JP2013216742A5 - - Google Patents
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- Publication number
- JP2013216742A5 JP2013216742A5 JP2012086811A JP2012086811A JP2013216742A5 JP 2013216742 A5 JP2013216742 A5 JP 2013216742A5 JP 2012086811 A JP2012086811 A JP 2012086811A JP 2012086811 A JP2012086811 A JP 2012086811A JP 2013216742 A5 JP2013216742 A5 JP 2013216742A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- meth
- radiation
- ethylenically unsaturated
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000178 monomer Substances 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive Effects 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 3
- 125000004432 carbon atoms Chemical group C* 0.000 claims 2
- 239000003431 cross linking reagent Substances 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 1
- 125000003368 amide group Chemical group 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000193 polymethacrylate Polymers 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012086811A JP5989381B2 (ja) | 2012-04-05 | 2012-04-05 | 放射線硬化性粘着組成物及びそれを用いた積層体 |
PCT/US2013/035357 WO2013152251A1 (en) | 2012-04-05 | 2013-04-05 | Radiation-cured adhesive composition and laminate using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012086811A JP5989381B2 (ja) | 2012-04-05 | 2012-04-05 | 放射線硬化性粘着組成物及びそれを用いた積層体 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013216742A JP2013216742A (ja) | 2013-10-24 |
JP2013216742A5 true JP2013216742A5 (he) | 2015-05-21 |
JP5989381B2 JP5989381B2 (ja) | 2016-09-07 |
Family
ID=48142095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012086811A Expired - Fee Related JP5989381B2 (ja) | 2012-04-05 | 2012-04-05 | 放射線硬化性粘着組成物及びそれを用いた積層体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5989381B2 (he) |
WO (1) | WO2013152251A1 (he) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103526596A (zh) * | 2013-10-23 | 2014-01-22 | 合肥聚合辐化技术有限公司 | 一种环保低温固化印花粘合剂及其制备方法 |
CN109554155B (zh) * | 2017-09-25 | 2021-04-02 | 3M创新有限公司 | 可印刷、可辐射固化的粘合剂组合物及其应用 |
US20240301243A1 (en) | 2021-06-02 | 2024-09-12 | Sekisui Chemical Co., Ltd. | Ultraviolet-curable composition |
JPWO2022255308A1 (he) | 2021-06-02 | 2022-12-08 | ||
CN116917344A (zh) | 2021-06-02 | 2023-10-20 | 积水化学工业株式会社 | 紫外线固化型散热性树脂组合物、散热性粘合片、层叠体及层叠体的制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61209281A (ja) | 1985-03-13 | 1986-09-17 | Hitachi Chem Co Ltd | 放射線硬化型粘着剤組成物 |
JP2909661B2 (ja) * | 1990-11-16 | 1999-06-23 | 大阪有機化学工業株式会社 | 放射線硬化型粘着剤組成物 |
JPH06107993A (ja) * | 1992-09-25 | 1994-04-19 | Nippon Kayaku Co Ltd | スクリーン印刷インキ組成物 |
JPH11246612A (ja) | 1998-03-03 | 1999-09-14 | Teikoku Ink Seizo Kk | 紫外線硬化性液状組成物及びこれを用いた製品 |
KR20010042211A (ko) * | 1998-03-27 | 2001-05-25 | 윌리암 로엘프 드 보에르 | 디지털 다기능 디스크용 방사선 경화성 접착제 |
JP2004115757A (ja) * | 2002-09-30 | 2004-04-15 | Jsr Corp | 液状硬化性樹脂組成物 |
JP4098597B2 (ja) | 2002-10-22 | 2008-06-11 | 株式会社巴川製紙所 | 半導体ウエハ加工用粘着シートおよびそれを用いた半導体ウエハの加工方法 |
JP4538189B2 (ja) * | 2002-12-27 | 2010-09-08 | 株式会社イーテック | 再剥離性粘着加工紙用組成物および再剥離性粘着加工紙 |
JP4184143B2 (ja) | 2003-04-28 | 2008-11-19 | ザ・インクテック株式会社 | 紫外線硬化型粘着剤組成物 |
JP5068793B2 (ja) * | 2009-09-24 | 2012-11-07 | リンテック株式会社 | 粘着シート |
KR101442442B1 (ko) * | 2010-10-01 | 2014-09-22 | 쇼와 덴코 가부시키가이샤 | 광 경화성 투명 점착 시트용 조성물 |
-
2012
- 2012-04-05 JP JP2012086811A patent/JP5989381B2/ja not_active Expired - Fee Related
-
2013
- 2013-04-05 WO PCT/US2013/035357 patent/WO2013152251A1/en active Application Filing
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