JP2013254886A - Component mounting apparatus and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method, capable of allowing a function of learning a suction position to correctly function even if an operation speed for a fine component is increased.SOLUTION: A component mounting apparatus is capable of switching an operation mode defining a speed pattern of operation speeds of a lifting drive shaft of a suction nozzle and a horizontal drive shaft of a mounting head between a normal operation mode that is set so as to shorten an operation time as much as possible and a low-speed operation mode in which the operation speed is set at a speed lower than that in a normal operation pattern. When misregistration of components in a component pickup operation is out of an allowable range, an operation mode switching section of the apparatus switches the operation mode to the low-speed operation mode and corrects a component suction position, and when misregistration after switching to the low-speed operation mode is within the allowable range, it switches the operation mode to the normal operation mode.

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting an electronic component on a substrate.

  In a component mounting apparatus, an electronic component is sucked and held by a suction nozzle provided in a mounting head from a component supply unit provided with a large number of component supply devices such as a tape feeder, and is transported and mounted on a substrate. In recent years, with the downsizing of electronic equipment and the miniaturization of electronic components, the demand for component mounting devices has increased, and as a result, the mounting operation accuracy has become higher. Yes. For this reason, a component supply device equipped with a so-called suction position learning function that corrects the appropriate position of the suction nozzle when sucking and holding a component based on the result of measuring the position shift state after actually sucking and holding the component is used. (See, for example, Patent Document 1). In the prior art shown in this patent document example, a deviation amount between the center position of the component sucked by the suction nozzle and the center position of the suction nozzle is detected, and a value obtained by multiplying the deviation amount by a sensitivity coefficient is used for the suction at the next suction. It is used as a correction value when positioning the nozzle.

Japanese Patent Laid-Open No. 2002-50896

  However, in the prior art including the above-mentioned patent document examples, there is a problem that the suction position learning does not function normally due to the increase in the operation speed due to the demand for miniaturization of parts to be worked on and the improvement of productivity. It is coming. That is, in the case of a fine part, the relative positional deviation amount allowed between the part and the suction nozzle in the suction operation is smaller than that of the normal part, and a higher degree of alignment accuracy is required. For this reason, a suction position learning function that is more precise than before is required, but the position at which the suction nozzle is positioned and stopped by servo control as the operation speed when the suction nozzle approaches the part increases. An inconvenient phenomenon occurs in which the error increases.

  In other words, when the operating speed is increased, the influence of minute vibrations generated in the mechanism parts such as the mounting head during the positioning operation process increases, and the suction nozzles before such fine vibrations are completely settled and become the correct positioning state. The component abuts against the component and suction of the component is performed. The settling position error due to the completion of positioning while the micro-vibration is not settled occurs with a different amount of misalignment for each suction operation, so the suction position learning does not function correctly, and the number of operations is repeated. It is difficult to converge to the correct adsorption position. As described above, the conventional component mounting apparatus has a problem that it is difficult to achieve convergence to the correct suction position by the suction position learning function with the miniaturization of parts to be worked and the increase in operation speed.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of correctly functioning the suction position learning function even when the operation speed is increased for a fine component.

  The component mounting apparatus of the present invention supplies the component to a predetermined supply position by the component supply means, moves the suction nozzle provided in the mounting head to the component suction position, and sucks and holds the supplied component. A component mounting apparatus for transferring and mounting a component to a mounting point on a substrate after a series of component extraction operations for recognizing the suction holding state of the extracted component by a component recognition means, and moving the suction nozzle up and down Mounting in normal operation, mounting drive mechanism including at least a horizontal drive shaft that horizontally moves the drive shaft and suction nozzle together with the mounting head, and an operation mode that defines a speed pattern of the operating speed of the elevating drive shaft and the horizontal drive shaft The normal operation mode set to shorten the operation time of the head as much as possible, and at least the suction nozzle in the series of operations. Based on a recognition result by the operation mode switching unit that switches between a low-speed operation mode in which a part of the operation speed when approaching the landing position is set lower than the operation speed in the normal operation mode, and the component recognition unit And a control unit that controls the mounting drive mechanism and the operation mode switching unit, and the control unit extracts the series of component extractions executed in the normal operation mode. In operation, when the state of displacement of the component exceeds a predetermined allowable range, the operation mode switching unit switches the operation mode to the low-speed operation mode, and the component suction position based on the displacement state. And the state of component misalignment in the series of component take-out operations performed after switching to the low-speed operation mode If the is within a predetermined allowable range, it switches the operation mode by the operation mode switching unit to the normal operation mode.

  In the component mounting method of the present invention, the component is supplied to a predetermined supply position by the component supply means, the suction nozzle provided in the mounting head is moved to the component suction position, and the supplied component is suction-held and taken out, After a series of component take-out operations for recognizing the suction holding state of the taken-out component by the component recognition means, a lifting drive shaft and a suction nozzle for moving the component to a mounting point on the substrate and raising and lowering the suction nozzle are provided. A mounting drive mechanism that has at least a horizontal drive shaft that moves horizontally with the mounting head, and an operation mode that defines the speed pattern of the operating speed of the elevating drive shaft and the horizontal drive shaft enables the mounting head operating time during normal operation. Normal operation mode that is set to shorten within a certain range, and when at least the suction nozzle is brought close to the component suction position in a series of operations An operation mode switching unit that switches between a part of the operation speeds and a low-speed operation mode that is set to be lower than the operation speed in the normal operation mode, and the positional deviation of the component based on the recognition result by the component recognition unit A component mounting method by a component mounting apparatus that includes a control unit that determines the state and controls the mounting drive mechanism and the operation mode switching unit, and the series of component take-out operations executed in the normal operation mode In the case where the component misalignment state exceeds a predetermined allowable range, the operation mode switching unit switches the operation mode to the low speed operation mode and corrects the component suction position based on the misalignment state. And a state of component misalignment in the series of component take-out operations performed after switching to the low-speed operation mode. If the is within a predetermined allowable range, it switches the operation mode by the operation mode switching unit to the normal operation mode.

  According to the present invention, the operation mode that defines the speed pattern of the vertical drive shaft that moves the suction nozzle up and down and the horizontal drive shaft that horizontally moves the suction nozzle together with the mounting head is shortened to the extent possible. It is possible to switch between the normal operation mode set to 1 and the low-speed operation mode where the operation speed is set slower than the normal operation pattern, and judgment is made by component recognition in a series of component extraction operations executed in the normal operation mode. When the state of the position deviation of the component that has been exceeded the predetermined allowable range, the operation mode switching unit switches the operation mode to the low speed operation mode, and corrects the component suction position based on the position deviation state, The component misalignment state in a series of component removal operations executed after switching to the low-speed operation mode is a predetermined tolerance. If it is within the range, the operation mode switching unit switches the operation mode to the normal operation mode, so that the suction position learning function can function correctly even when the operation speed is increased for fine parts. .

The top view of the component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention Structure explanatory drawing of the tape feeder of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the adsorption | suction position shift detection of the electronic component in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the operation mode (normal operation mode) of the mounting head in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the operation mode (1st low speed operation mode) of the mounting head in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the operation mode (2nd low-speed operation mode) of the mounting head in the component mounting apparatus of one embodiment of this invention The flowchart which shows the suction position shift correction process by the suction nozzle in the component mounting method of one embodiment of this invention The flowchart which shows the suction position shift correction process by the suction nozzle in the component mounting method of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. FIG. 2 partially shows the AA cross section in FIG. In FIG. 1, a substrate transport mechanism 2 is disposed in the X direction (substrate transport direction) at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 supplied from the upstream device and subjected to component mounting work by the device in the X direction and positions it at the component mounting work position. Component supply units 4 are arranged on both sides of the substrate transport mechanism 2, and each component supply unit 4 is provided with a plurality of tape feeders 5 serving as component supply means. The tape feeder 5 has a function of supplying an electronic component to a component suction position by a suction nozzle 9a of the mounting head 9 described below by pitch-feeding a carrier tape holding an electronic component (component) to be mounted. ing.

  A Y-axis movement table 7 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. The Y-axis movement table 7 is similarly provided with a linear drive mechanism. Two X-axis moving tables 8 are coupled so as to be movable in the Y direction. A mounting head 9 is mounted on each of the two X-axis moving tables 8 so as to be movable in the X direction. The mounting head 9 is a multiple-type head having a plurality of holding heads. At the lower end of each holding head, as shown in FIG. 9a is attached.

  By driving the Y-axis movement table 7 and the X-axis movement table 8, the mounting head 9 moves in the X direction and the Y direction. Thereby, the two mounting heads 9 take out the electronic component 16 (see FIG. 3) from the component suction position of the tape feeder 5 of the corresponding component supply unit 4 by the suction nozzle 9a and are positioned on the substrate transport mechanism 2. Transfer and mount at 3 mounting points. The Y-axis movement table 7, the X-axis movement table 8, and the mounting head 9 constitute a mounting drive mechanism 12 that transfers and mounts the electronic component 16 on the substrate 3 by moving the mounting head 9 that holds the electronic component 16. In other words, the mounting drive mechanism 12 includes at least a lifting drive shaft that moves the suction nozzle 9 a up and down and a horizontal drive shaft that horizontally moves the suction nozzle 9 a together with the mounting head 9.

  A component recognition camera 6 is disposed between the component supply unit 4 and the corresponding substrate transport mechanism 2. When the mounting head 9 that has taken out the electronic component 16 from the component supply unit 4 moves above the component recognition camera 6, the component recognition camera 6 captures and recognizes the electronic component 16 that is held by the mounting head 9. . Mounted on the mounting head 9 are substrate recognition cameras 10 that are positioned on the lower surface side of the X-axis moving table 8 and move together with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 10 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the recognition result of the electronic component 16 by the component recognition camera 6 and the substrate recognition result by the substrate recognition camera 10.

  That is, the component mounting apparatus 1 supplies the electronic component 16 to a predetermined supply position by the component supply means, moves the suction nozzle 9a provided in the mounting head 9 to the component suction position, and supplies the supplied electronic component 16 to the component suction position. The electronic component 16 is picked up and taken out, and the electronic component 16 is transferred to a mounting point on the substrate 3 after a series of component picking operations for recognizing the picked up and held state of the picked up electronic component 16 by the component recognition camera 6 as the component recognition means. It has a function to be installed.

  As shown in FIG. 2, a carriage 11 in which a plurality of tape feeders 5 are previously mounted on a feeder base 11 a is set in the component supply unit 4. The position of the carriage 11 is fixed in the component supply unit 4 by clamping the feeder base 11a to the fixed base 1b provided on the base 1a by the clamp mechanism 11b. The carriage 11 holds a supply reel 11c that stores a carrier tape 15 holding electronic components in a wound state. The carrier tape 15 drawn out from the supply reel 11c is pitch-fed by the tape feeder 5 to the pickup position by the suction nozzle 9a.

  Next, the configuration and function of the tape feeder 5 will be described with reference to FIG. As shown in FIG. 3, the tape feeder 5 includes a main body 5a and a mounting portion 5b protruding downward from the lower surface of the main body 5a. In a state where the tape feeder 5 is mounted with the lower surface of the main body portion 5a along the feeder base 11a, the connector portion 5c provided in the mounting portion 5b is fitted into the feeder base 11a. Thereby, the tape feeder 5 is fixedly mounted on the component supply unit 4, and the tape feeder 5 is electrically connected to the control unit 20 of the component mounting apparatus 1.

  Inside the main body 5a, a tape running path 5d that guides the carrier tape 15 drawn from the supply reel 11c and taken into the main body 5a is provided continuously from the rear end to the front end of the main body 5a. ing. In the component mounting apparatus 1 shown in the present embodiment, the end of the first carrier tape 15A that is already mounted on the tape feeder 5 is joined to the beginning of the second carrier tape 15B that is newly mounted when the component runs out. A splicing method is adopted in which the tape is joined by the joint portion J using tape, and the carrier tape 15 is continuously supplied to the tape feeder 5 without interruption due to replacement of the supply reel 11c.

  That is, in the component mounting apparatus 1 shown in the present embodiment, the carrier tape 15 holding the electronic component 16 is mounted on the tape feeder 5 arranged in the component supply unit 4, and the first carrier tape already mounted in the tape feeder 5. The carrier tape 15 is pitch-fed while repeating the splicing operation of joining the first carrier tape 15B to the newly-supplied second carrier tape 15B with the joining tape, whereby the electronic component 16 supplied to the pickup position is moved by the mounting head 9. The configuration is such that it is taken out and mounted on the substrate 3.

  In the carrier tape 15, a base pocket 15a constituting the tape body is provided with a component pocket 15b, which is a concave portion for housing the electronic component 16, and a feed hole 15d for pitch feeding the carrier tape 15 at a predetermined pitch. It becomes the composition. The upper surface of the base tape 15a is sealed with a top tape 15e so as to cover the component pocket 15b in order to prevent the electronic component 16 from falling off the component pocket 15b.

  In the main body 5a, a tape feeding portion 17 for pitch feeding the carrier tape 15 is incorporated. The tape feed unit 17 includes a tape feed motor 19 that rotationally drives a sprocket 13 provided at the tip of the tape running path 5d, and a feeder control unit 18 that controls the tape feed motor 19. When the tape feeder 5 is mounted on the feeder base 11a, the feeder controller 18 is connected to the controller 20.

  The sprocket 13 is provided with feed pins 13a that fit into the feed holes 15d at a constant pitch. With these feed pins 13a engaged with the feed holes 15d, the tape feed motor 19 is driven to drive the sprocket 13. Is intermittently rotated, whereby the carrier tape 15 is pitch-fed downstream. The front side of the sprocket 13 is a component suction position in which the electronic component 16 is taken out by vacuum suction from the component pocket 15b by the suction nozzle 9a of the mounting head 9.

  On the upper surface side of the main body 5a in the vicinity of the sprocket 13, a pressing member 14 for pressing and guiding the carrier tape 15 from the upper surface side is disposed. The holding member 14 is provided with a suction opening 14a corresponding to a pickup position by the suction nozzle 9a. The upstream end of the suction opening 14a is a top tape peeling portion 14b for peeling the top tape 15e. That is, in the process in which the carrier tape 15 travels below the pressing member 14, the top tape 15e circulates around the top tape peeling portion 14b and is drawn to the upstream side, so that the top tape 15e becomes the base tape on the upstream side of the pickup position. It is peeled off from 15a, folded back to the upstream side, sent into a tape collecting part provided in the main body part 5a, and collected. As a result, the electronic component 16 in the component pocket 15b is exposed upward in the suction opening 14a, and the component can be taken out by the suction nozzle 9a of the mounting head 9.

  In the present embodiment, since the electronic component 16 to be worked includes a fine component, the relative suction position deviation amount allowed in the suction operation when removing the component is smaller than that of the normal component, and is more advanced. High alignment accuracy is required. For this reason, a suction position learning method is adopted in which the suction position deviation amount is minimized by detecting and sequentially correcting the suction position deviation amount generated when the electronic component 16 is taken out by the mounting head 9. Furthermore, in the present embodiment, a plurality of operation modes are prepared in advance in order to appropriately control the operation speed when the mounting head 9 is accessed to the suction opening 14a and the suction nozzle 9a is landed on the component suction position. These operation modes are selected according to the operating state of the apparatus.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, the control unit 20 is a processing arithmetic device, and executes various programs stored in the storage unit 21 to control each unit described below to perform work operations and various processes by the component mounting apparatus 1. Let it run. In the control process by the control unit 20, the mounting data 22, the operation mode data 23, the positional deviation allowable range data 24, the status definition data 25, and the suction position learning data 26 stored in the storage unit 21 are referred to.

  The mounting data 22 indicates the type of the electronic component 16 mounted on the board 3 and the mounting position of these parts on the board 3 for each board type to be worked. The operation mode data 23 is data relating to an operation mode that defines a speed pattern of the operation speed of the horizontal drive shaft 12a and the elevation drive shaft 12b of the mounting drive mechanism 12 that moves the mounting head 9. Here, as the operation mode data 23, the normal operation mode 23a set so as to shorten the operation time of the mounting head 9 during the normal operation as much as possible, and a series of operations for component removal by the mounting head 9 are included. Two low-speed operation modes 23b are set in which at least a part of the operation speed when the suction nozzle 9a is approached to the component suction position is set lower than the operation speed in the normal operation mode 23a.

  The positional deviation allowable range data 24 is data defining the amount of relative positional deviation between the suction nozzle 9a and the electronic component 16 that is permitted when the electronic component 16 is vacuum-sucked and taken out by the suction nozzle 9a. It is defined by the amount of positional deviation between the 16 component centers and the nozzle center of the suction nozzle 9a. The status definition data 25 is definition data for classifying the state of the component mounting apparatus 1 from a specific point of view. Here, the status definition data 25 may affect a component suction position shift that occurs when the electronic component 16 is vacuum-sucked by the suction nozzle 9a. Status changes are defined by the presence or absence of gender changes.

  For example, the mechanism operation is not stable immediately after the apparatus is started until a predetermined time elapses. Further, when the tape feeder 5 is newly installed in the component supply unit 4, the component suction position varies due to the feeder machine difference. In addition, when the splicing operation for joining the preceding and succeeding carrier tapes 15 is performed in the tape feeder 5, it is inevitable that the component suction position is caused by the joining error. For this reason, in the present embodiment, the status change is defined as the execution of the work event as described above, and the presence or absence of the status change is detected by the status detection unit 31 described later. The suction position learning data 26 is data of a part suction position that is learned and sequentially updated by a suction position learning unit 29 described below.

  The mechanism driving unit 27 is controlled by the control unit 20 to drive the substrate transport mechanism 2 and the mounting driving mechanism 12. The mounting drive mechanism 12 includes a horizontal drive shaft 12 a, a lift drive shaft 12 b, and a θ drive shaft 12 c, and the above-described operation mode data 23 is referred to in the component removal operation by the mounting head 9. The recognition processing unit 28 performs recognition processing on the imaging data acquired by the component recognition camera 6 and the board recognition camera 10. By detecting the imaging data of the electronic component 16 obtained by the component recognition camera 6 and held by the suction nozzle 9a, the component suction position deviation state can be detected (see FIG. 5). Further, by performing recognition processing on the imaging data of the substrate 3 acquired by the substrate recognition camera 10, a positional deviation of the mounting point of the substrate 3 is detected.

  The suction position learning unit 29, based on the suction position deviation state detected by the recognition processing unit 28, is an appropriate component suction position for correctly holding the electronic component 16 by the suction nozzle 9a, that is, the correct movement of the suction nozzle 9a. A process of learning the target position and sequentially updating it is performed. The updated component suction position is stored in the storage unit 21 as suction position learning data 26. The operation mode switching unit 30 is controlled by the control unit 20 to perform a process of switching the operation mode data 23 between the normal operation mode 23a and the low speed operation mode 23b in the component picking operation by the mounting head 9.

  The status detection unit 31 performs a process of detecting whether or not the state of the component mounting apparatus 1 corresponds to the status definition data 25 defined in advance and stored in the storage unit 21. That is, the state of the component mounting apparatus 1 is determined based on a combination of various signals generated by an input signal from the operation panel, a sensor disposed in each part of the mechanism, a timer built in the control unit 20, or the like. In the above configuration, the control unit 20 determines whether the electronic component 16 is in a misalignment state based on the recognition result by the recognition processing unit 28, that is, the misalignment amount between the component center of the electronic component 16 and the nozzle center of the suction nozzle 9a is within an allowable range. And controlling the mounting drive mechanism 12 and the operation mode switching unit 30 to optimize the component take-out operation.

  In this processing, the control unit 20 determines that the position of the electronic component 16 exceeds the predetermined allowable range defined in the allowable positional deviation range data 24 in the series of component extraction operations executed in the normal operation mode 23a. The operation mode switching unit 30 switches the operation mode to the low-speed operation mode 23b, and the suction position learning unit 29 corrects the component suction position based on the position shift state. When the state of the position shift of the electronic component 16 in the series of component take-out operations executed after switching to the low speed operation mode 23b is within the predetermined allowable range defined in the position shift allowable range data 24, the operation state is It is determined that the operation is stable, and the operation mode switching unit 30 switches the operation mode to the normal operation mode 23a.

  Next, component recognition by the component recognition camera 6 will be described with reference to FIG. In the component mounting operation by the mounting head 9, as shown in FIG. 5A, the scanning operation for moving the mounting head 9 holding the electronic component 16 by suction nozzle 9a in a predetermined direction above the component recognition camera 6 is performed. I do. Thereby, the image of the electronic component 16 in the state of being sucked and held by the suction nozzle 9a is acquired. The image is subjected to recognition processing by the recognition processing unit 28 (see FIG. 4), and the amount of suction position deviation of the electronic component 16 is detected as shown in the recognition screen 6a of FIG. 5B.

  That is, on the recognition screen 6a, the component center PC indicating the center position of the electronic component 16 and the nozzle center NC indicating the center position of the suction nozzle 9a are recognized, and the X direction, Y direction, and Θ direction between the component center PC and the nozzle center NC. The adsorption position deviation amounts ΔX, ΔY, and ΔΘ indicating the position deviation are detected. In the present embodiment, when the suction position deviation amount exceeds a preset allowable range, it is a target position when the mounting head 9 is moved to bring the suction nozzle 9a closer to the electronic component 16. It is determined that the setting of the component suction position is inappropriate, and processing for optimizing the component extraction operation as described above is performed.

  Next, the details of the operation mode data 23 will be described with reference to FIGS. First, FIG. 6 shows a normal operation mode 23a set so as to shorten the operation time of the mounting head 9 during normal operation as much as possible. In the normal operation mode 23a, the suction nozzle 9a is moved to the component suction position for sucking the electronic component 16 in the component pocket 15b in the shortest possible time so that the nozzle center matches the component suction position. As shown in the figure, an arch motion M1 is employed in which a descent operation and a horizontal movement operation are overlapped to draw an arc-shaped locus on the suction nozzle 9a.

  In the arch motion M1, as shown in FIG. 6B, the speed pattern of the horizontal drive shaft 12a and the lift drive shaft 12b is as high as possible within the range allowed by the servo drive mechanism to shorten the operation time. Vxy1, Vz1 is used as the upper limit steady speed. With the normal operation mode 23a configured as described above, it is possible to shorten the operation time of the component extraction operation, and an improvement in productivity is expected. However, in the normal operation mode 23a, there is a problem caused by instability of stop position accuracy that is unavoidably accompanied by an increase in operation speed.

  6 (c) and 6 (d) show a problem that occurs in the normal operation mode 23a. In other words, when the operation speed is increased, there is a case where the suction nozzle 9a comes into contact with the electronic component 16 and the component is sucked before the fine vibration generated in the mechanism part during the positioning operation is completely settled and becomes a correct positioning state. is there. The settling position error due to the completion of positioning in such an unsetted state occurs with a different amount of positional deviation for each suction operation. For example, in the example illustrated in FIG. 6C, component suction is performed in a state where the nozzle center is displaced to the front side in the tape feeding direction with respect to the component suction position. In the example shown in FIG. 6D, on the contrary, the component suction is performed in a state where the nozzle center is displaced rearward. Then, since the suction position learning does not function correctly with respect to such a positional deviation caused by the settling position error, it is difficult to avoid the problem that it is difficult to converge to the correct component suction position even if the number of suction operations is repeated.

  In the present embodiment, the low-speed operation mode 23b in which the upper limit steady speed in the speed pattern is kept low is set for the purpose of reducing the problems associated with the increase in the operation speed as much as possible. That is, as shown in FIG. 7A, in the low-speed operation mode 23b (first low-speed operation mode), an arch motion that aligns the nozzle center with the component suction position by drawing an arc-shaped locus on the suction nozzle 9a. In M2, as shown in FIG. 7 (b), as the speed pattern of the horizontal drive shaft 12a and the lift drive shaft 12b, the speed having Vxy2 and Vz2 lower than Vxy1 and Vz1 in the normal operation mode 23a as the upper limit steady speed. The pattern is adopted. According to the low-speed operation mode 23b configured as described above, although the operation time of the component extraction operation is delayed as compared with the normal operation mode 23a, the positioning is completed in a state where the slight vibration at the time of stopping the suction nozzle 9a is settled. Therefore, the suction position learning function can be fully utilized to ensure high suction position accuracy.

  As the low speed operation mode 23b (second low speed operation mode), as shown in FIG. 8, an operation pattern in which the horizontal movement operation and the descent operation of the suction nozzle 9a are separated without using an arch motion is used. May be. That is, from the state shown in FIG. 8A, the horizontal movement operation M3 shown in FIG. 8B is executed, and the suction nozzle 9a moves above the electronic component 16 in the component pocket 15b. The height position is maintained until the fine vibration when the suction nozzle 9a is stopped is settled and the nozzle center is correctly aligned with the component suction position. As a result, as shown in FIG. 8C, the suction nozzle 9a is correctly aligned with the nozzle center at the component suction position. Then, as shown in FIG. 8D, the suction nozzle 9a sucks up to the suction height at which the electronic component 16 is sucked. A lowering operation M4 for lowering the nozzle 9a is performed. Similarly, in the low-speed operation mode 23b configured as described above, although the operation time of the component extraction operation is delayed as compared with the normal operation mode 23a, high suction position accuracy can be ensured.

  That is, in the low-speed operation mode 23b (first low-speed operation mode, first low-speed operation mode) shown in FIGS. 7 and 8, at least the suction nozzle 9a in the series of operations for component removal by the mounting head 9 is performed. A part of the operation speed when approaching the suction position is an operation mode set lower than the operation speed in the normal operation mode 23a.

  Next, by the component mounting apparatus 1 having the above-described configuration, the electronic component 16 whose components have been supplied to a predetermined supply position by the component supply unit is picked up and held by the suction nozzle 9a provided in the mounting head 9, and is taken out and taken out. A component mounting method for transferring and mounting the electronic component 16 to a mounting point on the substrate 3 after a series of component take-out operations for recognizing the suction holding state of the electronic component 16 by the component recognition camera 6 is shown in FIGS. It demonstrates along a flow.

  First, an example of controlling the mounting drive mechanism 12 and the operation mode switching unit 30 based on the detection result of the status detection unit 31 will be described with reference to FIG. In FIG. 9, when the operation of the component mounting apparatus 1 is started (ST1), the status detection unit 31 refers to the status definition data 25 to determine whether or not the apparatus state (status) is changed (ST2). If it is determined that there is a change, the operation mode switching unit 30 switches the operation mode of the mounting drive mechanism 12 to shift to the low speed operation mode 23b (ST3). Next, in this state, the mounting head 9 is moved to the component suction position of the tape feeder 5 and the component suction operation by the suction nozzle 9a is executed (ST4).

  Thereafter, the mounting head 9 holding the electronic component 16 is moved above the component recognition camera 6 to perform component imaging, thereby obtaining the component recognition / suction position deviation amount shown in FIG. 6 (ST5), and then mounting. The component 9 is moved by moving the head 9 onto the board 3 (ST6). Then, by the suction position learning function of the suction position learning unit 29, suction position correction is executed according to the suction position deviation amount acquired in (ST5) (ST7). The correction result is updated and stored in the storage unit 21 as suction position learning data 26.

  Here, it is determined whether or not the correction amount, that is, the state of positional deviation of the electronic component 16 is within a predetermined allowable range defined in the positional deviation allowable range data 24 (ST8). Then, it is confirmed whether the operation mode at the time is the normal operation mode 23a or the low-speed operation mode 23b (ST9). If the operation is being performed at a low speed, the operation mode switching unit 30 switches the operation mode to return to the normal operation mode 23a (ST10), and then returns to (ST2) to continue executing the same operation process. Similarly, when not in the low speed operation mode 23b in (ST9), the process returns to (ST2).

  Similarly, when it is confirmed in (ST8) that the position shift state is not within the allowable range, it is confirmed whether the operation mode at the time is the normal operation mode 23a or the low-speed operation mode 23b. (ST11). If the operation is at a low speed, the process returns to (ST4) and the operation process after the component adsorption operation is continued. On the other hand, if the operation is not being performed at a low speed, the process returns to (ST3) and the operation mode is switched to the low-speed operation mode 23b.

  That is, in the component mounting method shown in FIG. 9, when the status change state defined in the status definition data 25 is detected by the status detection unit 31 in a series of component extraction operations executed in the normal operation mode 23a, The operation mode switching unit 30 switches the operation mode to the low-speed operation mode 23b, corrects the component suction position based on the position shift state, and performs electronic components in a series of component pick-up operations executed after switching to the low-speed operation mode 23b. When the 16 position shift state is within a predetermined allowable range, the operation mode switching unit 30 switches the operation mode to the normal operation mode 23a.

  Next, referring to FIG. 10, when the position of the electronic component 16 is out of a predetermined allowable range in the component extraction operation, the mounting drive mechanism 12 and the operation mode switching unit 30 are controlled to operate at the low speed operation mode. An example of shifting to 23b will be described. Here, during the continuous execution of the component extraction operation in the normal operation mode 23a, the mode is shifted to the low-speed operation mode 23b for the reason described above. That is, in FIG. 10, the mounting head 9 is first moved to the component suction position of the tape feeder 5 and the component suction operation by the suction nozzle 9a is executed (ST12).

  Thereafter, the mounting head 9 holding the electronic component 16 is moved above the component recognition camera 6 to capture the component, thereby acquiring the component recognition / suction position deviation amount shown in FIG. 6 (ST13), and then the component. It is determined whether or not the center position is within an allowable range, that is, whether or not the amount of positional deviation is within a predetermined allowable range defined in the positional deviation allowable range data 24 (ST14). Here, if it is within the allowable range, the mounting head 9 is moved onto the substrate 3 to execute the component mounting operation (ST15). Then, by the suction position learning function of the suction position learning unit 29, suction position correction is executed according to the suction position deviation amount acquired in (ST13) (ST7). The correction result is updated and stored in the storage unit 21 as suction position learning data 26.

  In (ST14), when the component center position is not within the allowable range and the positional deviation amount exceeds the allowable range specified in the positional deviation allowable range data 24, the operation mode is switched by the operation mode switching unit 30. The process proceeds to the low speed operation mode 23b (ST17). Thereafter, the mounting head 9 is moved to a predetermined component disposal position, and the electronic component 16 held by the suction nozzle 9a in a misaligned state exceeding the allowable range is discarded as an NG component (ST18).

  Then, by the suction position learning function of the suction position learning unit 29, the suction position correction is executed according to the suction position deviation amount acquired in (ST13) (ST19). The correction result is updated and stored in the storage unit 21 as suction position learning data 26. Thereafter, the component take-out operation is executed in the low speed operation mode 23b. That is, the mounting head 9 is moved to the component suction position of the tape feeder 5 and the component suction operation by the suction nozzle 9a is executed (ST20).

  Thereafter, the mounting head 9 holding the electronic component 16 is moved above the component recognition camera 6 to perform component imaging, thereby acquiring the component recognition / suction position deviation amount shown in FIG. 6 (ST21), and then the component. It is determined whether or not the center position is within an allowable range, that is, whether or not the amount of positional deviation is within a predetermined allowable range defined in the positional deviation allowable range data 24 (ST22). Here, if it is within the allowable range, it is determined that the component suction position has been correctly set by correction, the operation mode switching unit 30 switches the operation mode and returns to the normal operation mode 23a (ST23), and thereafter (ST15) and thereafter. The operation process is repeatedly executed. In (ST22), when the amount of misalignment exceeds the predetermined permissible range defined in the permissible misalignment range data 24, returning to (ST18), the suction position learning operation after discarding the NG component is performed. The process is repeated until improvement of the suction position deviation state is confirmed in (ST22).

  That is, in the component mounting method shown in FIG. 10, in a series of component take-out operations executed in the normal operation mode 23 a, a predetermined allowable range in which the position of the electronic component 16 is placed in the position shift allowable range data 24 is defined. Is exceeded, the operation mode switching unit 30 switches the operation mode to the low-speed operation mode 23b, corrects the component suction position based on the position shift state, and executes after switching to the low-speed operation mode 23b. When the position of the electronic component 16 in the series of component extraction operations is within a predetermined allowable range, the operation mode switching unit 30 switches the operation mode to the normal operation mode 23a.

  As described above, the component mounting apparatus and the component mounting method electronic component shown in the present embodiment include the elevating drive shaft 12b that raises and lowers the suction nozzle 9a and the horizontal drive shaft 12a that horizontally moves the suction nozzle 9a together with the mounting head 9. An operation mode that defines a speed pattern of the operation speed includes a normal operation mode 23a that is set to shorten the operation time as much as possible, and a low-speed operation mode 23b that the operation speed is set to be lower than the normal operation pattern. It can be switched between.

  Then, in a series of component take-out operations executed in the normal operation mode 23a, when the status change state previously defined as the status definition data 25 is detected by the status detection unit 31, or the electronic component 16 determined by component recognition. When the state of misalignment exceeds a predetermined allowable range, the operation mode switching unit 30 switches the operation mode to the low speed operation mode 23b and corrects the component suction position based on the state of misalignment. When the state of component misalignment in a series of component take-out operations executed after switching to the operation mode 23b is within a predetermined allowable range, the operation mode switching unit 30 switches the operation mode to the normal operation mode 23a. It is a thing.

  As a result, the operation time in the low-speed operation mode 23b is shortened to suppress the decrease in productivity due to the low-speed operation as much as possible, and the operation speed in the time zone in which the low-speed operation is required in the suction position learning is made higher than the normal operation. Also, the suction position learning function can be made to function correctly even when the operation speed is increased for fine parts by setting it to a low speed.

  The component mounting apparatus and the component mounting method of the present invention have the effect that the suction position learning function can be functioned correctly even when the operation speed is increased for fine components, and is supplied by the component supply means. This is useful in the field of component mounting for mounting a manufactured component on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Board | substrate 4 Component supply part 5 Tape feeder 6 Component recognition camera 9 Mounting head 9a Adsorption nozzle 10 Board recognition camera 12 Mounting drive mechanism 16 Electronic component

Claims (2)

The component supply means supplies the component to a predetermined supply position, moves the suction nozzle provided in the mounting head to the component suction position, sucks and holds the supplied component, and sucks and holds the removed component. A component mounting apparatus for transferring and mounting the component to a mounting point on the board after a series of component take-out operations for recognizing the state by the component recognition means,
A mounting drive mechanism comprising at least a lifting drive shaft for moving the suction nozzle up and down and a horizontal drive shaft for moving the suction nozzle together with the mounting head;
The operation mode that defines the speed pattern of the operation speed of the elevating drive shaft and the horizontal drive shaft is a normal operation mode that is set to shorten the operation time of the mounting head during normal operation as much as possible, and a series of operations. An operation mode switching unit that switches between a low-speed operation mode in which at least a part of the operation speed when the suction nozzle approaches the component suction position is set lower than the operation speed in the normal operation mode;
And determining a position displacement state of the component based on a recognition result by the component recognition means, and a control unit for controlling the mounting drive mechanism and the operation mode switching unit,
In the series of component take-out operations executed in the normal operation mode, the control unit sets the operation mode to a low speed by the operation mode switching unit when the state of the component misalignment exceeds a predetermined allowable range. Switch to the operation mode, correct the component suction position based on the state of the displacement,
When the state of component misalignment in the series of component take-out operations executed after switching to the low-speed operation mode is within the predetermined allowable range, the operation mode switching unit changes the operation mode to the normal operation mode. A component mounting apparatus characterized by switching. The component supply means supplies the component to a predetermined supply position, moves the suction nozzle provided in the mounting head to the component suction position, sucks and holds the supplied component, and sucks and holds the removed component. After a series of component take-out operations for recognizing the state by the component recognition means, the component is transferred and mounted on the mounting point on the board,
A mounting drive mechanism including at least a lift drive shaft for moving the suction nozzle up and down and a horizontal drive shaft for horizontally moving the suction nozzle together with the mounting head, and an operation mode for defining a speed pattern of the operation speed of the lift drive shaft and the horizontal drive shaft A normal operation mode that is set so as to shorten the operation time of the mounting head during a normal operation as much as possible, and a part of operations when at least the suction nozzle is brought close to the component suction position in a series of operations. An operation mode switching unit that switches between a low-speed operation mode in which the speed is set to be lower than the operation speed in the normal operation mode, and a state of positional deviation of the component based on a recognition result by the component recognition unit In addition, a component implementation by a component mounting apparatus comprising the mounting drive mechanism and a control unit that controls the operation mode switching unit. There is provided a method,
When the state of component misalignment exceeds a predetermined allowable range in the series of component take-out operations executed in the normal operation mode, the operation mode switching unit switches the operation mode to the low-speed operation mode, and Correcting the component suction position based on the state of the displacement,
When the state of component misalignment in the series of component take-out operations executed after switching to the low-speed operation mode is within the predetermined allowable range, the operation mode switching unit changes the operation mode to the normal operation mode. A component mounting method characterized by switching.

Images