JP2013526040A5 - - Google Patents

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Publication number
JP2013526040A5
JP2013526040A5 JP2013506306A JP2013506306A JP2013526040A5 JP 2013526040 A5 JP2013526040 A5 JP 2013526040A5 JP 2013506306 A JP2013506306 A JP 2013506306A JP 2013506306 A JP2013506306 A JP 2013506306A JP 2013526040 A5 JP2013526040 A5 JP 2013526040A5
Authority
JP
Japan
Prior art keywords
single board
board computer
clamping device
heat
wedge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2013506306A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013526040A (ja
Filing date
Publication date
Priority claimed from US12/766,608 external-priority patent/US8270172B2/en
Application filed filed Critical
Publication of JP2013526040A publication Critical patent/JP2013526040A/ja
Publication of JP2013526040A5 publication Critical patent/JP2013526040A5/ja
Withdrawn legal-status Critical Current

Links

JP2013506306A 2010-04-23 2011-04-21 シングルボードコンピュータと共に使用する楔形ロック部、シングルボードコンピュータ、及びコンピュータシステムの組立方法 Withdrawn JP2013526040A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/766,608 US8270172B2 (en) 2010-04-23 2010-04-23 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
US12/766,608 2010-04-23
PCT/US2011/033438 WO2011133777A1 (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system

Publications (2)

Publication Number Publication Date
JP2013526040A JP2013526040A (ja) 2013-06-20
JP2013526040A5 true JP2013526040A5 (enExample) 2014-05-29

Family

ID=44121019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013506306A Withdrawn JP2013526040A (ja) 2010-04-23 2011-04-21 シングルボードコンピュータと共に使用する楔形ロック部、シングルボードコンピュータ、及びコンピュータシステムの組立方法

Country Status (10)

Country Link
US (1) US8270172B2 (enExample)
EP (1) EP2561733B1 (enExample)
JP (1) JP2013526040A (enExample)
KR (1) KR20130098851A (enExample)
CN (1) CN102845142A (enExample)
AU (1) AU2011242649A1 (enExample)
CA (1) CA2796919C (enExample)
MX (1) MX2012012218A (enExample)
TW (1) TW201214091A (enExample)
WO (1) WO2011133777A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US9658000B2 (en) 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
CN104704370B (zh) 2012-10-08 2017-05-10 通用电气公司 用于测试lal反应物质的预装载的测试基板、使用方法和制备方法
WO2014178817A1 (en) 2013-04-29 2014-11-06 GE Intelligent Platforms Embedded Systems, Inc. Circuit card assembly with thermal energy removal
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
CN106797709A (zh) * 2014-10-06 2017-05-31 通用电气智能平台有限公司 具有热能移除功能的电路卡组件
AT518126B1 (de) * 2015-12-01 2020-01-15 Melecs Ews Gmbh Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren
DE102017127607A1 (de) * 2017-11-22 2019-05-23 Liebherr-Elektronik Gmbh Fixierungsvorrichtung zur Fixierung ein oder mehrerer Leiterplatten an einer Gehäusewand
US10381760B2 (en) 2018-01-05 2019-08-13 Hamilton Sundstrand Corporation Printed circuit board edge electrical contact pads
JP6828903B2 (ja) * 2018-04-23 2021-02-10 合同会社スイッチオン シングルボードコンピュータ用アダプタ
FR3097978B1 (fr) * 2019-06-28 2021-06-25 Valeo Vision Module optique comprenant une matrice de micro-miroirs
US11997815B2 (en) * 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
DE102022204912A1 (de) 2022-05-18 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung für eine Arretierung einer Elektronikbaugruppe eines Kraftfahrzeugs

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US4879634A (en) 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US5010444A (en) 1987-11-13 1991-04-23 Radstone Technology Limited Rack mounted circuit board
US5887435A (en) * 1995-12-08 1999-03-30 Litton Systems, Inc. Environmentally protected module
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
US6246582B1 (en) * 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6239972B1 (en) * 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions
US6873528B2 (en) 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
US8317968B2 (en) * 2004-04-30 2012-11-27 Lam Research Corporation Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7476108B2 (en) * 2004-12-22 2009-01-13 Fci Americas Technology, Inc. Electrical power connectors with cooling features
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis

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