JP2013501823A - Ｃｍｐパッド用ポリウレタン組成物及びそれを製造する方法 - Google Patents

Ｃｍｐパッド用ポリウレタン組成物及びそれを製造する方法 Download PDF

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Publication number
JP2013501823A
JP2013501823A JP2012523628A JP2012523628A JP2013501823A JP 2013501823 A JP2013501823 A JP 2013501823A JP 2012523628 A JP2012523628 A JP 2012523628A JP 2012523628 A JP2012523628 A JP 2012523628A JP 2013501823 A JP2013501823 A JP 2013501823A
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JP
Japan
Prior art keywords
prepolymer
polishing pad
mechanical polishing
chemical mechanical
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012523628A
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English (en)
Japanese (ja)
Inventor
チャン、ヨン
ホアン、デイビッド
サン、ルー
Original Assignee
プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド filed Critical プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド
Publication of JP2013501823A publication Critical patent/JP2013501823A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
    • C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0041—Foam properties having specified density
    • C08G2110/0066—≥ 150kg/m3

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012523628A 2009-08-07 2010-07-16 Ｃｍｐパッド用ポリウレタン組成物及びそれを製造する方法 Pending JP2013501823A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/537,862 2009-08-07
US12/537,862 US8551201B2 (en) 2009-08-07 2009-08-07 Polyurethane composition for CMP pads and method of manufacturing same
PCT/US2010/042281 WO2011016971A1 (en) 2009-08-07 2010-07-16 Polyurethane composition for cmp pads and method of manufacturing same

Publications (1)

Publication Number Publication Date
JP2013501823A true JP2013501823A (ja) 2013-01-17

Family

ID=42732397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012523628A Pending JP2013501823A (ja) 2009-08-07 2010-07-16 Ｃｍｐパッド用ポリウレタン組成物及びそれを製造する方法

Country Status (9)

Country Link
US (2) US8551201B2 (enExample)
EP (1) EP2462178A1 (enExample)
JP (1) JP2013501823A (enExample)
KR (1) KR20120052282A (enExample)
CN (1) CN102574969A (enExample)
IN (1) IN2012DN00982A (enExample)
SG (1) SG178247A1 (enExample)
TW (1) TW201122033A (enExample)
WO (1) WO2011016971A1 (enExample)

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JP2016129223A (ja) * 2014-12-19 2016-07-14 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 高安定性ポリウレタン研磨パッド
WO2017056903A1 (ja) * 2015-10-02 2017-04-06 Dic株式会社 ポリウレタンエラストマーの製造方法
JP2017226828A (ja) * 2016-06-17 2017-12-28 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 高除去速度ケミカルメカニカル研磨パッド及び製造方法
CN112692725A (zh) * 2019-10-23 2021-04-23 Skc索密思株式会社 抛光垫用组合物及抛光垫
JP2021109277A (ja) * 2020-01-10 2021-08-02 ニッタ・デュポン株式会社 研磨パッド

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DE102009053224A1 (de) * 2009-11-06 2011-07-14 Bayer MaterialScience AG, 51373 Verfahren zur Herstellung eines Polyurethanschaums und hieraus erhältlicher Polyurethanschaum
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
CL2013000959A1 (es) * 2013-03-15 2013-08-23 Sika Technology Ag Composicion en base a poliuretano que comprende un prepolimero de poliuretano, un agente de curado que comprende una poliamina aromatica mononuclear, un disolvente y un plastificante; metodo de reparacion de defectos en sustratos elasticos; proceso de union de sustratos flexibles; y uso de dicha composicion.
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
KR102066002B1 (ko) * 2013-06-10 2020-02-11 삼성전자주식회사 연마 패드 조성물
US9102034B2 (en) 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9776300B2 (en) * 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
CN107452663A (zh) * 2016-05-30 2017-12-08 中芯国际集成电路制造(北京)有限公司 晶圆承载膜
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
CN107457716B (zh) * 2017-08-29 2019-11-22 湖北鼎龙控股股份有限公司 化学机械抛光垫的抛光层
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
WO2019198675A1 (ja) * 2018-04-10 2019-10-17 株式会社トクヤマ ポリロタキサンを用いたウレタン樹脂、および研磨用パッド
CN116833900B (zh) * 2023-07-31 2024-01-26 广东工业大学 一种用于半导体晶片化学机械抛光的磁流变弹性抛光垫、制备方法及其应用

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016129223A (ja) * 2014-12-19 2016-07-14 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 高安定性ポリウレタン研磨パッド
WO2017056903A1 (ja) * 2015-10-02 2017-04-06 Dic株式会社 ポリウレタンエラストマーの製造方法
JPWO2017056903A1 (ja) * 2015-10-02 2017-10-05 Dic株式会社 ポリウレタンエラストマーの製造方法
JP2017226828A (ja) * 2016-06-17 2017-12-28 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 高除去速度ケミカルメカニカル研磨パッド及び製造方法
CN112692725A (zh) * 2019-10-23 2021-04-23 Skc索密思株式会社 抛光垫用组合物及抛光垫
JP2021068904A (ja) * 2019-10-23 2021-04-30 エスケイシー・カンパニー・リミテッドＳｋｃ Ｃｏ．， Ｌｔｄ． 研磨パッド用組成物、研磨パッド
JP2023089007A (ja) * 2019-10-23 2023-06-27 エスケー エンパルス カンパニー リミテッド 研磨パッド用組成物、研磨パッド
JP7564272B2 (ja) 2019-10-23 2024-10-08 エスケー エンパルス カンパニー リミテッド 研磨パッド用組成物、研磨パッド
JP2021109277A (ja) * 2020-01-10 2021-08-02 ニッタ・デュポン株式会社 研磨パッド
JP7513397B2 (ja) 2020-01-10 2024-07-09 ニッタ・デュポン株式会社 研磨パッド

Also Published As

Publication number Publication date
US8551201B2 (en) 2013-10-08
IN2012DN00982A (enExample) 2015-04-10
CN102574969A (zh) 2012-07-11
US20130125473A1 (en) 2013-05-23
US20110034578A1 (en) 2011-02-10
WO2011016971A1 (en) 2011-02-10
KR20120052282A (ko) 2012-05-23
SG178247A1 (en) 2012-03-29
EP2462178A1 (en) 2012-06-13
TW201122033A (en) 2011-07-01

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