JP2013529386A5 - - Google Patents

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JP2013529386A5
JP2013529386A5 JP2013511174A JP2013511174A JP2013529386A5 JP 2013529386 A5 JP2013529386 A5 JP 2013529386A5 JP 2013511174 A JP2013511174 A JP 2013511174A JP 2013511174 A JP2013511174 A JP 2013511174A JP 2013529386 A5 JP2013529386 A5 JP 2013529386A5
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JP2013529386A (ja
JP6009436B2 (ja
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JP2013511174A 2010-05-17 2011-04-26 化学機械研磨における研磨速度補正のためのフィードバック Active JP6009436B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/781,644 2010-05-17
US12/781,644 US8190285B2 (en) 2010-05-17 2010-05-17 Feedback for polishing rate correction in chemical mechanical polishing
PCT/US2011/033998 WO2011146208A2 (en) 2010-05-17 2011-04-26 Feedback for polishing rate correction in chemical mechanical polishing

Publications (3)

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JP2013529386A JP2013529386A (ja) 2013-07-18
JP2013529386A5 true JP2013529386A5 (cg-RX-API-DMAC7.html) 2014-06-19
JP6009436B2 JP6009436B2 (ja) 2016-10-19

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JP2013511174A Active JP6009436B2 (ja) 2010-05-17 2011-04-26 化学機械研磨における研磨速度補正のためのフィードバック

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US (3) US8190285B2 (cg-RX-API-DMAC7.html)
JP (1) JP6009436B2 (cg-RX-API-DMAC7.html)
KR (1) KR101769886B1 (cg-RX-API-DMAC7.html)
TW (1) TWI593513B (cg-RX-API-DMAC7.html)
WO (1) WO2011146208A2 (cg-RX-API-DMAC7.html)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010028180A2 (en) * 2008-09-04 2010-03-11 Applied Materials, Inc. Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
KR101715726B1 (ko) * 2008-11-26 2017-03-13 어플라이드 머티어리얼스, 인코포레이티드 피드 백 및 피드 포워드 프로세스 제어를 위한 광학적 측정 이용
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
US8666665B2 (en) * 2010-06-07 2014-03-04 Applied Materials, Inc. Automatic initiation of reference spectra library generation for optical monitoring
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US8694144B2 (en) * 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US10643853B2 (en) * 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
WO2013130366A1 (en) * 2012-02-27 2013-09-06 Applied Materials, Inc. Feedback control using detection of clearance and adjustment for uniform topography
US8563335B1 (en) * 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9296084B2 (en) * 2012-07-19 2016-03-29 Applied Materials, Inc. Polishing control using weighting with default sequence
US20140030956A1 (en) * 2012-07-25 2014-01-30 Jimin Zhang Control of polishing of multiple substrates on the same platen in chemical mechanical polishing
WO2014078151A1 (en) * 2012-11-16 2014-05-22 Applied Materials, Inc. Recording measurements by sensors for a carrier head
US20140242877A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Spectrographic metrology with multiple measurements
US9242337B2 (en) 2013-03-15 2016-01-26 Applied Materials, Inc. Dynamic residue clearing control with in-situ profile control (ISPC)
US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US9490186B2 (en) * 2013-11-27 2016-11-08 Applied Materials, Inc. Limiting adjustment of polishing rates during substrate polishing
US9997420B2 (en) 2013-12-27 2018-06-12 Taiwan Semiconductor Manufacturing Company Limited Method and/or system for chemical mechanical planarization (CMP)
US10464184B2 (en) 2014-05-07 2019-11-05 Applied Materials, Inc. Modifying substrate thickness profiles
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR101679131B1 (ko) * 2014-12-29 2016-11-23 주식회사 엘지실트론 웨이퍼 연마장치 및 그 연마방법
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
US10562148B2 (en) * 2016-10-10 2020-02-18 Applied Materials, Inc. Real time profile control for chemical mechanical polishing
JP6847811B2 (ja) * 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
TWI825075B (zh) * 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
KR102746811B1 (ko) 2018-09-26 2024-12-27 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 전자기 유도 모니터링에 대한 가장자리 재구성에서의 기판 도핑에 대한 보상
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI809389B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
KR102737625B1 (ko) * 2020-06-26 2024-12-04 어플라이드 머티어리얼스, 인코포레이티드 변형가능한 기판 척
JP7389718B2 (ja) * 2020-06-29 2023-11-30 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP7637482B2 (ja) * 2020-08-11 2025-02-28 株式会社荏原製作所 基板処理装置及び研磨部材のドレッシング制御方法
US12311494B2 (en) * 2021-03-03 2025-05-27 Applied Materials, Inc. Pressure signals during motor torque monitoring to provide spatial resolution
US12420373B2 (en) 2021-03-05 2025-09-23 Applied Materials, Inc. Control of processing parameters during substrate polishing using cost function
CN113246012B (zh) * 2021-05-14 2022-08-09 上海华力集成电路制造有限公司 化学机械研磨的控制方法、设备和存储介质
JP2024040885A (ja) * 2022-09-13 2024-03-26 株式会社荏原製作所 研磨装置におけるグラフの表示方法およびコンピュータプログラム
CN115946036B (zh) * 2022-12-15 2025-08-05 北京晶亦精微科技股份有限公司 一种研磨压力修整方法、装置、计算机设备及介质
CN117140200A (zh) * 2023-09-19 2023-12-01 安徽久泰电气有限公司 一种打磨机器人全自动打磨抛光控制方法及系统

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5681215A (en) * 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US6491569B2 (en) * 2001-04-19 2002-12-10 Speedfam-Ipec Corporation Method and apparatus for using optical reflection data to obtain a continuous predictive signal during CMP
JP3932836B2 (ja) 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6945845B2 (en) * 2003-03-04 2005-09-20 Applied Materials, Inc. Chemical mechanical polishing apparatus with non-conductive elements
US6991516B1 (en) * 2003-08-18 2006-01-31 Applied Materials Inc. Chemical mechanical polishing with multi-stage monitoring of metal clearing
US7074109B1 (en) * 2003-08-18 2006-07-11 Applied Materials Chemical mechanical polishing control system and method
JP4464642B2 (ja) * 2003-09-10 2010-05-19 株式会社荏原製作所 研磨状態監視装置、研磨状態監視方法、研磨装置及び研磨方法
EP1758711B1 (en) * 2004-06-21 2013-08-07 Ebara Corporation Polishing apparatus and polishing method
JP4689367B2 (ja) * 2004-07-09 2011-05-25 株式会社荏原製作所 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置
KR101361875B1 (ko) * 2005-05-26 2014-02-12 가부시키가이샤 니콘 Ｃｍｐ 연마 장치에서의 연마 종료점 검출 방법, ｃｍｐ연마 장치, 및 반도체 디바이스의 제조 방법
KR101324644B1 (ko) * 2005-08-22 2013-11-01 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
KR101423579B1 (ko) * 2005-08-22 2014-07-25 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US8260446B2 (en) * 2005-08-22 2012-09-04 Applied Materials, Inc. Spectrographic monitoring of a substrate during processing using index values
US8392012B2 (en) * 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
EP2125291A4 (en) * 2007-02-23 2013-08-07 Applied Materials Inc USE OF SPECTROS FOR THE DETERMINATION OF POLISHING POINTS
WO2010028180A2 (en) * 2008-09-04 2010-03-11 Applied Materials, Inc. Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
US20100103422A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
JP5774482B2 (ja) * 2008-10-27 2015-09-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理中の基板の分光モニタリングにおける適合度
US20100114532A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Weighted spectrographic monitoring of a substrate during processing
US8295967B2 (en) 2008-11-07 2012-10-23 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US20100120331A1 (en) * 2008-11-07 2010-05-13 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
KR101715726B1 (ko) * 2008-11-26 2017-03-13 어플라이드 머티어리얼스, 인코포레이티드 피드 백 및 피드 포워드 프로세스 제어를 위한 광학적 측정 이용
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing

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