JP2014003337A - 樹脂製パッケージ配列シート、部品内蔵樹脂モジュール配列シート - Google Patents
樹脂製パッケージ配列シート、部品内蔵樹脂モジュール配列シート Download PDFInfo
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- JP2014003337A JP2014003337A JP2013201672A JP2013201672A JP2014003337A JP 2014003337 A JP2014003337 A JP 2014003337A JP 2013201672 A JP2013201672 A JP 2013201672A JP 2013201672 A JP2013201672 A JP 2013201672A JP 2014003337 A JP2014003337 A JP 2014003337A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】樹脂製パッケージが縦横に配列された樹脂製パッケージ配列シートであって、樹脂製パッケージのそれぞれが、樹脂層と、該樹脂層の厚み内に内包され埋め込まれたデバイスと、該デバイスに重なる樹脂層を貫通して設けられた該デバイスにつながる縦方向導電体または該デバイスのない領域の樹脂層に該樹脂層を貫通して設けられた縦方向導電体とを有し、樹脂製パッケージの占める各領域の隣にダミー領域が設けられ、かつ該樹脂製パッケージの領域と該ダミー領域とが横方向または縦方向の少なくとも一方の方向に交互に並べられている。
【選択図】図3
Description
Claims (4)
- 樹脂製パッケージが縦横に配列された樹脂製パッケージ配列シートであって、
前記樹脂製パッケージのそれぞれが、樹脂層と、該樹脂層の厚み内に内包され埋め込まれたデバイスと、該デバイスに重なる前記樹脂層を貫通して設けられた該デバイスにつながる縦方向導電体または該デバイスのない領域の前記樹脂層に該樹脂層を貫通して設けられた縦方向導電体とを有し、
前記樹脂製パッケージの占める各領域の隣にダミー領域が設けられ、かつ該樹脂製パッケージの領域と該ダミー領域とが横方向または縦方向の少なくとも一方の方向に交互に並べられていること
を特徴とする樹脂製パッケージ配列シート。 - 部品内蔵樹脂モジュールが縦横に配列された部品内蔵樹脂モジュール配列シートであって、
前記部品内蔵樹脂モジュールのそれぞれが、樹脂層と、該樹脂層の厚み内に内包され埋め込まれたデバイスと、該デバイスに重なる前記樹脂層を貫通して設けられた該デバイスにつながる縦方向導電体または該デバイスのない領域の前記樹脂層に該樹脂層を貫通して設けられた縦方向導電体とを有し、
前記部品内蔵樹脂モジュールの占める各領域の隣にダミー領域が設けられ、かつ該部品内蔵樹脂モジュールの領域と該ダミー領域とが横方向または縦方向の少なくとも一方の方向に交互に並べられていること
を特徴とする部品内蔵樹脂モジュール配列シート。 - 樹脂製パッケージが縦横に配列された樹脂製パッケージ配列シートであって、
前記樹脂製パッケージのそれぞれが、開口を備えた第1の樹脂層と、前記開口内に収められるように位置しているデバイスと、前記第1の樹脂層上に積層されかつ前記第1の樹脂層の前記開口を充填し前記デバイスを埋め込んでいる第2の樹脂層とを有し、
前記樹脂製パッケージの占める各領域の隣にダミー領域が設けられ、かつ該樹脂製パッケージの領域と該ダミー領域とが横方向または縦方向の少なくとも一方の方向に交互に並べられていること
を特徴とする樹脂製パッケージ配列シート。 - 部品内蔵樹脂モジュールが縦横に配列された部品内蔵樹脂モジュール配列シートであって、
前記部品内蔵樹脂モジュールのそれぞれが、開口を備えた第1の樹脂層と、前記開口内に収められるように位置しているデバイスと、前記第1の樹脂層上に積層されかつ前記第1の樹脂層の前記開口を充填し前記デバイスを埋め込んでいる第2の樹脂層とを有し、
前記部品内蔵樹脂モジュールの占める各領域の隣にダミー領域が設けられ、かつ該部品内蔵樹脂モジュールの領域と該ダミー領域とが横方向または縦方向の少なくとも一方の方向に交互に並べられていること
を特徴とする部品内蔵樹脂モジュール配列シート。
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JP2013201672A JP5825313B2 (ja) | 2013-09-27 | 2013-09-27 | 樹脂製パッケージ配列シート、部品内蔵樹脂モジュール配列シート |
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JP2013201672A JP5825313B2 (ja) | 2013-09-27 | 2013-09-27 | 樹脂製パッケージ配列シート、部品内蔵樹脂モジュール配列シート |
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JP2010106708A Division JP5418395B2 (ja) | 2010-05-06 | 2010-05-06 | 樹脂製パッケージの製造方法、部品内蔵樹脂モジュールの製造方法、樹脂製パッケージ配列シート、部品内蔵樹脂モジュール配列シート |
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JP5825313B2 JP5825313B2 (ja) | 2015-12-02 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09298256A (ja) * | 1996-03-07 | 1997-11-18 | Matsushita Electron Corp | 電子部品とその製造方法及びそれに用いるリードフレームと金型 |
JP2003179184A (ja) * | 1996-07-12 | 2003-06-27 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2008283127A (ja) * | 2007-05-14 | 2008-11-20 | Cmk Corp | 半導体装置とその製造方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09298256A (ja) * | 1996-03-07 | 1997-11-18 | Matsushita Electron Corp | 電子部品とその製造方法及びそれに用いるリードフレームと金型 |
JP2003179184A (ja) * | 1996-07-12 | 2003-06-27 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2008283127A (ja) * | 2007-05-14 | 2008-11-20 | Cmk Corp | 半導体装置とその製造方法 |
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