JP2013253220A5 - - Google Patents

Download PDF

Info

Publication number
JP2013253220A5
JP2013253220A5 JP2012252154A JP2012252154A JP2013253220A5 JP 2013253220 A5 JP2013253220 A5 JP 2013253220A5 JP 2012252154 A JP2012252154 A JP 2012252154A JP 2012252154 A JP2012252154 A JP 2012252154A JP 2013253220 A5 JP2013253220 A5 JP 2013253220A5
Authority
JP
Japan
Prior art keywords
melting point
present
compound
bismaleimide compound
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012252154A
Other languages
English (en)
Japanese (ja)
Other versions
JP6052868B2 (ja
JP2013253220A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012252154A priority Critical patent/JP6052868B2/ja
Priority claimed from JP2012252154A external-priority patent/JP6052868B2/ja
Publication of JP2013253220A publication Critical patent/JP2013253220A/ja
Publication of JP2013253220A5 publication Critical patent/JP2013253220A5/ja
Application granted granted Critical
Publication of JP6052868B2 publication Critical patent/JP6052868B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012252154A 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途 Active JP6052868B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012252154A JP6052868B2 (ja) 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012109574 2012-05-11
JP2012109574 2012-05-11
JP2012252154A JP6052868B2 (ja) 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途

Publications (3)

Publication Number Publication Date
JP2013253220A JP2013253220A (ja) 2013-12-19
JP2013253220A5 true JP2013253220A5 (enExample) 2015-09-10
JP6052868B2 JP6052868B2 (ja) 2016-12-27

Family

ID=49951017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012252154A Active JP6052868B2 (ja) 2012-05-11 2012-11-16 エポキシ樹脂の硬化剤、製法、およびその用途

Country Status (1)

Country Link
JP (1) JP6052868B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6192523B2 (ja) * 2013-03-05 2017-09-06 エア・ウォーター株式会社 エポキシ樹脂の硬化剤、製法、およびその用途
JP5918425B1 (ja) * 2015-06-23 2016-05-18 エア・ウォーター株式会社 イミド基含有ナフトール樹脂製造方法、熱硬化性樹脂組成物およびその硬化物ならびに用途
JP7424168B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP7424167B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05331263A (ja) * 1992-06-02 1993-12-14 Mitsui Toatsu Chem Inc 樹脂組成物
JPH0790054A (ja) * 1993-09-20 1995-04-04 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP4310668B2 (ja) * 1998-07-15 2009-08-12 日立化成工業株式会社 エポキシ樹脂組成物及び電子部品装置
JP2004168930A (ja) * 2002-11-21 2004-06-17 Mitsui Chemicals Inc 変性ポリイミド樹脂組成物およびその用途
JP2008063371A (ja) * 2006-09-05 2008-03-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置

Similar Documents

Publication Publication Date Title
JP2019526717A5 (enExample)
JP2016530380A5 (enExample)
JP2016503113A5 (enExample)
MY156527A (en) Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product
JP2014509678A5 (enExample)
JP2013504665A5 (enExample)
JP2013253220A5 (enExample)
ATE523544T1 (de) Alkylierte aminopropylierte ethyendiamine und verwendungen davon
JP2015158628A5 (enExample)
JP2015520782A5 (enExample)
MX2011011302A (es) Composiciones granuladas de polimeros aromaticos bromados de bajo peso molecular.
JP2007291236A5 (enExample)
JP2015134755A5 (enExample)
BR112014017220A2 (pt) composições aglutinantes e métodos para fabricar e utilizar as mesmas
TW201612213A (en) Polyamide ester resin, method for preparing the same, and molded article including the same
JP2015134710A5 (enExample)
JP2015500361A5 (enExample)
TWI456004B (zh) 液晶配向劑、液晶配向膜及液晶顯示元件
HK1160344A2 (en) Hardeners for thermosettable resin compositions
WO2011084810A3 (en) 2,4,5-triaminophenols and related compounds
JP2014515424A5 (enExample)
WO2011087809A3 (en) 2,4,5-triaminophenols and related compounds
WO2011084771A3 (en) 2,4,5-triaminophenols and related compounds
WO2012076886A3 (en) Process for the preparation of semiconductor materials, compounds and their use
JP2011170151A5 (enExample)