JP2013542863A5 - - Google Patents

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Publication number
JP2013542863A5
JP2013542863A5 JP2013540037A JP2013540037A JP2013542863A5 JP 2013542863 A5 JP2013542863 A5 JP 2013542863A5 JP 2013540037 A JP2013540037 A JP 2013540037A JP 2013540037 A JP2013540037 A JP 2013540037A JP 2013542863 A5 JP2013542863 A5 JP 2013542863A5
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JP
Japan
Prior art keywords
polishing pad
translucent insert
recess
thermoplastic polymer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013540037A
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English (en)
Japanese (ja)
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JP5918254B2 (ja
JP2013542863A (ja
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Publication date
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Priority claimed from PCT/US2011/061312 external-priority patent/WO2012068428A2/en
Publication of JP2013542863A publication Critical patent/JP2013542863A/ja
Publication of JP2013542863A5 publication Critical patent/JP2013542863A5/ja
Application granted granted Critical
Publication of JP5918254B2 publication Critical patent/JP5918254B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013540037A 2010-11-18 2011-11-18 透過性領域を含む研磨パッド Expired - Fee Related JP5918254B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41501510P 2010-11-18 2010-11-18
US61/415,015 2010-11-18
PCT/US2011/061312 WO2012068428A2 (en) 2010-11-18 2011-11-18 Polishing pad comprising transmissive region

Publications (3)

Publication Number Publication Date
JP2013542863A JP2013542863A (ja) 2013-11-28
JP2013542863A5 true JP2013542863A5 (https=) 2014-06-26
JP5918254B2 JP5918254B2 (ja) 2016-05-18

Family

ID=46084662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013540037A Expired - Fee Related JP5918254B2 (ja) 2010-11-18 2011-11-18 透過性領域を含む研磨パッド

Country Status (8)

Country Link
US (1) US20130237136A1 (https=)
EP (1) EP2641268A4 (https=)
JP (1) JP5918254B2 (https=)
KR (1) KR101602544B1 (https=)
CN (1) CN103222034B (https=)
MY (1) MY166716A (https=)
SG (1) SG190249A1 (https=)
WO (1) WO2012068428A2 (https=)

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US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统
KR101829542B1 (ko) * 2016-07-27 2018-02-23 신우유니온(주) 손톱용 버퍼의 제조방법
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
US11260495B2 (en) 2018-07-27 2022-03-01 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7317440B2 (ja) * 2019-04-15 2023-07-31 株式会社ディスコ ドレッシング工具
JP7220130B2 (ja) * 2019-07-11 2023-02-09 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
US11633830B2 (en) * 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
TWI855291B (zh) * 2021-01-25 2024-09-11 美商Ｃｍｃ材料有限責任公司 用於化學機械平坦化（ｃｍｐ）墊之窗及ｃｍｐ墊
KR102593117B1 (ko) * 2021-07-02 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
CN117050375A (zh) * 2023-08-28 2023-11-14 东莞鑫磊研磨工业有限公司 一种基于辐射交联技术制备树脂研磨垫的方法

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US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
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US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
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US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
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JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
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US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
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