JP2013518145A - 光電池用シート - Google Patents
光電池用シート Download PDFInfo
- Publication number
- JP2013518145A JP2013518145A JP2012549953A JP2012549953A JP2013518145A JP 2013518145 A JP2013518145 A JP 2013518145A JP 2012549953 A JP2012549953 A JP 2012549953A JP 2012549953 A JP2012549953 A JP 2012549953A JP 2013518145 A JP2013518145 A JP 2013518145A
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- JP
- Japan
- Prior art keywords
- chemical formula
- group
- sheet
- sio
- silicone resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000126 substance Substances 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 229920002050 silicone resin Polymers 0.000 claims description 36
- 125000003118 aryl group Chemical group 0.000 claims description 33
- -1 methacryloyl group Chemical group 0.000 claims description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 20
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000003566 sealing material Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 3
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 2
- 229920006254 polymer film Polymers 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- 210000004027 cell Anatomy 0.000 description 44
- 239000010410 layer Substances 0.000 description 38
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 24
- 150000001875 compounds Chemical class 0.000 description 21
- 229920001296 polysiloxane Polymers 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- 125000004432 carbon atom Chemical group C* 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- 239000011342 resin composition Substances 0.000 description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 238000006459 hydrosilylation reaction Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229920002313 fluoropolymer Polymers 0.000 description 3
- 239000004811 fluoropolymer Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000005375 organosiloxane group Chemical group 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- JNGZXGGOCLZBFB-IVCQMTBJSA-N compound E Chemical compound N([C@@H](C)C(=O)N[C@@H]1C(N(C)C2=CC=CC=C2C(C=2C=CC=CC=2)=N1)=O)C(=O)CC1=CC(F)=CC(F)=C1 JNGZXGGOCLZBFB-IVCQMTBJSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 210000004692 intercellular junction Anatomy 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229920005588 metal-containing polymer Polymers 0.000 description 1
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10798—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing silicone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
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Abstract
Description
(R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d
R1R2SiO2/2
R3SiO3/2
(C6H5)(CH3)SiO2/2
(C6H5)2SiO2/2
(C6H5)SiO3/2
(ViMe2SiO1/2)2(MePhSiO2/2)30
(ViMe2SiO1/2)2(Ph2SiO2/2)20(Me2SiO2/2)20
(ViMe2SiO1/2)2(Ph2SiO2/2)15(Me2SiO2/2)15(MeEpSiO2/2)5
(ViMe2SiO1/2)3(PhSiO3/2)10
(ViMe2SiO1/2)3(PhSiO3/2)10(MeSiO3/2)2
(ViMe2SiO1/2)3(PhSiO3/2)10(MeEpSiO2/2)5
(HMe2SiO1/2)3(PhSiO3/2)10
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)20
(HMe2SiO1/2)3(PhSiO3/2)10(MeEpSiO2/2)5
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
(PhSiO3/2)10(MePhSiO2/2)10(Me2SiO2/2)10
(PhSiO3/2)5(EpMeSiO2/2)2(Me2SiO2/2)10
(PhSiO3/2)5(AcSiO3/2)5(MePhSiO2/2)10
(PhSiO3/2)10(AcSiO3/2)5(ViMe2SiO1/2)5
[樹脂組成物(A)及び(B)の製造]
公知の方式で合成したオルガノシロキサン化合物として、各々下記の化学式A、B、C及びDで表示される化合物を混合して、ヒドロシリル化反応硬化性シロキサン組成物を製造した(配合量:化合物A:100g、化合物B:10g、化合物C:200g、化合物D:60g)。次に、前記組成物にPt(0)の含量が20ppmになる量で触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して樹脂組成物(A)を製造した。前記組成物(A)に平均粒径が100nmであり、400nmの波長に対する屈折率が約2.2である高屈折フィラー(TiO2)80gを混合して樹脂組成物(B)を製造した。
(ViMe2SiO1/2)2(Ph2SiO2/2)10(Me2SiO2/2)10
(ViMe2SiO1/2)2(EpSiO3/2)3(MePhSiO2/2)15
(ViMe2SiO1/2)3(MePhSiO2/2)1(PhSiO3/2)9
(HMe2SiO1/2)2(Ph2SiO2/2)1.5
前記製造した樹脂組成物(B)をポリエチレンテレフタレート(以下、「PET」)シートの両面に200μmの厚さの樹脂を形成するようにコーティング及び硬化させて、光電池用シートを製造した。前記コーティング後の硬化は、コーティング層を150℃で1時間処理して実行した。
[組成物(C)および(D)の製造]
公知の方式で合成したオルガノシロキサン化合物として、各々下記の化学式E乃至Gで表示される化合物を混合して、ヒドロシリル化反応硬化性樹脂組成物を製造した(配合量:化合物E:100g、化合物F:20g、化合物G:50g)。次に、前記組成物にPt(0)の含量が10ppmになる量で触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して樹脂組成物(C)を製造した。前記組成物(C)に第1の実施例と同一の高屈折フィラー(TiO2)40gを混合して樹脂組成物(D)を製造した。
(ViMe2SiO1/2)2(ViMeSiO2/2)15(MeSiO3/2)5(Me2SiO2/2)50
(ViMe2SiO1/2)2(MeSiO3/2)6(PhSiO3/2)1.5
(HMe2SiO1/2)2(HMeSiO2/2)2(Me2SiO2/2)10
前記製造した樹脂組成物(D)をPETシートの両面に200μmの厚さの樹脂層を形成するようにコーティング及び硬化させて、光電池用シートを製造した。前記コーティング後の硬化は、コーティング層を150℃で1時間処理して実行した。
[樹脂組成物(E)の製造]
公知の方式で合成したオルガノシロキサン化合物として、各々下記の化学式H乃至Jで表示される化合物を混合して、ヒドロシリル化反応硬化性シロキサン組成物を製造した(配合量:化合物H:100g、化合物I:20g、化合物J:50g)。次に、前記組成物にPt(0)含量が20ppmになるように触媒(Platinum(0)−1,3−divinyl−1,1,3,3−tetramethyldisiloxane)を配合し、均一に混合して樹脂組成物(E)を製造した。
(ViPh2SiO1/2)2(Me2SiO2/2)20
(ViPh2SiO1/2)3(MeSiO3/2)10
(HMe2SiO1/2)2(HMeSiO2/2)2(Me2SiO2/2)10
前記製造した樹脂組成物(E)をPETシートの両面に200μmの厚さの樹脂層を形成するようにコーティング及び硬化させて、光電池用シートを製造した。前記コーティング後の硬化は、コーティング層を150℃で1時間処理して実行した。
[(1) 水分透過性の測定]
第1の実施例の組成物(A)、第1の比較例の組成物(C)、及び第2の比較例の組成物(E)を150℃で1時間硬化させて、厚さが1mmである板状試片を製造し、前記試片に対して、水分透過性を測定した。具体的には、製造された試片の厚さ方向に対して、モコン装備を利用して同一の条件で水分透過性を測定して、その結果を下記表1に記載した。
第1の実施例の組成物(A)、第1の比較例の組成物(C)、及び第2の比較例の組成物(E)をPETシートに同一厚さでコーティング及び硬化させた後、85℃の温度及び85%の相対湿度の条件で1,000時間放置した後、樹脂層とPET層との間に剥離現状が誘発されるか否かを観察して、下記方式で評価した。
○:樹脂層及びPETシートの界面で剥離が発生しない場合
×:樹脂及びPETシートの界面で剥離が発生した場合
水分透過度測定に使用したものと同一の各試片に対してQ−UVA(340nm、0.89W/Cm2)装備で60℃で3日間光を照射し、黄変発生の有無を評価して、下記基準に基づく結果を記載した。
○:450nmの波長の光に対する吸収率が5%未満の場合
×:450nmの波長の光に対する吸収率が5%以上の場合
11:樹脂層
12:基材
23:高分子コーティング層
3、4:光電池モジュール
31、41:前面基板
32a、32b、42:封止層
33、43:光電変換素子
34、44:支持基板
Claims (16)
- 樹脂層を含む光電池用シートであって、
前記樹脂層が、ケイ素原子に結合したアリール基を有するシリコーン樹脂を含み、
前記アリール基の、前記シリコーン樹脂に含まれる全てのケイ素原子に対するモル比が、0.3を超過する、光電池用シート。 - 前記シリコーン樹脂に含まれる全てのケイ素原子に対するケイ素原子に結合したアリール基のモル比が0.5を超過する、請求項1に記載の光電池用シート。
- 前記シリコーン樹脂に含まれる全てのケイ素原子に対するケイ素原子に結合したアリール基のモル比が0.7以上である、請求項1に記載の光電池用シート。
- 前記シリコーン樹脂が有するアリール基がフェニル基である、請求項1に記載の光電池用シート。
- 前記シリコーン樹脂が、下記化学式1の平均組成式で表示される、請求項1に記載の光電池用シート。
[化学式1]:
(R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d
(前記化学式1において、Rは、ケイ素原子に直接結合した置換基であり、各々独立に、水素、ヒドロキシ基、エポキシ基、アクリロイル基、メタクリロイル基、イソシアネート基、アルコキシ基、または1価炭化水素基を示し、但し、Rの少なくとも一つはアリール基を示し、aは、0乃至0.6であり、bは、0乃至0.97であり、cは、0乃至0.8であり、dは、0乃至0.4である。但し、a+b+c+dは、1であり、b及びcは同時に0ではない。) - 前記Rの少なくとも一つが、ヒドロキシ基、エポキシ基、アクリロイル基、メタクリロイル基、またはビニル基である、請求項5に記載の光電池用シート。
- 前記Rの中で少なくとも一つが、エポキシ基である、請求項5に記載の光電池用シート。
- 前記化学式1の平均組成式で表示されるシリコーン樹脂が、下記化学式2または化学式3のシロキサン単位を含む、請求項5に記載の光電池用シート。
[化学式2]:
R1R2SiO2/2
[化学式3]:
R3SiO3/2
(前記化学式2及び3において、R1及びR2は、各々独立にアルキル基またはアリール基を示し、但し、R1及びR2の少なくとも一つはアリール基であり、R3は、アリール基を示す。) - 前記シリコーン樹脂に含まれるケイ素原子に結合した全てのアリール基が、化学式2または化学式3のシロキサン単位に含まれる、請求項8に記載の光電池用シート。
- 前記化学式2のシロキサン単位が、下記化学式4及び化学式5のシロキサン単位から選択される一つ以上である、請求項8に記載の光電池用シート。
[化学式4]:
(C6H5)(CH3)SiO2/2
[化学式5]:
(C6H5)2SiO2/2 - 前記化学式3のシロキサン単位が下記化学式6のシロキサン単位である、請求項8に記載の光電池用シート。
[化学式6]:
(C6H5)SiO3/2 - 前記シリコーン樹脂の重量平均分子量が、300乃至100,000である、請求項1に記載の光電池用シート。
- 基材をさらに含み、前記樹脂層が前記基材上に形成されている、請求項1に記載の光電池用シート。
- 前記基材が、金属箔、フッ素系重合体フィルム、ポリエステル系フィルム、またはこれらの2種以上からなる積層シートである、請求項12に記載の光電池用シート。
- ケイ素原子に結合したアリール基を有するシリコーン樹脂であって、前記シリコーン樹脂に含まれる全てのケイ素原子に対する前記アリール基のモル比が0.3を超過するシリコーン樹脂を形成することができる液状のケイ素系材料をコーティングし、コーティングした材料を硬化または乾燥させる段階を経て樹脂層を形成させる過程を含む、光電池用シートの製造方法。
- 請求項1による光電池用シート;前面基板;及び、前記光電池用シートと前面基板との間で光電変換素子をカプセル化している封止材を含む、光電池モジュール。
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