JP2013232567A5 - - Google Patents

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Publication number
JP2013232567A5
JP2013232567A5 JP2012104278A JP2012104278A JP2013232567A5 JP 2013232567 A5 JP2013232567 A5 JP 2013232567A5 JP 2012104278 A JP2012104278 A JP 2012104278A JP 2012104278 A JP2012104278 A JP 2012104278A JP 2013232567 A5 JP2013232567 A5 JP 2013232567A5
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JP
Japan
Prior art keywords
semiconductor layer
insulating film
oxide semiconductor
oxide
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012104278A
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English (en)
Japanese (ja)
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JP2013232567A (ja
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Publication date
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Priority to JP2012104278A priority Critical patent/JP2013232567A/ja
Priority claimed from JP2012104278A external-priority patent/JP2013232567A/ja
Publication of JP2013232567A publication Critical patent/JP2013232567A/ja
Publication of JP2013232567A5 publication Critical patent/JP2013232567A5/ja
Withdrawn legal-status Critical Current

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JP2012104278A 2012-04-30 2012-04-30 半導体装置の作製方法 Withdrawn JP2013232567A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012104278A JP2013232567A (ja) 2012-04-30 2012-04-30 半導体装置の作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012104278A JP2013232567A (ja) 2012-04-30 2012-04-30 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017209338A Division JP6448743B2 (ja) 2017-10-30 2017-10-30 半導体装置

Publications (2)

Publication Number Publication Date
JP2013232567A JP2013232567A (ja) 2013-11-14
JP2013232567A5 true JP2013232567A5 (https=) 2015-05-21

Family

ID=49678743

Family Applications (1)

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JP2012104278A Withdrawn JP2013232567A (ja) 2012-04-30 2012-04-30 半導体装置の作製方法

Country Status (1)

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JP (1) JP2013232567A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9960280B2 (en) * 2013-12-26 2018-05-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2015097596A1 (en) * 2013-12-26 2015-07-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2015136427A1 (ja) * 2014-03-14 2015-09-17 株式会社半導体エネルギー研究所 半導体装置
US10522693B2 (en) * 2015-01-16 2019-12-31 Semiconductor Energy Laboratory Co., Ltd. Memory device and electronic device
JP7078354B2 (ja) * 2016-05-04 2022-05-31 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP6985812B2 (ja) * 2016-05-04 2021-12-22 株式会社半導体エネルギー研究所 トランジスタの作製方法
US10586495B2 (en) * 2016-07-22 2020-03-10 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
WO2018235828A1 (ja) 2017-06-21 2018-12-27 株式会社村田製作所 硫化マグネシウム材料、硫化マグネシウム複合材料、二次電池用の正極部材、ワイドバンドギャップ半導体材料及びマグネシウム二次電池、並びに、閃亜鉛鉱型硫化マグネシウムの製造方法
CN108538848B (zh) * 2018-06-21 2024-01-16 长江存储科技有限责任公司 半导体结构及其形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8044464B2 (en) * 2007-09-21 2011-10-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5430846B2 (ja) * 2007-12-03 2014-03-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4275720B2 (ja) * 2008-03-20 2009-06-10 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
US9437454B2 (en) * 2010-06-29 2016-09-06 Semiconductor Energy Laboratory Co., Ltd. Wiring board, semiconductor device, and manufacturing methods thereof
KR101311653B1 (ko) * 2010-07-05 2013-09-25 샤프 가부시키가이샤 박막 트랜지스터 메모리 및 이를 구비한 표시장치
US20120032172A1 (en) * 2010-08-06 2012-02-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5710918B2 (ja) * 2010-09-13 2015-04-30 株式会社半導体エネルギー研究所 半導体装置及びその作製方法

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