JP2013258431A - Component built-in wiring board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component built-in wiring board capable of improving heat radiation performance of a built-in component without increasing the costs, and to provide a manufacturing method of the component built-in wiring board.SOLUTION: A component built-in wiring board includes: first and second insulation layers positioned in a laminated manner; an electronic component which is buried in the second insulation layer and has a semiconductor chip; a heat conductor buried in the second insulation layer and having a surface which faces an end surface of the semiconductor chip being spaced away from the end surface; a wiring pattern which is provided being sandwiched by the first insulation layer and the second insulation layer and includes a mounting land for the electronic component and a fixing land for the heat conductor; a conductive member which is provided being sandwiched between the electronic component and the mounting land; a heat conductive member which is provided being sandwiched between the heat conductor and the fixing land and thermally and mechanically connects the heat conductor with the fixing land; and another wiring pattern which is provided in the second insulation layer being spaced away from a surface of the heat conductor which is opposite to a surface of the heat conductor, on which the heat conductive member is disposed, and a surface of the electronic component which is opposite to a surface of the electronic component, on which the conductive member is disposed.

Description

  The present invention relates to a component built-in wiring board in which components are embedded and mounted in an insulating plate and a method for manufacturing the same, and more particularly to a component built-in wiring board in which electronic components having semiconductor chips are embedded and mounted and a method for manufacturing the same.

  An example of a component built-in wiring board in which a semiconductor chip is embedded and mounted by flip connection is disclosed in Japanese Unexamined Patent Application Publication No. 2003-197849. If a semiconductor chip (bare chip) is flip-connected, the thickness generated by the mounting is saved to a minimum. Therefore, the flip connection is an effective method for incorporating an electronic component having a semiconductor chip in a wiring board.

  However, not only flip-chip connection, but when electronic components are embedded in a wiring board, the electronic components are sealed with an insulating resin for the wiring board, so heat dissipation in the electronic components may become a problem. is there. The insulating resin for the wiring board is not particularly considered for thermal conductivity, and the heat radiation is considerably worse than in the air. An electronic component having a semiconductor chip significantly increases its heat generation depending on its rated voltage and integration degree.

  Therefore, the wiring board with built-in electronic components becomes hot, destroying the component mounting part, damaging the connection part of the wiring board, reducing reliability, and if excessive, smoke, ignition, etc. A condition can also be triggered. As a countermeasure, it can be considered that the insulating resin used for the wiring board is replaced with one having good thermal conductivity. However, since it is not a general material but a special material, it is disadvantageous in terms of availability and cost, and further, the workability is also different, resulting in an increase in cost as a manufacturing process.

JP 2003-197849 A

  The present invention relates to a component built-in wiring board in which an electronic component having a semiconductor chip is embedded and mounted, and a method of manufacturing the same, and a component built-in wiring board capable of improving the heat dissipation of a built-in component without incurring an increase in cost. It aims at providing the manufacturing method.

  In order to solve the above-described problem, a component built-in wiring board according to an aspect of the present invention includes a first insulating layer, a second insulating layer positioned in a stacked manner with respect to the first insulating layer, Thermal conduction having an electronic component having a semiconductor chip embedded in a second insulating layer and a surface further spaced from the end face of the semiconductor chip of the electronic component further embedded in the second insulating layer And a first wiring pattern including a mounting land for the electronic component and a fixing land for the heat conductor, which are provided between the first insulating layer and the second insulating layer. A conductive member that is electrically and mechanically connected between the electronic component and the mounting land of the first wiring pattern, and electrically connects the electronic component and the mounting land. Sandwiched between a conductor and the fixing land of the first wiring pattern Further, a heat conducting member for thermally and mechanically connecting the heat conductor and the fixing land, and a surface of the heat conductor opposite to the surface of the heat conductor on the side where the heat conducting member is disposed And a second wiring pattern provided in the second insulating layer apart from the surface of the electronic component opposite to the surface of the electronic component on the side where the conductive member is disposed. Features.

  That is, in this component built-in wiring board, the heat conductor is embedded so as to be opposed to the end face of the semiconductor chip included in the embedded electronic component. Therefore, the heat generated by the electronic component moves to the heat conductor through the insulating layer in which the electronic component is embedded, the conductive member, the first wiring pattern, and the heat conductive member, and heat is accumulated in the electronic component accordingly. State is avoided. That is, more efficient heat dissipation of the electronic component can be achieved. There is no need to use a special insulating material for the wiring board, and the cost is not increased.

  In addition, in the method for manufacturing a component-embedded wiring board according to another aspect of the present invention, the first metal foil laminated on the first insulating plate is patterned, and the first land for mounting the electronic component and Forming a first wiring pattern including a second land for fixing a heat conductor so that the first land and the second land are adjacent to each other; and on the first land and Applying cream solder on the second land, placing an electronic component having a semiconductor chip on the first land via the cream solder, and on the second land Placing a plate-like heat conductor through cream solder; reflowing the cream solder to mount the electronic component on the first insulating plate; and placing the heat conductor on the first Fixing on the insulating plate; and Patterning a second metal foil, which is a metal foil different from the first metal foil, laminated on a second insulating plate, which is an insulating plate different from the first insulating plate; And a third insulating plate, which is a different insulating plate from the first and second insulating plates, is laminated on the second insulating plate on the side having the second wiring pattern. And stacking the first insulating plate so as to embed the electronic component and the heat conductor in a fourth insulating plate which is an insulating layer different from the first to third insulating plates. And a step of integrating the fourth, third, and second insulating plates in the order of the stacking positions.

  This manufacturing method is an example of a process for manufacturing the component inner layer wiring board. According to this configuration, the heat conductor for heat dissipation can be handled in the same way as components such as electronic components. That is, in order to fix the heat conductor on the (first) wiring pattern, the heat conductor is placed on the land to which the cream solder is applied, and the cream solder is reflowed in the same manner as the electronic component. To do. Therefore, the component built-in wiring board having the above structure can be obtained without sacrificing productivity.

  According to the present invention, in a component built-in wiring board in which an electronic component having a semiconductor chip is embedded and mounted, and a method for manufacturing the same, a component built-in wiring that can improve the heat dissipation of a built-in component without increasing costs. A board and a manufacturing method thereof can be provided.

The longitudinal cross-sectional view which shows typically the structure of the component built-in wiring board which concerns on one Embodiment of this invention. The cross-sectional view which shows typically the structure of the component built-in wiring board in the A-Aa position shown in FIG. Process drawing which shows a part of manufacturing process of the component built-in wiring board shown in FIG. Process drawing which shows another part of manufacturing process of the component built-in wiring board shown in FIG. FIG. 9 is a process diagram schematically showing still another part of the manufacturing process of the component built-in wiring board shown in FIG. 1. Process drawing which shows the modification of the manufacturing process shown in FIG. 3 in a typical cross section.

  As an embodiment of the present invention, the heat conductor may be copper as its material. By using a copper conductor as the thermal conductor, good thermal conductivity can be obtained, and connection with the wiring pattern can be performed in the same manner as a normal electronic component.

  Here, the thermal conductor may have a roughened surface. By roughening the surface, the adhesion with the insulating layer in which the heat conductor is embedded can be enhanced. Thereby, the reliability as a wiring board can be improved.

  Further, as an embodiment, a second heat conducting member sandwiched between the surface of the heat conductor opposite to the surface of the heat conductor on the side where the heat conducting member is disposed and the second wiring pattern. It may be further provided with a member. According to this, it is preferable to further dissipate heat from the heat conductor through the second heat conducting member.

  Here, a third wiring pattern provided in a layer on the second insulating layer in a layered manner with the second wiring pattern and a part of the second insulating layer in the stacking direction pass through the second wiring pattern. It is sandwiched between the surface of the wiring pattern and the surface of the third wiring pattern, is made of a conductive composition, has an axis that coincides with the lamination direction, and the diameter changes in the direction of the axis. And an interlayer connection body having a shape, wherein the interlayer connection body and the second heat conducting member are conductive compositions made of the same material.

  In this aspect, during the course of manufacture, the second connection pattern is formed simultaneously with the formation of the interlayer connector (= vertical wiring portion) to be sandwiched between the second wiring pattern surface and the third wiring pattern surface. A heat conducting member can be formed. Therefore, production with high production efficiency is possible.

  As an embodiment, the conductive member and the heat conducting member can be made of the same material. According to this, mounting of an electronic component and fixing of a heat conductor can be performed at the same time, and efficient manufacturing becomes possible.

  As an embodiment, the heat conductor may have a shape surrounding the entire circumference of the electronic component. According to this, the heat transfer from the electronic component to the heat conductor becomes efficient, which is preferable for further heat dissipation.

  In addition, as an embodiment of the manufacturing method, after the step of forming the second wiring pattern, the method further includes a step of forming a bump having a conductive composition on the second wiring pattern, The step of laminating an insulating plate on the second insulating plate on the side having the second wiring pattern is such that the bump penetrates the third insulating plate, and the first insulating plate The step of integrating the fourth, third, and second insulating plates in a stacked manner in the order of the stacking position is such that the bumps are on the side of the thermal conductor opposite to the first insulating plate side. The heat conductor is pressed against the surface of the heat conductor so as to be plastically deformed.

  This aspect is intended to allow heat dissipation from the heat conductor to proceed further through bumps pressed against the heat conductor. This bump can also be formed simultaneously with the interlayer connector (= vertical wiring portion) to be provided through a part of the insulating layer in the stacking direction. By forming them simultaneously, higher functionality can be achieved without sacrificing manufacturing efficiency.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view schematically showing a configuration of a component built-in wiring board according to an embodiment of the present invention.

  As shown in FIG. 1, this component built-in wiring board includes an insulating layer 11 (first insulating layer), 12, 12, 13, 14, and 15 (12, 13, 14, 15 second insulating layer). ), Wiring layer 21, 22 (wiring pattern), 23, 24 (third wiring pattern), 25 (second wiring pattern), 26 (= 6 layers in total), interlayer connector 31, 32, 34, 35, through-hole conductor 33, surface-mounted passive element component 41, electronic component (semiconductor element by wafer level / chip scale package) 42, thermal conductor (copper plate) 43, connecting member (solder) ) 51, a conductive member (solder) 52, a heat conducting member (solder) 53, solder resists 61 and 62, and a heat conducting member 34a (second heat conducting member).

  2 is a cross-sectional view schematically showing the structure of the component built-in wiring board at the position A-Aa shown in FIG. In the following description, FIG. 2 can also be referred to as appropriate. In FIG. 2, the same components as those shown in FIG. To supplement the relationship with FIG. 1, in FIG. 1, the thickness direction of the plate is drawn considerably larger than the actual for convenience of explanation. 1 and FIG. 2, the planar size relationship between the surface-mounted passive element component 41 and the electronic component 42 is actually considerably larger in the electronic component 42 (for example, 1 in length). About a digit) Large.

  This wiring board can have a surface-mounted passive element component 41 and an electronic component 42 as built-in electric / electronic components. Among these built-in components, in particular, the electronic component 42 has a built-in heat conductor 43 so as to surround it for the purpose of improving heat dissipation.

  The surface-mounted passive element component 41 is a so-called chip component, and here is, for example, a chip capacitor (or chip resistor, chip inductor). The planar size is, for example, 0.6 mm × 0.3 mm. Terminals 41 a are provided at both ends, and the lower side thereof is opposed to the mounting land formed by the wiring layer 22. The terminals 41 a of the surface mount type passive element component 41 and the mounting lands are electrically and mechanically connected by a connecting member (solder) 51.

  The electronic component 42 is, for example, a semiconductor element based on a wafer level / chip scale package, and includes at least a semiconductor chip and a grid-arranged surface mounting terminal 42a formed on the semiconductor chip. The surface mounting terminal 42a is a terminal provided by rearranging its position while being electrically conducted through a rewiring layer from a terminal pad that the semiconductor chip originally has. By such rearrangement, the arrangement density as a terminal is coarser than that of the terminal pad on the semiconductor chip. The electronic component 42 is mounted on a mounting land formed by the wiring layer 22 via a conductive member (solder) 52 by surface mounting technology, and the electronic component 42 and the mounting land are mechanically and electrically connected.

  In this embodiment, the heat conductor 43 is formed by processing a copper plate, but a plate of another material having good heat conductivity can also be used. In plan view, as shown in FIG. 2, the electronic component 42 (semiconductor chip) is disposed so as to be adjacent to and spaced from the end surface. A thin gap generated by the separation is filled with an insulating resin material constituting the wiring board so as to avoid electrical contact between the heat conductor 43 and the electronic component 42. The heat generated by the electronic component 42 moves from the end face of the semiconductor chip to the opposing surface of the heat conductor 43 through the thin insulating resin material layer. This is one heat dissipation path for the heat generated by the electronic component 42.

  Further, the heat conductor 43 is fixed to the wiring layer 22 by a heat conducting member (solder) 53, and these are mechanically and thermally connected. That is, the heat conductor 43 is mounted on a dedicated land on the wiring layer 22 by a heat conducting member (solder) 53 as a component that is handled in the same manner as an electrical / electronic component such as the surface-mounted passive element component 41 and the electronic component 42. It was made.

  By handling the heat conductor 43 in this way, a new process is not particularly required in the assembly and manufacture of the wiring board, and the production efficiency is not lowered. Since the heat conductor 43 is handled as a built-in mounting component, it is possible to prevent a decrease in yield as a wiring board caused by a failure of the heat conductor 43 by inspecting the heat conductor 43 in advance. The heat generated by the electronic component 43 can also travel through the path of the conductive member (solder) 52, the wiring pattern 22, the heat conductive member (solder) 53, and the heat conductor 43 via the terminal 42 a of the electronic component 42.

  As shown in FIG. 2, it is preferable that the heat conductor 43 has a shape surrounding the entire circumference of the electronic component 43 as a heat conductor. However, it is also possible to radiate heat preferably by providing the heat conductor 43 so as to be adjacent to the circumference of the electronic component 43 that is close to a portion where heat generation is particularly large without surrounding the entire circumference. Further, since the heat conductor 43 is also electrically connected to the wiring layer 22, the heat conductor 43 can function as a shield member for the electronic component 42.

  Further, it is preferable for the purpose of heat dissipation that the planar shape of the heat conductor 43 is set as large as possible so as to avoid the area where the wiring patterns 23 and 24 are disposed. As shown in the figure, in the wiring board, the built-in components are provided in the opening of the central (core) insulating layer 13, and this opening allows the area of the wiring patterns 23 and 24 to be avoided. This is because the wiring patterns 23 and 24 are not provided. If the area of the wiring patterns 23 and 24 is avoided, however, the heat conductor 43 can be largely arranged in a wide area where the wiring patterns 23 and 24 are not arranged. Thereby, heat dissipation can be improved more.

  Further, the heat conductor 43 is in contact with the heat conducting member 34 a on the side opposite to the side on which the heat conducting member 53 is disposed, and the opposite side of the heat conducting member 34 a is in contact with the wiring layer 25. Therefore, the heat transferred from the electronic component 42 to the heat conductor 43 can also be transferred to other wiring layers via the heat conducting member 34a. Therefore, further improvement in heat dissipation is achieved. The heat conducting member 34a is made of the same material as the interlayer connector 34 and is formed by the same process as the interlayer connector 34 (described later). Therefore, even if the heat conducting member 34a is provided, a new process is not particularly required in assembling and manufacturing the wiring board, and the production efficiency is not lowered.

  For example, a conductive composition can be used for the conductive member 52 and the heat conducting member 53 instead of solder. The electronic component 42 is not limited to a semiconductor element based on a wafer level / chip scale package, but may be a bare semiconductor chip (flip-connected to the wiring layer 22), for example.

  Describing another structure as a component built-in wiring board, the wiring layers 21 and 26 are wiring layers on both main surfaces as a wiring board, and various components (not shown) can be mounted thereon. Solder resist 61 is provided on both main surfaces except for the land portions of the wiring layers 21 and 26 on which solder (not shown) is to be mounted in mounting, so that the solder melted at the time of solder connection is held on the land portions and thereafter functions as a protective layer. , 62 (thickness is about 20 μm, for example). An Ni / Au plating layer (not shown) with high corrosion resistance may be formed on the surface layer of the land portion.

  The wiring layers 22, 23, 24, and 25 are inner wiring layers, and the insulating layer 11 is insulated between the wiring layer 21 and the wiring layer 22, and the wiring layer 22 and the wiring layer 23 are insulated in this order. The insulating layer 13 is provided between the wiring layer 23 and the wiring layer 24, the insulating layer 14 is provided between the wiring layer 24 and the wiring layer 25, and the insulating layer 15 is provided between the wiring layer 25 and the wiring layer 26. However, the wiring layers 21 to 26 are separated from each other. Each of the wiring layers 21 to 26 is made of, for example, a metal (copper) foil having a thickness of 18 μm.

  Each of the insulating layers 11 to 15 is a rigid material made of, for example, a glass epoxy resin, each having a thickness of 100 μm, for example, only the insulating layer 13 has a thickness of, for example, 300 μm, excluding the insulating layer 13. In particular, the insulating layer 13 has openings at positions corresponding to the built-in surface mount passive element component 41, electronic component 42, and heat conductor 43, and provides a space for embedding them. The insulating layers 12 and 14 are deformed so as to fill the space inside the opening and the through-hole conductor 33 of the insulating layer 13, and there is no space serving as a gap inside.

  The wiring layer 21 and the wiring layer 22 can be conducted by an interlayer connector 31 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 11. Similarly, the wiring layer 22 and the wiring layer 23 can be conducted by an interlayer connector 32 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 12. The wiring layer 23 and the wiring layer 24 can be conducted by a through-hole conductor 33 provided through the insulating layer 13. The wiring layer 24 and the wiring layer 25 can be conducted by an interlayer insulator 34 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 14. The wiring layer 25 and the wiring layer 26 can be conducted by an interlayer connector 35 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 15.

  The interlayer connectors 31, 32, 34, and 35 (and the heat conducting member 34a) are derived from conductive bumps formed by screen printing of a conductive composition, and depend on the manufacturing process. The diameter changes in the direction (up and down lamination direction in FIG. 1). The diameter is, for example, 200 μm on the thick side.

  Next, a manufacturing process of the component built-in wiring board shown in FIGS. 1 and 2 will be described with reference to FIGS. 3 to 5 are process diagrams schematically showing a part of the manufacturing process of the component built-in wiring board shown in FIG. In these figures, the same or equivalent components as those shown in FIG.

  It demonstrates from FIG. FIG. 3 shows a manufacturing process of a portion centering on the insulating layer 11 in each configuration shown in FIG. First, as shown in FIG. 3 (a), a paste-like conductive composition to be an interlayer connection 31 is formed on a metal foil (electrolytic copper foil) 22A having a thickness of, for example, 18 μm by, for example, screen printing. It is formed in a bump shape (bottom diameter, for example, 200 μm, height, for example, 160 μm). This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin. For convenience of explanation, printing is performed on the lower surface of the metal foil 22A, but it may be printed on the upper surface (the following drawings are also the same). After the interlayer connector 31 is printed, it is dried and cured.

  Next, as shown in FIG. 3B, an FR-4 prepreg 11A having a thickness of, for example, 100 μm is laminated on the metal foil 22A to penetrate the interlayer connector 31 so that the head is exposed. To do. At the time of exposure or thereafter, the tip thereof may be crushed by plastic deformation (in any case, the shape of the interlayer connection body 31 has an axis that coincides with the stacking direction, and the diameter changes in the axial direction). Subsequently, as shown in FIG. 3C, a metal foil (electrolytic copper foil) 21A is laminated on the prepreg 11A, and the whole is integrated by pressing and heating. At this time, the metal foil 21A is in electrical continuity with the interlayer connector 31, and the prepreg 11A is completely cured to become the insulating layer 11.

  Next, as shown in FIG. 3D, the metal foil 22A on one side is subjected to patterning by, for example, well-known photolithography, and this is applied to the component mounting land and the heat conductor 43 adjacent to a part thereof. The wiring pattern 22 including the dedicated land is processed. Then, as shown in FIG. 3E, cream solder 51A, 52A, 53A is applied on the mounting land and the dedicated land for the heat conductor 43 obtained by processing. These can be applied using, for example, screen printing. Screen printing can be easily and efficiently printed in a predetermined pattern. In addition, it can replace with screen printing and can also apply with a dispenser.

  Next, the surface-mounted passive element component 41, the electronic component 42, and the heat conductor 43 are respectively mounted on the lands through the cream solders 51A, 52A, and 53A, for example, with a mounter. Subsequently, the cream solder 51A, 52A, 53A is reflowed by heating in a reflow furnace, for example. As a result, as shown in FIG. 3 (f), the surface-mounted passive element component 41, the electronic component 42, and the heat conductor 43 are connected to the wiring layer via the connection member 51, the conductive member 52, and the heat conductive member 53, respectively. The wiring board material 1 in a state of being connected on each of the 22 lands can be obtained. The subsequent process using the wiring board material 1 will be described with reference to FIG.

  Next, a description will be given with reference to FIG. FIG. 4 shows a manufacturing process of a part centering on the insulating layer 13 and the same 12 in each configuration shown in FIG. First, as shown in FIG. 4A, for example, an FR-4 insulating layer 13 having a thickness of, for example, 300 μm in which metal foils (electrolytic copper foils) 23A and 24A having a thickness of 18 μm are laminated on both surfaces is prepared. A through hole 83 for forming a through hole conductor is formed at a predetermined position, and the surface mount passive element component 41, the electronic component 42, and the component openings 81 and 82 are formed in portions corresponding to the heat conductor 43. Form. The component opening 82 is a heat dissipation compatible component opening.

  Next, electroless plating and electrolytic plating are performed to form a through-hole conductor 33 on the inner wall of the through-hole 83 as shown in FIG. At this time, a conductor is also formed on the inner walls of the openings 81 and 82. Further, as shown in FIG. 4C, the metal foils 23A and 24A are patterned in a predetermined manner using well-known photolithography to form wiring layers 23 and 24. By patterning the wiring layers 23 and 24, the conductor formed on the inner walls of the openings 81 and 82 is also removed.

  Next, as shown in FIG. 4 (d), conductive bumps (bottom diameter: 200 μm, height: 160 μm, for example) that will become the interlayer connector 32 are formed at predetermined positions on the wiring layer 23 of the paste-like conductive composition. It is formed by screen printing. Subsequently, as shown in FIG. 4E, an FR-4 prepreg 12A (nominal thickness, for example, 100 μm) to be the insulating layer 12 is laminated on the wiring layer 23 side using a press. The prepreg 12 </ b> A is previously provided with openings corresponding to the built-in surface mount passive element component 41, electronic component 42, and thermal conductor 43, similar to the insulating layer 13.

  In the stacking step of FIG. 4 (e), the head of the interlayer connector 32 is made to penetrate the prepreg 12A. In addition, the broken line of the head part of the interlayer connection body 32 in FIG. 4E indicates that there are both cases where the head part is plastically deformed and crushed at this stage, and when it is not plastically deformed. The wiring board material obtained as described above is referred to as a wiring board material 2.

  The steps shown in FIG. 4 can be performed as follows. In the stage of FIG. 4A, only the through hole 83 is formed, and the subsequent steps from FIG. 4B to FIG. 4D are performed without forming the openings 81 and 82 for the built-in components. Next, as a process corresponding to FIG. 4E, prepreg 12A (without opening) is stacked. And it is the process of forming simultaneously the opening part for components incorporation in the insulating layer 13 and the prepreg 12A.

  Next, a description will be given with reference to FIG. FIG. 5 is a diagram showing an arrangement relationship in which the wiring board materials 1 and 2 obtained as described above are stacked. Here, the upper wiring board material 3 shown in the figure applies the same process as that of the lower wiring board material 1, and thereafter, the interlayer connector 34 and the prepreg 14A are connected to the interlayer connector in the intermediate wiring board material 2 shown in the figure. 32 and the prepreg 12A. In the wiring board material 3, the interlayer connector 34 and the heat conducting member 34a can be formed by the same process.

  However, the wiring board material 3 is configured without any components (surface-mounted passive element components 41, electronic components 42, and heat conductors 43) and parts (each land) for connecting them, and the prepreg 14A includes Does not provide an opening for the surface-mounted passive element component 41 and an opening for the heat conductor 43 for the electronic component 42. In addition, the metal foil (electrolytic copper foil) 26A, the insulating layer 15, the interlayer connection body 35, the wiring layer 25, the prepreg 14A, and the interlayer connection body 34 (heat conducting member 34a) are respectively the metal foil 21A of the wiring board material 1 and the insulation. It is the same as the layer 11, the interlayer connector 31, the wiring layer 22, the prepreg 12 </ b> A of the wiring board material 2, and the interlayer connector 32.

  The respective wiring board materials 1, 2, and 3 are laminated and arranged in the arrangement as shown in FIG. Thereby, the prepregs 12A and 14A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 12 </ b> A and 14 </ b> A obtained by heating, the space around the surface-mounted passive element component 41, the electronic component 42, and the heat conductor 43, and the space inside the through-hole conductor 33 are prepreg 12A and 14A are deformed and no gap is generated. In addition, the wiring layers 22 and 24 are electrically connected to the interlayer connectors 32 and 34, respectively, and the heat conducting member 34a is plastically deformed and contacts the back surface of the heat conductor 43.

  After the laminating step shown in FIG. 5, the upper and lower metal foils 26A and 21A are patterned in a predetermined manner using well-known photolithography, and further, layers of solder resists 61 and 62 are formed, as shown in FIG. Such a component built-in wiring board can be obtained. In FIG. 5, the insulating layer 11 corresponds to a first insulating plate, the prepreg 12A and the insulating layer 13 correspond to a fourth insulating plate, the prepreg 14A corresponds to a third insulating plate, and the insulating layer 15 corresponds to a second insulating plate.

  As a modification, the through-hole conductor 33 provided in the intermediate insulating layer 13 can naturally have a configuration similar to the interlayer connector 31 or 32. Further, for the interlayer connectors 31, 32, 34, and 35, in addition to those derived from the conductive bumps printed by the conductive composition described above, for example, metal bumps formed by metal plate etching, conductive composition filling It is also possible to appropriately select and employ a connection body obtained from the above, a conductor bump formed by plating, or the like. In addition, the outer wiring layers 21 and 26 are formed at the stage of each wiring board material 1 and 3 (for example, at the stage of FIG. 3D) other than patterning after the last lamination step. May be.

  Next, FIG. 6 is a process diagram schematically showing a modification of the manufacturing process shown in FIG. In FIG. 6, parts that are the same as or equivalent to those already described are given the same reference numerals. More specifically, FIG. 6 shows a process of further processing the wiring board material 1 shown in FIG. 3 (f) and changing it to a new wiring board material 1 A that replaces the wiring board material 1. .

  First, FIG. 6A is exactly the same as FIG. 4F. Next, as shown in FIG. 6B, the surface exposed at this point of the wiring layer 22 and the surface exposed at this point of the thermal conductor 43 are roughened to obtain roughened surfaces. 22a, modified to a roughened surface 43a. Specifically, for example, a blackening reduction process or a microetching process can be employed. Examples of the micro-etching process include CZ processing (MEC product name) and bond film processing (Atotech product name).

  The wiring board material 1A having the form shown in FIG. 6B is used instead of the wiring board material 1 in the laminating process shown in FIG. In this lamination step, the surface of the wiring layer 22 is a roughened surface 22a, and the surface of the heat conductor 43 is also a roughened surface 43a. Therefore, the prepreg 12A, the prepreg 14A, the wiring layer 22, The mechanical connection reliability (adhesion) with the conductor 43 is improved. Thereby, reliability as a component built-in wiring board can be increased.

  DESCRIPTION OF SYMBOLS 1 ... Wiring board material, 1A ... Wiring board material, 2 ... Wiring board material, 3 ... Wiring board material, 11 ... Insulating layer, 11A ... Prepreg, 12 ... Insulating layer, 12A ... Prepreg, 13 ... Insulating layer, 14 ... Insulation 14A ... Prepreg, 15 ... Insulating layer, 21 ... Wiring layer (wiring pattern), 21A ... Metal foil (copper foil), 22 ... Wiring layer (wiring pattern), 22A ... Metal foil (copper foil), 22a ... Coarse 23 ... Wiring layer (wiring pattern), 23A ... Metal foil (copper foil), 24 ... Wiring layer (wiring pattern), 24A ... Metal foil (copper foil), 25 ... Wiring layer (wiring pattern), 26 ... Wiring layer (wiring pattern), 26A ... metal foil (copper foil), 31, 32, 34, 35 ... interlayer connection (conductive bumps printed by conductive composition), 33 ... through-hole conductor, 34a ... heat conducting member (Second heat conduction member; for conductive composition printing Conductive bumps), 41... Surface mounted passive element components, 41 a... Terminals, 42... Electronic components (semiconductor elements by wafer level chip scale package), 42 a... Surface mounting terminals, 43. 43a ... roughened surface 51 ... connecting member (solder) 51A ... cream solder 52 ... conductive member (solder or conductive composition) 52A ... cream solder 53 ... heat conducting member (solder or conductive composition) 53A ... Cream solder, 61, 62 ... Solder resist, 81 ... Openings for components, 82 ... Openings for heat radiation-compatible components, 83 ... Through holes.

Claims (9)

A first insulating layer;
A second insulating layer positioned in a stack with respect to the first insulating layer;
An electronic component having a semiconductor chip embedded in the second insulating layer;
A thermal conductor further embedded in the second insulating layer and having a surface facing away from an end surface of the semiconductor chip of the electronic component;
A first wiring pattern including a mounting land for the electronic component and a fixing land for the heat conductor provided between the first insulating layer and the second insulating layer;
A conductive member electrically and mechanically connected between the electronic component and the mounting land, sandwiched between the electronic component and the mounting land of the first wiring pattern;
A heat-conducting member interposed between the heat conductor and the fixing land of the first wiring pattern to thermally and mechanically connect the heat conductor and the fixing land;
From the surface of the heat conductor opposite to the surface of the heat conductor on the side where the heat conducting member is disposed and the surface of the electronic component opposite to the surface of the electronic component on the side where the conductive member is disposed And a second wiring pattern provided in the second insulating layer so as to be spaced apart from each other.   The component built-in wiring board according to claim 1, wherein the heat conductor is copper as a material thereof.   The component built-in wiring board according to claim 2, wherein the thermal conductor has a roughened surface.   A second heat conducting member sandwiched between the surface of the heat conductor opposite to the surface of the heat conductor on the side where the heat conducting member is disposed and the second wiring pattern; The component built-in wiring board according to claim 1. A third wiring pattern provided in a layered manner with the second wiring pattern in the second insulating layer;
The second insulating layer passes through a part of the stacking direction and is sandwiched between the surface of the second wiring pattern and the surface of the third wiring pattern, and is made of a conductive composition and stacked. An interlayer connection body having an axis that coincides with the direction and having a shape in which the diameter changes in the direction of the axis, and
5. The component built-in wiring board according to claim 4, wherein the interlayer connector and the second heat conducting member are conductive compositions made of the same material.   The component built-in wiring board according to claim 1, wherein the conductive member and the heat conducting member are made of the same material.   The component built-in wiring board according to claim 1, wherein the heat conductor has a shape surrounding the entire circumference of the electronic component. A first wiring pattern including a first land for patterning a first metal foil laminated on a first insulating plate and mounting an electronic component and a second land for fixing a heat conductor Forming the first land and the second land adjacent to each other;
Applying cream solder on the first land and on the second land;
Placing an electronic component having a semiconductor chip on the first land via the cream solder;
Placing a plate-like heat conductor on the second land via the cream solder;
Reflowing the cream solder, mounting the electronic component on the first insulating plate and fixing the heat conductor on the first insulating plate;
Patterning a second metal foil laminated on a second insulating plate, which is a different insulating plate from the first insulating plate, and being a metal foil different from the first metal foil; Forming a wiring pattern of
Laminating a third insulating plate, which is an insulating plate different from the first and second insulating plates, on the second insulating plate on the side having the second wiring pattern;
The fourth insulating plate is laminated on the first insulating plate so that the electronic component and the heat conductor are embedded in a fourth insulating plate which is an insulating layer different from the first to third insulating plates. And a step of integrating the third and second insulating plates in the order of the stacking positions. After the step of forming the second wiring pattern, further comprising the step of forming a bump having a conductive composition on the second wiring pattern;
The step of laminating a third insulating plate on the second insulating plate on the side having the second wiring pattern is such that the bumps penetrate the third insulating plate;
The step of integrating the fourth, third, and second insulating plates in the stacking order on the first insulating plate in the order of the stacking position is such that the bumps are formed on the first insulating plate of the thermal conductor. 9. The method of manufacturing a component built-in wiring board according to claim 8, wherein the part is plastically deformed by being pressed against a surface of the heat conductor opposite to the side.

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