|
US9087367B2
(en)
|
2011-09-13 |
2015-07-21 |
Kla-Tencor Corp. |
Determining design coordinates for wafer defects
|
|
US9053390B2
(en)
*
|
2012-08-14 |
2015-06-09 |
Kla-Tencor Corporation |
Automated inspection scenario generation
|
|
US9189844B2
(en)
|
2012-10-15 |
2015-11-17 |
Kla-Tencor Corp. |
Detecting defects on a wafer using defect-specific information
|
|
US9053527B2
(en)
|
2013-01-02 |
2015-06-09 |
Kla-Tencor Corp. |
Detecting defects on a wafer
|
|
US9311698B2
(en)
*
|
2013-01-09 |
2016-04-12 |
Kla-Tencor Corp. |
Detecting defects on a wafer using template image matching
|
|
US9865512B2
(en)
|
2013-04-08 |
2018-01-09 |
Kla-Tencor Corp. |
Dynamic design attributes for wafer inspection
|
|
US9310320B2
(en)
|
2013-04-15 |
2016-04-12 |
Kla-Tencor Corp. |
Based sampling and binning for yield critical defects
|
|
JP6126450B2
(ja)
*
|
2013-04-25 |
2017-05-10 |
株式会社ブリヂストン |
検査装置
|
|
CN104780513A
(zh)
*
|
2014-01-13 |
2015-07-15 |
北京快点网络科技有限公司 |
无线终端装置及其输出广告的方法
|
|
CN104297254B
(zh)
*
|
2014-10-08 |
2017-04-12 |
华南理工大学 |
一种基于混合法的印刷电路板缺陷检测方法及系统
|
|
US10192283B2
(en)
*
|
2014-12-22 |
2019-01-29 |
Cognex Corporation |
System and method for determining clutter in an acquired image
|
|
US11669953B2
(en)
*
|
2015-01-30 |
2023-06-06 |
Hitachi High-Tech Corporation |
Pattern matching device and computer program for pattern matching
|
|
JP6623545B2
(ja)
*
|
2015-04-30 |
2019-12-25 |
大日本印刷株式会社 |
検査システム、検査方法、プログラムおよび記憶媒体
|
|
KR102352698B1
(ko)
|
2015-04-30 |
2022-01-17 |
케이엘에이 코포레이션 |
자동화된 이미지 기반 프로세스 모니터링 및 제어
|
|
US10535131B2
(en)
*
|
2015-11-18 |
2020-01-14 |
Kla-Tencor Corporation |
Systems and methods for region-adaptive defect detection
|
|
US10451407B2
(en)
*
|
2015-11-23 |
2019-10-22 |
The Boeing Company |
System and method of analyzing a curved surface
|
|
US10365639B2
(en)
*
|
2016-01-06 |
2019-07-30 |
Kla-Tencor Corporation |
Feature selection and automated process window monitoring through outlier detection
|
|
WO2017141611A1
(ja)
*
|
2016-02-19 |
2017-08-24 |
株式会社Screenホールディングス |
欠陥検出装置、欠陥検出方法およびプログラム
|
|
US10740888B2
(en)
*
|
2016-04-22 |
2020-08-11 |
Kla-Tencor Corporation |
Computer assisted weak pattern detection and quantification system
|
|
JP6666046B2
(ja)
*
|
2016-04-25 |
2020-03-13 |
キヤノン株式会社 |
画像処理装置および画像処理方法
|
|
US10190991B2
(en)
|
2016-11-03 |
2019-01-29 |
Applied Materials Israel Ltd. |
Method for adaptive sampling in examining an object and system thereof
|
|
WO2019028017A1
(en)
*
|
2017-08-01 |
2019-02-07 |
Applied Materials Israel Ltd. |
EMPTY DETECTION METHOD AND INSPECTION SYSTEM
|
|
US10408764B2
(en)
*
|
2017-09-13 |
2019-09-10 |
Applied Materials Israel Ltd. |
System, method and computer program product for object examination
|
|
US10755405B2
(en)
|
2017-11-24 |
2020-08-25 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method and system for diagnosing a semiconductor wafer
|
|
KR102409943B1
(ko)
*
|
2017-11-29 |
2022-06-16 |
삼성전자주식회사 |
결함 검출 방법 및 이를 수행하기 위한 장치
|
|
CN110293753B
(zh)
*
|
2018-03-22 |
2021-07-23 |
海德堡印刷机械股份公司 |
借助计算机对印刷产品进行图像检测的方法
|
|
US11562505B2
(en)
|
2018-03-25 |
2023-01-24 |
Cognex Corporation |
System and method for representing and displaying color accuracy in pattern matching by a vision system
|
|
US11668655B2
(en)
*
|
2018-07-20 |
2023-06-06 |
Kla Corporation |
Multimode defect classification in semiconductor inspection
|
|
CN110969175B
(zh)
*
|
2018-09-29 |
2022-04-12 |
长鑫存储技术有限公司 |
晶圆处理方法及装置、存储介质和电子设备
|
|
JP7215882B2
(ja)
*
|
2018-11-15 |
2023-01-31 |
株式会社ニューフレアテクノロジー |
パターン検査装置及びパターン検査方法
|
|
CN109671078B
(zh)
*
|
2018-12-24 |
2022-11-01 |
广东理致技术有限公司 |
一种产品表面图像异常检测方法及装置
|
|
US10964015B2
(en)
|
2019-01-15 |
2021-03-30 |
International Business Machines Corporation |
Product defect detection
|
|
US10902620B1
(en)
*
|
2019-04-18 |
2021-01-26 |
Applied Materials Israel Ltd. |
Registration between an image of an object and a description
|
|
US11162906B2
(en)
|
2019-05-16 |
2021-11-02 |
General Inspection, Llc |
High-speed method and system for inspecting and sorting a stream of unidentified mixed parts
|
|
US11045842B2
(en)
|
2019-05-16 |
2021-06-29 |
General Inspection, Llc |
Method and system for inspecting unidentified mixed parts at an inspection station having a measurement axis to identify the parts
|
|
US11543364B2
(en)
*
|
2019-05-16 |
2023-01-03 |
General Inspection, Llc |
Computer-implemented method of automatically generating inspection templates of a plurality of known good fasteners
|
|
CN110276754B
(zh)
*
|
2019-06-21 |
2021-08-20 |
厦门大学 |
一种表面缺陷检测方法、终端设备及存储介质
|
|
US11137485B2
(en)
|
2019-08-06 |
2021-10-05 |
Waymo Llc |
Window occlusion imager near focal plane
|
|
KR102075872B1
(ko)
*
|
2019-08-09 |
2020-02-11 |
레이디소프트 주식회사 |
투과영상 기반의 비파괴검사 방법 및 이를 위한 장치
|
|
KR102415928B1
(ko)
*
|
2019-08-26 |
2022-07-05 |
레이디소프트 주식회사 |
투과영상 기반의 비파괴검사 방법
|
|
US11676260B2
(en)
|
2019-09-26 |
2023-06-13 |
Kla Corporation |
Variation-based segmentation for wafer defect detection
|
|
JP7745994B2
(ja)
*
|
2019-11-13 |
2025-09-30 |
キヤノン株式会社 |
情報処理装置及びその制御方法
|
|
CN110967851B
(zh)
*
|
2019-12-26 |
2022-06-21 |
成都数之联科技股份有限公司 |
一种液晶面板array图像的线路提取方法及系统
|
|
US11423529B2
(en)
*
|
2020-02-18 |
2022-08-23 |
Applied Materials Isreal Ltd. |
Determination of defect location for examination of a specimen
|
|
DE102020204508A1
(de)
*
|
2020-04-07 |
2021-10-07 |
Carl Zeiss Smt Gmbh |
System und Verfahren zur Inspektion einer Maske für die EUV-Lithographie
|
|
US11749569B2
(en)
*
|
2020-05-06 |
2023-09-05 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method for non-destructive inspection of cell etch redeposition
|
|
DE102020125929A1
(de)
*
|
2020-05-06 |
2021-11-11 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Verfahren zur nicht destruktiven überprüfung parasitärer ätzabscheidungen auf zellen
|
|
CN111913873A
(zh)
*
|
2020-06-17 |
2020-11-10 |
浙江数链科技有限公司 |
图片校验方法、装置、系统和计算机可读存储介质
|
|
CN116018612A
(zh)
*
|
2020-08-11 |
2023-04-25 |
应用材料公司 |
用于对基板作缺陷检查测量的方法、用于对基板成像的设备及其操作方法
|
|
US11907627B2
(en)
*
|
2020-12-15 |
2024-02-20 |
Battelle Memorial Institute |
Fabricated layout correlation
|
|
CN112581463B
(zh)
|
2020-12-25 |
2024-02-27 |
北京百度网讯科技有限公司 |
图像缺陷的检测方法、装置、电子设备、存储介质及产品
|
|
KR102595278B1
(ko)
*
|
2020-12-29 |
2023-10-27 |
부산대학교 산학협력단 |
표면결함검출 스캐너를 위한 이미지 데이터 저장 장치 및 방법
|
|
CN112712513A
(zh)
*
|
2021-01-05 |
2021-04-27 |
歌尔股份有限公司 |
产品缺陷检测方法、装置、设备及计算机可读存储介质
|
|
CN112734747B
(zh)
*
|
2021-01-21 |
2024-06-25 |
腾讯科技(深圳)有限公司 |
一种目标检测方法、装置、电子设备和存储介质
|
|
WO2023158457A2
(en)
*
|
2021-06-30 |
2023-08-24 |
Battelle Memorial Institute |
Automated circuit design validation
|
|
JP7699978B2
(ja)
*
|
2021-07-01 |
2025-06-30 |
株式会社日立製作所 |
計算機及び外観検査方法
|
|
US20230092975A1
(en)
*
|
2021-09-21 |
2023-03-23 |
Nimble Robotics, Inc. |
Systems And Methods For Teleoperated Robot
|
|
KR102670531B1
(ko)
*
|
2021-10-01 |
2024-05-30 |
삼성전자주식회사 |
반도체 웨이퍼 검사 방법 및 시스템, 및 이를 이용한 반도체 소자의 제조 방법
|
|
CN114091620B
(zh)
*
|
2021-12-01 |
2022-06-03 |
常州市宏发纵横新材料科技股份有限公司 |
一种模板匹配检测方法、计算机设备及存储介质
|
|
US12415619B2
(en)
*
|
2021-12-02 |
2025-09-16 |
Twin Coast Metrology, Inc. |
Metrological inspection system for aircraft
|
|
CN114187294B
(zh)
*
|
2022-02-16 |
2022-05-17 |
常州铭赛机器人科技股份有限公司 |
基于先验信息的规则晶片定位方法
|
|
EP4303794A1
(en)
*
|
2022-07-08 |
2024-01-10 |
Amadeus S.A.S. |
Method of baggage identification and baggage reconciliation for public transport
|
|
CN117094944B
(zh)
*
|
2023-07-11 |
2025-12-05 |
易思维(杭州)科技股份有限公司 |
一种基于二分法的图像缺陷定位方法
|
|
CN118315298B
(zh)
*
|
2024-06-07 |
2024-09-13 |
山东隽宇电子科技有限公司 |
一种半导体封装测试方法及系统
|