JP2013246021A - 熱型電磁波検出素子、熱型電磁波検出素子の製造方法、熱型電磁波検出装置および電子機器 - Google Patents

熱型電磁波検出素子、熱型電磁波検出素子の製造方法、熱型電磁波検出装置および電子機器 Download PDF

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JP2013246021A
JP2013246021A JP2012119424A JP2012119424A JP2013246021A JP 2013246021 A JP2013246021 A JP 2013246021A JP 2012119424 A JP2012119424 A JP 2012119424A JP 2012119424 A JP2012119424 A JP 2012119424A JP 2013246021 A JP2013246021 A JP 2013246021A
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Prior art keywords
electromagnetic wave
pair
wave detection
semiconductor substrate
thermal electromagnetic
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JP2012119424A
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Japanese (ja)
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JP2013246021A5 (https=
Inventor
Takashi Noda
貴史 野田
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2012119424A priority Critical patent/JP2013246021A/ja
Priority to US13/902,329 priority patent/US9006856B2/en
Publication of JP2013246021A publication Critical patent/JP2013246021A/ja
Publication of JP2013246021A5 publication Critical patent/JP2013246021A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/025—Interfacing a pyrometer to an external device or network; User interface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • G01J2005/345—Arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0837—Microantennas, e.g. bow-tie

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
JP2012119424A 2012-05-25 2012-05-25 熱型電磁波検出素子、熱型電磁波検出素子の製造方法、熱型電磁波検出装置および電子機器 Withdrawn JP2013246021A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012119424A JP2013246021A (ja) 2012-05-25 2012-05-25 熱型電磁波検出素子、熱型電磁波検出素子の製造方法、熱型電磁波検出装置および電子機器
US13/902,329 US9006856B2 (en) 2012-05-25 2013-05-24 Thermal electromagnetic wave detection element, method for producing thermal electromagnetic wave detection element, thermal electromagnetic wave detection device, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012119424A JP2013246021A (ja) 2012-05-25 2012-05-25 熱型電磁波検出素子、熱型電磁波検出素子の製造方法、熱型電磁波検出装置および電子機器

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JP2013246021A true JP2013246021A (ja) 2013-12-09
JP2013246021A5 JP2013246021A5 (https=) 2015-06-11

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017501423A (ja) * 2013-12-17 2017-01-12 ピレオス リミテッドＰｙｒｅｏｓ Ｌｔｄ． Ａｔｒ赤外分光計
WO2018193825A1 (ja) * 2017-04-17 2018-10-25 パナソニックＩｐマネジメント株式会社 焦電センサ素子及びこれを用いた焦電センサ
WO2019021874A1 (ja) * 2017-07-28 2019-01-31 パイオニア株式会社 電磁波検出装置
JP2023033863A (ja) * 2021-08-30 2023-03-13 Tdk株式会社 構造体及び電磁波センサ
US12323102B2 (en) 2021-11-12 2025-06-03 Renesas Design Netherlands B.V. Apparatus comprising a local oscillator for driving a mixer

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019001871A1 (en) * 2017-06-26 2019-01-03 Asml Netherlands B.V. METHOD OF DETERMINING DEFORMATION
JP7353748B2 (ja) * 2018-11-29 2023-10-02 キヤノン株式会社 半導体装置の製造方法および半導体装置
GB201902452D0 (en) * 2019-02-22 2019-04-10 Pyreos Ltd Microsystem and method for making the microsystem
JP7340965B2 (ja) * 2019-06-13 2023-09-08 キヤノン株式会社 半導体装置およびその製造方法
WO2023159448A1 (zh) * 2022-02-24 2023-08-31 京东方科技集团股份有限公司 显示模组和显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005488A (ja) * 2003-06-12 2005-01-06 Dainippon Printing Co Ltd 半導体モジュールおよびそれらの製造方法
JP2007171170A (ja) * 2005-11-25 2007-07-05 Matsushita Electric Works Ltd 熱型赤外線検出装置の製造方法
JP2010204112A (ja) * 2010-04-26 2010-09-16 Hamamatsu Photonics Kk センサ及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5644121B2 (ja) * 2010-01-26 2014-12-24 セイコーエプソン株式会社 熱型光検出器、熱型光検出装置、電子機器および熱型光検出器の製造方法
JP5589486B2 (ja) 2010-03-26 2014-09-17 セイコーエプソン株式会社 焦電型光検出器、焦電型光検出装置及び電子機器
JP5830877B2 (ja) * 2011-02-24 2015-12-09 セイコーエプソン株式会社 焦電型検出器、焦電型検出装置及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005005488A (ja) * 2003-06-12 2005-01-06 Dainippon Printing Co Ltd 半導体モジュールおよびそれらの製造方法
JP2007171170A (ja) * 2005-11-25 2007-07-05 Matsushita Electric Works Ltd 熱型赤外線検出装置の製造方法
JP2010204112A (ja) * 2010-04-26 2010-09-16 Hamamatsu Photonics Kk センサ及びその製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017501423A (ja) * 2013-12-17 2017-01-12 ピレオス リミテッドＰｙｒｅｏｓ Ｌｔｄ． Ａｔｒ赤外分光計
WO2018193825A1 (ja) * 2017-04-17 2018-10-25 パナソニックＩｐマネジメント株式会社 焦電センサ素子及びこれを用いた焦電センサ
WO2019021874A1 (ja) * 2017-07-28 2019-01-31 パイオニア株式会社 電磁波検出装置
JPWO2019021874A1 (ja) * 2017-07-28 2020-07-30 パイオニア株式会社 電磁波検出装置
US11047732B2 (en) 2017-07-28 2021-06-29 Pioneer Corporation Electromagnetic wave detection device
JP2023033863A (ja) * 2021-08-30 2023-03-13 Tdk株式会社 構造体及び電磁波センサ
JP7718914B2 (ja) 2021-08-30 2025-08-05 Tdk株式会社 構造体及び電磁波センサ
US12323102B2 (en) 2021-11-12 2025-06-03 Renesas Design Netherlands B.V. Apparatus comprising a local oscillator for driving a mixer

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US20130313674A1 (en) 2013-11-28

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