JP2013249480A5 - - Google Patents

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Publication number
JP2013249480A5
JP2013249480A5 JP2013171722A JP2013171722A JP2013249480A5 JP 2013249480 A5 JP2013249480 A5 JP 2013249480A5 JP 2013171722 A JP2013171722 A JP 2013171722A JP 2013171722 A JP2013171722 A JP 2013171722A JP 2013249480 A5 JP2013249480 A5 JP 2013249480A5
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JP
Japan
Prior art keywords
film
adhesive film
expansion coefficient
linear expansion
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013171722A
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English (en)
Japanese (ja)
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JP2013249480A (ja
JP5758456B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2013171722A priority Critical patent/JP5758456B2/ja
Priority claimed from JP2013171722A external-priority patent/JP5758456B2/ja
Publication of JP2013249480A publication Critical patent/JP2013249480A/ja
Publication of JP2013249480A5 publication Critical patent/JP2013249480A5/ja
Application granted granted Critical
Publication of JP5758456B2 publication Critical patent/JP5758456B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2013171722A 2004-05-13 2013-08-21 接着フィルムの製造方法およびフレキシブル金属張積層板の製造方法 Expired - Lifetime JP5758456B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013171722A JP5758456B2 (ja) 2004-05-13 2013-08-21 接着フィルムの製造方法およびフレキシブル金属張積層板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004144107 2004-05-13
JP2004144107 2004-05-13
JP2013171722A JP5758456B2 (ja) 2004-05-13 2013-08-21 接着フィルムの製造方法およびフレキシブル金属張積層板の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005141613A Division JP2005350668A (ja) 2004-05-13 2005-05-13 接着フィルムおよびフレキシブル金属張積層板並びにそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2013249480A JP2013249480A (ja) 2013-12-12
JP2013249480A5 true JP2013249480A5 (https=) 2014-07-10
JP5758456B2 JP5758456B2 (ja) 2015-08-05

Family

ID=38045500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013171722A Expired - Lifetime JP5758456B2 (ja) 2004-05-13 2013-08-21 接着フィルムの製造方法およびフレキシブル金属張積層板の製造方法

Country Status (2)

Country Link
JP (1) JP5758456B2 (https=)
CN (1) CN1946823A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6704463B2 (ja) * 2016-10-14 2020-06-03 株式会社カネカ グラファイトフィルムの製造方法
EP3822056B1 (en) * 2019-11-18 2024-05-08 Heraeus Noblelight Ltd. System for treatment of a multi-layered cushioning product and operating method for a system for expanding a multi-layered cushioning product
CN110933846B (zh) * 2019-11-29 2021-01-05 盐城维信电子有限公司 一种卷料柔性线路板背靠背制程制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241024A (ja) * 1985-08-19 1987-02-23 Kanegafuchi Chem Ind Co Ltd 加熱収縮性の改良されたポリイミドフイルム
JP3351265B2 (ja) * 1995-10-03 2002-11-25 宇部興産株式会社 芳香族ポリイミドフィルム及び銅箔積層フィルム
JP4035243B2 (ja) * 1998-12-03 2008-01-16 株式会社カネカ 銅張積層板用の多層ボンディングシートの製造方法
JP3994696B2 (ja) * 2000-10-02 2007-10-24 宇部興産株式会社 線膨張係数を制御したポリイミドフィルム及び積層体
JP2003174247A (ja) * 2001-09-28 2003-06-20 Ube Ind Ltd カバーレイフィルムおよび該フィルムを用いた回路基板
JP3932506B2 (ja) * 2002-01-10 2007-06-20 東レ・デュポン株式会社 ポリイミドフィルム、印刷回路および金属配線板
JP2004068002A (ja) * 2002-06-13 2004-03-04 Du Pont Toray Co Ltd ポリイミド混交フィルムの製造方法およびこれを基材とした金属配線回路板

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