JP2013191709A - Method of manufacturing three-dimensional circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional circuit board in which occurrence of a gap in a joint due to bonding of a film-like circuit board to a substrate is eliminated, not by bonding the film-like circuit board to the substrate but by forming the wiring directly on the surface of the substrate.SOLUTION: The method of manufacturing the three-dimensional circuit board in which the wiring is formed on the peripheral surface of a cylindrical or columnar substrate 10, includes a step for preparing a film-like circuit board 50 in which a metal film 40 is formed on one surface of an insulating film 30, a step for preparing the substrate 10 in which an adhesive layer 20 is formed on the peripheral surface, and a step for forming the wiring by compression bonding the surface of the film-like circuit board 50, on which the metal film 40 is formed, to the peripheral surface of the substrate 10, thereby transferring the metal film 40 to the peripheral surface of the substrate 10.

Description

  The present invention relates to a method for manufacturing a three-dimensional circuit board, and more particularly, to a method for manufacturing a three-dimensional circuit board in which wiring is formed on a peripheral surface of a substrate having a cylindrical shape or a columnar shape.

  In recent years, along with the downsizing, multifunctionalization, and cost reduction of electronic devices such as mobile phones, it has been required to mount circuit boards in a compact manner on the inner and outer surfaces of the substrate. For this reason, not a planar circuit board but a three-dimensional one may be required. Also, in the field of copying machines, it is proposed that a circuit board be formed over the entire circumference of the surface of a cylindrical or cylindrical substrate made of metal or resin such as a developing roller to produce a three-dimensional circuit board. (For example, refer to Patent Document 1).

  As a means for forming a circuit board around the entire surface of such a base, a film-like circuit board in which electrode wiring is provided on the surface of an insulating film such as polyimide, polyethylene terephthalate (PET), or polyethylene naphthalate (PEN) is used as the base. There is a method of sticking to the outer periphery of the. Since such a film-like circuit board can be produced in a large amount and at a low cost, it is considered that the method of attaching the film-like circuit board to the substrate is easier than the method of directly forming the electrode wiring on the substrate. .

  By the way, as a method of laminating a film on a can body, a method of sticking a film to a cylindrical or cylindrical can body by a rotary cutter method has been proposed (for example, see Patent Document 2). In this method, a flexible film that cannot be held on its own is cut into a predetermined length with high accuracy, and the obtained film is supplied to the can body for lamination, whereby the film is attached to the can body. It is possible to attach.

  The sticking method by the rotary cutter method described in Patent Document 2 has been developed for the purpose of sticking a label on the surface of a beverage container such as a can or a bottle. For this reason, it is not necessary to strictly manage the positional accuracy of the label, and when a label is applied to the entire surface of the beverage container, it may cause a problem even if the film overlaps or a gap occurs at the end of the film. There is no.

  On the other hand, when a film-like circuit board for electronic equipment is attached to the entire surface of a columnar or cylindrical substrate, if there is an overlap or a large gap on the film-like circuit board, the wiring constituting the circuit This causes a serious problem because a short circuit or a conduction failure occurs, or toner enters the gaps and affects the electrical characteristics of the circuit. Therefore, it is required to attach the film-like circuit board so that it does not overlap and is small enough to allow the gap between the ends of the circuit board.

JP-A-6-59568 Japanese Patent Laid-Open No. 10-236446 JP 2009-267014 A

  However, in order to meet the above-mentioned requirements, even when the film-like circuit board is cut with high accuracy and pasted so that there is no overlap or large gap at the time of sticking, there is variation due to the cutting of the film-like circuit board, and Since there are variations in the finished diameter of the substrate itself, the present situation is that the occurrence of a gap exceeding the allowable range between the overlapping of the film-like circuit boards and the end portions cannot be prevented.

  In addition, for such a gap, if a resin can be applied for surface protection of the circuit board that is pasted and the gap can be embedded, it is effective in preventing short circuits and poor conduction, but currently, a resin for surface protection is applied. However, the step of the gap may not be completely filled, and the end of the film-like circuit board may be exposed. In order to solve this problem, a method has been proposed in which resin is filled in the gap portion of the generated joint (Patent Document 3).

  However, even if the gap is filled with resin, the resin has the property that the thin part is pulled to the thick part. In other words, there is a problem that the resin remains in the gap portion and the step is not solved.

  In view of this, the present invention does not generate a gap portion between joints formed by directly forming the wiring on the surface of the substrate and affixing the film circuit substrate to the substrate, instead of attaching the film circuit substrate to the substrate. An object of the present invention is to provide a method for manufacturing a three-dimensional circuit board.

In order to achieve the above object, a method for manufacturing a three-dimensional circuit board according to one aspect of the present invention is a method for manufacturing a three-dimensional circuit board in which wiring is formed on a peripheral surface of a base having a cylindrical shape or a columnar shape. ,
Preparing a film-like substrate in which a metal film is formed on one side of the insulating film;
Preparing the base having an adhesive layer formed on the peripheral surface;
Pressing the surface of the film substrate on which the metal film is formed on the peripheral surface of the base, and transferring the metal film to the peripheral surface of the base to form the wiring. Features.

The metal film is formed on substantially the entire surface of one side of the insulating film,
The wiring may be formed by transferring a part of the metal film using a pressing member having a convex portion having the same pattern as the wiring.

  In this case, the metal film preferably has a thickness of 1 μm or less.

Further, the metal film is formed in the same pattern as the wiring,
The wiring may be formed by transferring the metal film as it is.

  Here, the insulating film is preferably polyethylene terephthalate or polyethylene naphthalate.

  The adhesive layer is preferably composed of a thermosetting adhesive, and is preferably heated to exert pressure-sensitive adhesiveness when the metal film is pressure-bonded to the substrate.

  Furthermore, the adhesive layer is preferably formed by spray coating.

  The degree of transfer of the metal film to the substrate can be adjusted by changing the adhesion between the insulating film and the metal film.

  Here, the adhesiveness is preferably adjusted in a range of peel strength of 98 N / m to 361 N / m.

  ADVANTAGE OF THE INVENTION According to this invention, there is no level | step difference in a surrounding surface, and a flat three-dimensional circuit board can be provided over a perimeter.

It is the figure which showed an example of the manufacturing method of the three-dimensional circuit board which concerns on Embodiment 1 of this invention. It is the figure which showed an example of the three-dimensional circuit board manufactured by the manufacturing method of the three-dimensional circuit board which concerns on this embodiment. It is the figure which showed an example of the manufacturing method of the three-dimensional circuit board which concerns on Embodiment 2 of this invention. FIG. 3 is a diagram showing a wiring pattern formed on the peripheral surface of a three-dimensional circuit board in Example 1.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

Embodiment 1
FIG. 1 is a diagram showing an example of a manufacturing method of a three-dimensional circuit board according to Embodiment 1 of the present invention. As shown in FIG. 1, in the method for manufacturing a three-dimensional circuit board according to the first embodiment, a base body 10, an adhesive layer 20, a film-like substrate 50, and a convex pressing member 60 are used. The film-like substrate 50 has an insulating film 30 and a metal film 40.

  The substrate 10 is a circuit formation target medium having a cylindrical shape, a columnar shape, or a roller shape. A wiring is formed on the outer peripheral surface of the base 10 to form a three-dimensional circuit board. The base 10 may be composed of various materials such as metal and resin, but may be composed of, for example, an aluminum pipe.

  The adhesive layer 20 is a bonding means for adhering and fixing the wiring to the peripheral surface of the base 10, and is formed in almost the entire region on the outer peripheral surface of the base 10. The adhesive used for the adhesive layer 20 can be formed on the outer peripheral surface of the substrate 10 without unevenness, and various adhesives can be used as long as the wiring can be bonded and fixed. For example, a thermosetting adhesive is used. Is preferred. Thermosetting adhesives are solid at room temperature and do not have tackiness (adhesiveness), but exhibit tackiness (adhesiveness) when heated. Therefore, if a solid adhesive layer 20 is formed on the peripheral surface of the base 10 at room temperature and heated to function as an adhesive when wiring bonding is required, it can be applied to the surface of the base 10. The adhesive layer 20 to be handled can be easily handled.

  As the method for forming the adhesive layer 20, various methods for forming the adhesive layer 20 can be used as long as the adhesive layer 20 can be formed on the outer peripheral surface of the substrate 10 without any level difference and unevenness. You may make it apply | coat by spraying an agent. The application by spraying can be applied uniformly to the surface of the substrate 10 without a step, and thus can be suitably used in the method for manufacturing a three-dimensional circuit board according to the present embodiment.

  The adhesive layer 20 can be made of a pressure sensitive adhesive such as a double-sided tape as long as it can be uniformly formed without a step. When a double-sided tape is used, for example, a thermosetting adhesive film may be used and heated to exhibit tackiness. Thus, the adhesive layer 20 in the manufacturing method of the three-dimensional circuit board according to the present embodiment is not limited to the adhesive layer 20 in a narrow sense excluding the adhesive layer, and may also include an adhesive layer.

  The adhesive layer 20 may be composed of a thermosetting adhesive that cures in two stages of temporary curing and main curing. For example, an adhesive that temporarily cures at 150 to 160 [deg.] C. to exhibit tackiness and that is cured at 180 [deg.] C. may be used. In this case, when the wiring is transferred to the surface of the substrate 10, it is temporarily cured to exhibit tackiness, and after the transfer of the wiring is completed, the main curing is performed and the wiring is fixed, so that the wiring can be smoothly performed. Transcription can be performed. Note that such an adhesive layer 20 that cures in two stages is already commercially available for both adhesives formed by spraying and adhesive double-sided tapes formed by adhesive films, and both can be used. Therefore, the adhesive layer 20 that cures in two steps may be used depending on the application.

  The film substrate 50 is a base material for holding the metal film 40 for forming wiring on the surface of the base 10. The film-like substrate 50 is configured by forming a metal film 40 on the surface of one side of the insulating film 30.

  The insulating film 30 can be made of various materials as long as it is a film-like insulator, but is preferably made of a material that does not have a high degree of adhesion with the metal film 40. This is because the metal film 40 formed on one surface of the insulating film 30 is transferred onto the surface of the substrate 10 by pressure bonding in the manufacturing method of the three-dimensional circuit board according to the present embodiment. If the adhesiveness with the insulating film 30 is too high, the metal film 40 is not separated from the insulating film 30, and a situation in which transfer is not performed smoothly may occur. Therefore, the material of the insulating film 30 is selected so that the degree of adhesion with the metal film 40 is not so high. For example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or the like is used.

  Moreover, it is preferable that the adhesiveness of the insulating film 30 and the metal film 40 exists in the range of the peel strength 98N / m-361N / m, for example. With this degree of adhesion, the state in which the metal film 40 is formed on the insulating film 30 can be maintained until the pressure bonding is started, and the metal film 40 can be easily attached to the insulating film after the pressure bonding is started. The image can be transferred to the substrate 10 by being separated from 30. The above-mentioned polyethylene terephthalate and polyethylene naphthalate are materials that can satisfy the adhesion with the metal film 40 having the above-mentioned peel strength of 98 N / m or more and 361 N / m or less, and the manufacture of the three-dimensional circuit board according to this embodiment. It can utilize suitably for a method.

  Various materials can be used for the metal film 40 as long as it is a metal material used as a highly conductive wiring material. For example, a wiring material such as copper, aluminum, or silver can be used according to the application. .

  The metal film 40 is formed so as to cover substantially the entire one surface of the insulating film 30. In the manufacturing method of the three-dimensional circuit board according to the present embodiment, since the wiring pattern is formed using the convex pressing member 60, the metal film 40 is entirely formed at locations corresponding to the convex portions of the convex pressing member 60. Must exist. Therefore, the metal film 40 is formed so as to cover almost all regions on one side of the insulating film. In addition, formation of the metal film 40 may be performed by various methods, such as vapor deposition, sputtering, and electroless plating.

  The thickness of the metal film 40 may be determined according to the application, but is set to be 1 μm or less, for example. In the present embodiment, at the time of transfer, only the portion for forming the wiring is transferred to the base 10, so a part of the metal film 40 is cut and transferred to the base 10. If the metal film 40 is too thick, This is because the strength of the film 40 increases so that the cutting becomes difficult, and there is a possibility that proper transfer cannot be performed. Since the metal film 40 is not too thin and transfer is not difficult, the thickness of the metal film 40 may be greater than 0 μm and 40 μm or less.

  Since the metal film 40 is transferred to the base 10 by pressing the surface of the film-like board 50 on the side where the metal film 40 exists to the outer peripheral face of the base 10, the film-like circuit board 50 has the outer periphery of the base 10. It has a size and shape that covers the surface. Specifically, it is necessary that the lateral width is substantially the same as the width of the base 10 and the vertical length is longer than the circumferential length of the cylindrical portion or the columnar portion of the base 10.

  The convex pressing member 60 is a pressure-bonding means for pressure-bonding the film-like substrate 50 to the base 10, transferring the metal film 40 to the base 10, and forming a predetermined wiring pattern on the peripheral surface of the base 10. . An uneven shape corresponding to a predetermined wiring pattern is formed on the surface of the convex pressing member 60, the uneven convex portion 61 presses the film substrate 50 to the base 10, and the metal film 40 is attached to the peripheral surface of the base 10. Transcript to. That is, the convex pressing member 60 is formed with the same convex portion 61 as the wiring pattern formed on the outer peripheral surface of the base body 10, and the metal film 40 at the portion crimped to the convex portion 61 is transferred to the base body 10. Therefore, the portion that is not transferred is formed as a concave-convex concave portion 62. The convex pressing member 60 has a rectangular shape whose horizontal width (direction perpendicular to the paper surface) can cover the formation of the wiring having the horizontal width of the substrate 10 and whose vertical length can cover the circumferential length of the outer peripheral surface of the substrate 10. You may comprise in plate shape. The material of the convex pressing member 60 may be a mold used for general pressing or the like, or a material used for the pressing member.

  Next, a specific processing method of the manufacturing method of the three-dimensional circuit board according to Embodiment 1 using such components will be described with reference to FIG.

  First, a cylindrical or columnar substrate 10 having an adhesive layer 20 formed on the peripheral surface is prepared. At the same time, a film-like substrate 50 in which the metal film 40 is formed on the surface of the insulating film 30 is prepared, and the uneven surface of the convex pressing member 60 is arranged so that the surface on which the metal film 40 is formed is on the substrate 10 side. It arrange | positions so that it may be pinched | interposed between the outer peripheral surfaces of the base | substrate 10. As shown in FIG.

  Next, as shown in FIG. 1, the convex pressing member 60 is pressed (pressed) toward the substrate 10, and the film substrate 50 is pressed against the substrate 10. The convex part 61 of the convex pressing member 60 presses the insulating film 30, the metal film 40 under the pressed part is pressed against the adhesive layer 20, and the metal film 40 is transferred to the base 10 side. At that time, pressure bonding is performed in a state where the adhesive layer 20 is heated to a temperature having tackiness. Further, the base 10 is rotated and the convex pressing member 60 is advanced in the same direction as the rotation direction of the base 10 to transfer the metal film 40 to the entire outer periphery of the base 10.

  Further, after the transfer, heating for curing the adhesive layer 20 may be performed as necessary.

  In this way, a three-dimensional circuit board having a wiring formed on the peripheral surface is manufactured. The metal film 40 is directly transferred to the surface of the substrate 10 instead of attaching the film substrate on which the wiring is formed to the surface of the substrate 10, so that there is no step due to the gap between the film substrates, and the entire circumferential surface Wiring can be formed uniformly.

  FIG. 2 is a diagram illustrating an example of a three-dimensional circuit board manufactured by the method of manufacturing a three-dimensional circuit board according to the present embodiment. In FIG. 2, a uniform adhesive layer 20 without a step is formed on the outer peripheral surface of a cylindrical or columnar substrate 10, and a metal film 40 for forming a wiring 41 is pasted on the surface of the adhesive layer 20. It is attached. Thus, according to the manufacturing method of the three-dimensional circuit board concerning Embodiment 1, the three-dimensional circuit board without a level | step difference can be manufactured on a surrounding surface.

  The three-dimensional circuit board according to the present embodiment is often used for a developing roller of a printer. For example, when the three-dimensional circuit board is used for the developing roller, the wiring is a comb-shaped wiring extending in parallel to the axis. It is often a pattern or a wiring pattern of a slit like a pedestrian crossing. Therefore, the shape of the convex part 61 and the recessed part 62 of the convex pressing member 60 does not necessarily need to be a complicated pattern, and the convex pressing member 60 can be produced without a problem in terms of processing accuracy.

[Embodiment 2]
FIG. 3 is a diagram showing an example of a manufacturing method of a three-dimensional circuit board according to Embodiment 2 of the present invention. In FIG. 3, the same components as those used in the manufacturing method of the three-dimensional circuit board according to Embodiment 1 shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted. To do.

  In FIG. 3, the components used in the method for manufacturing a three-dimensional circuit board according to the second embodiment include a base 10, an adhesive layer 20, a film-like substrate 51, and a planar pressing member 63. The film substrate 51 includes an insulating film 30 and wirings 41.

  In FIG. 3, the substrate 10 and the adhesive layer 20 are the same as those in the first embodiment, but the configuration of the film-like substrate 51 is different from that in the first embodiment, and the convex pressing member 60 is replaced with the planar pressing member 63. This is different from the first embodiment.

  A metal film 42 is formed on one surface of the film-like substrate 51, and the metal film 42 already constitutes the wiring 43. In the first embodiment, the metal film 40 covering substantially the entire surface is formed on one surface of the film-like substrate 50. However, in the second embodiment, the metal film 42 is partially formed and the pattern is already formed. Wiring 43 is formed. Thus, the wiring 43 may already be formed on the film-like substrate 51, and the wiring 43 may be transferred to the surface of the substrate 10 as it is.

  The planar pressing member 63 is a means for pressing the film-like substrate 51 against the substrate 10 in order to crimp the wiring 43 to the substrate 10. The lower surface of the planar pressing member 63 is not formed with an uneven shape, and is a flat surface. This is because the wiring 43 has already been formed on the surface of the film-like substrate 51, and it is sufficient for the planar pressing member 63 to squeeze and transfer the wiring 43 to the substrate 10 as it is, which corresponds to the wiring pattern. This is because it is not necessary to form an uneven shape.

  As described above, the metal film 42 constituting the wiring 43 has already been formed on the surface of the insulating film 30, and the metal film 43 is directly pressure-bonded and transferred to the substrate 10 with the flat pressing member 63 having a flat surface. You may make it do. Even if such a process is used, a three-dimensional circuit board in which the wiring 43 is formed on the outer peripheral surface can be manufactured.

  In the method for manufacturing a three-dimensional circuit board according to the second embodiment, the width of the metal film 42 is not limited and may have a lateral width of 1 μm or more. This is because, in the method for manufacturing a three-dimensional circuit board according to the second embodiment, the metal film 42 is not cut at the time of pressure bonding, so that the transfer can be performed regardless of the strength of the metal film 42.

  In addition, since the material of the metal film 42, the material of the insulating film 30, etc. are the same as that of the manufacturing method of the three-dimensional circuit board concerning Embodiment 1, the description is abbreviate | omitted.

  The planar pressing member 63 can also be made of the same material as the convex pressing member 60 except that the surface is flat. However, in FIG. 3, the planar pressing member 63 having a shape in which the surface of the convex pressing member 60 of the first embodiment is flattened is described. However, the planar pressing member 63 includes the base 10 and the film substrate 51. It is sufficient that the contact area can be pressed, so that the length of the planar pressing member 63 can be further shortened, or a roller shape having a diameter that can cover the contact area can be formed.

  Further, since the various conditions other than the configuration and materials of the base 10 and the adhesive layer 20, the procedure of pressure bonding, and the lateral width of the metal film 42 are the same as those in the first embodiment, the description thereof is omitted.

  In the three-dimensional circuit board manufactured by the method for manufacturing a three-dimensional circuit board according to the second embodiment, the metal film 40 and the wiring 41 of the three-dimensional circuit board shown in FIG. Since it is the same as that of a thing, the description is abbreviate | omitted.

  According to the manufacturing method of the three-dimensional circuit board according to the second embodiment, the wiring 43 can be formed without a step on the surface of the base body 10 without using a pressing member having an uneven shape.

  Next, an example in which the manufacturing method of the three-dimensional circuit board according to the first and second embodiments is performed will be described.

[Example 1]
In Example 1, the manufacturing method of the three-dimensional circuit board which concerns on Embodiment 1 was implemented.

  First, a Cu film with a thickness of 0.8 μm was formed on the surface of 12 μm thick polyethylene naphthalate (PEN) (trade name Q51 manufactured by Teijin) by vapor deposition. When the adhesion at this time was measured, the peel strength was 211 N / m.

FIG. 4 is a diagram illustrating a pattern of the wiring 41 formed on the peripheral surface of the three-dimensional circuit board in the first embodiment. Using the pressing member having a wiring width of 500 μm, 250 μm, 100 μm, and 75 μm in the wiring pattern having the shape shown in FIG. 4, the pressing member is thermocompression bonded to the roll surface by the method shown in FIG. The Cu film was transferred under the conditions of 0 ° C. and a pressing force of 10 kg / cm ² .

  The roll was an aluminum pipe having a diameter of 16 mm and a length of 300 mm, and this was used as a base, and a test was conducted to transfer a Cu film onto the peripheral surface. An adhesive (trade name 8405 manufactured by Tessa Tape) was attached to the entire surface of the substrate, and transfer was performed by the method for manufacturing a three-dimensional circuit board according to FIG. At this time, it was confirmed how much the wiring was transferred.

  Table 1 shows the results of each example.

表１の上から２段目に、実施例１に係る立体的回路基板の製造方法の結果が示されている。密着性を示すピール強度は２１１Ｎ／ｍであり、転写された配線は、総ての配線幅において、縦又は横に形成した配線４１が完全に基体に転写できていることが確認された。

In the second row from the top of Table 1, the result of the manufacturing method of the three-dimensional circuit board according to Example 1 is shown. The peel strength indicating adhesion was 211 N / m, and it was confirmed that the wiring 41 formed in the vertical or horizontal direction was completely transferred to the substrate in all wiring widths.

[Example 2]
In Example 2, the manufacturing method of the three-dimensional circuit board according to Embodiment 1 was carried out by changing the conditions from Example 1.

  First, a Cu film having a thickness of 0.3 μm was formed on the surface of 25 μm thick polyethylene terephthalate (PET) (trade name S10 manufactured by Toray Industries, Inc.) by sputtering. After forming the Cu film, it was heated at a temperature of 120 ° C. for 15 minutes. When the adhesion at this time was measured, the peel strength was 98 N / m.

Next, using a pressing member having a wiring width of 500 μm, 250 μm, 100 μm, and 75 μm so that the wiring pattern having the shape shown in FIG. 4 is obtained, the pressing member is thermocompression bonded to the roll surface by the method shown in FIG. The Cu film was transferred under a condition of 120 ° C. and a pressing force of 10 kg / cm ² . The roll was tested by transferring a Cu film onto an aluminum pipe having a diameter of 16 mm and a length of 300 mm as a base. An adhesive (trade name 1571 manufactured by ThreeBond) layer was formed on the entire outer peripheral surface of the substrate so as to have a thickness of 50 μm by spray coating, and transferred by the method of FIG.

  Thereafter, in order to thicken the metal layer of the circuit, plating was performed to a Cu film thickness of 8 μm by copper sulfate plating (trade name Cubelite 21 manufactured by Sugawara Eugelite). At this time, it was confirmed how much the wiring was transferred.

  The results of Example 2 are shown in the first row of Table 1. As for the transferred wiring, it was confirmed that the wiring formed vertically or horizontally was completely transferred to the housing.

Example 3
In Example 3, the manufacturing method of the three-dimensional circuit board according to the first embodiment was performed under the same conditions as in Examples 1 and 2.

  A resin (product name: GA4100, manufactured by Jujo Chemical Co., Ltd.) was applied to the surface of 25 μm thick polyethylene terephthalate (PET) (product name: S10 manufactured by Toray Industries) to control or adjust the adhesion, and after drying, a Cu film was formed by sputtering Was formed with a thickness of 0.3 μm. The adhesion at this time was measured, and the peel strength was 361 N / m.

Next, using a pressing member having a wiring width of 500 μm, 250 μm, 100 μm, and 75 μm so that a wiring pattern having the shape shown in FIG. 4 is obtained, the pressing member is applied to the roll surface by the method shown in FIG. The Cu film was transferred by thermocompression bonding (temperature of 120 ° C. and pressing force of 10 kg / cm ² ). The roll was tested using an aluminum pipe with a diameter of 16 mm and a length of 300 mm as a substrate, and transferring a Cu film onto the substrate. An adhesive (trade name 1571, manufactured by ThreeBond Co., Ltd.) was formed on the entire outer peripheral surface of the substrate by spray coating so as to have a thickness of 50 μm, and transferred by the method shown in FIG. At this time, it was confirmed how much the wiring was transferred.

  The results of Example 3 are shown in the third row of Table 1. As for the transferred wiring of 100 μm or more, it was confirmed that the wiring formed vertically or horizontally could be completely transferred to the housing.

Example 4
After forming a Cu film with a thickness of 0.3 μm on the surface of polyethylene naphthalate (PEN) (trade name Q51, manufactured by Teijin) by a vapor deposition method, copper sulfate plating (trade name Cubelite 21, manufactured by Sugawara Eugleite) is used to form Cu. Plating was performed to a film thickness of 8 μm.

  Wirings were formed on the Cu film by a photoresist method using a dry film resist (AQ-1558 manufactured by Asahi Kasei) so that the wiring widths were 500 μm, 250 μm, 100 μm, and 75 μm.

Next, PEN is thermocompression-bonded to the peripheral surface of the roll (temperature 120 ° C., pressing force 10 kg / cm ²⁾ using a pressing member having a flat surface with no irregularities on the surface by the method shown in FIG. Then, the wiring formed on the PEN was transferred to a roll. For the roll, an aluminum pipe having a diameter of 16 mm and a length of 300 mm was used as a base, and a test was conducted in which the wiring of the Cu film was transferred to the base.

  An adhesive (trade name 1571 manufactured by ThreeBond) was formed on the entire outer peripheral surface of the substrate by spray coating so as to have a thickness of 50 μm, and transfer was performed by the method of FIG. At this time, it was confirmed how much the wiring was transferred.

  The results of Example 4 are shown in the fourth row of Table 1. As for the transferred wiring, it was confirmed that the wiring formed vertically or horizontally was completely transferred to the housing.

  As shown in Table 1, in all the manufacturing methods of the three-dimensional circuit boards according to Examples 1 to 4 in which the peel strength is in the range of 98 N / m to 361 N / m, the transfer is performed when the wiring width is 100 μm or more and 500 μm or less. Completely done and gave good results. Therefore, in the manufacturing method of the three-dimensional circuit board according to the present invention, the degree of adhesion is preferably adjusted within a range of peel strength of 98 N / m to 361 N / m.

  In Example 3 where the peel strength was 361 N / m, the transfer was not complete when the wiring width was 75 μm, but Examples 1 and 2 in which the peel strength was in the range of 98 N / m to 211 N / m. No. 4 and No. 4 were completely transferred even when the wiring width was 75 μm. Therefore, in the manufacturing method of the three-dimensional circuit board according to the present invention, the adhesion degree is more preferably adjusted within a range of peel strength of 98 N / m to 211 N / m.

  As described in the first embodiment, the lower the degree of adhesion between the insulating film and the metal film, the better. Therefore, it is preferably 361 N / m or less, and more preferably 211 N / m or less.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added.

  The present invention can be used for various electronic devices, for example, a developing roller used in a printer.

DESCRIPTION OF SYMBOLS 10 Substrate 20 Adhesive layer 30 Insulating film 40, 42 Metal film 41, 43 Wiring 50, 51 Film-like substrate 60 Convex pressing member 61 Convex part 62 Concave part 63 Flat pressing member

Claims (9)

A method of manufacturing a three-dimensional circuit board in which wiring is formed on a peripheral surface of a base body having a cylindrical shape or a columnar shape,
Preparing a film-like substrate in which a metal film is formed on one side of the insulating film;
Preparing the base having an adhesive layer formed on the peripheral surface;
Pressing the surface of the film substrate on which the metal film is formed on the peripheral surface of the base, and transferring the metal film to the peripheral surface of the base to form the wiring. A method for manufacturing a three-dimensional circuit board. The metal film is formed on substantially the entire surface of one side of the insulating film,
The three-dimensional circuit board according to claim 1, wherein the wiring is formed by transferring a part of the metal film using a pressing member having a convex portion having the same pattern as the wiring. Manufacturing method.   3. The method of manufacturing a three-dimensional circuit board according to claim 2, wherein the metal film has a thickness of 1 [mu] m or less. The metal film is formed in the same pattern as the wiring,
2. The method of manufacturing a three-dimensional circuit board according to claim 1, wherein the wiring is formed by transferring the metal film as it is.   The method for manufacturing a three-dimensional circuit board according to any one of claims 1 to 4, wherein the insulating film is polyethylene terephthalate or polyethylene naphthalate.   6. The adhesive layer according to claim 1, wherein the adhesive layer is composed of a thermosetting adhesive, and is heated to exhibit adhesiveness when the metal film is pressure-bonded to the substrate. A method for manufacturing a three-dimensional circuit board according to one item.   The method for manufacturing a three-dimensional circuit board according to any one of claims 1 to 6, wherein the adhesive layer is formed by spray coating.   The degree of transfer of the metal film to the substrate is adjusted by changing the adhesion between the insulating film and the metal film. Manufacturing method of three-dimensional circuit board.   The method for manufacturing a three-dimensional circuit board according to claim 8, wherein the adhesion is adjusted in a range of peel strength of 98 N / m to 361 N / m.

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