KR20120052282A - Ｃｍｐ 패드용 폴리우레탄 조성물 및 그의 제조 방법 - Google Patents

Ｃｍｐ 패드용 폴리우레탄 조성물 및 그의 제조 방법 Download PDF

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Publication number
KR20120052282A
KR20120052282A KR1020127003191A KR20127003191A KR20120052282A KR 20120052282 A KR20120052282 A KR 20120052282A KR 1020127003191 A KR1020127003191 A KR 1020127003191A KR 20127003191 A KR20127003191 A KR 20127003191A KR 20120052282 A KR20120052282 A KR 20120052282A
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KR
South Korea
Prior art keywords
prepolymer
polishing pad
polyester
chemical mechanical
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127003191A
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English (en)
Korean (ko)
Inventor
용 장
데이비드 후앙
루 쑨
Original Assignee
프랙스에어 에스.티. 테크놀로지, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프랙스에어 에스.티. 테크놀로지, 인코포레이티드 filed Critical 프랙스에어 에스.티. 테크놀로지, 인코포레이티드
Publication of KR20120052282A publication Critical patent/KR20120052282A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
    • C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0041—Foam properties having specified density
    • C08G2110/0066—≥ 150kg/m3

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020127003191A 2009-08-07 2010-07-16 Ｃｍｐ 패드용 폴리우레탄 조성물 및 그의 제조 방법 Withdrawn KR20120052282A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/537,862 2009-08-07
US12/537,862 US8551201B2 (en) 2009-08-07 2009-08-07 Polyurethane composition for CMP pads and method of manufacturing same

Publications (1)

Publication Number Publication Date
KR20120052282A true KR20120052282A (ko) 2012-05-23

Family

ID=42732397

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127003191A Withdrawn KR20120052282A (ko) 2009-08-07 2010-07-16 Ｃｍｐ 패드용 폴리우레탄 조성물 및 그의 제조 방법

Country Status (9)

Country Link
US (2) US8551201B2 (enExample)
EP (1) EP2462178A1 (enExample)
JP (1) JP2013501823A (enExample)
KR (1) KR20120052282A (enExample)
CN (1) CN102574969A (enExample)
IN (1) IN2012DN00982A (enExample)
SG (1) SG178247A1 (enExample)
TW (1) TW201122033A (enExample)
WO (1) WO2011016971A1 (enExample)

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DE102009053224A1 (de) * 2009-11-06 2011-07-14 Bayer MaterialScience AG, 51373 Verfahren zur Herstellung eines Polyurethanschaums und hieraus erhältlicher Polyurethanschaum
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
CL2013000959A1 (es) * 2013-03-15 2013-08-23 Sika Technology Ag Composicion en base a poliuretano que comprende un prepolimero de poliuretano, un agente de curado que comprende una poliamina aromatica mononuclear, un disolvente y un plastificante; metodo de reparacion de defectos en sustratos elasticos; proceso de union de sustratos flexibles; y uso de dicha composicion.
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
KR102066002B1 (ko) * 2013-06-10 2020-02-11 삼성전자주식회사 연마 패드 조성물
US9102034B2 (en) 2013-08-30 2015-08-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9481070B2 (en) * 2014-12-19 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High-stability polyurethane polishing pad
US9776300B2 (en) * 2015-06-26 2017-10-03 Rohm And Haas Electronic Materials Cmp Holdings Inc. Chemical mechanical polishing pad and method of making same
WO2017056903A1 (ja) * 2015-10-02 2017-04-06 Dic株式会社 ポリウレタンエラストマーの製造方法
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
CN107452663A (zh) * 2016-05-30 2017-12-08 中芯国际集成电路制造(北京)有限公司 晶圆承载膜
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
CN107457716B (zh) * 2017-08-29 2019-11-22 湖北鼎龙控股股份有限公司 化学机械抛光垫的抛光层
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
WO2019198675A1 (ja) * 2018-04-10 2019-10-17 株式会社トクヤマ ポリロタキサンを用いたウレタン樹脂、および研磨用パッド
US12122013B2 (en) * 2019-10-23 2024-10-22 Sk Enpulse Co., Ltd. Composition for polishing pad and polishing pad
JP7513397B2 (ja) * 2020-01-10 2024-07-09 ニッタ・デュポン株式会社 研磨パッド
CN116833900B (zh) * 2023-07-31 2024-01-26 广东工业大学 一种用于半导体晶片化学机械抛光的磁流变弹性抛光垫、制备方法及其应用

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US3094495A (en) * 1958-09-15 1963-06-18 Mobay Chemical Corp Process for preparing cellular polyurethanes from mixture of two prepolymers and resulting product
US4980386A (en) 1989-04-28 1990-12-25 Polymer Dynamics Technology, Inc. Methods for the manufacture of energy-attenuating polyurethanes
US5545706A (en) 1995-05-09 1996-08-13 Arco Chemical Technology, L.P. PTMEG polyurethane elastomers employing monofunctional polyethers
US6184262B1 (en) * 1997-09-22 2001-02-06 R. T. Vanderbilt Company, Inc. Benzotriazole stabilizers for polyols and polyurethane foam
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US6095902A (en) 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
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US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
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Also Published As

Publication number Publication date
US8551201B2 (en) 2013-10-08
IN2012DN00982A (enExample) 2015-04-10
CN102574969A (zh) 2012-07-11
US20130125473A1 (en) 2013-05-23
JP2013501823A (ja) 2013-01-17
US20110034578A1 (en) 2011-02-10
WO2011016971A1 (en) 2011-02-10
SG178247A1 (en) 2012-03-29
EP2462178A1 (en) 2012-06-13
TW201122033A (en) 2011-07-01

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PA0105 International application

Patent event date: 20120206

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20140704

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid