JP2013533125A5 - - Google Patents

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Publication number
JP2013533125A5
JP2013533125A5 JP2013515384A JP2013515384A JP2013533125A5 JP 2013533125 A5 JP2013533125 A5 JP 2013533125A5 JP 2013515384 A JP2013515384 A JP 2013515384A JP 2013515384 A JP2013515384 A JP 2013515384A JP 2013533125 A5 JP2013533125 A5 JP 2013533125A5
Authority
JP
Japan
Prior art keywords
edge
polishing
polishing element
support pad
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013515384A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013533125A (ja
Filing date
Publication date
Priority claimed from US12/815,764 external-priority patent/US8360823B2/en
Application filed filed Critical
Publication of JP2013533125A publication Critical patent/JP2013533125A/ja
Publication of JP2013533125A5 publication Critical patent/JP2013533125A5/ja
Pending legal-status Critical Current

Links

JP2013515384A 2010-06-15 2011-06-08 化学機械平坦化に使用される固定研磨材の接合技法 Pending JP2013533125A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/815,764 2010-06-15
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Publications (2)

Publication Number Publication Date
JP2013533125A JP2013533125A (ja) 2013-08-22
JP2013533125A5 true JP2013533125A5 (enExample) 2014-07-17

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013515384A Pending JP2013533125A (ja) 2010-06-15 2011-06-08 化学機械平坦化に使用される固定研磨材の接合技法

Country Status (7)

Country Link
US (1) US8360823B2 (enExample)
JP (1) JP2013533125A (enExample)
KR (1) KR20130079480A (enExample)
CN (1) CN102939644B (enExample)
SG (1) SG186203A1 (enExample)
TW (1) TWI535526B (enExample)
WO (1) WO2011159536A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI544064B (zh) 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN104994996B (zh) 2012-12-31 2017-12-05 圣戈班磨料磨具有限公司 粘结研磨制品和碾磨方法
EP2938460B1 (en) 2012-12-31 2018-08-15 Saint-Gobain Abrasives, Inc. Method of grinding
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
US9833877B2 (en) 2013-03-31 2017-12-05 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN106363528A (zh) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 一种针对蓝宝石的固结磨料及研磨工艺
CN119556530A (zh) * 2018-05-22 2025-03-04 Asml控股股份有限公司 用于原位夹具表面粗糙化的装置和方法
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法
KR102843434B1 (ko) * 2020-01-06 2025-08-08 생-고뱅 어브레이시브즈, 인코포레이티드 연마 용품 및 사용 방법

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CN101607381B (zh) * 2000-08-31 2014-04-16 株式会社荏原制作所 化学机械抛光头、设备和方法以及平面化半导体晶片
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JP2002252191A (ja) * 2001-02-26 2002-09-06 Mitsubishi Materials Silicon Corp 半導体ウェーハの研磨装置
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TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
TWI284584B (en) * 2005-05-09 2007-08-01 Nat Univ Chung Cheng Method for detecting the using condition and lifetime of the polish pad by sensing the temperature of the grinding interface during the chemical-mechanical polishing process
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KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치

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