、次々と連鎖的に酸化劣化が起き、高分子素材の機能低下をもたらすことから、本発明の感光性組成物には酸化を防ぐために、(1)発生したラジカルを無効化するようなラジカル捕捉剤又は/及び(2)発生した過酸化物を無害な物質に分解し、新たなラジカルが発生しないようにする過酸化物分解剤などの酸化防止剤を添加することができる。   In many polymer materials, once oxidation begins, oxidative degradation occurs one after another in a chain, resulting in a decrease in the function of the polymer material. Therefore, in order to prevent oxidation, the photosensitive composition of the present invention has (1 ) Antioxidants such as radical scavengers that invalidate the generated radicals and / or peroxide decomposers that decompose the generated peroxides into harmless substances and prevent new radicals from being generated. An agent can be added.

ラジカル捕捉剤として働く酸化防止剤としては、例えば、ヒドロキノン、4−t−ブチルカテコール、2−t−ブチルヒドロキノン、ヒドロキノンモノメチルエーテル、2,6−ジ−t−ブチル−p−クレゾール、2,2−メチレン−ビス(4−メチル−6−t−ブチルフェノール)、1,1,3−トリス(2−メチル−4−ヒドロキシ−5−t−ブチルフェニル)ブタン、1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)ベンゼン、1,3,5−トリス(3’,5’−ジ−t−ブチル−4−ヒドロキシベンジル)−S−トリアジン−2,4,6−(1H,3H,5H)トリオン等のフェノール系、メトキノン、ベンゾキノン等のキノン系化合物、ビス(2,2,6,6−テトラメチル−4−ピペリジル)−セバケート、フェノチアジン等のアミン系化合物等が挙げられる。   Examples of the antioxidant acting as a radical scavenger include hydroquinone, 4-t-butylcatechol, 2-t-butylhydroquinone, hydroquinone monomethyl ether, 2,6-di-t-butyl-p-cresol, 2,2 -Methylene-bis (4-methyl-6-tert-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2 , 4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, 1,3,5-tris (3 ′, 5′-di-t-butyl-4-hydroxybenzyl)- Phenolic compounds such as S-triazine-2,4,6- (1H, 3H, 5H) trione, quinone compounds such as methoquinone and benzoquinone, bis (2,2,6,6-tetramethyl- - piperidyl) - sebacate, amine compounds such as phenothiazine and the like.

前記表1及び表2中の酸価、エポキシ当量、二重結合当量は以下の方法で測定した。
<有機成分総量に対する酸価の測定法>
感光性組成物を70℃、24時間乾燥させて、有機溶剤を除去し、固形分を得た。固形分にアセトンを加えて溶解・分散させ、遠心分離機より、固形分からフィラーを分離した。フィラーを分離した有機成分を用いて、JIS K2501に従い、酸価を測定した。このようにして得られた酸価が、有機成分総量に対する酸価である。
The acid values, epoxy equivalents, and double bond equivalents in Tables 1 and 2 were measured by the following methods.
<Method of measuring acid value relative to total amount of organic components>
The photosensitive composition was dried at 70 ° C. for 24 hours to remove the organic solvent to obtain a solid content. Acetone was added to the solid content to dissolve and disperse, and the filler was separated from the solid content using a centrifuge. The acid value was measured according to JIS K2501 using the organic component from which the filler was separated. The acid value thus obtained is the acid value relative to the total amount of organic components.

試験管:
試験管としては、図1に示すように、内径30mm、高さ120mmの平底円筒型透明ガラス製のもので、管底から55mm及び85mmの高さのところにそれぞれ標線2,3が付され、試験管の口をゴム栓4aで密閉した液状判定用試験管1aと、同じサイズで同様に標線が付され、中央に温度計を挿入・支持するための孔があけられたゴム栓4bで試験管の口を密閉し、ゴム栓4bに温度計5を挿入した温度測定用試験管1bを用いる。以下、管底から55mmの高さの標線を「A線」、管底から85mmの高さの標線を「B線」という。
温度計5としては、JIS B7410(1982)「石油類試験用ガラス製温度計」に規定する凝固点測定用のもの(SOP−58目盛範囲20〜50℃)を用いるが、0〜50℃の温度範囲が測定できるものであればよい。
Test tube:
As shown in FIG. 1, the test tube is made of a flat bottom cylindrical transparent glass having an inner diameter of 30 mm and a height of 120 mm, and marked lines 2 and 3 are respectively provided at heights of 55 mm and 85 mm from the tube bottom. The test tube 1a for liquid judgment with the mouth of the test tube sealed with a rubber plug 4a is the same size as that of the test tube 1a, and a rubber plug 4b with a hole for inserting and supporting a thermometer in the center. A test tube 1b for temperature measurement in which the mouth of the test tube is sealed and a thermometer 5 is inserted into the rubber plug 4b is used. Hereinafter, a marked line having a height of 55 mm from the tube bottom is referred to as “A line”, and a marked line having a height of 85 mm from the tube bottom is referred to as “B line”.
As the thermometer 5, the one for freezing point measurement (SOP-58 scale range 20 to 50 ° C.) specified in JIS B7410 (1982) “Petroleum test glass thermometer” is used, but the temperature is 0 to 50 ° C. It is sufficient if the range can be measured.

JP2013085450A 2012-05-29 2013-04-16 Photosensitive composition and printed wiring board having cured layer thereof Active JP6240399B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013085450A JP6240399B2 (en) 2012-05-29 2013-04-16 Photosensitive composition and printed wiring board having cured layer thereof
KR1020147036115A KR102050126B1 (en) 2012-05-29 2013-05-08 Photosensitive composition and printed circuit board having hardened layer thereof
CN201380028583.2A CN104350421B (en) 2012-05-29 2013-05-08 Photosensitive composite and printed circuit board with its cured layer
PCT/JP2013/062951 WO2013179863A1 (en) 2012-05-29 2013-05-08 Photosensitive composition and printed circuit board having hardened layer thereof
TW102117740A TWI620016B (en) 2012-05-29 2013-05-20 Photosensitive composition and printed wiring board having hardened layer thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012122325 2012-05-29
JP2012122325 2012-05-29
JP2013085450A JP6240399B2 (en) 2012-05-29 2013-04-16 Photosensitive composition and printed wiring board having cured layer thereof

Publications (3)

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JP2014006498A JP2014006498A (en) 2014-01-16
JP2014006498A5 true JP2014006498A5 (en) 2016-04-21
JP6240399B2 JP6240399B2 (en) 2017-11-29

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JP (2) JP6240399B2 (en)
KR (1) KR102050126B1 (en)
CN (1) CN104350421B (en)
TW (1) TWI620016B (en)

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CN106916261B (en) * 2015-12-25 2020-05-19 太阳油墨(苏州)有限公司 Curable resin composition for filling holes, cured product thereof, and printed wiring board
CN106916262B (en) * 2015-12-25 2020-03-13 太阳油墨(苏州)有限公司 Curable resin composition for filling holes, cured product thereof, and printed wiring board
JP5997860B1 (en) 2016-03-16 2016-09-28 互応化学工業株式会社 Liquid solder resist composition and printed wiring board
JP6112691B1 (en) * 2016-03-16 2017-04-12 互応化学工業株式会社 Liquid solder resist composition and printed wiring board
CN109073969B (en) * 2016-03-31 2022-09-13 太阳油墨制造株式会社 Curable resin composition, dry film, cured product, and printed wiring board
JP6154942B1 (en) * 2016-07-11 2017-06-28 互応化学工業株式会社 Liquid solder resist composition and printed wiring board
JP7013666B2 (en) * 2017-03-29 2022-02-01 昭和電工マテリアルズ株式会社 Manufacturing method of photosensitive resin composition, photosensitive element, printed wiring board and printed wiring board
JP6759323B2 (en) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 Photosensitive resin composition, two-component photosensitive resin composition, dry film and printed wiring board
CN110317316B (en) * 2019-07-02 2021-11-30 戚玉侠 Preparation method of antibacterial and stain-resistant polyurethane for synthetic leather

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KR100634341B1 (en) * 2000-02-14 2006-10-16 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 Photocurable/thermosetting composition for forming matte film
JP2004294882A (en) * 2003-03-27 2004-10-21 Nippon Steel Chem Co Ltd Photosensitive resin composition and hardened product
JP2004359890A (en) * 2003-06-06 2004-12-24 Japan U-Pica Co Ltd Photocurable resin composition, photosensitive thermosetting resin composition and its cured product
JP4449402B2 (en) 2003-08-25 2010-04-14 日立化成工業株式会社 Photosensitive resin composition for permanent resist, photosensitive film for permanent resist, method for forming resist pattern, and printed wiring board
KR100787341B1 (en) * 2005-09-06 2007-12-18 다이요 잉키 세이조 가부시키가이샤 A resin composition, cured material therefrom, and printing wiring boards using the same
KR100883047B1 (en) * 2006-07-10 2009-02-11 다이요 잉키 세이조 가부시키가이샤 Photocurable/thermosetting resin composition, cured product thereof and printed wiring board
JP4994922B2 (en) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 Solder resist composition and cured product thereof
JP4657358B2 (en) * 2008-12-12 2011-03-23 積水化学工業株式会社 Photosensitive composition and solder resist composition
JP5338009B2 (en) * 2009-03-27 2013-11-13 太陽ホールディングス株式会社 Photo-curable thermosetting resin composition, cured product thereof, and printed wiring board using them
WO2011018907A1 (en) * 2009-08-10 2011-02-17 積水化学工業株式会社 Photosensitive composition and solder resist composition
JP5113298B2 (en) * 2012-01-10 2013-01-09 太陽ホールディングス株式会社 Photocurable / thermosetting resin composition and printed wiring board obtained using the same

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