JP2013249480A5 - - Google Patents
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- JP2013249480A5 JP2013249480A5 JP2013171722A JP2013171722A JP2013249480A5 JP 2013249480 A5 JP2013249480 A5 JP 2013249480A5 JP 2013171722 A JP2013171722 A JP 2013171722A JP 2013171722 A JP2013171722 A JP 2013171722A JP 2013249480 A5 JP2013249480 A5 JP 2013249480A5
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- JP
- Japan
- Prior art keywords
- film
- adhesive film
- expansion coefficient
- linear expansion
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (6)
ゲルフィルムの両端を固定しながら加熱炉内を搬送する工程を含み、上記工程の少なくとも一部において、フィルムの幅方向の張力が実質的に無張力となるように、フィルムの両端部固定端の距離よりも両端部固定端間のフィルムの幅が広くなるようにフィルムを固定して搬送する工程を含み、
該接着フィルムの線膨張係数が
１．０＞（ＭＤ方向の線膨張係数）／（ＴＤ方向の線膨張係数）＞０．１
（線膨張係数は、１００〜２００℃における値である）
を満足することを特徴とする、接着フィルムの製造方法。 A method for producing an adhesive film in which an adhesive layer containing a thermoplastic polyimide is provided on at least one side of the polyimide film,
Including a step of transporting the inside of the heating furnace while fixing both ends of the gel film, and at least a part of the above-described steps, at both ends of the film, so that the tension in the width direction of the film becomes substantially no tension . distance includes the step you transport securing the film such that the width of the film between the two ends fixed ends is wider than,
The linear expansion coefficient of the adhesive film is 1.0> (linear expansion coefficient in MD direction) / (linear expansion coefficient in TD direction)> 0.1
(The linear expansion coefficient is a value at 100 to 200 ° C.)
The manufacturing method of the adhesive film characterized by satisfying these.
ゲルフィルムの両端を固定しながら加熱炉内を搬送する工程を含み、上記工程の少なくとも一部において、フィルムの幅方向の張力が実質的に無張力となるように、フィルムの両端部固定端の距離よりも両端部固定端間のフィルムの幅が広くなるようにフィルムを固定して搬送する工程を含み、
該接着フィルムは、連続的に生産されるとともに、全幅において、該接着フィルムの線膨張係数が
１．０＞（ＭＤ方向の線膨張係数）／（ＴＤ方向の線膨張係数）＞０．１
（線膨張係数は、１００〜２００℃における値である）
を満足することを特徴とする、接着フィルムの製造方法。 A method for producing an adhesive film in which an adhesive layer containing a thermoplastic polyimide is provided on at least one side of the polyimide film,
Including a step of transporting the inside of the heating furnace while fixing both ends of the gel film, and at least a part of the above-described steps, at both ends of the film, so that the tension in the width direction of the film becomes substantially no tension . distance include more engineering to convey securing the film such that the width of the film between the two ends fixed ends is wider than,
The adhesive film is continuously produced and has a linear expansion coefficient of 1.0> (linear expansion coefficient in MD direction) / (linear expansion coefficient in TD direction)> 0.1 over the entire width.
(The linear expansion coefficient is a value at 100 to 200 ° C.)
The manufacturing method of the adhesive film characterized by satisfying these.
上記工程は、フィルムを固定して搬送した後、加熱炉内でフィルムをＴＤ方向に引き延ばす工程を含むことを特徴とする請求項１〜３のいずれか１項に記載の接着フィルムの製造方法。 Including a step of transporting the inside of the heating furnace while fixing both ends of the gel film, and at least a part of the above-described steps, at both ends of the film, so that the tension in the width direction of the film becomes substantially no tension . Fix and transport the film so that the width of the film between the fixed ends at both ends is wider than the distance ,
The said process includes the process of extending a film in a TD direction within a heating furnace after fixing and conveying a film, The manufacturing method of the adhesive film of any one of Claims 1-3 characterized by the above-mentioned.
上記接着フィルムを金属箔とともに、一対以上の金属ロールにより加熱および加圧して連続的に張り合わせることを特徴とする、フレキシブル金属張積層板の製造方法。 After obtaining the adhesive film by the method for producing an adhesive film according to any one of claims 1 to 4, a metal foil is bonded to the adhesive film,
A method for producing a flexible metal-clad laminate, wherein the adhesive film is continuously laminated together with a metal foil by heating and pressing with a pair of metal rolls.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013171722A JP5758456B2 (en) | 2004-05-13 | 2013-08-21 | Method for producing adhesive film and method for producing flexible metal-clad laminate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004144107 | 2004-05-13 | ||
| JP2004144107 | 2004-05-13 | ||
| JP2013171722A JP5758456B2 (en) | 2004-05-13 | 2013-08-21 | Method for producing adhesive film and method for producing flexible metal-clad laminate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005141613A Division JP2005350668A (en) | 2004-05-13 | 2005-05-13 | Adhesive film, flexible metal-clad laminate, and process for producing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013249480A JP2013249480A (en) | 2013-12-12 |
| JP2013249480A5 true JP2013249480A5 (en) | 2014-07-10 |
| JP5758456B2 JP5758456B2 (en) | 2015-08-05 |
Family
ID=38045500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013171722A Active JP5758456B2 (en) | 2004-05-13 | 2013-08-21 | Method for producing adhesive film and method for producing flexible metal-clad laminate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5758456B2 (en) |
| CN (1) | CN1946823A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018070476A1 (en) * | 2016-10-14 | 2018-04-19 | 株式会社カネカ | Method for producing graphite film |
| CN110933846B (en) * | 2019-11-29 | 2021-01-05 | 盐城维信电子有限公司 | Manufacturing method for back-to-back process of coiled material flexible circuit board |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6241024A (en) * | 1985-08-19 | 1987-02-23 | Kanegafuchi Chem Ind Co Ltd | Polyimide film having improved heat shrinking characteristics |
| JP3351265B2 (en) * | 1995-10-03 | 2002-11-25 | 宇部興産株式会社 | Aromatic polyimide film and copper foil laminated film |
| JP4035243B2 (en) * | 1998-12-03 | 2008-01-16 | 株式会社カネカ | Method for producing multilayer bonding sheet for copper-clad laminate |
| JP3994696B2 (en) * | 2000-10-02 | 2007-10-24 | 宇部興産株式会社 | Polyimide film and laminate with controlled linear expansion coefficient |
| JP2003174247A (en) * | 2001-09-28 | 2003-06-20 | Ube Ind Ltd | Cover-laid film, and circuit board using the film |
| JP3932506B2 (en) * | 2002-01-10 | 2007-06-20 | 東レ・デュポン株式会社 | Polyimide film, printed circuit and metal wiring board |
| JP2004068002A (en) * | 2002-06-13 | 2004-03-04 | Du Pont Toray Co Ltd | Method for manufacturing polyimide-mixed film and metal-wiring circuit board using the same as substrate |
-
2005
- 2005-04-26 CN CN 200580013179 patent/CN1946823A/en active Pending
-
2013
- 2013-08-21 JP JP2013171722A patent/JP5758456B2/en active Active
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