KR20130079480A - 화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술 - Google Patents

화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술 Download PDF

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Publication number
KR20130079480A
KR20130079480A KR1020137000932A KR20137000932A KR20130079480A KR 20130079480 A KR20130079480 A KR 20130079480A KR 1020137000932 A KR1020137000932 A KR 1020137000932A KR 20137000932 A KR20137000932 A KR 20137000932A KR 20130079480 A KR20130079480 A KR 20130079480A
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KR
South Korea
Prior art keywords
abrasive
edge
support pad
edges
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137000932A
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English (en)
Korean (ko)
Inventor
존 제이 가글리아르디
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20130079480A publication Critical patent/KR20130079480A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020137000932A 2010-06-15 2011-06-08 화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술 Withdrawn KR20130079480A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/815,764 2010-06-15
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Publications (1)

Publication Number Publication Date
KR20130079480A true KR20130079480A (ko) 2013-07-10

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137000932A Withdrawn KR20130079480A (ko) 2010-06-15 2011-06-08 화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술

Country Status (7)

Country Link
US (1) US8360823B2 (enExample)
JP (1) JP2013533125A (enExample)
KR (1) KR20130079480A (enExample)
CN (1) CN102939644B (enExample)
SG (1) SG186203A1 (enExample)
TW (1) TWI535526B (enExample)
WO (1) WO2011159536A2 (enExample)

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TWI544064B (zh) 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN104994996B (zh) 2012-12-31 2017-12-05 圣戈班磨料磨具有限公司 粘结研磨制品和碾磨方法
EP2938460B1 (en) 2012-12-31 2018-08-15 Saint-Gobain Abrasives, Inc. Method of grinding
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
US9833877B2 (en) 2013-03-31 2017-12-05 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN106363528A (zh) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 一种针对蓝宝石的固结磨料及研磨工艺
CN119556530A (zh) * 2018-05-22 2025-03-04 Asml控股股份有限公司 用于原位夹具表面粗糙化的装置和方法
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法
KR102843434B1 (ko) * 2020-01-06 2025-08-08 생-고뱅 어브레이시브즈, 인코포레이티드 연마 용품 및 사용 방법

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US4623364A (en) 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4770671A (en) 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
US4881951A (en) 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
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US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
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Also Published As

Publication number Publication date
US20110306276A1 (en) 2011-12-15
US8360823B2 (en) 2013-01-29
WO2011159536A3 (en) 2012-04-05
SG186203A1 (en) 2013-01-30
CN102939644B (zh) 2015-12-16
TWI535526B (zh) 2016-06-01
WO2011159536A2 (en) 2011-12-22
CN102939644A (zh) 2013-02-20
JP2013533125A (ja) 2013-08-22
TW201208810A (en) 2012-03-01

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Date Code Title Description
PA0105 International application

Patent event date: 20130114

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid