JP2013240927A5 - - Google Patents

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Publication number
JP2013240927A5
JP2013240927A5 JP2012115572A JP2012115572A JP2013240927A5 JP 2013240927 A5 JP2013240927 A5 JP 2013240927A5 JP 2012115572 A JP2012115572 A JP 2012115572A JP 2012115572 A JP2012115572 A JP 2012115572A JP 2013240927 A5 JP2013240927 A5 JP 2013240927A5
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JP
Japan
Prior art keywords
film
base film
minutes
heat treatment
temperature
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Application number
JP2012115572A
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Japanese (ja)
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JP2013240927A (en
JP5877122B2 (en
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Publication date
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Priority to JP2012115572A priority Critical patent/JP5877122B2/en
Priority claimed from JP2012115572A external-priority patent/JP5877122B2/en
Priority to TW102117189A priority patent/TWI593551B/en
Priority to CN201310181843.1A priority patent/CN103421437B/en
Priority to KR20130055828A priority patent/KR101511093B1/en
Publication of JP2013240927A publication Critical patent/JP2013240927A/en
Publication of JP2013240927A5 publication Critical patent/JP2013240927A5/ja
Application granted granted Critical
Publication of JP5877122B2 publication Critical patent/JP5877122B2/en
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Claims (6)

可撓性を有する基材フィルムの一方の面に、粘着剤層が積層され、該粘着剤層の表面上に、剥離処理された剥離フィルムが、前記剥離処理された面を介して積層され、前記基材フィルムの少なくとも他方の面に、温度１６０℃×６０分間の加熱処理又は、温度２００℃×３０分間の加熱処理を経た後でも、前記基材フィルムに起因するオリゴマーの析出を防止できる保護層が形成されており、前記保護層が、エポキシ樹脂と、エポキシ基と反応する官能基を有するポリエステル樹脂と、アミン系硬化剤とを含む樹脂組成物の薄膜からなることを特徴とする表面保護フィルム。 On one surface of the base film having flexibility, an adhesive layer is laminated, and on the surface of the adhesive layer, a release film subjected to a release treatment is laminated via the release-treated surface, Protection capable of preventing precipitation of oligomers due to the base film even after the heat treatment at a temperature of 160 ° C. for 60 minutes or the heat treatment at a temperature of 200 ° C. for 30 minutes on at least the other surface of the base film layer is formed, the surface of the protective layer is an epoxy resin, a polyester resin having a functional group reactive with an epoxy group, wherein Rukoto such a thin film of a resin composition containing an amine curing agent Protective film. 可撓性を有する基材フィルムの少なくとも一方の面に、温度１６０℃×６０分間の加熱処理又は、温度２００℃×３０分間の加熱処理を経た後でも、前記基材フィルムに起因するオリゴマーの析出を防止できる保護層が形成されており、前記保護層が、エポキシ樹脂と、エポキシ基と反応する官能基を有するポリエステル樹脂と、アミン系硬化剤とを含む樹脂組成物の薄膜からなることを特徴とする表面処理フィルム。 Precipitation of oligomers resulting from the base film even after undergoing a heat treatment at a temperature of 160 ° C. for 60 minutes or a heat treatment at a temperature of 200 ° C. for 30 minutes on at least one surface of the base film having flexibility are protective layer formed can be prevented, the protective layer is an epoxy resin, a polyester resin having a functional group reactive with an epoxy group, a Rukoto such a thin film of a resin composition containing an amine curing agent A featured surface treatment film. 前記基材フィルムが、２軸延伸したポリエステルフィルムである請求項２に記載の表面処理フィルム。 The surface-treated film according to claim 2 , wherein the base film is a biaxially stretched polyester film. 前記基材フィルムが、２軸延伸したポリエステルフィルムである請求項１に記載の表面保護フィルム。 The surface protective film according to claim 1 , wherein the base film is a biaxially stretched polyester film . 前記粘着剤が、アクリル系粘着剤である請求項１、又は４に記載の表面保護フィルム。 The adhesive surface protective film according to claim 1 or 4 which is an acrylic adhesive. 請求項１、４、５のいずれかに記載の表面保護フィルムが貼り合わせてなる精密電気・電子部品であって、フレキシブルプリント配線基板、リジッドプリント配線基板、透明導電性フィルムからなる精密電気・電子部品群から選択されたいずれかの精密電気・電子部品。 A precision electric / electronic component comprising the surface protective film according to any one of claims 1, 4, and 5, and comprising a flexible printed circuit board, a rigid printed circuit board, and a transparent conductive film. Any precision electrical / electronic component selected from the group of components.
JP2012115572A 2012-05-21 2012-05-21 Surface treatment film, surface protection film, and precision electrical and electronic parts on which it is bonded Active JP5877122B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012115572A JP5877122B2 (en) 2012-05-21 2012-05-21 Surface treatment film, surface protection film, and precision electrical and electronic parts on which it is bonded
TW102117189A TWI593551B (en) 2012-05-21 2013-05-15 Surface treating film, surface protection film, and precision electrical and electronic components attached with the same
CN201310181843.1A CN103421437B (en) 2012-05-21 2013-05-16 Surface treating film, surface protection film, and precision electrical/electronic components
KR20130055828A KR101511093B1 (en) 2012-05-21 2013-05-16 Surface treating film, surface protection film, and precision electrical and electronic components attached with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012115572A JP5877122B2 (en) 2012-05-21 2012-05-21 Surface treatment film, surface protection film, and precision electrical and electronic parts on which it is bonded

Publications (3)

Publication Number Publication Date
JP2013240927A JP2013240927A (en) 2013-12-05
JP2013240927A5 true JP2013240927A5 (en) 2015-07-09
JP5877122B2 JP5877122B2 (en) 2016-03-02

Family

ID=49646840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012115572A Active JP5877122B2 (en) 2012-05-21 2012-05-21 Surface treatment film, surface protection film, and precision electrical and electronic parts on which it is bonded

Country Status (4)

Country Link
JP (1) JP5877122B2 (en)
KR (1) KR101511093B1 (en)
CN (1) CN103421437B (en)
TW (1) TWI593551B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6042251B2 (en) * 2013-03-28 2016-12-14 リンテック株式会社 Adhesive sheet
JP6268025B2 (en) * 2014-03-31 2018-01-24 リンテック株式会社 Adhesive sheet
JP6254476B2 (en) * 2014-03-31 2017-12-27 リンテック株式会社 Process film, laminated sheet, and method for producing resin sheet
JP2015205439A (en) * 2014-04-19 2015-11-19 三菱樹脂株式会社 Base material for protective film for electroconductive film
JP6299491B2 (en) * 2014-07-03 2018-03-28 三菱ケミカル株式会社 Release film substrate for conductive film
JP6424070B2 (en) * 2014-11-20 2018-11-14 リンテック株式会社 Heat-resistant adhesive sheet and method for producing functional film
JP5957133B2 (en) * 2014-11-20 2016-07-27 日東電工株式会社 Transparent conductive film with protective film
JP6563254B2 (en) * 2015-06-03 2019-08-21 日東電工株式会社 Laminated body, method for manufacturing touch panel sensor, and touch panel sensor
CN107636100B (en) * 2015-09-01 2019-11-22 琳得科株式会社 Bonding sheet
JP6636343B2 (en) * 2016-01-21 2020-01-29 昭和電工パッケージング株式会社 Laminate packaging material
CN108022533B (en) * 2016-11-02 2020-11-10 群创光电股份有限公司 Display device and method of manufacturing the same
CN106584998A (en) * 2016-11-18 2017-04-26 无锡祁龙胶粘制品有限公司 Anti-static special stamping protective film
JP7002896B2 (en) * 2017-09-19 2022-01-20 藤森工業株式会社 Manufacturing method of three-dimensional molded product
JP7115510B2 (en) * 2019-06-06 2022-08-09 Ａｇｃ株式会社 Laminated substrate and package
CN110628348A (en) * 2019-10-28 2019-12-31 南昌正业科技有限公司 Pure rubber protective film for transformer and production process thereof
JP6876855B2 (en) * 2020-06-16 2021-05-26 藤森工業株式会社 Release film for antistatic surface protection film

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09109333A (en) * 1995-10-19 1997-04-28 Dainippon Printing Co Ltd Decorative sheet
JP2000019313A (en) * 1998-07-07 2000-01-21 Mitsui Chemicals Inc Reflector and curved surface reflector using the same
JP4336427B2 (en) * 1999-10-01 2009-09-30 帝人株式会社 Surface protective film and laminate comprising the same
JP2001316650A (en) 2000-05-02 2001-11-16 Three M Innovative Properties Co Adhesive sheet and adhesive structure
JP2002275296A (en) 2001-01-11 2002-09-25 Teijin Ltd Laminated polyester film for surface-protected film and surface-protected film
JP2003137337A (en) * 2001-10-31 2003-05-14 Teijin Dupont Films Japan Ltd Polyester film for packaging
JP2003237005A (en) * 2002-02-18 2003-08-26 Mitsubishi Polyester Film Copp Coating film
JP2004082371A (en) * 2002-08-23 2004-03-18 Teijin Dupont Films Japan Ltd Surface protective film
JP3960281B2 (en) * 2003-05-28 2007-08-15 Ｊｓｒ株式会社 Curable resin composition, protective film and method for forming protective film
JP2007127823A (en) * 2005-11-04 2007-05-24 Nippon Kayaku Co Ltd Optical film and its manufacturing method
JP4941909B2 (en) * 2006-06-30 2012-05-30 東レフィルム加工株式会社 Release film
JP5544835B2 (en) * 2008-12-03 2014-07-09 住友化学株式会社 Surface protection film
JP5541937B2 (en) * 2010-01-29 2014-07-09 帝人デュポンフィルム株式会社 Release polyester film
JP5848565B2 (en) * 2010-09-29 2016-01-27 日東電工株式会社 Resin film with adhesive layer, laminated film and touch panel

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