JP2013500225A - 乾湿低摩擦炭化ケイ素シール - Google Patents
乾湿低摩擦炭化ケイ素シール Download PDFInfo
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 54
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 41
- 239000010439 graphite Substances 0.000 claims abstract description 41
- 239000011148 porous material Substances 0.000 claims abstract description 18
- 229910021426 porous silicon Inorganic materials 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims description 42
- 239000000203 mixture Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 31
- 238000005245 sintering Methods 0.000 claims description 25
- 229920000642 polymer Polymers 0.000 claims description 18
- 239000011324 bead Substances 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000000314 lubricant Substances 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052580 B4C Inorganic materials 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000008187 granular material Substances 0.000 description 25
- 239000002131 composite material Substances 0.000 description 15
- 239000002002 slurry Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 8
- 238000005469 granulation Methods 0.000 description 8
- 230000003179 granulation Effects 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000001694 spray drying Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021431 alpha silicon carbide Inorganic materials 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000009694 cold isostatic pressing Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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Abstract
Description
本出願は、2009年7月24日出願の米国仮特許出願第61/271,739号明細書の優先権を主張するものである。
本発明は、その例証実施形態に関して具体的に示され、記載されてきたが、形態および詳細の様々な変更が添付のクレームによって包含される本発明の範囲から逸脱することなくその中で行われ得ることは、当業者によって理解されるであろう。
Claims (21)
- 炭化ケイ素と黒鉛とを含む多孔質の炭化ケイ素焼結体。
- 前記多孔質の炭化ケイ素焼結体がシールである、請求項1に記載の物品。
- 前記多孔質の炭化ケイ素焼結体が、約20μm〜約40μmの範囲の平均孔径で細孔を画定する、請求項1に記載の物品。
- 前記多孔質の炭化ケイ素焼結体が、約1容量%〜約5容量%の範囲の気孔率を構成する細孔を画定する、請求項1に記載の物品。
- a)セラミック粉末を焼結助剤と混合してセラミック混合物を形成する工程と;
b)セラミックと黒鉛との粒状混合物をポリマービーズとおよび前記セラミック混合物と組み合わせて未熟成混合物を形成する工程と;
c)前記未熟成混合物を造形して素地にする工程と;
d)前記素地を、それが実質的に不活性である雰囲気中でおよび前記ポリマーがガス状生成物へ少なくとも一部は分解する温度で焼結し、それによって多孔質のセラミック焼結体を形成する工程と
を含む多孔質のセラミック焼結体の形成方法。 - 前記セラミック粉末が炭化ケイ素を含み、そして固体滑剤が黒鉛を含む、請求項5に記載の方法。
- 前記セラミック粉末がジルコニアを含む、請求項5に記載の方法。
- 前記セラミック粉末がアルミナを含む、請求項5に記載の方法。
- 前記固体滑剤が黒鉛を含む、請求項5に記載の方法。
- 前記固体滑剤が窒化ホウ素を含む、請求項5に記載の方法。
- 前記粒状混合物が炭化ケイ素と黒鉛とを約1:1〜約2:1の範囲の重量比で含む、請求項6に記載の方法。
- 前記焼結助剤が、約0.25重量%〜約1重量%の範囲の量の炭化ホウ素粉末を含み、そしてまた、約1重量%〜約5重量%の範囲の量の炭素を含む、請求項5に記載の方法。
- 炭化ケイ素と黒鉛との前記粒状混合物が、約1重量%〜約15重量%の範囲の量で前記未熟成混合物中に存在する、請求項6に記載の方法。
- 炭化ケイ素と黒鉛との前記粒状混合物が約10μm〜約100μmの範囲の平均粒径を有する、請求項13に記載の方法。
- 前記ポリマービーズがポリメチルメタクリレート、ポリエチレン、ポリプロピレン、またはそれらのあらゆる組み合わせを含む、請求項5に記載の方法。
- 前記ポリマービーズが約1重量%〜約5重量%の範囲の量で前記未熟成混合物中に存在し、前記ポリマービーズが約10μm〜約80μmの範囲の平均粒径を有する、請求項5に記載の方法。
- 前記ポリマービーズが約1重量%〜約3重量%の範囲の量で前記未熟成混合物中に存在する、請求項16に記載の方法。
- 前記素地を焼結する工程が、約2125℃〜約2250℃の範囲の温度で、約1時間〜約5時間の間行われる、請求項5に記載の方法。
- 前記多孔質のセラミック焼結体がシールである、請求項5に記載の方法。
- 前記多孔質のセラミック焼結体が、約20μm〜約40μmの範囲の平均孔径で細孔を画定する、請求項5に記載の方法。
- 前記多孔質のセラミック焼結体が約1〜約5容量%の範囲の気孔率を構成する細孔を画定する、請求項5に記載の方法。
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US27173909P | 2009-07-24 | 2009-07-24 | |
US61/271,739 | 2009-07-24 | ||
PCT/US2010/042875 WO2011011586A2 (en) | 2009-07-24 | 2010-07-22 | Dry and wet low friction silicon carbide seal |
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JP2013500225A true JP2013500225A (ja) | 2013-01-07 |
JP5551778B2 JP5551778B2 (ja) | 2014-07-16 |
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JP2012521779A Active JP5551778B2 (ja) | 2009-07-24 | 2010-07-22 | 乾湿低摩擦炭化ケイ素シール |
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US (2) | US20110172080A1 (ja) |
EP (1) | EP2456734A4 (ja) |
JP (1) | JP5551778B2 (ja) |
WO (1) | WO2011011586A2 (ja) |
Cited By (1)
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WO2021246377A1 (ja) * | 2020-06-02 | 2021-12-09 | 京セラ株式会社 | 耐摩耗性部材およびこれを用いたフォーセットバルブ、ピストン・シリンダユニット |
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CN112939606B (zh) * | 2021-03-18 | 2022-12-09 | 西安交通大学 | 一种多孔碳化硅陶瓷及其制备方法 |
CN114349528A (zh) * | 2021-12-28 | 2022-04-15 | 中国科学院长春光学精密机械与物理研究所 | 一种含有缺陷的碳化硅素坯及其制备方法、无损检测方法 |
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JPH0255273A (ja) * | 1988-08-18 | 1990-02-23 | Showa Denko Kk | メカニカルシール用炭化珪素焼結体およびそれを用いたメカニカルシール |
JPH0269367A (ja) * | 1988-09-05 | 1990-03-08 | Showa Denko Kk | セラミックス多孔質焼結体成形用顆粒 |
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- 2010-07-22 JP JP2012521779A patent/JP5551778B2/ja active Active
- 2010-07-22 EP EP10802889.5A patent/EP2456734A4/en not_active Withdrawn
- 2010-07-22 US US12/841,420 patent/US20110172080A1/en not_active Abandoned
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WO2021246377A1 (ja) * | 2020-06-02 | 2021-12-09 | 京セラ株式会社 | 耐摩耗性部材およびこれを用いたフォーセットバルブ、ピストン・シリンダユニット |
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US20140291898A1 (en) | 2014-10-02 |
WO2011011586A3 (en) | 2011-04-28 |
JP5551778B2 (ja) | 2014-07-16 |
WO2011011586A2 (en) | 2011-01-27 |
US20110172080A1 (en) | 2011-07-14 |
EP2456734A4 (en) | 2013-12-11 |
EP2456734A2 (en) | 2012-05-30 |
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