CN103491761B - Element fixing apparatus and component mounting method - Google Patents
Element fixing apparatus and component mounting method Download PDFInfo
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- CN103491761B CN103491761B CN201310148030.2A CN201310148030A CN103491761B CN 103491761 B CN103491761 B CN 103491761B CN 201310148030 A CN201310148030 A CN 201310148030A CN 103491761 B CN103491761 B CN 103491761B
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Abstract
It is an object of the invention to provide a kind of element fixing apparatus and component mounting method, even in also absorption position learning functionality being made normally to play in the case of responsiveness high speed as object fine element.Pattern as defined in being carried out to the lift drive shaft of suction nozzle and the velocity mode of the responsiveness of the horizontal drive shaft of mounting head is in the usual pattern set in the way of actuation time is shortened within the bounds of possibility and responsiveness is set as between the low speed pattern lower than usual pattern to switch over, when the position deviation of element exceeds allowed band in element taking-up action, pattern is switched into low speed pattern by pattern switching part, and correcting element absorption position, after low speed pattern is switched to, if pattern just is switched into usual pattern in position deviation allowed band.
Description
Technical field
The present invention relates to a kind of element fixing apparatus and component mounting method that electronic component is installed on to substrate.
Background technology
In element fixing apparatus, by being arranged at the suction nozzle of mounting head from being disposed with the elements such as multiple tape feeders
The component feeding portion absorption of feedway is kept and takes out electronic component, and electronic element transferring is equipped on into substrate.It is near several
Year, the installation action precision with the miniaturization of electronic equipment, the miniaturization of electronic component to element fixing apparatus requirement is high
Degreeization, the result is that, it is desirable to holding element is adsorbed with high positional precision by suction nozzle.Therefore, using possessing so-called adsorption potential
The component supplying apparatus of learning functionality is put, the absorption position learning functionality is according to the position after the actual absorption holding element of measurement
Result that bias state obtains is put to correct the function of the appropriate location of suction nozzle during absorption holding element（Referring for example to patent text
Offer 1）.In the prior art, detected shown in patent document example in the center and suction nozzle of the element of suction
Departure between heart position, by the suction nozzle when value after sensitivity coefficient is multiplied by the departure as to adsorbing next time
Corrected value when being positioned.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2002-50896 publications
The content of the invention
However, including above-mentioned patent document example in the prior art, due to the miniaturization of the element as manipulating object
With the requirement that productivity ratio is improved and the high speed of responsiveness that produces, to produce absorption position and learn normally to play
The problem of effect.That is, in the case of fine element, the relative position allowed in absorption action between element and suction nozzle is inclined
Residual quantity is smaller compared with usual element, it is desirable to higher aligning accuracy.Therefore, while it is desirable to finer absorption position than ever
Learning functionality, but with making suction nozzle be uprised close to responsiveness during element, produce suction nozzle positioned by SERVO CONTROL and
Site error during stopping becomes big bad phenomenon.
That is, if responsiveness is uprised, the micro-vibration that first-class mechanism section occurs etc. is being installed during location action
Influence becomes big, and before this micro-vibration complete stability reaches correct positioning states, suction nozzle is connected to element and carries out member
Part is adsorbed.Moreover, because the settling position error for completing positioning under being in unsteady state in this micro-vibration and producing is each
Absorption action occurs with different position deviation amounts, so absorption position study can not normally play a role, even if increase is acted
Number of times is also difficult to converge to correct absorption position.In this way, there is following problem in existing element fixing apparatus：With conduct
The miniaturization of the element of manipulating object and the high speed of responsiveness, and be difficult to based on absorption position learning functionality to just
The convergence of true absorption position.
Therefore, it is an object of the invention to provide a kind of element fixing apparatus and component mounting method, even in will be fine
Element also can normally play absorption position learning functionality as object in the case of responsiveness high speed.
The element fixing apparatus of the present invention, makes setting by component feeding by component feeding unit to defined supply position
Element absorption position is moved in the suction nozzle of mounting head, absorption keeps and takes out the element being supplied to, recognized by element single
The absorption hold mode of the element of the member to being removed is identified, will more than after a series of element taking-up action
Element transfer is equipped on the mount point on substrate, and the element fixing apparatus possesses：Drive mechanism is installed, at least possessing makes institute
The horizontal drive shaft stated the lift drive shaft of suction nozzle lifting and make suction nozzle be moved horizontally together with mounting head；Pattern switches
Portion, will carry out defined pattern usual to the lift drive shaft and the velocity mode of the responsiveness of horizontal drive shaft
Switched between pattern and low speed pattern, the usual pattern is with by mounting head during usual action
The pattern that the mode that actuation time shortens within the bounds of possibility is set, the low speed pattern is will be a succession of
Action in suction nozzle is set as close to the responsiveness of the part during element absorption position generally more dynamic than described
The low pattern of responsiveness in operation mode；And control unit, according to the identification knot produced by the component recognition unit
Fruit controls the installation drive mechanism and pattern switching come the state of the position deviation that judges the element
Portion, control unit element described in a series of element taking-up action performed according to the usual pattern
When the state of position deviation exceeds defined allowed band, low speed is switched to move pattern by the pattern switching part
Operation mode, and the element absorption position is corrected according to the state of the position deviation, acted switching to the low speed
The state of the position deviation of element in a series of element taking-up action performed after pattern is in described defined
When in allowed band, pattern is switched into usual pattern by the pattern switching part.
The component mounting method of the present invention, based on element fixing apparatus, in the element fixing apparatus, by component feeding list
Component feeding to defined supply position is made the suction nozzle for being arranged at mounting head be moved to element absorption position by member, and absorption is kept
And the element that is supplied to described in taking out, the absorption hold mode of the element by component recognition unit to being removed knows
Not, more than after a series of element taking-up action, the element is transferred to the mount point being equipped on substrate, the element peace
Assembling device possesses：Drive mechanism is installed, at least possesses the lift drive shaft for making the suction nozzle lifting and makes suction nozzle and mounting head one
Act the horizontal drive shaft moved horizontally；Pattern switching part, by the action speed of the lift drive shaft and horizontal drive shaft
The velocity mode of degree carries out defined pattern and switched between usual pattern and low speed pattern, described logical
Normal pattern is set in the way of the actuation time of mounting head when generally acting is shortened within the bounds of possibility
Pattern, when the low speed pattern is by suction nozzle is at least made in a series of action close to the element absorption position
The responsiveness of a part be set as the pattern lower than responsiveness in the usual pattern；And control
Portion, the state of the position deviation of the element is judged according to the recognition result produced by the component recognition unit, and is controlled
In the system installation drive mechanism and the pattern switching part, the component mounting method, according to the usual action
When the state of the position deviation of element exceeds defined allowed band in a series of element taking-up action that pattern is performed,
Pattern is switched into low speed pattern by the pattern switching part, and according to the state of the position deviation come
The element absorption position is corrected, a series of element performed after the low speed pattern is switched to takes out dynamic
, will be dynamic by the pattern switching part when state of the position deviation of element in work is in the defined allowed band
Operation mode switches to usual pattern.
Invention effect
In accordance with the invention it is possible to by making the lift drive shaft of suction nozzle lifting and suction nozzle is moved horizontally together with mounting head
Horizontal drive shaft responsiveness velocity mode carry out as defined in pattern usual pattern and low speed action mould
Switched between formula, the usual pattern is set in the way of actuation time is shortened within the bounds of possibility
Pattern, the low speed pattern is that responsiveness is set as to the pattern lower than usual pattern, in root
The position for the element for being recognized and being judged by element in a series of element taking-up action performed according to usual pattern is inclined
When the state of difference exceeds defined allowed band, pattern is switched into low speed pattern by pattern switching part, and
And according to the state of position deviation come correcting element absorption position, what is performed after low speed pattern is switched to is a series of
, will by pattern switching part when the state of the position deviation of element in element taking-up action is in defined allowed band
Pattern switches to usual pattern, thus, even in regarding fine element as object and the feelings of responsiveness high speed
Also absorption position learning functionality can be made normally to play under condition.
Brief description of the drawings
Fig. 1 is the top view of the element fixing apparatus of one embodiment of the present invention.
Fig. 2 is the partial section of the element fixing apparatus of one embodiment of the present invention.
Fig. 3 is the structure explanation figure of the tape feeder of one embodiment of the present invention.
Fig. 4 is the block diagram of the structure of the control system for the element fixing apparatus for representing one embodiment of the present invention.
Fig. 5 is the absorption position separate-blas estimation of the electronic component in the element fixing apparatus of one embodiment of the present invention
Illustrate figure.
Fig. 6 is the pattern of the mounting head in the element fixing apparatus of one embodiment of the present invention（Generally act mould
Formula）Explanation figure.
Fig. 7 is the pattern of the mounting head in the element fixing apparatus of one embodiment of the present invention（First low speed is moved
Operation mode）Explanation figure.
Fig. 8 is the pattern of the mounting head in the element fixing apparatus of one embodiment of the present invention（Second low speed is moved
Operation mode）Explanation figure.
Fig. 9 is the absorption position deviation school based on suction nozzle in the component mounting method for represent one embodiment of the present invention
The flow chart just handled.
Figure 10 is the absorption position deviation based on suction nozzle in the component mounting method for represent one embodiment of the present invention
The flow chart of correction process.
Reference
1 element fixing apparatus
3 substrates
4 component feeding portions
5 tape feeders
6 component recognizing cameras
9 mounting heads
9a suction nozzles
10 board-recognition cameras
12 install drive mechanism
16 electronic components
Embodiment
Then, embodiments of the present invention are illustrated referring to the drawings.First, reference picture 1, Fig. 2 are installed to element and filled
The structure for putting 1 is illustrated.In addition, Fig. 2 partly illustrates the Section A-A in Fig. 1.Base station 1a center in Fig. 1, along X
Direction（Board carrying direction）It is configured with substrate conveying mechanism 2.Substrate conveying mechanism 2 is carried in X direction to be supplied from upstream side device
Give and object as the component mounting work based on the element fixing apparatus 1 substrate 3, the substrate 3 is positioned at element peace
Fill job position.Component feeding portion 4 is configured with the both sides of substrate conveying mechanism 2, is disposed with each component feeding portion 4
It is used as multiple tape feeders 5 of component feeding unit.Tape feeder 5 has by keeping the electronics as mounting object
Element（Element）Carrier band enter line space feeding, and electronic component is supplied to the suction nozzle 9a based on mounting head 9 described below
Element absorption position function.
The end of the side of X-direction on base station 1a upper surfaces, is configured with the Y-axis mobile working for possessing linear driving mechanism
Platform 7, in Y-axis mobile work platform 7, the two X-axis shifting for being likewise supplied with linear driving mechanism is movably combined with along Y-direction
Dynamic workbench 8.In two X-axis mobile work platforms 8, mounting head 9 is movably installed in X direction respectively.Mounting head 9 is
Possesses the multi-type head of multiple holding heads, in the bottom of each holding head, as shown in Fig. 2 being provided with absorption keeps electronics member
Part and the suction nozzle 9a that can individually lift.
By driving Y-axis mobile work platform 7, X-axis mobile work platform 8, mounting head 9 in X direction, Y-direction movement.Thus,
In two mounting heads 9, taken by the element absorption position of suction nozzle 9a from the tape feeder 5 in each self-corresponding component feeding portion 4
Go out electronic component 16（Reference picture 3）, the electronic component 16 is transferred to the substrate 3 for being equipped on and being positioned on substrate conveying mechanism 2
Mount point.Y-axis mobile work platform 7, X-axis mobile work platform 8 and mounting head 9 are constituted by making the installation of holding electronic component 16
First 9 move and move electronic component 16 the installation drive mechanism 12 for being equipped on substrate 3.That is, it is at least to install drive mechanism 12
Possess the lift drive shaft for lifting suction nozzle 9a and the knot for the horizontal drive shaft for making suction nozzle 9a be moved horizontally together with mounting head 9
Structure.
Between component feeding portion 4 and corresponding substrate conveying mechanism 2, component recognizing camera 6 is configured with.From component feeding
Portion 4 takes out the mounting head 9 after electronic component 16 in the top movement of component recognizing camera 6, and 6 pairs of component recognizing camera is held in
The electronic component 16 of the state of mounting head 9 is shot and recognized.It is provided with mounting head 9 positioned at X-axis mobile work platform 8
Lower face side and the board-recognition camera 10 integratedly moved with mounting head 9 respectively.Moved by mounting head 9, substrate identification phase
Machine 10 is moved to the top for the substrate 3 being positioned on substrate conveying mechanism 2, and substrate 3 is shot and recognized.Based on peace
In the component mounting operation to substrate 3 of dress first 9, component recognizing camera 6 is added to the recognition result of electronic component 16 and is based on
The substrate recognition result of board-recognition camera 10 carries out mounting position correcting.
That is, element fixing apparatus 1 has following function：Electronic component 16 is supplied to defined by component feeding unit and supplied
To position, the suction nozzle 9a for being arranged at mounting head 9 is set to be moved to element absorption position, absorption keeps and taken out the electronics member being supplied to
Part 16, the absorption hold mode for the electronic component 16 being removed by 6 pairs of the component recognizing camera as component recognition unit is carried out
Identification, more than after a series of element taking-up action, the electronic component 16 is transferred the mount point being equipped on substrate 3.
Multiple tape feeders 5 are mounted with loader pedestal 11a in advance as shown in Fig. 2 being provided with component feeding portion 4
State chassis 11.Relative to the fixed pedestal 1b set on base station 1a, by clamp system 11b by loader pedestal
11a is clamped, and the position of chassis 11 is thus fixed in component feeding portion 4.Supply spool 11c is maintained on chassis 11, the supply
Spool 11c stores the carrier band 15 for maintaining electronic component with reeling condition.Pass through belt from the supply spool 11c carrier bands 15 drawn
Loader 5 enters line space and is fed to the take-off location based on suction nozzle 9a.
Then, reference picture 3 is illustrated to the structure and function of tape feeder 5.As shown in figure 3, tape feeder 5 is
Possess main part 5a and protrude the installation portion 5b of setting structure downwards from main part 5a following table.Make main part 5a's
In the state of lower surface installs tape feeder 5 along loader pedestal 11a, the connecting portion 5c set on installation portion 5b is with supplying
Glassware pedestal 11a is fitted together to.Thus, tape feeder 5 is fixedly installed in component feeding portion 4, and tape feeder 5 is pacified with element
The control unit 20 of assembling device 1 is electrically connected.
In main part 5a inside, band travel path 5d is continuously provided with to leading section from main part 5a rearward end, should
Drawn with travel path 5d guiding from supply spool 11c and be taken into the carrier band 15 in main part 5a.Shown in present embodiment
Element fixing apparatus 1 in, employ connecting method, the connecting method is by using the seam J of bonding ribbon by belt
The the second carrier band 15B reinstalled when mounted first carrier band 15A tail portion and element is finished in loader 5 beginning portion
Engagement, so that interruption will not be produced because of supply spool 11c replacing, constantly to the supply of tape feeder 5 carrier band 15.
That is, in the element fixing apparatus 1 shown in present embodiment, it is formed as mode：Electronic component will be maintained
16 carrier band 15 is installed on the tape feeder 5 arranged in component feeding portion 4, is repeated tape feeder by bonding ribbon
The splicing operation of mounted first carrier band 15A and the second carrier band 15B engagements supplied again in 5, and carrier band 15 is entered in the ranks
Away from feeding, it is supplied to the electronic component 16 of take-off location so as to be taken out by mounting head 9 and electronic component 16 is installed on base
Plate 3.
Carrier band 15 is to be provided as storing with regulation spacing on the base band 15a with main body is constituted keeping electronic component 16
The recess of element storage is element resettlement section 15b and the structure for entering the inlet ports 15d that line space is fed to carrier band 15.Base
Upper surface with 15a is by heading tape 15e coverings and potted component resettlement section 15b, to prevent electronic component 16 from element resettlement section
15b comes off.
The band feeding portion 17 for entering line space feeding to carrier band 15 is built-in with main part 5a.Band feeding portion 17 possesses pair
The sprocket wheel 13 set in the leading section with travel path 5d carries out the band feeding motor 19 and control band feeding motor of rotation driving
19 loader control unit 18.In the state of tape feeder 5 is installed on loader pedestal 11a, loader control unit 18 with
Control unit 20 is connected.
The feeding pin 13a chimeric with inlet ports 15d is provided with determining deviation on sprocket wheel 13, in these feeding pin 13a engagings
In the state of inlet ports 15d, motor 19 is fed by drive belt and makes the intermittent rotary of sprocket wheel 13, the downstream side spacing of carrier band 15
Feeding.The nearby side of sprocket wheel 13 be by mounting head 9 suction nozzle 9a is from element resettlement section 15b vacuum suctions and takes out electronic component
16 element absorption position.
The upper surface side of main part 5a near sprocket wheel 13 be configured with pressed from upper surface side and guide carrier band 15 by
Splenium part 14.With the take-off location based on suction nozzle 9a accordingly provided with absorption opening portion 14a on pressing component 14.Absorption opening
Portion 14a upstream end is the heading tape stripping portion 14b for peeling off heading tape 15e.That is, carrier band 15 pressing component 14 bottom row
During entering, heading tape 15e is set to be drawn to the upstream side around heading tape stripping portion 14b, so as to be pushed up in the upstream side of take-off location
Band 15e is peeled off from base band 15a and turned back to the upstream side, and is fed in the band recoverer set in main part 5a and is reclaimed.
Thus, the electronic component 16 in the 15b of element resettlement section exposes upward in absorption opening portion 14a, in can be based on
The state that the suction nozzle 9a of mounting head 9 element takes out.
In the present embodiment, due to including fine element as the electronic component 16 of manipulating object, so element takes
The relative absorption position departure allowed in absorption action when going out is smaller compared with usual element, it is desirable to higher contraposition essence
Degree.Therefore, employ the absorption position departure that is produced during the taking-up by detecting the electronic component 16 based on mounting head 9 and according to
Secondary be corrected and make the minimum absorption position mode of learning of absorption position departure.Moreover, in the present embodiment, in order to suitable
Responsiveness when locality control makes mounting head 9 close to absorption opening portion 14a and makes suction nozzle 9a arrival element absorption positions, in advance
Multiple patterns are prepared with, to select these patterns according to device operating condition.
Then, reference picture 4 is illustrated to the structure of control system.In Fig. 4, control unit 20 is processing arithmetic unit,
By performing the various programs stored in storage part 21, each several part described below is controlled, each several part is performed based on element peace
The operation action of assembling device 1 and various processing.When carrying out the control process based on control unit 20, reference is stored in storage part 21
Installation data 22, pattern data 23, position deviation allowed band data 24, state define data 25, absorption position
Practise data 26.
Installation data 22 is represented to be installed on the classification and substrate of the electronic component 16 of substrate 3 by the substrate of every kind of manipulating object
Installation site of these elements in 3 etc..Pattern data 23 are the data for being related to pattern, and the pattern is to making
Horizontal drive shaft 12a, the velocity mode of lift drive shaft 12b responsiveness for the installation drive mechanism 12 that mounting head 9 is moved
Provided.Here, as pattern data 23, being set with following two patterns：With by installation during usual action
The usual pattern 23a that the mode that first 9 actuation time shortens within the bounds of possibility is set；It will be used for based on installation
At least make suction nozzle 9a close to the responsiveness of part during element absorption position in a series of action that first 9 element takes out
It is set as the low speed pattern 23b lower than responsiveness in usual pattern 23a.
Position deviation allowed band data 24 are the suction to allowing by suction nozzle 9a vacuum suctions and when taking out electronic component 16
Relative position deviation amount between mouth 9a and electronic component 16 carry out as defined in data, by the element central of electronic component 16 and
Position deviation amount between suction nozzle 9a mouth center is provided.It is to distinguish element peace from specific viewpoint that state, which defines data 25,
The definition data of the state of assembling device 1, here, according to by suction nozzle 9a vacuum suction electronic components 16 when the element that produces adsorb
The presence or absence of change of possibility that position deviation is impacted carrys out definition status change.
For example, after device just starting untill by the stipulated time, mechanism action is unstable.Also, in component feeding
In the case of tape feeder 5 is reinstalled in portion 4, the variation of generating element absorption position because of the machine error of loader.
Also, in tape feeder 5, if performing the splicing operation that is engaged to leading, follow-up carrier band 15, be not avoided that by
The generation of element absorption position caused by bonding error.Therefore, in the present embodiment, according to activity as described above
Execution be defined as Status Change, the presence or absence of Status Change detected by state detecting section 31 described later.Absorption position learns number
It is the data for the element absorption position for being learnt by absorption position study portion 29 described below and being updated successively according to 26.
Mechanism drive part 27 is controlled by control unit 20, and substrate conveying mechanism 2, installation drive mechanism 12 are driven.Peace
Dress drive mechanism 12 includes horizontal drive shaft 12a, lift drive shaft 12b, θ drive shaft 12c, in the element based on mounting head 9
In taking-up action, with reference to foregoing pattern data 23.28 pairs of identifying processing portion recognizes phase by component recognizing camera 6, substrate
Processing is identified in the photographed data that machine 10 is obtained.By to it is being obtained by component recognizing camera 6, be held in suction nozzle 9a state
The photographed data of electronic component 16 processing is identified, being capable of detecting element absorption position bias state（Reference picture 5）.And
And, processing is identified by the photographed data of the substrate 3 to being obtained by board-recognition camera 10, the mount point of substrate 3 is detected
Position deviation.
Absorption position study portion 29 carries out as follows according to the absorption position bias state detected by identifying processing portion 28
Processing：Learn and update successively for by suction nozzle 9a correctly adsorb holding electronic component 16 appropriate element absorption position i.e.
Suction nozzle 9a correct moving target position.Element absorption position after renewal is stored in as absorption position learning data 26
Storage portion 21.Pattern switching part 30 is carried out by being controlled by control unit 20 in the element taking-up action based on mounting head 9
The processing of switching action mode data 23 between usual pattern 23a and low speed pattern 23b.
Whether the state of the progress detecting element of state detecting section 31 erecting device 1, which meets, pre-defines and is stored in storage part
21 state defines the processing of data 25.That is, according to the input signal from guidance panel, it is configured at the sensing of mechanism each several part
Device carrys out the state of judgment component erecting device 1 with the combination for being built in the various signals that timer of control unit 20 etc. is sent.
In said structure, control unit 20 judges the position deviation of electronic component 16 according to the recognition result based on identifying processing portion 28
State is whether the position deviation amount between the element central of electronic component 16 and suction nozzle 9a mouth center is in allowed band,
And control that drive mechanism 12 is installed and pattern switching part 30 optimizes the processing of element taking-up action.
Moreover, in managing in this place, control unit 20 takes out dynamic in a series of element performed according to usual pattern 23a
The state of the position deviation of electronic component 16 exceeds the regulation allowed band of the defined of position deviation allowed band data 24 in work
When, pattern is switched into low speed pattern 23b by pattern switching part 30, and by 29, absorption position study portion
Carry out correcting element absorption position according to the state of position deviation.Then, the company performed after low speed pattern 23b is switched to
The state of the position deviation of electronic component 16 in the element taking-up action of string is advised in position deviation allowed band data 24
When in fixed regulation allowed band, it is judged as that operating state is stable, is switched to pattern by pattern switching part 30 logical
Normal pattern 23a.
Then, element identification of 5 pairs of the reference picture based on component recognizing camera 6 is illustrated.In the element based on mounting head 9
In installation action, such as Fig. 5（a）It is shown, enter to exercise to be adsorbed the mounting head 9 for maintaining electronic component 16 by suction nozzle 9a in element identification
The scanning motion that the top of camera 6 is moved along prescribed direction.Thus, the electronic component that absorption is held in suction nozzle 9a state is obtained
16 image.Then, by by identifying processing portion 28（Reference picture 4）Processing, such as Fig. 5 are identified to the image（b）Identification
Shown in picture 6a, the absorption position departure of electronic component 16 is detected.
That is, in identification picture 6a, identification represents the element central PC of the center of electronic component 16, represents suction nozzle 9a
Center suction nozzle center NC, detection represent element central PC and suction nozzle center NC between X-direction, Y-direction, θ directions
Position deviation absorption position departure Δ X, Δ Y, Δ θ.In the present embodiment, the absorption position departure is beyond advance
During the allowed band of setting, it is judged as making mounting head 9 move and make suction nozzle 9a close to target location during electronic component 16 i.e. member
The setting of part absorption position is inappropriate, and the processing of element taking-up action is optimized as described above.
Then, 6~Fig. 8 of reference picture is illustrated to the details of pattern data 23.First, Fig. 6 represents to incite somebody to action
The usual pattern that the mode that the actuation time of mounting head 9 when generally acting shortens within the bounds of possibility is set
23a.In usual pattern 23a, in order that suction nozzle 9a is moved within the extremely short time to the electricity in the 15b of element resettlement section
The element absorption position Bing Shizui centers that subcomponent 16 is adsorbed are consistent with element absorption position, such as Fig. 6（a）It is shown, use
Make down maneuver and move horizontally action superposition and make suction nozzle 9a describe arc-shaped track arcuate movement M1.
Moreover, in arcuate movement M1, for the shortening of actuation time, such as Fig. 6（b）It is shown, it is used as horizontal drive shaft
12a, lift drive shaft 12b velocity mode, employ with the range of allowing in servo-actuating device by hypervelocity
Vxy1, Vz1 are set to the velocity mode of upper limit stabilized speed.By the usual pattern 23a so constituted, element can be realized
The shortening of the actuation time of taking-up action, expects the raising of productivity ratio.However, in usual pattern 23a, generate by with
The unstable caused unfavorable condition for the stop position precision the high speed of action and be inevitably generated.
Fig. 6（c）、（d）Represent the unfavorable condition produced in above-mentioned usual pattern 23a.That is, if responsiveness becomes
Height, then in the presence of following situation：During location action, the micro-vibration complete stability that occurs on mechanism section and reach correct
Positioning states before, suction nozzle 9a be connected to electronic component 16 and enter units absorption.Because being completed under this unsteady state
The settling position error for positioning and producing occurs in each absorption action with different position deviation amounts.For example, in Fig. 6（c）
In shown example, at mouth center, the state of position deviation occurs for the front side relative to element absorption position on direction of feed
Under enter units absorption.In addition, in Fig. 6（d）In shown example, on the contrary, occurring position deviation in mouth center back side side
Enter units absorption under state.Moreover, for the position deviation as caused by this settling position error, absorption position study can not
Normally play a role, so being difficult to avoid that following unfavorable conditions：Even if increase absorption action frequency, it is also difficult to converge to correct
Element absorption position.
So that the unfavorable condition of this high speed with responsiveness is tried one's best for the purpose of reduction, in present embodiment
In, set the low speed pattern 23b for suppressing relatively low by the upper limit stabilized speed in velocity mode.That is, such as Fig. 7（a）Institute
Show, in low speed pattern 23b（First low speed pattern）In, at the track Er Jiangzui centers for making suction nozzle 9a describe arc-shaped
It is pointed in the arcuate movement M2 of element absorption position, such as Fig. 7（b）It is shown, it is used as horizontal drive shaft 12a, lift drive shaft 12b
Velocity mode, employ using Vxy2, Vz2 of Vxy1, Vz1 low speed in than usual pattern 23a as upper limit stabilized speed
Velocity mode.According to the low speed pattern 23b so constituted, although the actuation time of element taking-up action is compared to generally dynamic
Operation mode 23a postpones, but micro-vibration that can be when suction nozzle 9a stops completes positioning in the state of stablizing, so can be abundant
Ground ensures high absorption position precision using absorption position learning functionality.
Also, it is used as low speed pattern 23b（Second low speed pattern）, as shown in figure 8, arc can not also be used
Motion, and use the suction nozzle 9a pattern that action is separated with down maneuver that moves horizontally.That is, from Fig. 8（a）Shown shape
State rises, and performs Fig. 8（b）Shown move horizontally action M3, suction nozzle 9a is moved to the upper of element resettlement section 15b electronic component 16
Side.Then, keep the height and position to suction nozzle 9a stop when micro-vibration it is stable and mouth center is correctly pointed to element absorption
Untill position.Thus, such as Fig. 8（c）Shown, mouth center is correctly pointed to element absorption position by suction nozzle 9a, then such as Fig. 8
（d）It is shown, perform make suction nozzle 9a drop to the absorption height adsorbed to electronic component 16 untill down maneuver M4.Together
Sample, according to the low speed pattern 23b so constituted, although the actuation time of element taking-up action compares usual pattern
23a postpones, but is able to ensure that high absorption position precision.
That is, the low speed pattern 23b shown in Fig. 7, Fig. 8（First low speed pattern, the second low speed pattern）For
Following manner of execution：At least make suction nozzle 9a in a series of action that will be taken out for the element based on mounting head 9 close to member
The responsiveness of part during part absorption position is set as lower than responsiveness in usual pattern 23a.
Then, the element being carried out as follows according to Fig. 9, Figure 10 flow to the element fixing apparatus 1 by said structure is pacified
Dress method is illustrated：Adsorbed by the suction nozzle 9a for being arranged at mounting head 9 and keep component feeding and take out by component feeding unit
To the electronic component 16 of defined supply position, the absorption for the electronic component 16 being removed by 6 pairs of component recognizing camera keeps shape
State is identified, and more than after a series of element taking-up action, the electronic component 16 is transferred to the peace being equipped on substrate 3
Decorate.
First, 9 pairs of testing results according to state detecting section 31 of reference picture come control install drive mechanism 12 and act mould
The example of formula switching part 30 is illustrated.In fig .9, if starting the operating of element fixing apparatus 1（ST1）, then examined by state
Survey portion 31 defines data 25, judgment means state with reference to state（State）The presence or absence of change（ST2）.If here, being judged as there is change
More, then switch the pattern for installing drive mechanism 12 by pattern switching part 30, be transferred to low speed pattern 23b
（ST3）.Then, mounting head 9 is made to be moved to the element absorption position of tape feeder 5 and perform based on suction nozzle 9a in this condition
Element absorption action（ST4）.
Then, the mounting head 9 of holding electronic component 16 is moved to the top of component recognizing camera 6 and enter units bat
Take the photograph, so as to obtain the element identification absorption position departure shown in Fig. 6（ST5）, mounting head 9 is moved on substrate 3
And executive component installation action（ST6）.Then, by the absorption position learning functionality in absorption position study portion 29, according to
（ST5）The absorption position departure of acquirement corrects to perform absorption position（ST7）.Correction result is used as absorption position learning data
26 renewals are stored in storage part 21.
Here, judging whether the correcting value i.e. state of the position deviation of electronic component 16 is in position deviation allowed band number
According in the regulation allowed band of 24 defineds（ST8）If in allowed band, then confirming the pattern at the moment is
Usual pattern 23a or low speed pattern 23b（ST9）.If here, in low speed action, being cut by pattern
Change the switching action pattern of portion 30 and recover to usual pattern 23a（ST10）, then return to（ST2）And continue executing with thereafter
Same action processing.Moreover,（ST9）In be not similarly to return in the case of low speed pattern 23b（ST2）.
Also,（ST8）In confirm as position deviation state be not in allowed band in the case of, similarly confirm
The pattern at the moment is usual pattern 23a or low speed pattern 23b（ST11）.Then, if dynamic in low speed
In work, then return to（ST4）And continue executing with the action processing after element absorption action.Also, it is being not at low speed action
In in the case of, return to（ST3）And pattern is switched into low speed pattern 23b, then proceed to perform same move
Deal with.
That is, in the component mounting method shown in Fig. 9, taken according to the usual pattern 23a a series of elements performed
Go out in action, during the Status Change state defined in defining data 25 that done well as the detection of state detecting section 31, by pattern
Pattern is switched to low speed pattern 23b by switching part 30, and is adsorbed according to the state of position deviation come correcting element
Position, the position of the electronic component 16 in a series of element taking-up action performed after switching to low speed pattern 23b
When the state for putting deviation is in defined allowed band, pattern is switched into usual action by pattern switching part 30
Pattern 23a.
Then, the state of the position deviation of electronic component 16 is beyond defined permission during reference picture 10 is acted to element taking-up
The example that control installs drive mechanism 12 and pattern switching part 30 and is transferred to low speed pattern 23b during scope is said
It is bright.Here, during continuing executive component taking-up action in usual pattern 23a, low speed being transferred to for the above reasons and is moved
Operation mode 23b.I.e., in Fig. 10, first, mounting head 9 is made to be moved to the element absorption position of tape feeder 5, execution is based on
Suction nozzle 9a element absorption action（ST12）.
Then, the mounting head 9 of holding electronic component 16 is moved to the top of component recognizing camera 6 and enter units bat
Take the photograph, so as to obtain the element identification absorption position departure shown in Fig. 6（ST13）, subsequently determine whether whether element central position is located
In in allowed band, that is, judge position deviation amount whether in the defined of position deviation allowed band data 24 regulation allow model
In enclosing（ST14）.If here, in the allowed band, making mounting head 9 be moved and executive component installation action on substrate 3
（ST15）.Then, by the absorption position learning functionality in absorption position study portion 29, according to（ST13）The absorption position of acquirement
Departure corrects to perform absorption position（ST16）.Correction result updates as absorption position learning data 26 is stored in storage part
21。
In addition,（ST14）Middle element central position is not in allowed band and position deviation amount exceeds position deviation
During the allowed band of the defined of allowed band data 24, it is transferred to low speed by the switching action pattern of pattern switching part 30 and is moved
Operation mode 23b（ST17）.Moreover, then, mounting head 9 is moved to defined element discard position, will be beyond allowed band
Position deviation state under the electronic component 16 that is kept by suction nozzle 9a discarded as bad element（ST18）.
Then, by the absorption position learning functionality in absorption position study portion 29, according to（ST13）The adsorption potential of acquirement
Departure is put to perform absorption position correction（ST19）.Correction result updates as absorption position learning data 26 is stored in storage
Portion 21.Then, executive component taking-up is acted in low speed pattern 23b.That is, mounting head 9 is made to be moved to tape feeder 5
Element absorption position, performs the element absorption action based on suction nozzle 9a（ST20）.
Then, the mounting head 9 for maintaining electronic component 16 is moved to the top of component recognizing camera 6 and enter units bat
Take the photograph, so as to obtain the element identification absorption position departure shown in Fig. 6（ST21）, subsequently determine whether whether element central position is located
In in allowed band, that is, judge position deviation amount whether in the defined of position deviation allowed band data 24 regulation allow model
In enclosing（ST22）.If here, being in allowed band, being judged as correctly setting element absorption position according to correction, by
The switching action pattern of pattern switching part 30 and return to usual pattern 23a（ST23）, then, perform repeatedly（ST15）
Action processing afterwards.In addition,（ST22）Middle position departure exceeds the rule of the defined of position deviation allowed band data 24
When determining allowed band, return to（ST18）And the absorption position study action after bad element is discarded is performed repeatedly, until really
Recognize（ST22）Untill the improvement of middle absorption position bias state.
That is, in the component mounting method shown in Figure 10, taken according to the usual pattern 23a a series of elements performed
Go out in action, the absorption position bias state of electronic component 16 is permitted beyond the regulation of the defined of position deviation allowed band data 24
Perhaps during scope, pattern is switched into low speed pattern 23b by pattern switching part 30, and according to position deviation
State carrys out correcting element absorption position, a series of element taking-up action performed after low speed pattern 23b is switched to
In the state of position deviation of electronic component 16 when being in defined allowed band, will be acted by pattern switching part 30
Pattern switching is usual pattern 23a.
As described above, the element fixing apparatus and component mounting method shown in present embodiment are configured to, Neng Gou
The usual pattern 23a that is set in the way of actuation time is shortened within the bounds of possibility and responsiveness is set
Between the low speed pattern 23b lower than usual pattern, to switch to making the lift drive shaft 12b of suction nozzle 9a liftings and making
The velocity mode of the responsiveness for the horizontal drive shaft 12a that suction nozzle 9a is moved horizontally together with mounting head 9 is acted as defined in carrying out
Pattern.
Moreover, in a series of element taking-up action performed according to usual pattern 23a, by state detecting section 31
Detect to be defined previously as to recognize the electronic component judged when state defines the Status Change state of data 25 or by element
When the state of 16 position deviation exceeds defined allowed band, pattern is switched into low speed by pattern switching part 30
Pattern 23b, and low speed pattern 23b is being switched to come correcting element absorption position according to the state of position deviation
When the state of the position deviation of element in a series of element taking-up action performed afterwards is in defined allowed band,
Pattern is switched into usual pattern 23a by pattern switching part 30.
Thus, shorten the actuation time operated according to low speed pattern 23b and suppress to act with low speed as far as possible
Productivity ratio reduction, and need during absorption position is learnt the responsiveness in the period that low speed acts to be set as than logical
Often act it is low, even in can also learn absorption position in the case of responsiveness high speed as object fine element
Function is normally played.
Industrial applicability
The element fixing apparatus and component mounting method of the present invention has to be acted even in using fine element as object
The effect that in the case of speed high speed also absorption position learning functionality can normally played, available for will be by component feeding list
The element of member supply is installed on the element installing area of substrate.
Claims (2)
1. a kind of element fixing apparatus, by component feeding unit by component feeding to defined supply position, makes to be arranged at installation
The suction nozzle of head is moved to element absorption position, and absorption keeps and takes out the element being supplied to, by component recognition unit to quilt
The absorption hold mode of the element taken out is identified, more than after a series of element taking-up action, by the element
Transfer is equipped on the mount point on substrate, and the element fixing apparatus is characterised by possessing：
Drive mechanism is installed, at least possesses the lift drive shaft for making the suction nozzle lifting and moves suction nozzle level together with mounting head
Dynamic horizontal drive shaft；
Pattern switching part, the velocity mode to the lift drive shaft and the responsiveness of horizontal drive shaft is provided
Pattern switched between usual pattern and low speed pattern, the usual pattern is with will be usual
The pattern that the mode that the actuation time of mounting head during action shortens within the bounds of possibility is set, the low speed is moved
Operation mode is will at least to make suction nozzle close to the part during element absorption position in a series of element taking-up action
Responsiveness be set as the pattern lower than responsiveness in the usual pattern；And
Control unit, the shape of the position deviation of the element is judged according to the recognition result produced by the component recognition unit
State, and control the installation drive mechanism and pattern switching part,
Control unit element described in a series of element taking-up action performed according to the usual pattern
The state of position deviation when exceeding defined allowed band, pattern is switched into low speed by the pattern switching part
Pattern, the state of execution position deviation exceeds the element of defined allowed band under the low speed pattern
The taking-up action of element below, and the element absorption position is corrected according to the state of the position deviation,
The a series of member being performed after the low speed pattern is switched to, correcting the element absorption position
When the state of the position deviation of element in part taking-up action is in the defined allowed band, cut by the pattern
Change portion and pattern is switched into usual pattern, the state of execution position deviation is in regulation under the usual pattern
Allowed band in the element behind element taking-up action.
2. a kind of component mounting method, based on element fixing apparatus, in the element fixing apparatus, by component feeding unit by member
Part is supplied to defined supply position, the suction nozzle for being arranged at mounting head is moved to element absorption position, and absorption keeps and taken out
The element being supplied to, the absorption hold mode of the element by component recognition unit to being removed is identified, with
After upper a series of element taking-up action, the element is transferred to the mount point being equipped on substrate,
The element fixing apparatus possesses：Drive mechanism is installed, at least possesses the lift drive shaft for making the suction nozzle lifting and makes
The horizontal drive shaft that suction nozzle is moved horizontally together with mounting head；Pattern switching part, will be to the lift drive shaft and level
The velocity mode of the responsiveness of drive shaft carries out defined pattern between usual pattern and low speed pattern
Switch over, the usual pattern is so that the actuation time of mounting head during usual action to be shortened within the bounds of possibility
The pattern that is set of mode, the low speed pattern is will at least to make in a series of element taking-up action
Suction nozzle is set as than the action in the usual pattern close to the responsiveness of the part during element absorption position
The low pattern of speed；And control unit, the member is judged according to the recognition result produced by the component recognition unit
The state of the position deviation of part, and the installation drive mechanism and the pattern switching part are controlled, the element is installed
Method is characterised by,
The shape of the position deviation of element in a series of element taking-up action performed according to the usual pattern
When state exceeds defined allowed band, pattern is switched into low speed pattern by the pattern switching part, in institute
State element of the state of execution position deviation under low speed pattern behind the element of defined allowed band
Taking-up is acted, and corrects the element absorption position according to the state of the position deviation,
The a series of member being performed after the low speed pattern is switched to, correcting the element absorption position
When the state of the position deviation of element in part taking-up action is in the defined allowed band, cut by the pattern
Change portion and pattern is switched into usual pattern, the state of execution position deviation is in regulation under the usual pattern
Allowed band in the element behind element taking-up action.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012130575A JP5927496B2 (en) | 2012-06-08 | 2012-06-08 | Component mounting apparatus and component mounting method |
| JP2012-130575 | 2012-06-08 |
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| Publication Number | Publication Date |
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| CN103491761A CN103491761A (en) | 2014-01-01 |
| CN103491761B true CN103491761B (en) | 2017-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310148030.2A Active CN103491761B (en) | 2012-06-08 | 2013-04-25 | Element fixing apparatus and component mounting method |
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| JP (1) | JP5927496B2 (en) |
| CN (1) | CN103491761B (en) |
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|---|---|---|---|---|
| CN104185383B (en) * | 2014-09-04 | 2018-01-30 | 山东日发纺织机械有限公司 | Electronic component mounting head category identification device and recognition methods |
| JP6389716B2 (en) * | 2014-09-19 | 2018-09-12 | Juki株式会社 | Electronic component mounting equipment |
| CN107710906B (en) * | 2015-07-07 | 2021-02-26 | 株式会社富士 | Component mounting apparatus |
| WO2019180953A1 (en) * | 2018-03-23 | 2019-09-26 | 株式会社Ｆｕｊｉ | Component-mounting device |
| CN113303040B (en) * | 2019-02-05 | 2022-12-13 | 株式会社富士 | Allowable value setting device and allowable value setting method |
| JP7474988B2 (en) | 2020-09-18 | 2024-04-26 | パナソニックＩｐマネジメント株式会社 | Component mounting system and control method for component mounting machine |
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| JP4695954B2 (en) * | 2005-09-30 | 2011-06-08 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
| JP5130030B2 (en) * | 2007-12-06 | 2013-01-30 | Ｊｕｋｉ株式会社 | Electronic component mounting device |
| JP2009176859A (en) * | 2008-01-23 | 2009-08-06 | Juki Corp | Method and device for mounting component |
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| CN103491761A (en) | 2014-01-01 |
| JP5927496B2 (en) | 2016-06-01 |
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