JP2013533125A - 化学機械平坦化に使用される固定研磨材の接合技法 - Google Patents

化学機械平坦化に使用される固定研磨材の接合技法 Download PDF

Info

Publication number
JP2013533125A
JP2013533125A JP2013515384A JP2013515384A JP2013533125A JP 2013533125 A JP2013533125 A JP 2013533125A JP 2013515384 A JP2013515384 A JP 2013515384A JP 2013515384 A JP2013515384 A JP 2013515384A JP 2013533125 A JP2013533125 A JP 2013533125A
Authority
JP
Japan
Prior art keywords
edge
polishing
support pad
channel
edges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013515384A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013533125A5 (enExample
Inventor
ジョン ジェイ． ガリアルディ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2013533125A publication Critical patent/JP2013533125A/ja
Publication of JP2013533125A5 publication Critical patent/JP2013533125A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013515384A 2010-06-15 2011-06-08 化学機械平坦化に使用される固定研磨材の接合技法 Pending JP2013533125A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/815,764 2010-06-15
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Publications (2)

Publication Number Publication Date
JP2013533125A true JP2013533125A (ja) 2013-08-22
JP2013533125A5 JP2013533125A5 (enExample) 2014-07-17

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013515384A Pending JP2013533125A (ja) 2010-06-15 2011-06-08 化学機械平坦化に使用される固定研磨材の接合技法

Country Status (7)

Country Link
US (1) US8360823B2 (enExample)
JP (1) JP2013533125A (enExample)
KR (1) KR20130079480A (enExample)
CN (1) CN102939644B (enExample)
SG (1) SG186203A1 (enExample)
TW (1) TWI535526B (enExample)
WO (1) WO2011159536A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI544064B (zh) 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN104994996B (zh) 2012-12-31 2017-12-05 圣戈班磨料磨具有限公司 粘结研磨制品和碾磨方法
EP2938460B1 (en) 2012-12-31 2018-08-15 Saint-Gobain Abrasives, Inc. Method of grinding
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
US9833877B2 (en) 2013-03-31 2017-12-05 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN106363528A (zh) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 一种针对蓝宝石的固结磨料及研磨工艺
CN119556530A (zh) * 2018-05-22 2025-03-04 Asml控股股份有限公司 用于原位夹具表面粗糙化的装置和方法
KR102843434B1 (ko) * 2020-01-06 2025-08-08 생-고뱅 어브레이시브즈, 인코포레이티드 연마 용품 및 사용 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09277163A (ja) * 1996-04-16 1997-10-28 Sony Corp 研磨方法と研磨装置
JPH11333703A (ja) * 1998-05-28 1999-12-07 Speedfam-Ipec Co Ltd ポリッシング加工機
JP2002252191A (ja) * 2001-02-26 2002-09-06 Mitsubishi Materials Silicon Corp 半導体ウェーハの研磨装置
JP2004322232A (ja) * 2003-04-22 2004-11-18 Rodel Nitta Co 研磨装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1924773A (en) * 1932-03-11 1933-08-29 Titan Abrasives Company Abrasive disk
US2242877A (en) * 1939-03-15 1941-05-20 Albertson & Co Inc Abrasive disk and method of making the same
US2685155A (en) * 1951-04-28 1954-08-03 Minnesota Mining & Mfg Multiple center hole abrasive disk
US3568371A (en) * 1969-03-12 1971-03-09 Spitfire Tool & Machine Co Inc Lapping and polishing machine
US3763604A (en) * 1969-05-08 1973-10-09 Norton Co Coated abrasive belt joint
SE338933B (enExample) * 1970-01-20 1971-09-20 Fab Ab Eka
US4215516A (en) * 1979-04-18 1980-08-05 Sheldahl, Inc. Unidirectional tape
US4314827A (en) 1979-06-29 1982-02-09 Minnesota Mining And Manufacturing Company Non-fused aluminum oxide-based abrasive mineral
US4623364A (en) 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4770671A (en) 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
US4881951A (en) 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5256227A (en) * 1991-05-09 1993-10-26 Minnesota Mining And Manufacturing Company Method of splicing endless abrasive belts and cones
AU1735295A (en) * 1994-02-22 1995-09-04 Minnesota Mining And Manufacturing Company Method for making an endless coated abrasive article and the product thereof
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5595804A (en) * 1994-08-22 1997-01-21 Minnesota Mining And Manufacturing Company Splice means, a method of splicing an abrasive article with same and the spliced abrasive article formed thereby
US6453899B1 (en) * 1995-06-07 2002-09-24 Ultimate Abrasive Systems, L.L.C. Method for making a sintered article and products produced thereby
KR100329307B1 (ko) * 1995-12-08 2002-09-26 생-고뱅 어브레이시브즈, 인코포레이티드 연마디스크용백킹판
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6062958A (en) * 1997-04-04 2000-05-16 Micron Technology, Inc. Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
US5920769A (en) * 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6419554B2 (en) 1999-06-24 2002-07-16 Micron Technology, Inc. Fixed abrasive chemical-mechanical planarization of titanium nitride
US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
WO2001083167A1 (en) * 2000-05-03 2001-11-08 Rodel Holdings, Inc. Polishing pad with a seam which is reinforced with caulking material
JP2003535707A (ja) * 2000-06-19 2003-12-02 ストルエルス アクティーゼルスカブ 多ゾーン型研削及び／又は研磨シート
CN101607381B (zh) * 2000-08-31 2014-04-16 株式会社荏原制作所 化学机械抛光头、设备和方法以及平面化半导体晶片
US20020072296A1 (en) * 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
US6835118B2 (en) * 2001-12-14 2004-12-28 Oriol, Inc. Rigid plate assembly with polishing pad and method of using
US6602123B1 (en) * 2002-09-13 2003-08-05 Infineon Technologies Ag Finishing pad design for multidirectional use
CN100551623C (zh) 2003-01-10 2009-10-21 3M创新有限公司 应用于化学机械平面化的垫结构
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
TWI284584B (en) * 2005-05-09 2007-08-01 Nat Univ Chung Cheng Method for detecting the using condition and lifetime of the polish pad by sensing the temperature of the grinding interface during the chemical-mechanical polishing process
US7494519B2 (en) 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09277163A (ja) * 1996-04-16 1997-10-28 Sony Corp 研磨方法と研磨装置
JPH11333703A (ja) * 1998-05-28 1999-12-07 Speedfam-Ipec Co Ltd ポリッシング加工機
JP2002252191A (ja) * 2001-02-26 2002-09-06 Mitsubishi Materials Silicon Corp 半導体ウェーハの研磨装置
JP2004322232A (ja) * 2003-04-22 2004-11-18 Rodel Nitta Co 研磨装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法
WO2020110258A1 (ja) * 2018-11-29 2020-06-04 株式会社大輝 ポリッシングパッドおよびその製造方法

Also Published As

Publication number Publication date
US20110306276A1 (en) 2011-12-15
US8360823B2 (en) 2013-01-29
WO2011159536A3 (en) 2012-04-05
SG186203A1 (en) 2013-01-30
CN102939644B (zh) 2015-12-16
TWI535526B (zh) 2016-06-01
WO2011159536A2 (en) 2011-12-22
CN102939644A (zh) 2013-02-20
KR20130079480A (ko) 2013-07-10
TW201208810A (en) 2012-03-01

Similar Documents

Publication Publication Date Title
JP2013533125A (ja) 化学機械平坦化に使用される固定研磨材の接合技法
US5692950A (en) Abrasive construction for semiconductor wafer modification
CN1289263C (zh) 用于修饰半导体晶片的固定磨具和设备以及修饰方法
US6746311B1 (en) Polishing pad with release layer
US9314903B2 (en) Abrasive article
JP2001505489A5 (enExample)
JPH0623664A (ja) シート状弾性発泡体及びそれを用いたウェーハ研磨加工用治具
WO2013101575A2 (en) Coated abrasive article
US6616519B2 (en) Sanding system
US7014550B2 (en) Sanding system
JP2002059357A (ja) 研磨パッドおよび研磨装置ならびに研磨方法
TWI821561B (zh) 具有紋理化之平板黏著劑之化學機械研磨墊及貼附彼之方法
CN213136220U (zh) 研磨工具和包括该研磨工具的组件
JP2010274338A (ja) 研磨装置及び研磨パッドの固定方法
JP2017131976A (ja) 研磨パッド及びその製造方法、並びに、研磨加工品の製造方法
JP2005014135A (ja) 研磨シート
WO2025144854A1 (en) Structured abrasive article with interlayer
JP2017131977A (ja) 難削材用ラッピングシート及びその製造方法、並びに、ラッピング加工品の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140527

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140527

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150217

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150825

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20151125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151224

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160308