JP2013239498A - Cleaning device - Google Patents

Cleaning device Download PDF

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JP2013239498A
JP2013239498A JP2012110068A JP2012110068A JP2013239498A JP 2013239498 A JP2013239498 A JP 2013239498A JP 2012110068 A JP2012110068 A JP 2012110068A JP 2012110068 A JP2012110068 A JP 2012110068A JP 2013239498 A JP2013239498 A JP 2013239498A
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cleaning
rotation
cleaned
support rollers
support
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JP5955635B2 (en
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Ichiro Yamahata
一郎 山端
Ken Kimura
謙 木村
Kenji Murata
研二 村田
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Disco Corp
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Disco Abrasive Systems Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning device having a simple structure, capable of holding an object to be cleaned having a different diameter by support rollers and cleaning a lower surface of the object to be cleaned.SOLUTION: A cleaning device 1 includes: rotation holding means 2 for holding an object to be cleaned at an outer peripheral edge to rotate it; and cleaning means 3 for cleaning a lower surface of the object to be cleaned held by the rotation holding means 2. The rotation holding means 2 includes: support rollers 21a-21d rotating around rotary shafts R1a-R1d, respectively, while contacting an outer peripheral edge Sc of the object to be cleaned; rotary drive sources 23a-23c attached to the support rollers 21a-21c, respectively; rotary bases 22a-22d rotatably supporting the support rollers 21a-21d, and rotating around rotary shafts R2a-R2d different in position from the rotary shafts R1a-R1d of the support rollers 21a-21d, respectively; and moving mechanisms 25a and 25b positioning the support rollers 21a-21d to a small diameter holding position and a large diameter holding position. The device 1 cleans a lower surface of the object to be cleaned according to a change in diameter of the object to be cleaned.

Description

本発明は、円盤状の洗浄対象物の洗浄に関し、特に洗浄対象物の裏面の洗浄装置に関するものである。   The present invention relates to cleaning of a disk-shaped cleaning object, and more particularly to a cleaning device for a back surface of a cleaning object.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画された表面に形成されたウェーハは、研削装置により薄化され、切削装置によって個々のデバイスに分割され、携帯電話、パソコン等の電子機器に用いられている。また、複数のデバイスを積層して、１つのデバイスとする技術が提案されている（例えば、特許文献１参照）。例えば、デバイスの電極がウェーハの表面から裏面近傍まで形成されており、ウェーハの裏面を研削することで、各デバイスを薄化するとともに、電極を表面および裏面から露出させ、上下に隣り合う各デバイスの電極を連結させることで、複数のデバイスを積層し、１つのデバイスを構成するものである。研削装置により裏面が研削されたウェーハは、極薄となり腰がなくなるため、研削後の搬送を容易とする目的で、支持基板にウェーハが接着された状態で、上記研削や研削後の積層や膜の形成などの工程を経ることとなる。   A wafer formed on the surface where a plurality of devices such as IC, LSI, etc. are partitioned by a line to be divided is thinned by a grinding machine and divided into individual devices by a cutting machine to be used in electronic devices such as mobile phones and personal computers. It is used. In addition, a technique has been proposed in which a plurality of devices are stacked to form one device (see, for example, Patent Document 1). For example, the device electrodes are formed from the front surface of the wafer to the vicinity of the back surface, and by grinding the back surface of the wafer, each device is thinned and the electrodes are exposed from the front and back surfaces, and each device adjacent vertically By connecting these electrodes, a plurality of devices are stacked to constitute one device. A wafer whose back surface has been ground by a grinding device becomes extremely thin and loses its elasticity. Therefore, for the purpose of facilitating transport after grinding, the above-mentioned grinding and post-grinding lamination and film are performed with the wafer adhered to the support substrate. It goes through processes such as forming.

特開２００３−２４９６２０号公報JP 2003-249620 A

ところで、研削では、研削屑が大量に発生する。研削後のウェーハに対してさらに積層等の工程を実施する場合、非常に微細で少量でも研削屑が付着するとデバイスの不良につながる可能性がある。そこで、研削後に、ウェーハの研削面のみならず、ウェーハが接着された支持基板のウェーハとの接着面と反対側の面、すなわち下面に付着した研削屑を洗浄することとなる。研削後の支持基板の下面を洗浄する洗浄装置としては、洗浄後に可能な限り研削屑やその他の付着物が残存することを抑制するため、支持基板の外周縁を保持し、下面側において支持基板の中央を通り、支持基板を覆う（支持基板の直径よりも長い）洗浄ローラーを回転軸周りに回転させる等で行うものが考えられる。   By the way, in grinding, a large amount of grinding waste is generated. When a process such as laminating is further performed on a ground wafer, if a very small amount of grinding debris adheres to the wafer, it may lead to a device failure. Therefore, after grinding, not only the grinding surface of the wafer but also the grinding scraps adhering to the surface opposite to the bonding surface of the supporting substrate to which the wafer is bonded to the wafer, that is, the lower surface is cleaned. As a cleaning device for cleaning the lower surface of the support substrate after grinding, the outer peripheral edge of the support substrate is held and the support substrate is supported on the lower surface side in order to suppress grinding debris and other deposits from remaining as much as possible after cleaning. It is conceivable that the cleaning roller that passes through the center of the substrate and covers the support substrate (longer than the diameter of the support substrate) is rotated around the rotation axis.

ここで、ウェーハには直径が異なる（例えば、φ８インチとφ１２インチなど）ものがあるため、１つの洗浄装置で、直径の異なるウェーハに対応する支持基板を保持し、支持基板の下面を洗浄することが望まれる。洗浄ローラーを直径の異なる支持基板に対応させるためには、長さを直径が大きい支持基板の直径よりも長くすれば対応することができる。一方、直径の異なるウェーハに対応する支持基板を保持する機構としては、各直径の支持基板を保持できる位置に位置決めできることが必要な機構となり、例えば、鉛直方向から見た際に、支持基板を保持する支持部材を保持される支持基板の中心から放射状に伸びる案内レール上を支持基板の下方で移動させることが考えられるが、この場合洗浄ローラーを保持される支持基板の下面側中央に配置することが困難であり、保持される支持基板の中央に洗浄手段を配置する場合は、上記機構を用いて各直径の支持基板を保持させることは困難であった。   Here, since there are wafers having different diameters (for example, φ8 inch and φ12 inch), the supporting substrate corresponding to the wafers having different diameters is held by one cleaning apparatus, and the lower surface of the supporting substrate is cleaned. It is desirable. In order to make the cleaning roller correspond to the support substrate having a different diameter, the length can be made longer than the diameter of the support substrate having a larger diameter. On the other hand, as a mechanism for holding a support substrate corresponding to wafers having different diameters, it is necessary to be able to position the support substrate at a position where each diameter support substrate can be held. For example, the support substrate is held when viewed from the vertical direction. It is conceivable to move the supporting member on the guide rail extending radially from the center of the supporting substrate to be held below the supporting substrate. In this case, the cleaning roller is disposed at the center on the lower surface side of the supporting substrate to be held. In the case where the cleaning means is arranged in the center of the supporting substrate to be held, it has been difficult to hold the supporting substrates having the respective diameters using the above mechanism.

本発明は、上記に鑑みてなされたものであって、簡単な構成で、直径が異なる洗浄対象物を支持ローラーにより保持でき、洗浄対象物の下面を洗浄することができる洗浄装置を提供することを目的とする。   The present invention has been made in view of the above, and provides a cleaning device that can hold a cleaning object having a different diameter with a support roller with a simple configuration and can clean the lower surface of the cleaning object. With the goal.

上述した課題を解決し、目的を達成するために、本発明は、少なくとも被加工物を含む円盤状の洗浄対象物を外周縁で水平あるいは略水平に保持しながら回転させる回転保持手段と、前記回転保持手段で保持された前記洗浄対象物の下面を洗浄する洗浄手段とを備えた洗浄装置であって、前記回転保持手段は、前記洗浄対象物の外周縁に接触しつつ、鉛直方向の回転軸で回転する３個以上の支持ローラーと、少なくとも１個の前記支持ローラーに装着された回転駆動源と、前記支持ローラーを回転自在に支持し、前記支持ローラーの回転軸とは異なる位置にある鉛直方向の回転軸で回動する回転基台と、所定の異なる位置に前記支持ローラーを位置づける移動機構と、を備え、前記移動機構は、前記回転基台を前記回転軸周りに回動させ、隣り合う前記支持ローラーの相対距離を変更するものであり、鉛直方向から見た際に、前記回転保持手段が前記洗浄対象物の外周縁に対応する領域および前記洗浄対象物の外側に配設され、前記洗浄手段が前記洗浄対象物の中央を含んだ領域の前記洗浄対象物の下方に配設され、前記洗浄対象物の直径の変更に対応して前記洗浄対象物の下面を洗浄することを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention includes a rotation holding means for rotating a disc-shaped cleaning object including at least a workpiece while holding the outer peripheral edge horizontally or substantially horizontally, And a cleaning device for cleaning the lower surface of the cleaning object held by the rotation holding means, wherein the rotation holding means rotates in the vertical direction while contacting the outer periphery of the cleaning object. Three or more support rollers that rotate on a shaft, a rotation drive source mounted on at least one of the support rollers, and the support roller are rotatably supported, and are in positions different from the rotation shaft of the support roller. A rotation base that rotates around a vertical rotation axis, and a movement mechanism that positions the support roller at a predetermined different position, and the movement mechanism rotates the rotation base around the rotation axis, next to The relative distance of the supporting rollers to be fitted is changed, and when viewed from the vertical direction, the rotation holding means is disposed on an area corresponding to the outer periphery of the object to be cleaned and outside the object to be cleaned, The cleaning means is disposed below the cleaning target in a region including the center of the cleaning target, and cleans the lower surface of the cleaning target in response to a change in the diameter of the cleaning target. And

本発明に係る洗浄装置は、各支持ローラーの位置の変更を、移動機構により回動基台が各支持ローラーの回転軸とは異なる位置にある鉛直方向の回転軸で回動することにより行うことができるので、簡単な構成で、洗浄対象物の直径の変更に対応して洗浄対象物の下面を洗浄することができるという効果を奏する。   In the cleaning apparatus according to the present invention, the position of each support roller is changed by rotating the rotation base on a vertical rotation axis at a position different from the rotation axis of each support roller by a moving mechanism. Therefore, it is possible to clean the lower surface of the object to be cleaned in accordance with the change in the diameter of the object to be cleaned with a simple configuration.

図１は、本実施形態に係る洗浄装置（小径保持位置）の平面図である。FIG. 1 is a plan view of a cleaning device (small diameter holding position) according to the present embodiment. 図２は、本実施形態に係る洗浄装置（小径保持位置）の正面図である。FIG. 2 is a front view of the cleaning device (small diameter holding position) according to the present embodiment. 図３は、本実施形態に係る洗浄装置（大径保持位置）の平面図である。FIG. 3 is a plan view of the cleaning device (large diameter holding position) according to the present embodiment. 図４は、本実施形態に係る洗浄装置（大径保持位置）の正面図である。FIG. 4 is a front view of the cleaning apparatus (large diameter holding position) according to the present embodiment. 図５は、本実施形態に係る洗浄装置により洗浄される洗浄対象物（小径）を示す図である。FIG. 5 is a diagram illustrating a cleaning object (small diameter) to be cleaned by the cleaning apparatus according to the present embodiment. 図６は、本実施形態に係る洗浄装置により洗浄される洗浄対象物（大径）を示す図である。FIG. 6 is a diagram illustrating a cleaning object (large diameter) to be cleaned by the cleaning apparatus according to the present embodiment.

本発明を実施するための形態（実施形態）につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。   DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

〔実施形態〕
図１は、本実施形態に係る洗浄装置（小径保持位置）の平面図である。図２は、本実施形態に係る洗浄装置（小径保持位置）の正面図である。図３は、本実施形態に係る洗浄装置（大径保持位置）の平面図である。図４は、本実施形態に係る洗浄装置（大径保持位置）の正面図である。図５は、本実施形態に係る洗浄装置により洗浄される洗浄対象物（小径）を示す図である。図６は、本実施形態に係る洗浄装置により洗浄される洗浄対象物（大径）を示す図である。本実施形態に係る洗浄装置は、洗浄対象物を保持した状態で回転させながら、洗浄対象物の下面を洗浄するものである。洗浄装置１は、図１〜図４に示すように、回転保持手段２と、洗浄手段３とを含んで構成されている。 Embodiment
FIG. 1 is a plan view of a cleaning device (small diameter holding position) according to the present embodiment. FIG. 2 is a front view of the cleaning device (small diameter holding position) according to the present embodiment. FIG. 3 is a plan view of the cleaning device (large diameter holding position) according to the present embodiment. FIG. 4 is a front view of the cleaning apparatus (large diameter holding position) according to the present embodiment. FIG. 5 is a diagram illustrating a cleaning object (small diameter) to be cleaned by the cleaning apparatus according to the present embodiment. FIG. 6 is a diagram illustrating a cleaning object (large diameter) to be cleaned by the cleaning apparatus according to the present embodiment. The cleaning apparatus according to the present embodiment cleans the lower surface of the cleaning target while rotating while holding the cleaning target. As shown in FIGS. 1 to 4, the cleaning device 1 includes a rotation holding unit 2 and a cleaning unit 3.

ここで、洗浄対象物は、図５および図６に示すように、円盤状に形成されており、本実施形態では、円盤状の被加工物Ｗ１，Ｗ２および被加工物Ｗ１，Ｗ２の直径以上の直径Ｄ１，Ｄ２（図３および図４では、被加工物Ｗ１，Ｗ２と同径）をそれぞれ有する円盤状の支持基板Ｔ１，Ｔ２により構成されている。洗浄対象物Ｓ１，Ｓ２は、支持基板Ｔ１，Ｔ２の上面と被加工物Ｗ１，Ｗ２の下面との間に接着剤（例えば、紫外線硬化樹脂や熱可塑性樹脂など）を介在することで、支持基板Ｔ１，Ｔ２に被加工物Ｗ１，Ｗ２を接着したものである。ここで、被加工物Ｗ１，Ｗ２は、シリコン、サファイア、ガリウムなどを母材とするウェーハである。また、支持基板Ｔ１，Ｔ２は、被加工物Ｗ１，Ｗ２の撓みを抑制することで、本実施形態に係る洗浄装置１による洗浄工程の前工程や後工程における被加工物Ｗの加工や搬送を容易にするものである。ここで、洗浄対象物Ｓ１，Ｓ２は、被加工物Ｗ１，Ｗ２の直径に対応して直径Ｄ１，Ｄ２が異なるものであり、洗浄対象物Ｓ１が洗浄対象物Ｓ２よりも径が小さく形成されている。また、洗浄対象物Ｓ１，Ｓ２は、被加工物Ｗ１，Ｗ２と支持基板Ｔ１，Ｔ２が一体になったものに限定されるものではなく、被加工物Ｗ１，Ｗ２単体や被加工物Ｗ１，Ｗ２がそれぞれ複数積層されたものであってもよい。   Here, as shown in FIGS. 5 and 6, the object to be cleaned is formed in a disk shape, and in this embodiment, the diameter is larger than the diameters of the disk-shaped workpieces W1 and W2 and the workpieces W1 and W2. Are respectively formed by disk-shaped support substrates T1 and T2 having the same diameters D1 and D2 (the same diameter as the workpieces W1 and W2 in FIGS. 3 and 4). The objects S1 and S2 to be cleaned are supported by interposing an adhesive (for example, an ultraviolet curable resin or a thermoplastic resin) between the upper surfaces of the support substrates T1 and T2 and the lower surfaces of the workpieces W1 and W2. Workpieces W1 and W2 are bonded to T1 and T2. Here, the workpieces W1 and W2 are wafers whose base material is silicon, sapphire, gallium or the like. Further, the supporting substrates T1 and T2 suppress the bending of the workpieces W1 and W2, thereby processing and transporting the workpiece W in the pre-process and the post-process of the cleaning process by the cleaning device 1 according to the present embodiment. To make it easier. Here, the cleaning objects S1 and S2 have different diameters D1 and D2 corresponding to the diameters of the workpieces W1 and W2, and the cleaning object S1 has a smaller diameter than the cleaning object S2. Yes. In addition, the cleaning objects S1 and S2 are not limited to those in which the workpieces W1 and W2 and the support substrates T1 and T2 are integrated, but the workpieces W1 and W2 alone or the workpieces W1 and W2 are used. A plurality of layers may be stacked.

回転保持手段２は、図１〜図４に示すように、洗浄対象物Ｓ１，Ｓ２を外周縁Ｓｃで保持しながら回転させるものであり、鉛直方向から見た際に、保持した洗浄対象物Ｓ１，Ｓ２の外周縁Ｓｃに対応する領域および洗浄対象物Ｓ１，Ｓ２の外側に配設されるものである。回転保持手段２は、４つの支持ローラー２１ａ〜２１ｄと、回転基台２２ａ〜２２ｄと、３つの回転駆動源２３ａ〜２３ｃと、２つの移動機構２５ａ，２５ｂとを含んで構成され、さらに、固定基台２４ａ，２４ｂと、回転センサ２６と、小径規制ピン２７ａ〜２７ｄと、大径規制ピン２８ａ〜２８ｄとを含んでいる。   As shown in FIGS. 1 to 4, the rotation holding means 2 rotates the cleaning objects S <b> 1 and S <b> 2 while holding them at the outer peripheral edge Sc, and holds the cleaning object S <b> 1 when viewed from the vertical direction. , S2 and the outer side of the objects S1 and S2 corresponding to the outer peripheral edge Sc. The rotation holding means 2 includes four support rollers 21a to 21d, rotation bases 22a to 22d, three rotation driving sources 23a to 23c, and two moving mechanisms 25a and 25b, and is further fixed. The bases 24a and 24b, the rotation sensor 26, small diameter restricting pins 27a to 27d, and large diameter restricting pins 28a to 28d are included.

各支持ローラー２１ａ〜２１ｄは、洗浄対象物Ｓ１，Ｓ２の外周縁Ｓｃにそれぞれ接触することで洗浄対象物Ｓ１，Ｓ２を支持するものであり、鉛直方向の回転軸Ｒ１ａ〜Ｒ１ｄでそれぞれ回転するものである。各支持ローラー２１ａ〜２１ｄは、洗浄手段３の後述する洗浄ローラー３１を挟んで、支持ローラー２１ａ，２１ｄと、支持ローラー２１ｂ，２１ｃとが対向して、洗浄対象物Ｓ１，Ｓ２に対して周方向に等間隔に配設されている。各支持ローラー２１ａ〜２１ｄは、ウレタンゴムなどの弾性体であり、円筒状に形成され、洗浄対象物Ｓ１，Ｓ２の下面が対向する上面から洗浄対象物Ｓ１，Ｓ２の外周縁Ｓｃに接触する接触部２１ｅ〜２１ｈがそれぞれ突出して形成されている。各接触部２１ｅ〜２１ｈは、略円錐状に形成され、下方に向かうに伴い外径が広く形成されている。各接触部２１ｅ〜２１ｈは、同一水平面に位置しており、各支持ローラー２１ａ〜２１ｄが後述する小径保持位置および大径保持位置において、外周面が接触するように設定されている。従って、回転保持手段２は、各接触部２１ｅ〜２１ｈに接触することで洗浄対象物Ｓ１，Ｓ２を水平あるいはほぼ水平（水平面に対して数度程度傾き）に支持するとともに、洗浄対象物Ｓ１，Ｓ２の自重により洗浄対象物Ｓ１，Ｓ２を保持することができる。   The support rollers 21a to 21d support the cleaning objects S1 and S2 by coming into contact with the outer peripheral edges Sc of the cleaning objects S1 and S2, respectively, and rotate about vertical rotation axes R1a to R1d, respectively. It is. Each of the support rollers 21a to 21d sandwiches a later-described cleaning roller 31 of the cleaning unit 3 so that the support rollers 21a and 21d and the support rollers 21b and 21c face each other, and are circumferential with respect to the cleaning objects S1 and S2. Are arranged at equal intervals. Each of the support rollers 21a to 21d is an elastic body such as urethane rubber, is formed in a cylindrical shape, and comes into contact with the outer peripheral edge Sc of the cleaning objects S1 and S2 from the upper surface where the lower surfaces of the cleaning objects S1 and S2 face each other. The portions 21e to 21h are formed to protrude. Each contact part 21e-21h is formed in a substantially cone shape, and the outer diameter is formed widely as it goes below. Each contact part 21e-21h is located in the same horizontal surface, and it is set so that each outer peripheral surface may contact each support roller 21a-21d in the small diameter holding position and large diameter holding position which are mentioned later. Therefore, the rotation holding means 2 supports the cleaning objects S1 and S2 horizontally or substantially horizontally (inclination of about several degrees with respect to the horizontal plane) by contacting the contact portions 21e to 21h, and the cleaning object S1, The objects S1 and S2 can be held by the dead weight of S2.

各回転基台２２ａ〜２２ｄは、各支持ローラー２１ａ〜２１ｄをそれぞれ回転軸Ｒ１ａ〜Ｒ１ｄ周りに回転自在に支持するものである。各回転基台２２ａ〜２２ｄは、洗浄ローラー３１を挟んで、回転基台２２ａ，２２ｄと、回転基台２２ｂ，２２ｃとが対向して配設されている。各回転基台２２ａ〜２２ｄは、鉛直方向から見た際に、各支持ローラー２１ａ〜２１ｄの回転軸Ｒ１ａ〜Ｒ１ｄと異なる位置にある鉛直方向の回転軸Ｒ２ａ〜Ｒ２ｄでそれぞれ回動するものである。各回転基台２２ａ〜２２ｄは、本実施形態では、略矩形状に形成されており、各支持ローラー２１ａ〜２１近傍の外周面が洗浄手段３との干渉を抑制するため沿って円弧状に湾曲して形成されている。ここで、各回転軸Ｒ２ａ〜Ｒ２ｄは、各回転軸Ｒ１ａ〜Ｒ１ｄとの距離がそれぞれ同じであり、矩形状に配置されている。つまり、各回転軸Ｒ２ａ〜Ｒ２ｄを通る円の中心は、各回転軸Ｒ１ａ〜Ｒ１ｄを通る円の中心となり、すなわち各支持ローラー２１ａ〜２１ｄの中心となる。各回転軸Ｒ２ａ〜Ｒ２ｄは、本実施形態では、鉛直方向から見た際に、同じ固定基台２４ａ，２４ｂに支持されている回転基台２２ａ，２２ｄ、回転基台２２ｂ，２２ｃが互いに近接している側の端部近傍に形成されている。   Each rotation base 22a-22d supports each support roller 21a-21d so that rotation to the surroundings of rotating shaft R1a-R1d is possible respectively. The rotation bases 22a to 22d are disposed such that the rotation bases 22a and 22d and the rotation bases 22b and 22c face each other with the cleaning roller 31 interposed therebetween. When viewed from the vertical direction, each of the rotation bases 22a to 22d is rotated by a vertical rotation axis R2a to R2d at a position different from the rotation axes R1a to R1d of the respective support rollers 21a to 21d. . In the present embodiment, each of the rotation bases 22a to 22d is formed in a substantially rectangular shape, and the outer peripheral surface in the vicinity of each of the support rollers 21a to 21 is curved in a circular arc shape to suppress interference with the cleaning means 3. Is formed. Here, each rotation axis R2a to R2d has the same distance from each rotation axis R1a to R1d, and is arranged in a rectangular shape. That is, the center of the circle passing through each of the rotation axes R2a to R2d is the center of the circle passing through each of the rotation axes R1a to R1d, that is, the center of each of the support rollers 21a to 21d. In the present embodiment, when the rotation axes R2a to R2d are viewed from the vertical direction, the rotation bases 22a and 22d and the rotation bases 22b and 22c supported by the same fixed bases 24a and 24b are close to each other. It is formed in the vicinity of the end on the side.

各回転駆動源２３ａ〜２３ｃは、各支持ローラー２１ａ〜２１ｃにそれぞれ装着され、各支持ローラー２１ａ〜２１ｃを各回転基台２２ａ〜２２ｃに対してそれぞれ回転させるものである（図１および図３に示す矢印Ａ）。各回転駆動源２３ａ〜２３ｃは、例えば、モータであり、図示しない洗浄装置１の各構成要素を制御する制御手段に接続されており、制御手段により駆動制御が行われる。   Each rotation drive source 23a-23c is mounted on each support roller 21a-21c, and rotates each support roller 21a-21c relative to each rotation base 22a-22c (see FIGS. 1 and 3). Arrow A) shown. Each rotation drive source 23a-23c is a motor, for example, is connected to the control means which controls each component of the washing | cleaning apparatus 1 which is not shown in figure, and drive control is performed by the control means.

各固定基台２４ａ，２４ｂは、洗浄装置１の図示しない筐体に固定されており、固定基台２４ａが各回転基台２２ａ，２２ｄをそれぞれ回転軸Ｒ２ａ，Ｒ２ｄ周りに回転自在に支持するものであり、固定基台２４ｂが各回転基台２２ｂ，２２ｃをそれぞれ回転軸Ｒ２ｂ，Ｒ２ｃ周りに回転自在に支持するものである。各固定基台２４ａ，２４ｂは、洗浄ローラー３１を挟んで対向して配設されている。各固定基台２４ａ，２４ｂは、本実施形態では、矩形状に形成されており、各支持ローラー２１ａ〜２１ｄが後述する小径保持位置および大径保持位置において、鉛直方向から見た場合に、各支持ローラー２１ａ〜２１ｄの回転軸Ｒ１ａ〜Ｒ１ｄの少なくとも一部と重なるように形成されている。   The fixed bases 24a and 24b are fixed to a housing (not shown) of the cleaning apparatus 1, and the fixed base 24a supports the rotary bases 22a and 22d so as to be rotatable around the rotation axes R2a and R2d, respectively. The fixed base 24b supports the rotary bases 22b and 22c so as to be rotatable around the rotation axes R2b and R2c, respectively. The fixed bases 24 a and 24 b are disposed to face each other with the cleaning roller 31 interposed therebetween. In the present embodiment, each of the fixed bases 24a and 24b is formed in a rectangular shape, and each of the support rollers 21a to 21d has a small diameter holding position and a large diameter holding position, which will be described later, when viewed from the vertical direction. It forms so that it may overlap with at least one part of rotating shaft R1a-R1d of support roller 21a-21d.

各移動機構２５ａ，２５ｂは、所定の異なる位置、本実施形態では、小径保持位置および大径保持位置の２つの位置に、各支持ローラー２１ａ〜２１ｄを位置づけるものである。移動機構２５ａは回転基台２２ａ，２２ｄを回転軸Ｒ２ａ，Ｒ２ｄ周りに回動させ（図１および図３に示す矢印Ｆ，Ｈ）、隣り合う、本実施形態では、洗浄ローラー３１の軸方向に隣り合って配設された支持ローラー２１ａ，２１ｄの相対距離を変更するものであり、移動機構２５ｂは回転基台２２ｂ，２２ｃを回転軸Ｒ２ｂ，Ｒ２ｃ周りに回動させ、隣り合う、本実施形態では、洗浄ローラー３１の軸方向に隣り合って配設された支持ローラー２１ｂ，２１ｃの相対距離を変更するものである。ここで、小径保持位置とは、各支持ローラー２１ａ〜２１ｄの中心を通る円の直径が、洗浄装置１の洗浄対象物Ｓ１の外周縁Ｓｃを各支持ローラー２１ａ〜２１ｄの各接触部２１ｅ〜２１ｈに当接させることができる長さとなる位置であり、各移動機構２５ａ，２５ｂが伸びた状態である。一方、大径保持位置とは、各支持ローラー２１ａ〜２１ｄの中心を通る円の直径が、洗浄装置１の洗浄対象物Ｓ２の外周縁Ｓｃを各支持ローラー２１ａ〜２１ｄの各接触部２１ｅ〜２１ｈに当接させることができる長さとなる位置であり、各移動機構２５ａ，２５ｂが縮んだ状態である。   Each moving mechanism 25a, 25b positions each support roller 21a-21d in two different positions, in this embodiment, a small diameter holding position and a large diameter holding position. The moving mechanism 25a rotates the rotation bases 22a and 22d around the rotation axes R2a and R2d (arrows F and H shown in FIGS. 1 and 3), and in the present embodiment, in the axial direction of the cleaning roller 31. This embodiment changes the relative distance between the support rollers 21a and 21d arranged adjacent to each other, and the moving mechanism 25b rotates the rotation bases 22b and 22c around the rotation axes R2b and R2c to be adjacent to each other. Then, the relative distance between the support rollers 21b and 21c arranged adjacent to each other in the axial direction of the cleaning roller 31 is changed. Here, the small diameter holding position means that the diameter of a circle passing through the center of each of the support rollers 21a to 21d is the outer peripheral edge Sc of the cleaning object S1 of the cleaning device 1 and each of the contact portions 21e to 21h of each of the support rollers 21a to 21d. The moving mechanism 25a, 25b is in an extended state. On the other hand, the large-diameter holding position means that the diameter of a circle passing through the center of each support roller 21a to 21d is the outer peripheral edge Sc of the cleaning object S2 of the cleaning device 1 and each contact portion 21e to 21h of each support roller 21a to 21d. In this state, the moving mechanisms 25a and 25b are contracted.

各移動機構２５ａ，２５ｂは、アクチュエータ、本実施形態では、図示しない圧縮空気供給源から供給される圧縮空気により伸縮（図１および図３に示す矢印Ｅ、Ｇ）するエアシリンダーであり、図示しないピストンを有するシャフト２５ｃ，２５ｄと、シリンダ本体２５ｅ，２５ｆとにより構成されている。移動機構２５ａは、シャフト２５ｃの先端部が回転基台２２ａに形成された支持部材２２ｅに対して回転自在に支持され、鉛直方向の回転軸Ｒ３ａで回転するものであり、シリンダ本体２５ｅのシャフト２５ｃ側と反対側の端部が回転基台２２ｄに形成された支持部材２２ｈに対して回転自在に支持され、回転軸Ｒ３ｄで回転するものであることで、回転基台２２ａ，２２ｄの間に回転自在に支持されている。移動機構２５ｂは、シャフト２５ｄの先端部が回転基台２２ｂに形成された支持部材２２ｆに対して回転自在に支持され、鉛直方向の回転軸Ｒ３ｂで回転するものであり、シリンダ本体２５ｆのシャフト２５ｄ側と反対側の端部が回転基台２２ｃに形成された支持部材２２ｇに対して回転自在に支持され、回転軸Ｒ３ｃで回転するものであることで、回転基台２２ｂ，２２ｃの間に回転自在に支持されている。各移動機構２５ａ，２５ｂは、圧縮空気の供給が図示しない制御手段により制御されており、伸縮量が同期するように制御されている。各支持部材２２ｅ〜２２ｈは、本実施形態では、鉛直方向から見た際に、同じ固定基台２４ａ，２４ｂに支持されている回転基台２２ａ，２２ｄ、回転基台２２ｂ，２２ｃが互いに離間している側の端部近傍に形成されている。   Each moving mechanism 25a, 25b is an actuator, in this embodiment, an air cylinder that expands and contracts (arrows E and G shown in FIGS. 1 and 3) by compressed air supplied from a compressed air supply source (not shown), not shown. It comprises shafts 25c, 25d having pistons and cylinder bodies 25e, 25f. The moving mechanism 25a is such that the distal end portion of the shaft 25c is rotatably supported with respect to a support member 22e formed on the rotation base 22a, and rotates about a vertical rotation axis R3a. The end opposite to the side is rotatably supported with respect to a support member 22h formed on the rotation base 22d and rotates about the rotation axis R3d, so that it rotates between the rotation bases 22a and 22d. It is supported freely. In the moving mechanism 25b, the tip end of the shaft 25d is rotatably supported with respect to a support member 22f formed on the rotation base 22b, and rotates about a vertical rotation axis R3b. The end opposite to the side is rotatably supported by a support member 22g formed on the rotation base 22c, and rotates between the rotation bases 22b and 22c by rotating around the rotation axis R3c. It is supported freely. In each of the moving mechanisms 25a and 25b, the supply of compressed air is controlled by a control unit (not shown), and the amount of expansion and contraction is controlled. In this embodiment, when the support members 22e to 22h are viewed from the vertical direction, the rotary bases 22a and 22d and the rotary bases 22b and 22c supported by the same fixed bases 24a and 24b are separated from each other. It is formed in the vicinity of the end on the side.

回転センサ２６は、支持ローラー２１ｄの回転を検出することで、各支持ローラー２１ａ〜２１ｄに保持された洗浄対象物Ｓ１，Ｓ２の回転を検出するものである。回転センサ２６は、図示しない制御手段に接続されており、制御手段により保持された洗浄対象物Ｓ１，Ｓ２の回転有無が判定される。   The rotation sensor 26 detects the rotation of the cleaning objects S1 and S2 held by the support rollers 21a to 21d by detecting the rotation of the support roller 21d. The rotation sensor 26 is connected to control means (not shown), and it is determined whether or not the cleaning objects S1 and S2 held by the control means are rotating.

小径規制ピン２７ａ〜２７ｄおよび大径規制ピン２８ａ〜２８ｄは、各回転基台２２ａ〜２２ｄに対応して固定基台２４ａ，２４ｂの各回転基台２２ａ〜２２ｄを支持する支持面から突出して形成されている。小径規制ピン２７ａ〜２７ｄは、各回転基台２２ａ〜２２ｄが回転する（図３に示す矢印Ｈ）ことで、各支持ローラー２１ａ〜２１ｄが各移動機構２５ａ，２５ｂにより小径保持位置に向かって移動し、小径保持位置に位置した際に、各回転基台２２ａ〜２２ｄの外周面に当接するものである。従って、小径規制ピン２７ａ〜２７ｄは、各支持ローラー２１ａ〜２１ｄが小径保持位置に位置した後、各回転基台２２ａ〜２２ｄのそれ以上の回転を規制することができ、各支持ローラー２１ａ〜２１ｄの小径保持位置における位置決め精度を向上することができる。大径規制ピン２８ａ〜２８ｄは、各回転基台２２ａ〜２２ｄが回転する（図１に示す矢印Ｆ）ことで、各支持ローラー２１ａ〜２１ｄが各移動機構２５ａ，２５ｂにより大径保持位置に向かって移動し、大径保持位置に位置した際に、各回転基台２２ａ〜２２ｄの外周面に当接するものである。従って、大径規制ピン２８ａ〜２８ｄは、各支持ローラー２１ａ〜２１ｄが大径保持位置に位置した後、各回転基台２２ａ〜２２ｄのそれ以上の回転を規制することができ、各支持ローラー２１ａ〜２１ｄの大径保持位置における位置決め精度を向上することができる。   The small-diameter regulating pins 27a to 27d and the large-diameter regulating pins 28a to 28d are formed so as to protrude from the support surfaces that support the rotary bases 22a to 22d of the fixed bases 24a and 24b corresponding to the rotary bases 22a to 22d. Has been. The small diameter regulating pins 27a to 27d are rotated by the rotation bases 22a to 22d (arrow H shown in FIG. 3), so that the support rollers 21a to 21d are moved toward the small diameter holding position by the moving mechanisms 25a and 25b. However, when it is located at the small diameter holding position, it comes into contact with the outer peripheral surface of each of the rotation bases 22a to 22d. Therefore, the small diameter regulating pins 27a to 27d can regulate further rotation of the respective rotation bases 22a to 22d after the respective support rollers 21a to 21d are positioned at the small diameter holding position, and the respective support rollers 21a to 21d. The positioning accuracy at the small-diameter holding position can be improved. The large diameter regulating pins 28a to 28d are rotated by the rotation bases 22a to 22d (arrow F shown in FIG. 1), so that the support rollers 21a to 21d are moved to the large diameter holding position by the moving mechanisms 25a and 25b. When it is moved and positioned at the large-diameter holding position, it comes into contact with the outer peripheral surfaces of the respective rotation bases 22a to 22d. Accordingly, the large diameter regulating pins 28a to 28d can regulate further rotation of the respective rotation bases 22a to 22d after the respective support rollers 21a to 21d are positioned at the large diameter holding position, and each of the support rollers 21a. The positioning accuracy in the large diameter holding position of ˜21d can be improved.

洗浄手段３は、回転保持手段２で保持された洗浄対象物Ｓ１，Ｓ２の下面を洗浄するものであり、本実施形態では、図示しない洗浄液供給源から洗浄液が供給される洗浄ローラー３１が、保持された洗浄対象物Ｓ１，Ｓ２の下面に接触しながら回転するものである。洗浄ローラー３１は、鉛直方向から見た際に、保持された洗浄対象物Ｓ１，Ｓ２の中央（中心）を含んだ領域の保持された洗浄対象物Ｓ１，Ｓ２の下方で、外周面が保持された洗浄対象物Ｓ１，Ｓ２の下面と接触する高さに配設されている。洗浄ローラー３１は、軸方向における長さが洗浄対象物Ｓ２の直径Ｄ２よりも長く設定されており、洗浄対象物Ｓ１，Ｓ２が回転保持手段２で保持されると、軸方向における両端部が洗浄対象物Ｓ１，Ｓ２の外周縁Ｓｃよりも突出するものである。つまり、洗浄ローラー３１は、洗浄対象物Ｓ１，Ｓ２の洗浄時、常に回転する洗浄対象物Ｓ１，Ｓ２の下面のうち、洗浄対象物Ｓ１，Ｓ２の中心を通る直径Ｄ１，Ｄ２分を長さとする領域に接触している。洗浄ローラー３１は、両端部が回転自在に支持された回転シャフト３２に取り付けられており、洗浄ローラー回転駆動源３３により回転する（図１および図３に示す矢印Ｄ）ものである。洗浄ローラー回転駆動源３３は、例えば、モータであり、制御手段に接続されており、制御手段により駆動制御が行われる。なお、洗浄液は、洗浄ローラー３１の内部から供給されてもよいし、図示しない洗浄液ノズルなどにより外部から洗浄ローラー３１に供給されてもよい。   The cleaning means 3 cleans the lower surfaces of the cleaning objects S1 and S2 held by the rotation holding means 2, and in this embodiment, the cleaning roller 31 to which the cleaning liquid is supplied from a cleaning liquid supply source (not shown) is held. It rotates while contacting the lower surfaces of the cleaned objects S1 and S2. When viewed from the vertical direction, the cleaning roller 31 has an outer peripheral surface held below the cleaned objects S1 and S2 in a region including the center (center) of the held objects S1 and S2. Further, the cleaning objects are disposed at a height in contact with the lower surfaces of the cleaning objects S1 and S2. The length of the cleaning roller 31 in the axial direction is set to be longer than the diameter D2 of the cleaning object S2. When the cleaning objects S1 and S2 are held by the rotation holding means 2, both ends in the axial direction are cleaned. It protrudes from the outer peripheral edge Sc of the objects S1, S2. That is, the cleaning roller 31 has a length corresponding to the diameters D1 and D2 passing through the centers of the cleaning objects S1 and S2 among the lower surfaces of the cleaning objects S1 and S2 that are always rotated when cleaning the cleaning objects S1 and S2. Touching the area. The cleaning roller 31 is attached to a rotary shaft 32 that is rotatably supported at both ends, and is rotated by a cleaning roller rotation drive source 33 (arrow D shown in FIGS. 1 and 3). The cleaning roller rotation drive source 33 is, for example, a motor, and is connected to a control unit, and drive control is performed by the control unit. The cleaning liquid may be supplied from the inside of the cleaning roller 31 or may be supplied to the cleaning roller 31 from the outside by a cleaning liquid nozzle (not shown).

次に、本実施形態に係る洗浄装置１の動作について説明する。ここで、洗浄装置１による洗浄工程の前工程は、例えば洗浄対象物Ｓ１，Ｓ２の被加工物Ｗ１，Ｗ２の上面を研削装置により研削した場合のように研削屑などが洗浄対象物Ｓ１，Ｓ２の下面に付着する可能性が生じる工程である。   Next, operation | movement of the washing | cleaning apparatus 1 which concerns on this embodiment is demonstrated. Here, the pre-process of the cleaning process by the cleaning apparatus 1 is such that, for example, when the upper surfaces of the workpieces W1 and W2 of the cleaning objects S1 and S2 are ground by the grinding apparatus, the grinding scraps are the cleaning objects S1 and S2. This is a process in which there is a possibility of adhering to the lower surface.

制御手段は、洗浄する洗浄対象物が小径の洗浄対象物Ｓ１か大径の洗浄対象物Ｓ２であるかを判定する。上記判定は、例えば、洗浄動作の開始前に予め作業員による洗浄対象物Ｓ１，Ｓ２の指定指示が図示しない操作手段から入力されることで行われる。制御手段は、洗浄対象物Ｓ１を洗浄すると判定すると、各支持ローラー２１ａ〜２１ｄが大径保持位置に位置している場合には小径保持位置に移動させる。ここでは、制御手段は、各移動機構２５ａ，２５ｂを伸ばす（図３に示す矢印Ｇ）ことで、各回転基台２２ａ〜２２ｄを隣り合う支持ローラー２１ａ，２１ｄおよび支持ローラー２１ｂ，２１ｃが近接するように回転させ（図３に示す矢印Ｈ）、各支持ローラー２１ａ〜２１ｄが小径保持位置に位置すると、各移動機構２５ａ，２５ｂの伸縮を停止し、位置を保持する。これにより、図１および図２に示すように、各支持ローラー２１ａ〜２１ｄは小径保持位置に位置する。このとき、各回転基台２２ａ〜２２ｄが小径規制ピン２７ａ〜２７ｄとそれぞれ当接した状態となる。一方、制御手段は、洗浄対象物Ｓ２を洗浄すると判定すると、各支持ローラー２１ａ〜２１ｄが小径保持位置に位置している場合には大径保持位置に移動させる。ここでは、制御手段は、各移動機構２５ａ，２５ｂを縮める（図１に示す矢印Ｅ）ことで、各回転基台２２ａ〜２２ｄを隣り合う支持ローラー２１ａ，２１ｄおよび支持ローラー２１ｂ，２１ｃが離間するように回転させ（図１に示す矢印Ｆ）、各支持ローラー２１ａ〜２１ｄが大径保持位置に位置すると、各移動機構２５ａ，２５ｂの伸縮を停止し、位置を保持する。これにより、図３および図４に示すように、各支持ローラー２１ａ〜２１ｄは大径保持位置に位置する。このとき、各回転基台２２ａ〜２２ｄが大径規制ピン２８ａ〜２８ｄとそれぞれ当接した状態となる。   The control means determines whether the object to be cleaned is the small diameter cleaning object S1 or the large diameter cleaning object S2. The determination is performed, for example, by inputting a designation instruction for the objects to be cleaned S1 and S2 by an operator in advance from an operation unit (not shown) before the start of the cleaning operation. When it is determined that the cleaning object S1 is to be cleaned, the control unit moves the support rollers 21a to 21d to the small diameter holding position when the support rollers 21a to 21d are positioned at the large diameter holding position. Here, the control means extends the respective moving mechanisms 25a and 25b (arrow G shown in FIG. 3) so that the adjacent support rollers 21a and 21d and the support rollers 21b and 21c approach each rotation base 22a to 22d. When the support rollers 21a to 21d are positioned at the small diameter holding positions, the expansion and contraction of the moving mechanisms 25a and 25b is stopped and the positions are held. Thereby, as shown in FIG.1 and FIG.2, each support roller 21a-21d is located in a small diameter holding position. At this time, the rotation bases 22a to 22d are in contact with the small diameter regulating pins 27a to 27d, respectively. On the other hand, when it is determined that the cleaning object S2 is to be cleaned, the control unit moves the support rollers 21a to 21d to the large diameter holding position when the support rollers 21a to 21d are positioned at the small diameter holding position. Here, the control means contracts each moving mechanism 25a, 25b (arrow E shown in FIG. 1), so that the adjacent support rollers 21a, 21d and the support rollers 21b, 21c are separated from each other on the respective rotation bases 22a-22d. When the support rollers 21a to 21d are positioned at the large diameter holding position, the expansion and contraction of the moving mechanisms 25a and 25b is stopped and the positions are held. Thereby, as shown in FIG. 3 and FIG. 4, each support roller 21a-21d is located in a large diameter holding position. At this time, the respective rotation bases 22a to 22d are in contact with the large diameter regulating pins 28a to 28d, respectively.

制御手段は、各支持ローラー２１ａ〜２１ｄが洗浄対象物Ｓ１，Ｓ２に対応する保持位置に位置し、図示しない搬送手段により、各支持ローラー２１ａ〜２１ｄの間に洗浄対象物Ｓ１，Ｓ２が搬送され、各支持ローラー２１ａ〜２１ｄにより洗浄対象物Ｓ１，Ｓ２が保持されると、各回転駆動源２３ａ〜２３ｃにより各支持ローラー２１ａ〜２１ｃを回転させる（図１および図３に示す矢印Ａ）とともに、洗浄液を供給しながら洗浄ローラー回転駆動源３３により洗浄ローラー３１を回転させる（図１および図３に示す矢印Ｄ）。これにより、洗浄ローラー３１は、自転する（図１および図３に示す矢印Ｂ）ことで、洗浄対象物Ｓ１，Ｓ２の下面全面と当接し、下面に付着している切削屑を洗浄・除去することができる。各回転駆動源２３ａ〜２３ｃにより各支持ローラー２１ａ〜２１ｃを回転すると、保持された洗浄対象物Ｓ１，Ｓ２により支持ローラー２１ｄが連れ回って回転（図１および図３に示す矢印Ｃ）し、洗浄対象物Ｓ１，Ｓ２の回転が検出される。従って、制御手段は、各回転駆動源２３ａ〜２３ｃにより各支持ローラー２１ａ〜２１ｃを回転しても、支持ローラー２１ｄが回転していないと判断すると、洗浄対象物Ｓ１，Ｓ２が各支持ローラー２１ａ〜２１ｄに保持されていない、あるいは故障などの異常が発生していると判定し、各支持ローラー２１ａ〜２１ｃの回転を停止し、作業員に図示しない報知手段により報知する。なお、洗浄装置１により洗浄が行われた洗浄対象物Ｓ１，Ｓ２は、再び搬送手段により後工程を行う装置あるいは領域に搬送される。   The control means is such that the support rollers 21a to 21d are positioned at the holding positions corresponding to the objects to be cleaned S1 and S2, and the objects to be cleaned S1 and S2 are conveyed between the support rollers 21a to 21d by a conveying means (not shown). When the cleaning objects S1 and S2 are held by the support rollers 21a to 21d, the support rollers 21a to 21c are rotated by the rotation driving sources 23a to 23c (arrow A shown in FIGS. 1 and 3). While supplying the cleaning liquid, the cleaning roller 31 is rotated by the cleaning roller rotation drive source 33 (arrow D shown in FIGS. 1 and 3). As a result, the cleaning roller 31 rotates (arrow B shown in FIGS. 1 and 3) to contact the entire lower surface of the objects to be cleaned S1 and S2 to clean and remove the cutting waste adhering to the lower surface. be able to. When the respective support rollers 21a to 21c are rotated by the respective rotation drive sources 23a to 23c, the support rollers 21d are rotated by the held cleaning objects S1 and S2 (arrow C shown in FIGS. 1 and 3) and cleaned. The rotation of the objects S1 and S2 is detected. Therefore, if the control means determines that the support roller 21d is not rotating even if the support rollers 21a to 21c are rotated by the rotation driving sources 23a to 23c, the cleaning objects S1 and S2 are moved to the support rollers 21a to 21c. It is determined that an abnormality such as a failure or the like has not occurred, and the rotation of each of the support rollers 21a to 21c is stopped, and the worker is notified by a not-illustrated notification means. The cleaning objects S1 and S2 that have been cleaned by the cleaning device 1 are again transported to a device or region that performs a post-process by the transport means.

以上のように、本実施形態に係る洗浄装置１は、洗浄対象物Ｓ１，Ｓ２の直径Ｄ１，Ｄ２の変更に対応して、直径Ｄ１，Ｄ２の異なる洗浄対象物Ｓ１，Ｓ２を保持することができ、洗浄対象物Ｓ１，Ｓ２の下面を洗浄することがきる。また、各移動機構２５ａ，２５ｂにより各回転基台２２ａ〜２２ｄが各支持ローラー２１ａ〜２１ｄの回転軸Ｒ１ａ〜Ｒ１ｄとは異なる位置にある鉛直方向の回転軸Ｒ２ａ〜Ｒ２ｄで回動させる簡単な構成で、各支持ローラー２１ａ〜２１ｄの位置の変更、すなわち小径保持位置と大径保持位置との切り換えを行うことができる。さらに、鉛直方向から見た際に、各支持ローラー２１ａ〜２１ｄを通る円の中心から放射状に各支持ローラー２１ａ〜２１ｄの位置を変更する場合と比較して、洗浄対象物Ｓ１，Ｓ２の中央にスペースを確保することができ、洗浄対象物Ｓ２に対応することができる長さの洗浄ローラー３１を有する洗浄手段３を配設することができる。また、各移動機構２５ａ，２５ｂは伸縮により各支持ローラー２１ａ〜２１ｄの位置の変更、位置決めを行うので、簡単で安価な構成とすることができる。   As described above, the cleaning apparatus 1 according to the present embodiment can hold the cleaning objects S1 and S2 having different diameters D1 and D2 in response to the change of the diameters D1 and D2 of the cleaning objects S1 and S2. It is possible to clean the lower surfaces of the objects S1 and S2. In addition, a simple configuration in which the rotary bases 22a to 22d are rotated by the rotary mechanisms R2a to R2d in the vertical direction at positions different from the rotary axes R1a to R1d of the support rollers 21a to 21d by the moving mechanisms 25a and 25b. Thus, the position of each of the support rollers 21a to 21d can be changed, that is, the small diameter holding position and the large diameter holding position can be switched. Furthermore, when viewed from the vertical direction, compared to the case where the positions of the support rollers 21a to 21d are changed radially from the center of the circle passing through the support rollers 21a to 21d, the cleaning objects S1 and S2 are located at the center. The cleaning means 3 having the cleaning roller 31 having a length that can secure a space and can correspond to the cleaning object S2 can be provided. Moreover, since each moving mechanism 25a, 25b changes and positions the position of each support roller 21a-21d by expansion-contraction, it can be set as a simple and cheap structure.

なお、本実施形態に係る洗浄装置１は、４つの支持ローラー２１ａ〜２１ｄを有するが本発明はこれに限定されるものではなく、３つ以上の支持ローラーを有していればよい。また、本実施形態に係る洗浄装置１は、３つの回転駆動源２３ａ〜２３ｃを有するが本発明はこれに限定されるものではなく、１つ以上の回転駆動源を有していればよい。また、回転センサ２６を回転駆動源２３ａ〜２３ｃが装着された支持ローラー２１ａ〜２１ｃに設けられている場合は、回転駆動源２３ａ〜２３ｃが装着された支持ローラー２１ａ〜２１ｃ以外の支持ローラーを設けなくてもよい。   In addition, although the washing | cleaning apparatus 1 which concerns on this embodiment has four support rollers 21a-21d, this invention is not limited to this, What is necessary is just to have three or more support rollers. Moreover, although the washing | cleaning apparatus 1 which concerns on this embodiment has three rotation drive sources 23a-23c, this invention is not limited to this, What is necessary is just to have one or more rotation drive sources. Further, when the rotation sensor 26 is provided on the support rollers 21a to 21c to which the rotation drive sources 23a to 23c are attached, a support roller other than the support rollers 21a to 21c to which the rotation drive sources 23a to 23c are attached is provided. It does not have to be.

１ 洗浄装置
２ 回転保持手段
２１ａ〜２１ｄ 支持ローラー
２１ｅ〜２１ｈ 接触部
２２ａ〜２２ｄ 回転基台
２３ａ〜２３ｃ 回転駆動源
２４ａ，２４ｂ 固定基台
２５ａ，２５ｂ 移動機構
２５ｃ，２５ｄ シャフト
２５ｅ，２５ｆ シリンダ本体
２６ 回転センサ
２７ａ〜２７ｄ 小径規制ピン
２８ａ〜２８ｄ 大径規制ピン
３ 洗浄手段
３１ 洗浄ローラー
３２ 回転シャフト
３３ 洗浄ローラー回転駆動源
Ｒ１ａ〜Ｒ１ｄ：回転軸
Ｒ２ａ〜Ｒ２ｄ：回転軸
Ｒ３ａ〜Ｒ３ｄ：回転軸
Ｓ１，Ｓ２ 洗浄対象物
Ｔ１，Ｔ２ 支持基板
Ｗ１，Ｗ２ 被加工物 DESCRIPTION OF SYMBOLS 1 Cleaning apparatus 2 Rotation holding means 21a-21d Support roller 21e-21h Contact part 22a-22d Rotation base 23a-23c Rotation drive source 24a, 24b Fixed base 25a, 25b Moving mechanism 25c, 25d Shaft 25e, 25f Cylinder main body 26 Rotation sensor 27a to 27d Small diameter regulating pin 28a to 28d Large diameter regulating pin 3 Cleaning means 31 Cleaning roller 32 Rotating shaft 33 Cleaning roller rotation drive source R1a to R1d: Rotating shaft R2a to R2d: Rotating shaft R3a to R3d: Rotating shaft S1, S2 Object to be cleaned T1, T2 Support substrate W1, W2 Workpiece

Claims (1)

少なくとも被加工物を含む円盤状の洗浄対象物を外周縁で水平あるいは略水平に保持しながら回転させる回転保持手段と、前記回転保持手段で保持された前記洗浄対象物の下面を洗浄する洗浄手段とを備えた洗浄装置であって、
前記回転保持手段は、
前記洗浄対象物の外周縁に接触しつつ、鉛直方向の回転軸で回転する３個以上の支持ローラーと、
少なくとも１個の前記支持ローラーに装着された回転駆動源と、
前記支持ローラーを回転自在に支持し、前記支持ローラーの回転軸とは異なる位置にある鉛直方向の回転軸で回動する回転基台と、
所定の異なる位置に前記支持ローラーを位置づける移動機構と、
を備え、
前記移動機構は、前記回転基台を前記回転軸周りに回動させ、隣り合う前記支持ローラーの相対距離を変更するものであり、
鉛直方向から見た際に、前記回転保持手段が前記洗浄対象物の外周縁に対応する領域および前記洗浄対象物の外側に配設され、前記洗浄手段が前記洗浄対象物の中央を含んだ領域の前記洗浄対象物の下方に配設され、
前記洗浄対象物の直径の変更に対応して前記洗浄対象物の下面を洗浄することを特徴とする洗浄装置。 Rotation holding means for rotating at least a disk-shaped cleaning object including a workpiece at the outer periphery while holding it horizontally or substantially horizontally, and a cleaning means for cleaning the lower surface of the cleaning object held by the rotation holding means A cleaning device comprising:
The rotation holding means is
Three or more support rollers that rotate around a vertical axis of rotation while contacting the outer periphery of the object to be cleaned;
A rotational drive source mounted on at least one of the support rollers;
A rotating base that rotatably supports the support roller and rotates around a vertical rotation axis at a position different from the rotation axis of the support roller;
A moving mechanism for positioning the support roller at a predetermined different position;
With
The moving mechanism rotates the rotation base around the rotation axis and changes the relative distance between the adjacent support rollers,
When viewed from the vertical direction, the rotation holding means is disposed on an area corresponding to the outer peripheral edge of the object to be cleaned and on the outside of the object to be cleaned, and the area on which the cleaning means includes the center of the object to be cleaned Is disposed below the object to be cleaned,
A cleaning apparatus for cleaning the lower surface of the cleaning object in response to a change in the diameter of the cleaning object.
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JP2016115776A (en) * 2014-12-12 2016-06-23 株式会社ディスコ Washing apparatus
JP2017041522A (en) * 2015-08-19 2017-02-23 株式会社ディスコ Washing device
JP2017152565A (en) * 2016-02-25 2017-08-31 株式会社ディスコ Washing apparatus
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