JP2013253220A5 - - Google Patents

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Publication number
JP2013253220A5
JP2013253220A5 JP2012252154A JP2012252154A JP2013253220A5 JP 2013253220 A5 JP2013253220 A5 JP 2013253220A5 JP 2012252154 A JP2012252154 A JP 2012252154A JP 2012252154 A JP2012252154 A JP 2012252154A JP 2013253220 A5 JP2013253220 A5 JP 2013253220A5
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JP
Japan
Prior art keywords
melting point
present
compound
bismaleimide compound
epoxy resin
Prior art date
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Application number
JP2012252154A
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English (en)
Japanese (ja)
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JP6052868B2 (ja
JP2013253220A (ja
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Priority to JP2012252154A priority Critical patent/JP6052868B2/ja
Priority claimed from JP2012252154A external-priority patent/JP6052868B2/ja
Publication of JP2013253220A publication Critical patent/JP2013253220A/ja
Publication of JP2013253220A5 publication Critical patent/JP2013253220A5/ja
Application granted granted Critical
Publication of JP6052868B2 publication Critical patent/JP6052868B2/ja
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Anticipated expiration legal-status Critical

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JP2012252154A 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途 Active JP6052868B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012252154A JP6052868B2 (ja) 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012109574 2012-05-11
JP2012109574 2012-05-11
JP2012252154A JP6052868B2 (ja) 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途

Publications (3)

Publication Number Publication Date
JP2013253220A JP2013253220A (ja) 2013-12-19
JP2013253220A5 true JP2013253220A5 (enExample) 2015-09-10
JP6052868B2 JP6052868B2 (ja) 2016-12-27

Family

ID=49951017

Family Applications (1)

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JP2012252154A Active JP6052868B2 (ja) 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途

Country Status (1)

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JP (1) JP6052868B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6192523B2 (ja) * 2013-03-05 2017-09-06 エア・ウォーター株式会社 エポキシ樹脂の硬化剤、製法、およびその用途
JP5918425B1 (ja) * 2015-06-23 2016-05-18 エア・ウォーター株式会社 イミド基含有ナフトール樹脂製造方法、熱硬化性樹脂組成物およびその硬化物ならびに用途
JP7424168B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP7424167B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05331263A (ja) * 1992-06-02 1993-12-14 Mitsui Toatsu Chem Inc 樹脂組成物
JPH0790054A (ja) * 1993-09-20 1995-04-04 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP4310668B2 (ja) * 1998-07-15 2009-08-12 日立化成工業株式会社 エポキシ樹脂組成物及び電子部品装置
JP2004168930A (ja) * 2002-11-21 2004-06-17 Mitsui Chemicals Inc 変性ポリイミド樹脂組成物およびその用途
JP2008063371A (ja) * 2006-09-05 2008-03-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置

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