JP2013513694A5 - - Google Patents

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Publication number
JP2013513694A5
JP2013513694A5 JP2012543162A JP2012543162A JP2013513694A5 JP 2013513694 A5 JP2013513694 A5 JP 2013513694A5 JP 2012543162 A JP2012543162 A JP 2012543162A JP 2012543162 A JP2012543162 A JP 2012543162A JP 2013513694 A5 JP2013513694 A5 JP 2013513694A5
Authority
JP
Japan
Prior art keywords
epoxy resin
mass
composition according
moiety
dioxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012543162A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013513694A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2010/058695 external-priority patent/WO2011071745A1/en
Publication of JP2013513694A publication Critical patent/JP2013513694A/ja
Publication of JP2013513694A5 publication Critical patent/JP2013513694A5/ja
Withdrawn legal-status Critical Current

Links

JP2012543162A 2009-12-09 2010-12-02 エポキシ樹脂組成物 Withdrawn JP2013513694A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US26794709P 2009-12-09 2009-12-09
US61/267,947 2009-12-09
PCT/US2010/058695 WO2011071745A1 (en) 2009-12-09 2010-12-02 Epoxy resin compositions

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015146610A Division JP2015212399A (ja) 2009-12-09 2015-07-24 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JP2013513694A JP2013513694A (ja) 2013-04-22
JP2013513694A5 true JP2013513694A5 (enExample) 2014-01-23

Family

ID=43858785

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012543162A Withdrawn JP2013513694A (ja) 2009-12-09 2010-12-02 エポキシ樹脂組成物
JP2015146610A Pending JP2015212399A (ja) 2009-12-09 2015-07-24 エポキシ樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015146610A Pending JP2015212399A (ja) 2009-12-09 2015-07-24 エポキシ樹脂組成物

Country Status (8)

Country Link
US (1) US20120238711A1 (enExample)
EP (1) EP2510042A1 (enExample)
JP (2) JP2013513694A (enExample)
KR (1) KR20120114295A (enExample)
CN (1) CN102666649A (enExample)
BR (1) BR112012013527A2 (enExample)
TW (1) TW201130876A (enExample)
WO (1) WO2011071745A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011163282A2 (en) * 2010-06-25 2011-12-29 Dow Global Technologies Llc Curable epoxy resin compositions and composites made therefrom
BR112013029224B1 (pt) * 2011-05-13 2021-03-09 Dow Global Technologies Llc composição de formulação de resina epóxi curável, processo para preparar uma composição de formulação de resina epóxi curável, processo para preparar um material isolante de epóxi e produto
JP2015502413A (ja) * 2011-11-01 2015-01-22 ダウ グローバル テクノロジーズ エルエルシー 液状エポキシ樹脂配合物
CN103917570A (zh) * 2011-11-08 2014-07-09 陶氏环球技术有限责任公司 可固化组合物
AU2015371229B2 (en) * 2014-12-23 2019-09-12 Dow Global Technologies Llc Treated porous material
KR102344683B1 (ko) 2017-09-04 2021-12-30 삼성디스플레이 주식회사 표시 장치용 차폐 잉크층 및 그 제조 방법
WO2022044507A1 (ja) * 2020-08-31 2022-03-03 昭和電工株式会社 硬化性樹脂組成物、電気電子部品、及び電気電子部品の製造方法

Family Cites Families (26)

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US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US2912389A (en) * 1957-08-08 1959-11-10 Union Carbide Corp Polymers of divinylbenzene dioxide
US2924580A (en) * 1957-08-08 1960-02-09 Union Carbide Corp Divinyl benzene dioxide compositions
US2982752A (en) 1958-04-25 1961-05-02 Union Carbide Corp Composition comprising a polyepoxide and divinylbenzene dioxide
US3455967A (en) * 1965-09-23 1969-07-15 Dow Chemical Co Synthesis of aromatic epoxides from benzylic sulfonium salts
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
AU711786B2 (en) * 1997-05-16 1999-10-21 National Starch And Chemical Investment Holding Corporation Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
CN102653598B (zh) 2004-05-28 2015-05-13 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
JP5248860B2 (ja) 2004-11-10 2013-07-31 ダウ グローバル テクノロジーズ エルエルシー 両親媒性ブロックコポリマーにより靭性を付与したエポキシ樹脂及びそれらから製造された電気用積層板
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
CN101796443A (zh) * 2007-09-06 2010-08-04 3M创新有限公司 具有提供输出光区域控制的光提取结构的光导装置
JP5450386B2 (ja) * 2008-03-27 2014-03-26 新日鉄住金化学株式会社 エポキシ樹脂組成物及び硬化物
BRPI0918349A2 (pt) * 2008-12-30 2015-08-11 Dow Global Technologies Llc Processo para preparar dióxido de divinilareno
CN102341426B (zh) * 2009-03-05 2013-07-24 新日铁住金化学株式会社 环氧树脂组合物
KR101716634B1 (ko) * 2009-03-31 2017-03-14 신닛테츠 수미킨 가가쿠 가부시키가이샤 에폭시수지, 에폭시수지 조성물 및 경화물
CN102741236B (zh) * 2009-11-04 2015-05-20 陶氏环球技术有限责任公司 制备二乙烯基芳烃二氧化物的方法
EP2504394B1 (en) * 2009-11-23 2014-11-05 Dow Global Technologies LLC Toughened epoxy resin formulations

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