CN102845142A - 供单板计算机使用的楔锁、单板计算机以及装配计算机系统的方法 - Google Patents

供单板计算机使用的楔锁、单板计算机以及装配计算机系统的方法 Download PDF

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Publication number
CN102845142A
CN102845142A CN2011800202830A CN201180020283A CN102845142A CN 102845142 A CN102845142 A CN 102845142A CN 2011800202830 A CN2011800202830 A CN 2011800202830A CN 201180020283 A CN201180020283 A CN 201180020283A CN 102845142 A CN102845142 A CN 102845142A
Authority
CN
China
Prior art keywords
single board
board computer
thermal
pcb
wedge lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800202830A
Other languages
English (en)
Chinese (zh)
Inventor
B.斯波雷尔
R.爱尔兰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems Inc
Original Assignee
GE Fanuc Embedded Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Fanuc Embedded Systems Inc filed Critical GE Fanuc Embedded Systems Inc
Publication of CN102845142A publication Critical patent/CN102845142A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2011800202830A 2010-04-23 2011-04-21 供单板计算机使用的楔锁、单板计算机以及装配计算机系统的方法 Pending CN102845142A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/766,608 US8270172B2 (en) 2010-04-23 2010-04-23 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
US12/766,608 2010-04-23
PCT/US2011/033438 WO2011133777A1 (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system

Publications (1)

Publication Number Publication Date
CN102845142A true CN102845142A (zh) 2012-12-26

Family

ID=44121019

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800202830A Pending CN102845142A (zh) 2010-04-23 2011-04-21 供单板计算机使用的楔锁、单板计算机以及装配计算机系统的方法

Country Status (10)

Country Link
US (1) US8270172B2 (enExample)
EP (1) EP2561733B1 (enExample)
JP (1) JP2013526040A (enExample)
KR (1) KR20130098851A (enExample)
CN (1) CN102845142A (enExample)
AU (1) AU2011242649A1 (enExample)
CA (1) CA2796919C (enExample)
MX (1) MX2012012218A (enExample)
TW (1) TW201214091A (enExample)
WO (1) WO2011133777A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106797709A (zh) * 2014-10-06 2017-05-31 通用电气智能平台有限公司 具有热能移除功能的电路卡组件
CN109819620A (zh) * 2017-11-22 2019-05-28 利勃海尔-电子有限责任公司 用于将一个或多个印刷电路板固定到壳体壁上的固定装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US9658000B2 (en) 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
CN104704370B (zh) 2012-10-08 2017-05-10 通用电气公司 用于测试lal反应物质的预装载的测试基板、使用方法和制备方法
WO2014178817A1 (en) 2013-04-29 2014-11-06 GE Intelligent Platforms Embedded Systems, Inc. Circuit card assembly with thermal energy removal
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
AT518126B1 (de) * 2015-12-01 2020-01-15 Melecs Ews Gmbh Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren
US10381760B2 (en) 2018-01-05 2019-08-13 Hamilton Sundstrand Corporation Printed circuit board edge electrical contact pads
JP6828903B2 (ja) * 2018-04-23 2021-02-10 合同会社スイッチオン シングルボードコンピュータ用アダプタ
FR3097978B1 (fr) * 2019-06-28 2021-06-25 Valeo Vision Module optique comprenant une matrice de micro-miroirs
US11997815B2 (en) * 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
DE102022204912A1 (de) 2022-05-18 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung für eine Arretierung einer Elektronikbaugruppe eines Kraftfahrzeugs

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US20030223197A1 (en) * 2002-05-28 2003-12-04 Dy-04 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
CN101018884A (zh) * 2004-04-30 2007-08-15 兰姆研究公司 包含输送工艺气体和射频功率的气体分配单元的等离子处理设备
CN101084608A (zh) * 2004-12-22 2007-12-05 Fci公司 电连接器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4879634A (en) 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US5010444A (en) 1987-11-13 1991-04-23 Radstone Technology Limited Rack mounted circuit board
US5887435A (en) * 1995-12-08 1999-03-30 Litton Systems, Inc. Environmentally protected module
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
US6246582B1 (en) * 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6239972B1 (en) * 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions
US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US20030223197A1 (en) * 2002-05-28 2003-12-04 Dy-04 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
CN101018884A (zh) * 2004-04-30 2007-08-15 兰姆研究公司 包含输送工艺气体和射频功率的气体分配单元的等离子处理设备
CN101084608A (zh) * 2004-12-22 2007-12-05 Fci公司 电连接器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106797709A (zh) * 2014-10-06 2017-05-31 通用电气智能平台有限公司 具有热能移除功能的电路卡组件
CN109819620A (zh) * 2017-11-22 2019-05-28 利勃海尔-电子有限责任公司 用于将一个或多个印刷电路板固定到壳体壁上的固定装置
CN109819620B (zh) * 2017-11-22 2021-12-07 利勃海尔-电子有限责任公司 用于将一个或多个印刷电路板固定到壳体壁上的固定装置

Also Published As

Publication number Publication date
US20110261537A1 (en) 2011-10-27
TW201214091A (en) 2012-04-01
WO2011133777A1 (en) 2011-10-27
CA2796919C (en) 2018-06-26
MX2012012218A (es) 2012-12-17
CA2796919A1 (en) 2011-10-27
US8270172B2 (en) 2012-09-18
JP2013526040A (ja) 2013-06-20
AU2011242649A1 (en) 2012-11-08
KR20130098851A (ko) 2013-09-05
EP2561733B1 (en) 2019-08-28
EP2561733A1 (en) 2013-02-27

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Application publication date: 20121226