JP2013542591A - インプリント・リソフラフィで用いる蒸気供給システム - Google Patents
インプリント・リソフラフィで用いる蒸気供給システム Download PDFInfo
- Publication number
- JP2013542591A JP2013542591A JP2013528296A JP2013528296A JP2013542591A JP 2013542591 A JP2013542591 A JP 2013542591A JP 2013528296 A JP2013528296 A JP 2013528296A JP 2013528296 A JP2013528296 A JP 2013528296A JP 2013542591 A JP2013542591 A JP 2013542591A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive material
- reservoir
- steam supply
- supply system
- vaporizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001459 lithography Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 41
- 230000008569 process Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 53
- 239000006200 vaporizer Substances 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 39
- 230000001070 adhesive effect Effects 0.000 claims description 39
- 239000012530 fluid Substances 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 25
- 230000008016 vaporization Effects 0.000 claims description 18
- 238000009834 vaporization Methods 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 13
- 238000010926 purge Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 2
- 230000007062 hydrolysis Effects 0.000 claims description 2
- 238000006460 hydrolysis reaction Methods 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- -1 silane compound Chemical class 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- JPPHEZSCZWYTOP-UHFFFAOYSA-N trimethoxysilylmethyl prop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C=C JPPHEZSCZWYTOP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 4
- 230000014759 maintenance of location Effects 0.000 claims 2
- 230000001737 promoting effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000002318 adhesion promoter Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000012705 liquid precursor Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 238000010793 Steam injection (oil industry) Methods 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
- B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38076010P | 2010-09-08 | 2010-09-08 | |
| US61/380,760 | 2010-09-08 | ||
| PCT/US2011/050874 WO2012033943A2 (en) | 2010-09-08 | 2011-09-08 | Vapor delivery system for use in imprint lithography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013542591A true JP2013542591A (ja) | 2013-11-21 |
| JP2013542591A5 JP2013542591A5 (enExample) | 2014-10-02 |
Family
ID=45811164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013528296A Pending JP2013542591A (ja) | 2010-09-08 | 2011-09-08 | インプリント・リソフラフィで用いる蒸気供給システム |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120070572A1 (enExample) |
| JP (1) | JP2013542591A (enExample) |
| KR (1) | KR20130105648A (enExample) |
| WO (1) | WO2012033943A2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013115208A (ja) * | 2011-11-28 | 2013-06-10 | Tokyo Electron Ltd | 気化原料供給装置、これを備える基板処理装置、及び気化原料供給方法 |
| JP6343937B2 (ja) * | 2014-01-10 | 2018-06-20 | デクセリアルズ株式会社 | 反射防止構造体及びその設計方法 |
| US10921706B2 (en) * | 2018-06-07 | 2021-02-16 | Canon Kabushiki Kaisha | Systems and methods for modifying mesa sidewalls |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5554077A (en) * | 1978-10-16 | 1980-04-21 | Tokuyama Soda Co Ltd | Vaporizing of high boiling point residue discharged from vinyl chloride monomer production process |
| JPS6452731A (en) * | 1987-08-24 | 1989-02-28 | Mitsubishi Chem Ind | Thermal decomposition of dichloroethane |
| JPH0390429U (enExample) * | 1989-12-28 | 1991-09-13 | ||
| JPH06310444A (ja) * | 1993-04-27 | 1994-11-04 | Ryoden Semiconductor Syst Eng Kk | 液体原料用cvd装置 |
| JPH11269653A (ja) * | 1998-03-26 | 1999-10-05 | Shimadzu Corp | 液体材料気化装置 |
| US20070017631A1 (en) * | 2005-07-22 | 2007-01-25 | Molecular Imprints, Inc. | Method for adhering materials together |
| JP2009108387A (ja) * | 2007-10-31 | 2009-05-21 | Omron Corp | 気化装置 |
| WO2009122646A1 (ja) * | 2008-04-01 | 2009-10-08 | 株式会社フジキン | 気化器を備えたガス供給装置 |
| US20100098862A1 (en) * | 2008-10-21 | 2010-04-22 | Intevac, Inc. | Method and apparatus for precision surface modification in nano-imprint lithography |
| JP2010526426A (ja) * | 2007-04-12 | 2010-07-29 | モレキュラー・インプリンツ・インコーポレーテッド | 接着プライマー層を利用するインプリント・リソグラフィーのための方法 |
| JP2012507391A (ja) * | 2008-10-30 | 2012-03-29 | モレキュラー・インプリンツ・インコーポレーテッド | 基板とパターン形成層との間の接着性の促進 |
| JP2012508978A (ja) * | 2008-11-13 | 2012-04-12 | モレキュラー・インプリンツ・インコーポレーテッド | ナノサイズ形状の大面積パターニング |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19600630A1 (de) * | 1996-01-10 | 1997-07-17 | Bayer Ag | Verfahren und Vorrichtung zum kontinuierlichen Eindampfen von zähflüssigen, zum Haften neigenden Lösungen und Suspensionen bis zur Trockenmasse |
| US6409839B1 (en) * | 1997-06-02 | 2002-06-25 | Msp Corporation | Method and apparatus for vapor generation and film deposition |
| US20030101938A1 (en) * | 1998-10-27 | 2003-06-05 | Applied Materials, Inc. | Apparatus for the deposition of high dielectric constant films |
| US6178925B1 (en) * | 1999-09-29 | 2001-01-30 | Advanced Technology Materials, Inc. | Burst pulse cleaning method and apparatus for liquid delivery system |
| US6501052B2 (en) * | 2000-12-22 | 2002-12-31 | Chrysalis Technologies Incorporated | Aerosol generator having multiple heating zones and methods of use thereof |
| US20030021595A1 (en) * | 2001-07-16 | 2003-01-30 | Mindi Xu | Apparatus and method for vaporizing a liquid chemical |
| US20030049933A1 (en) * | 2001-09-07 | 2003-03-13 | Applied Materials, Inc. | Apparatus for handling liquid precursor material for semiconductor processing |
| US20060207503A1 (en) * | 2005-03-18 | 2006-09-21 | Paul Meneghini | Vaporizer and method of vaporizing a liquid for thin film delivery |
-
2011
- 2011-09-08 US US13/228,298 patent/US20120070572A1/en not_active Abandoned
- 2011-09-08 JP JP2013528296A patent/JP2013542591A/ja active Pending
- 2011-09-08 KR KR1020137008766A patent/KR20130105648A/ko not_active Withdrawn
- 2011-09-08 WO PCT/US2011/050874 patent/WO2012033943A2/en not_active Ceased
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5554077A (en) * | 1978-10-16 | 1980-04-21 | Tokuyama Soda Co Ltd | Vaporizing of high boiling point residue discharged from vinyl chloride monomer production process |
| JPS6452731A (en) * | 1987-08-24 | 1989-02-28 | Mitsubishi Chem Ind | Thermal decomposition of dichloroethane |
| JPH0390429U (enExample) * | 1989-12-28 | 1991-09-13 | ||
| JPH06310444A (ja) * | 1993-04-27 | 1994-11-04 | Ryoden Semiconductor Syst Eng Kk | 液体原料用cvd装置 |
| JPH11269653A (ja) * | 1998-03-26 | 1999-10-05 | Shimadzu Corp | 液体材料気化装置 |
| US20070017631A1 (en) * | 2005-07-22 | 2007-01-25 | Molecular Imprints, Inc. | Method for adhering materials together |
| JP2010526426A (ja) * | 2007-04-12 | 2010-07-29 | モレキュラー・インプリンツ・インコーポレーテッド | 接着プライマー層を利用するインプリント・リソグラフィーのための方法 |
| JP2009108387A (ja) * | 2007-10-31 | 2009-05-21 | Omron Corp | 気化装置 |
| WO2009122646A1 (ja) * | 2008-04-01 | 2009-10-08 | 株式会社フジキン | 気化器を備えたガス供給装置 |
| US20100098862A1 (en) * | 2008-10-21 | 2010-04-22 | Intevac, Inc. | Method and apparatus for precision surface modification in nano-imprint lithography |
| JP2010118136A (ja) * | 2008-10-21 | 2010-05-27 | Intevac Inc | ナノインプリントリソグラフィーにおける精密表面改質の方法及び装置 |
| JP2012507391A (ja) * | 2008-10-30 | 2012-03-29 | モレキュラー・インプリンツ・インコーポレーテッド | 基板とパターン形成層との間の接着性の促進 |
| JP2012508978A (ja) * | 2008-11-13 | 2012-04-12 | モレキュラー・インプリンツ・インコーポレーテッド | ナノサイズ形状の大面積パターニング |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012033943A3 (en) | 2012-08-16 |
| KR20130105648A (ko) | 2013-09-25 |
| WO2012033943A2 (en) | 2012-03-15 |
| US20120070572A1 (en) | 2012-03-22 |
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