JP2013201248A - Substrate housing container and foreign object removal method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology which removes foreign objects from a peripheral part of a substrate without needing discharge of a liquid while inhibiting the increase of the manufacturing costs and the processing time.SOLUTION: A substrate housing container includes: a container body part 10 having a carry in/out port; and a lid part closing the carry in/out port. The container body part 10 includes: a holding part 30 having holding surfaces 311 to 313 holding a peripheral part 90 of a substrate 9; and a first adhesive material 33 covering the holding surfaces 311 to 313. When the substrate 9 is housed, the first adhesive material 33 contacts with the peripheral part 90 of the substrate 9 in the substrate housing container. At that time, foreign objects of the peripheral part 90 of the substrate 9 adheres to the first adhesive material 33. This structure removes foreign objects from the peripheral part 90 of the substrate 9 without needing discharge of a liquid while inhibiting the increase of the manufacturing costs and the processing time.

Description

  The present invention relates to a substrate storage container for storing a substrate and a foreign matter removal method for removing foreign matter from a peripheral portion of the substrate.

  In the manufacturing process of a substrate for precision electronic components such as a semiconductor wafer, foreign matter adhering to the peripheral portion of the substrate may be a problem. For example, if a foreign substance adhering to the peripheral edge of the substrate is transferred to the device surface of the substrate in the course of processing, it may cause a product defect. For this reason, in the manufacturing process of a board | substrate, the process which removes a foreign material from the peripheral part of a board | substrate is performed. For example, Patent Documents 1 and 2 disclose conventional techniques for removing foreign substances from the peripheral edge of a substrate.

JP 2002-164420 A JP 2006-128153 A

  As a method for removing foreign substances from the peripheral portion of the substrate, for example, a method of cleaning the peripheral portion of the substrate by discharging pure water to the rotating substrate and bringing a brush into contact with the peripheral portion of the substrate is known. However, in recent years, a material that dislikes pure water, such as a low-k material or Ge, may be used as the material of the substrate. In the case of using the material, it is difficult to employ cleaning with discharging pure water. In addition, when a liquid is discharged to the substrate, there is a possibility that a fine structure on the substrate is destroyed by the surface tension of the liquid.

  On the other hand, as a method that does not require liquid discharge, Patent Document 1 discloses that a sticky roller is brought into contact with the circumferential portion of the semiconductor wafer by contacting the circumferential portion of the semiconductor wafer and rotating the roller. Describes a method of removing damaged particles (paragraph 0022). Patent Document 2 describes a method in which an adhesive rubber roll is brought into contact with the end surface of the printed circuit board to adsorb dust adhering to the end surface of the printed circuit board (paragraph 0020).

  However, the methods of Patent Documents 1 and 2 require a driving mechanism and electric power for rotating the roller or the adhesive rubber roll. This greatly increases the manufacturing cost of the substrate. In the methods of Patent Documents 1 and 2, in order to remove foreign substances from the peripheral edge of the substrate, it is necessary to secure a processing time separately from other processes.

  The present invention has been made in view of such circumstances, and provides a technique capable of removing foreign substances from the peripheral portion of a substrate without requiring liquid discharge and suppressing an increase in manufacturing cost and processing time. For the purpose.

  In order to solve the above-mentioned problem, a first invention of the present application is a substrate storage container for storing a substrate, comprising: a container body having a loading / unloading port; and a lid for closing the loading / unloading port; The holding portion having a holding surface for holding the peripheral portion of the substrate, and a first adhesive material that covers the holding surface, and when the substrate is accommodated, the first adhesive material is placed on the peripheral portion of the substrate. Contact.

  The second invention of the present application is the substrate container of the first invention, wherein the holding surface is a pair of a holding surface facing a central holding surface facing the outer end surface of the substrate and an inclined surface adjacent to the outer end surface of the substrate. The first pressure-sensitive adhesive material covers the central holding surface and the pair of inclined holding surfaces.

  A third invention of the present application is the substrate container of the first invention or the second invention, wherein the first adhesive material is detachable from the holding surface.

  A fourth invention of the present application is the substrate container according to any one of the first invention to the third invention, wherein the holding portion is formed of an elastic material.

  A fifth invention of the present application is any one of the substrate containers according to the first invention to the fourth invention, wherein the lid portion has a pressing portion that presses the substrate toward the holding portion.

  6th invention of this application is a board | substrate storage container of 5th invention, Comprising: The said press part has the press surface which presses the peripheral part of a board | substrate, and the 2nd adhesive material which coat | covers the said press surface, When the substrate is accommodated, the second adhesive material contacts the peripheral edge of the substrate.

  7th invention of this application is a board | substrate storage container of 6th invention, Comprising: The adhesive force of a said 1st adhesive material is stronger than the adhesive force of a said 2nd adhesive material.

  The eighth invention of the present application is the substrate storage container of the sixth invention or the seventh invention, wherein the container main body portion further includes a stopper portion interposed between the substrate and the lid portion.

  A ninth invention of the present application is the substrate container according to the fifth invention, wherein the pressing portion has a pressing surface that presses a peripheral edge of the substrate, and a non-adhesive material is exposed on the pressing surface. Yes.

  A tenth invention of the present application is any one of the substrate storage containers according to the first to ninth inventions, wherein the container main body has a plurality of holding surfaces arranged in multiple stages in the vertical direction, The holding surface holds the peripheral portions of a plurality of substrates accommodated in multiple stages in the vertical direction.

  An eleventh invention of the present application is a foreign matter removing method for removing foreign matter from a peripheral portion of a substrate, wherein a) the substrate is carried into the substrate storage container, and the adhesive material provided in the substrate storage container and the peripheral edge of the substrate And b) a step of separating the adhesive material and the peripheral edge of the substrate and carrying the substrate out of the substrate container.

  According to the first to tenth aspects of the present application, the foreign matter on the peripheral edge of the substrate adheres to the first adhesive material inside the substrate container. As a result, foreign matter can be removed from the peripheral edge of the substrate without requiring liquid discharge and suppressing an increase in manufacturing cost and processing time.

  In particular, according to the second invention of the present application, foreign matter can be removed on both the outer end surface of the substrate and the pair of inclined surfaces.

  In particular, according to the third invention of the present application, the foreign substance removal performance can be maintained by replacing the adhesive material.

  In particular, according to the fourth invention of the present application, the first adhesive material can be easily adhered to the peripheral edge portion of the substrate. Therefore, the foreign matter removal rate is improved.

  In particular, according to the fifth invention of the present application, the peripheral edge portion of the substrate is more closely attached to the first adhesive material. Therefore, the foreign matter removal rate is improved.

  In particular, according to the sixth invention of the present application, foreign matters can be removed in a wider region of the peripheral edge of the substrate.

  In particular, according to the seventh invention of the present application, when the lid portion is opened, it is possible to suppress the substrate from jumping out of the container main body portion with the movement of the pressing portion.

  In particular, according to the eighth invention of the present application, when the lid portion is opened, it is possible to suppress the substrate from jumping out of the container main body portion with the movement of the pressing portion.

  In particular, according to the ninth invention of the present application, when the lid portion is opened, it is possible to suppress the substrate from jumping out of the container main body portion with the movement of the pressing portion.

  In particular, according to the tenth aspect of the present invention, foreign substances can be removed from the peripheral portions of the plurality of substrates inside the substrate container.

  According to the eleventh aspect of the present invention, the foreign matter on the peripheral edge of the substrate adheres to the adhesive material inside the substrate container. As a result, foreign matter can be removed from the peripheral edge of the substrate without requiring liquid discharge and suppressing an increase in manufacturing cost and processing time.

It is a perspective view of a substrate storage container. It is a cross-sectional view of a substrate storage container. It is a longitudinal cross-sectional view of a substrate storage container. It is a fragmentary longitudinal cross-sectional view of a substrate storage container. It is a fragmentary longitudinal cross-sectional view of a substrate storage container. It is a flowchart which shows the flow of the foreign material removal process using a board | substrate storage container. It is a cross-sectional view of a substrate container according to a modification.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

<1. Overall configuration of substrate container>
FIG. 1 is a perspective view of a substrate container 1 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the substrate container 1. FIG. 3 is a longitudinal sectional view of the substrate container 1 as viewed from the position of III-III in FIG. The substrate storage container 1 is a container for storing a plurality of semiconductor wafers 9 in order to transport or store the semiconductor wafer 9 which is a substantially disk-shaped substrate in a semiconductor manufacturing process. As shown in FIGS. 1 to 3, the substrate container 1 includes a container main body 10 and a lid 20. For example, a resin such as polycarbonate is used as the material of the container body 10 and the lid 20. However, a material such as glass or metal may be used in place of the resin.

  The container main body 10 is a housing having a loading / unloading port 11 for loading and unloading the semiconductor wafer 9. The container body 10 includes a top plate 12, a bottom plate 13, a back wall 14, and a pair of side walls 15. A plurality of semiconductor wafers 9 are carried in via the loading / unloading port 11, and are formed below the top plate portion 12, above the bottom plate portion 13, before the back wall portion 14, and between the pair of side wall portions 15. The internal space 16 is accommodated.

  Further, the container body 10 has a pair of holding parts 30. Each holding portion 30 is made of, for example, resin, and is fixed to an inner surface of the back wall portion 14 that extends in a semicylindrical shape. As shown in FIG. 3, each holding portion 30 is provided with first grooves 31 that hold the peripheral edge portion 90 of the semiconductor wafer 9 in multiple stages in the vertical direction. Each first groove 31 extends in an arc shape in the horizontal direction.

  Note that the semiconductor wafer 9 is carried into and out of the container body 10 by a robot arm. As shown in FIG. 2, a gap 32 is secured between the pair of holding parts 30 for the tip part of the robot arm to enter.

  The lid 20 is a substantially plate-like member that closes the loading / unloading port 11 of the container body 10. A drive mechanism 21 conceptually shown in FIG. 3 is connected to the lid 20. The drive mechanism 21 is realized, for example, by combining a drive source such as a motor or shear cylinder with a power transmission mechanism such as a gear or an arm. When the drive mechanism 21 is operated, the lid 20 has a closed position (a position indicated by a solid line in FIG. 3) that closes the loading / unloading port 11 of the container main body 10, and a standby position below the container main body 10 ( The position moves between the two-dot chain lines in FIG. When the lid 20 is disposed at the standby position, the loading / unloading port 11 of the container body 10 is opened, and the semiconductor wafer 9 can be loaded and unloaded.

  The lid 20 has a pressing part 40. The pressing portion 40 is made of, for example, resin, and is fixed to the surface of the lid portion 20 on the inner space 16 side. As shown in FIG. 2, the pressing portion 40 extends in a substantially arc shape when viewed from above. As shown in FIG. 3, the pressing portion 40 is provided with second grooves 41 that hold the peripheral edge of the semiconductor wafer 9 in multiple stages in the vertical direction. Each second groove 41 extends in an arc shape in the horizontal direction.

  When the semiconductor wafer 9 is accommodated, the peripheral edge 90 of each semiconductor wafer 9 is fitted into the pair of first grooves 31 and second grooves 41. Thereby, each semiconductor wafer 9 is held horizontally. In addition, the plurality of first grooves 31 and the plurality of second grooves 41 are arranged at equal intervals in the vertical direction. For this reason, a plurality of semiconductor wafers 9 are arranged at equal intervals in the vertical direction inside the substrate container 1.

  Further, when the lid portion 20 is disposed at the closed position, the pressing portion 40 presses the semiconductor wafer 9 toward the back wall portion 14 side while being bent by contact with the semiconductor wafer 9. As a result, the semiconductor wafer 9 is sandwiched between the pair of holding portions 30 and the pressing portion 40 with an elastic force. As a result, the vibration of the semiconductor wafer 9 is absorbed, and cracks and chips of the semiconductor wafer 9 inside the substrate container 1 are suppressed.

  Note that the radius of curvature of the surface of the pressing portion 40 on the side of the semiconductor wafer 9 in the natural state (in a state where it is not in contact with the semiconductor wafer 9) in order for the pressing portion 40 to exert an elastic force due to bending is the peripheral edge of the semiconductor wafer 9. It is preferable that the radius of curvature of the portion 90 is set slightly smaller.

<2. About adhesive material>
4 and 5 are partial longitudinal sectional views of the substrate container 1. As shown in FIGS. 4 and 5, the peripheral edge 90 of the semiconductor wafer 9 includes an outer end surface 91, and an upper inclined surface 92 and a lower inclined surface 93 adjacent to the outer end surface 91. The outer end surface 91 extends in an annular shape at the outermost peripheral portion of the semiconductor wafer 9. The upper inclined surface 92 expands in a tapered shape so that the diameter decreases as it goes upward from the upper end of the outer end surface 91. The lower inclined surface 93 expands in a tapered shape so that the diameter decreases from the lower end portion of the outer end surface 91 downward.

  As shown in FIG. 4, the surface of the first groove 31 of the holding unit 30 includes a central holding surface 311, and an upper inclined holding surface 312 and a lower inclined holding surface 313 adjacent to the central holding surface 311. Yes. The central holding surface 311 extends in a substantially arc shape between the upper inclined holding surface 312 and the lower inclined holding surface 313. The upper inclined holding surface 312 extends obliquely so that the diameter decreases from the upper end of the central holding surface 311 upward. The lower inclined holding surface 313 extends obliquely so that the diameter decreases from the lower end of the central holding surface 311 toward the lower side.

  When the semiconductor wafer 9 is accommodated, the central holding surface 311, the upper inclined holding surface 312, and the lower inclined holding surface 313 face the outer end surface 91, the upper inclined surface 92, and the lower inclined surface 93 of the semiconductor wafer 9, respectively.

  Further, the central holding surface 311, the upper inclined holding surface 312, and the lower inclined holding surface 313 of the holding unit 30 are covered with the first adhesive material 33. When the semiconductor wafer 9 is accommodated, the first adhesive material 33 contacts the outer end surface 91, the upper inclined surface 92, and the lower inclined surface 93 of the semiconductor wafer 9. As a result, foreign matter on the peripheral edge 90 of the semiconductor wafer 9 adheres to the first adhesive material 33. Further, when the semiconductor wafer 9 is unloaded from the substrate container 1, the foreign matter is peeled off from the peripheral edge 90 of the semiconductor wafer 9 and remains on the first adhesive material 33 side. As a result, foreign matter is removed from the peripheral edge 90 of the semiconductor wafer 9.

  As described above, the substrate container 1 has a function of removing foreign substances from the peripheral edge 90 of the semiconductor wafer 9 in the process of housing and unloading the semiconductor wafer 9. For this reason, the peripheral part 90 of the semiconductor wafer 9 can be cleaned without preparing a separate cleaning process or cleaning apparatus. Thereby, the increase in the manufacturing cost and processing time of a semiconductor can be suppressed. Further, it is not necessary to discharge a liquid such as pure water to the semiconductor wafer 9 in order to remove foreign matters from the peripheral edge 90 of the semiconductor wafer 9.

  In particular, in the present embodiment, not only the central holding surface 311 of the holding unit 30 but also the upper inclined holding surface 312 and the lower inclined holding surface 313 are covered with the first adhesive material 33. For this reason, not only the foreign material adhering to the outer end surface 91 but also the foreign material adhering to the upper inclined surface 92 and the lower inclined surface 93 in the peripheral edge 90 of the semiconductor wafer 9 can be removed. Moreover, the holding | maintenance part 30 of this embodiment is formed with the material which has elasticity. For this reason, the holding part 30 bends due to the contact with the semiconductor wafer 9, whereby the peripheral edge 90 of the semiconductor wafer 9 and the first adhesive material 33 are brought into close contact with each other. Therefore, the foreign matter is removed more favorably from the peripheral edge 90 of the semiconductor wafer 9.

  Further, in the present embodiment, as shown in FIG. 2, the ends of the pair of holding portions 30 opposite to the gaps 32 are positioned at 90 degrees with respect to the transport direction of the semiconductor wafer 9 (the back wall portion 14 and the side wall). To the boundary part 15). That is, the holding portion 30 extends over the entire left and right regions of the inner side surface of the back wall portion 14 excluding the portion facing the gap 32. Thereby, the area | region which installs the 1st adhesive material 33 is expanded. As a result, a wide contact area between the peripheral edge 90 of the semiconductor wafer 9 and the first adhesive material 33 is ensured.

  In the present embodiment, when the semiconductor wafer 9 is accommodated, the pressing portion 40 presses the semiconductor wafer 9 toward the back wall portion 14. Accordingly, the peripheral edge 90 of the semiconductor wafer 9 is more closely attached to the first adhesive material 33. As a result, the foreign matter removal rate is further improved.

  As shown in FIG. 5, the surface of the second groove 41 of the pressing portion 40 includes a central pressing surface 411, and an upper inclined pressing surface 412 and a lower inclined pressing surface 413 adjacent to the central pressing surface 411. The central pressing surface 411 extends in a substantially arc shape between the upper inclined pressing surface 412 and the lower inclined pressing surface 413. The upper inclined pressing surface 412 spreads obliquely so that the diameter decreases from the upper end of the central pressing surface 411 upward. The lower inclined pressing surface 413 extends obliquely so that the diameter decreases from the lower end of the central pressing surface 411 downward.

  When the semiconductor wafer 9 is accommodated, the central pressing surface 411, the upper inclined pressing surface 412, and the lower inclined pressing surface 413 press the outer end surface 91, the upper inclined surface 92, and the lower inclined surface 93 of the semiconductor wafer 9, respectively.

  The central pressing surface 411, the upper inclined pressing surface 412, and the lower inclined pressing surface 413 of the pressing unit 40 are covered with the second adhesive material 42. When the semiconductor wafer 9 is accommodated, the second adhesive material 42 contacts the outer end surface 91, the upper inclined surface 92, and the lower inclined surface 93 of the semiconductor wafer 9. As a result, foreign matter on the peripheral edge 90 of the semiconductor wafer 9 adheres to the second adhesive material 42. Further, when the lid 20 is opened and the pressing portion 40 is pulled away from the semiconductor wafer 9, the foreign matter is peeled off from the peripheral portion 90 of the semiconductor wafer 9 and remains on the second adhesive material 42 side. As a result, foreign matter is removed from the peripheral edge 90 of the semiconductor wafer 9.

  In particular, in the present embodiment, not only the central pressing surface 411 of the pressing portion 40 but also the upper inclined pressing surface 412 and the lower inclined pressing surface 413 are covered with the second adhesive material 42. For this reason, not only the foreign material adhering to the outer end surface 91 but also the foreign material adhering to the upper inclined surface 92 and the lower inclined surface 93 in the peripheral edge 90 of the semiconductor wafer 9 can be removed. Moreover, the press part 40 of this embodiment is formed with the material which has elasticity. For this reason, the pressing portion 40 is bent by the contact with the semiconductor wafer 9, and thereby the peripheral edge portion 90 of the semiconductor wafer 9 and the second adhesive material 42 are in close contact with each other. Therefore, the foreign matter is removed more favorably from the peripheral edge 90 of the semiconductor wafer 9.

  Thus, in the substrate storage container 1 of the present embodiment, the adhesive material is provided on both the holding part 30 of the container main body part 10 and the pressing part 40 of the lid part 20. For this reason, foreign substances are removed from a wider area of the peripheral edge 90 of the semiconductor wafer 9.

   As the first adhesive material 33 and the second adhesive material 42, for example, a known adhesive material mainly composed of silicone rubber, natural rubber, acrylic polymer, urethane resin, or the like can be used. Further, the first adhesive material 33 and the second adhesive material 42 may be, for example, a paste-like material applied, and a double-sided tape in which an adhesive layer is formed on both surfaces of a sheet-like film. Also good.

  However, if the adhesive force of the second adhesive material 42 is too strong, the semiconductor wafer 9 may jump out of the container body 10 with the movement of the pressing portion 40 when the lid portion 20 is opened. Considering this point, it is preferable to use a material having a stronger adhesive force than the second adhesive material 42 for the first adhesive material 33. Then, the second adhesive material 42 can be separated from the semiconductor wafer 9 before the first adhesive material 33. Therefore, the semiconductor wafer 9 can be prevented from jumping out.

  Moreover, it is preferable that the 1st adhesive material 33 is removable with respect to the holding | maintenance part 30, and the 2nd adhesive material 42 with respect to the press part 40, respectively. If the first adhesive material 33 and the second adhesive material 42 are detachable, the first adhesive material 33 and the second adhesive material 42 after use are removed and a new first adhesive material 33 and a second adhesive material 42 are attached. Can do. Thereby, the foreign substance removal performance can be maintained.

  Note that if the holding unit 30 itself or the pressing unit 40 itself is formed of an adhesive material, it is difficult to achieve both the rigidity of the holding unit 30 and the pressing unit 40 and the adhesive force. In the present embodiment, as the material of the holding unit 30 itself and the pressing unit 40 itself, a resin having no adhesive force with an emphasis on rigidity is used, and the surface of the resin is covered with an adhesive material. Thereby, the rigidity of the holding | maintenance part 30 and the press part 40 and the high foreign material removal performance are reconciled.

<3. Foreign matter removal process>
Next, the flow of foreign matter removal processing using the substrate container 1 will be described with reference to the flowchart of FIG.

  When removing foreign substances using the substrate container 1, first, the semiconductor wafer 9 is carried into the substrate container 1 (step S1). Specifically, first, the drive mechanism 21 is operated to move the lid 20 of the substrate container 1 to the standby position. Thereby, the loading / unloading port 11 of the container main body 10 is opened. Next, one or a plurality of semiconductor wafers 9 are horizontally loaded into the container body 10 via the loading / unloading port 11. When the semiconductor wafer 9 is carried into the container body 10, the peripheral edge 90 on the back wall portion 14 side of each semiconductor wafer 9 is held in the first groove 31 of the pair of holding portions 30, and the first adhesive material 33 is contacted. As a result, foreign matter on the peripheral edge 90 of the semiconductor wafer 9 adheres to the first adhesive material 33.

  Subsequently, the drive mechanism 21 is operated to move the lid portion 20 of the substrate container 1 to the closed position again. Thereby, the loading / unloading port 11 of the container main-body part 10 is closed. When the loading / unloading port 11 is closed, the peripheral edge 90 on the loading / unloading port 11 side of each semiconductor wafer 9 is held in the second groove 41 of the pressing unit 40 and comes into contact with the second adhesive material 42. As a result, foreign matter on the peripheral edge 90 of the semiconductor wafer 9 adheres to the second adhesive material 42.

  Subsequently, the substrate container 1 containing the semiconductor wafer 9 is transported or stored (step S2). Here, for example, the substrate container 1 is transported from one apparatus to another along a rail provided on the ceiling of the clean room. Further, the substrate container 1 is transported to the stocker device as necessary, and stored in the stocker device until preparation for the next process is completed.

  Thereafter, the semiconductor wafer 9 is unloaded from the substrate container 1 (step S3). Specifically, first, the drive mechanism 21 is operated to move the lid 20 of the substrate container 1 to the standby position. Thereby, the loading / unloading port 11 of the container main body 10 is opened. At this time, the peripheral edge 90 of the semiconductor wafer 9 on the loading / unloading port 11 side is pulled away from the second adhesive material 42. If it does so, a foreign material will peel from the said peripheral part 90 of the semiconductor wafer 9, and it will remain in the 2nd adhesive material 42 side. As a result, foreign matter is removed from the peripheral edge 90 of the semiconductor wafer 9.

  Next, the semiconductor wafer 9 is unloaded from the container body 10 using the robot arm. The semiconductor wafer 9 is pulled out horizontally from the inside of the container main body 10 via the loading / unloading port 11. At this time, the peripheral edge portion 90 on the back wall portion 14 side of the semiconductor wafer 9 is pulled away from the first adhesive material 33. If it does so, a foreign material will peel from the said peripheral part 90 of the semiconductor wafer 9, and it will remain in the 1st adhesive material 33 side. As a result, foreign matter is removed from the peripheral edge 90 of the semiconductor wafer 9.

  In the semiconductor manufacturing process, various processes are performed on the semiconductor wafer 9 in a plurality of apparatuses. Accordingly, the semiconductor wafer 9 is repeatedly carried into and out of the substrate container 1. That is, the operations in steps S1 to S3 are repeated. Further, in the processing of the semiconductor wafer 9, the rotation direction of the semiconductor wafer 9 accommodated in the substrate container 1 is not constant unless special control is performed. For this reason, every time it is accommodated in the substrate container 1, different portions of the semiconductor wafer 9 come into contact with the first adhesive material 33 and the second adhesive material 42. Therefore, by repeating the processes in steps S1 to S3, finally, foreign matters are removed from the entire circumference of the peripheral edge 90 of the semiconductor wafer 9.

<4. Modification>
Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment.

  FIG. 7 is a cross-sectional view of a substrate container 1A according to a modification. In the example of FIG. 7, the container main body 10A has a stopper 50A interposed between the semiconductor wafer 9A and the lid 20A. In this way, when the lid 20A is opened, the semiconductor wafer 9A can be prevented from jumping out of the container body 10A along with the movement of the pressing portion 40A. For this reason, it becomes possible to set the adhesive force of the second adhesive material to be equal to or higher than the adhesive force of the first adhesive material. Therefore, the removal rate of foreign matters by the second adhesive material can be increased. When the semiconductor wafer 9A is carried out by the robot arm, the stopper portion 50 may be avoided by lifting the semiconductor wafer 9 and then pulling it out.

  Moreover, in said embodiment, although the 2nd adhesive material was provided in the press part, the press part does not need to have a 2nd adhesive material. That is, the non-adhesive material may be exposed on the central pressing surface, the upper inclined pressing surface, and the lower inclined pressing surface of the pressing portion. If it does in that way, when opening a cover part, it can prevent that a semiconductor wafer jumps out of a container main-body part with the movement of a press part.

  In the above embodiment, the semiconductor wafer is held by the first groove provided in the holding part and the second groove provided in the pressing part. However, the shape of the holding part and the pressing part is as described above. The shape may be different from that of the embodiment. For example, the periphery of the semiconductor wafer may be placed on a step-shaped holding surface provided in the holding unit. In the above embodiment, the plurality of semiconductor wafers are held by the columnar holding portions and pressing portions extending in the vertical direction. However, the holding portions and the pressing portions are individually provided for each semiconductor wafer. Also good.

  Further, in the above embodiment, the semiconductor wafer is targeted, but the substrate container and the foreign matter removing method of the present invention are a glass substrate for a liquid crystal display device, a glass substrate for a PDP, a substrate for a photomask, a substrate for a color filter, Other precision electronic component substrates such as a recording disk substrate and a solar cell substrate may be targeted. However, if a board | substrate is disk shape, whenever it accommodates a board | substrate in a board | substrate storage container, the part made to contact an adhesive material among the peripheral parts of a board | substrate can be shifted by arbitrary angles. Therefore, the present invention is particularly useful when targeting a disk-shaped substrate.

  Further, in the above embodiment, a plurality of semiconductor wafers are horizontally accommodated in the substrate container. However, the substrate container of the present invention may be one that vertically accommodates the substrate. It may contain only a single substrate.

  Further, the detailed shape of the substrate container may be different from the shape shown in each drawing of the present application. Moreover, you may combine suitably each element which appeared in said embodiment and modification in the range which does not produce inconsistency.

DESCRIPTION OF SYMBOLS 1 Substrate accommodating container 9 Semiconductor wafer 10 Container main body part 11 Loading / unloading port 12 Top plate part 13 Bottom plate part 14 Back wall part 15 Side wall part 16 Internal space 20 Lid part 21 Drive mechanism 30 Holding part 31 1st groove | channel 32 Cavity 33 1st adhesion Material 40 Pressing portion 41 Second groove 42 Second adhesive material 90 Peripheral portion 91 Outer end surface 92 Upper inclined surface 93 Lower inclined surface 311 Central holding surface 312 Upper inclined holding surface 313 Lower inclined holding surface 411 Central pressing surface 412 Upper inclined pressing surface 413 Lower inclined pressing surface

Claims (11)

A substrate storage container for storing a substrate,
A container body having a loading / unloading port;
A lid for closing the loading / unloading port;
With
The container body is
A holding part having a holding surface for holding the peripheral part of the substrate;
A first adhesive covering the holding surface;
Have
A substrate storage container in which the first adhesive material contacts the peripheral edge of the substrate when the substrate is stored. The substrate storage container according to claim 1,
The holding surface is
A central holding surface facing the outer end surface of the substrate;
A pair of inclined holding surfaces facing an inclined surface adjacent to the outer end surface of the substrate;
Including
The substrate container in which the first adhesive material covers the central holding surface and the pair of inclined holding surfaces. The substrate storage container according to claim 1 or 2,
A substrate container in which the first adhesive material is detachable from the holding surface. A substrate storage container according to any one of claims 1 to 3,
A substrate container in which the holding portion is formed of a material having elasticity. A substrate storage container according to any one of claims 1 to 4,
A substrate storage container in which the lid portion has a pressing portion that presses the substrate toward the holding portion. The substrate storage container according to claim 5,
The pressing portion is
A pressing surface for pressing the peripheral edge of the substrate;
A second adhesive material covering the pressing surface;
Have
A substrate storage container in which the second adhesive material contacts the peripheral edge of the substrate when the substrate is stored. The substrate storage container according to claim 6,
A substrate container in which the adhesive force of the first adhesive material is stronger than the adhesive force of the second adhesive material. The substrate storage container according to claim 6 or 7,
The substrate container, wherein the container main body portion further includes a stopper portion interposed between the substrate and the lid portion. The substrate storage container according to claim 5,
The pressing portion has a pressing surface that presses the peripheral edge of the substrate,
A substrate container in which a non-adhesive material is exposed on the pressing surface. A substrate storage container according to any one of claims 1 to 9,
The container main body has a plurality of the holding surfaces arranged in multiple stages up and down,
A substrate storage container in which the plurality of holding surfaces respectively hold the peripheral portions of a plurality of substrates that are stored in multiple stages in the vertical direction. A foreign matter removing method for removing foreign matter from a peripheral edge of a substrate,
a) carrying the substrate into the substrate container and bringing the adhesive material provided in the substrate container into contact with the peripheral edge of the substrate;
b) separating the adhesive material and the peripheral edge of the substrate, and unloading the substrate from the substrate container;
Foreign matter removal method including

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