JP2013183164A - マイクロフォン - Google Patents
マイクロフォン Download PDFInfo
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- JP2013183164A JP2013183164A JP2012043381A JP2012043381A JP2013183164A JP 2013183164 A JP2013183164 A JP 2013183164A JP 2012043381 A JP2012043381 A JP 2012043381A JP 2012043381 A JP2012043381 A JP 2012043381A JP 2013183164 A JP2013183164 A JP 2013183164A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
- H04R1/245—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges of microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
- H04R2201/401—2D or 3D arrays of transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/03—Reduction of intrinsic noise in microphones
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Computer Hardware Design (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
【解決手段】パッケージ42内の底面には、板状のインターポーザ53が固定されている。インターポーザ53の上面には、複数個の音響センサ43a、43bが固定されている。インターポーザ53には、上下に貫通した複数個の貫通孔54、54が設けられており、各貫通孔54、54は各音響センサ43a、43bの空洞(フロントチャンバ52)と連通している。また、パッケージ42の底面には音孔45が開口しており、音孔45は各貫通孔54と少なくとも一部が重なり合っている。その結果、音孔45は貫通孔54を介して音響センサ43a、43bの空洞につながっている。また、音響センサ43a、43b間の隙間はインターポーザ53によって塞がれている。
【選択図】図5
Description
以下、図4−6を参照して本発明の実施形態1によるマイクロフォンを説明する。図4は、本発明の実施形態1によるマイクロフォン41を示す下面側からの斜視図である。図5Aは、図4のX−X線断面図であり、図5Bは、マイクロフォン41のパッケージ内の様子を表した斜視図である。図6は、パッケージ42の音孔45とインターポーザ53(支持基台)を示す斜視図である。
図7は、本発明の実施形態1によるマイクロフォンの変形例を示す断面図である。この変形例では、音孔45の開口面積を大きくしている。特に、インターポーザ53の上面に垂直な方向から見たとき、インターポーザ53の貫通孔54、54がいずれも音孔45内に納まるように、音孔45の開口面積を大きくしている。
マイクロフォンの内部には、3個以上の音響センサを内蔵していてもよい。図8Aは、本発明の実施形態1の別な変形例によるマイクロフォンのパッケージ内の様子を表した斜視図である。図8Bは、図8Aのマイクロフォンにおけるパッケージの音孔とインターポーザを示す斜視図である。
図9Aは、本発明の実施形態2によるマイクロフォン61を示す断面図である。図9Bは、図9Aに示すマイクロフォン61のパッケージ42内の様子を表した斜視図である。また、図10は、マイクロフォン61に用いられているインターポーザ53の下面側からの斜視図である。
図11Aは、本発明の実施形態2の変形例によるマイクロフォン62を示す断面図である。図11Bは、マイクロフォン62のパッケージ42内の様子を表した斜視図である。また、図12は、マイクロフォン62に用いられているインターポーザの下面側からの斜視図である。
42 パッケージ
43a、43b、43c、43d 音響センサ
45 音孔
47 ダイアフラム
49 固定電極膜
51 バックチャンバ
52 フロントチャンバ
53 インターポーザ
54 貫通孔
54a 連通部
54b 貫通部
Claims (7)
- パッケージと、
前記パッケージの内面に固定された支持基台と、
前記支持基台の表面の上に設置された複数個の音響センサとからなり、
前記パッケージは、前記支持基台を設置された領域に開口した音孔を有し、
前記支持基台は、前記支持基台の表面で開口する複数の開口を有していて前記音孔と前記各音響センサ内の空洞とを連通させる貫通孔を有し、
前記支持基台の表面における前記貫通孔の開口は、互いに離間していてそれぞれ異なる前記音響センサ内の空洞と連通していることを特徴とするマイクロフォン。 - 前記支持基台が、互いに独立した複数個の貫通孔を有し、
前記貫通孔の前記音孔側の開口は、それぞれ少なくとも一部が前記音孔の前記支持基台側の開口に重なり合っていることを特徴とする、請求項1に記載のマイクロフォン。 - 前記音孔の開口面積が、前記貫通孔の前記音孔側の開口面積よりも大きいことを特徴とする、請求項2に記載のマイクロフォン。
- 前記貫通孔は、前記音孔側から前記音響センサ側に向けて前記支持基台内で分岐していることを特徴とする、請求項1に記載のマイクロフォン。
- 前記支持基台の上面に垂直な方向から見たとき、前記音孔と前記貫通孔の前記音響センサ側の開口とが重なり合っていないことを特徴とする、請求項4に記載のマイクロフォン。
- 前記音孔の一部が、前記支持基台によって塞がれていることを特徴とする、請求項1に記載のマイクロフォン。
- 音響センサどうしの間の隙間が、前記支持基台によって塞がれていることを特徴とする、請求項1に記載のマイクロフォン。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012043381A JP5741487B2 (ja) | 2012-02-29 | 2012-02-29 | マイクロフォン |
PCT/JP2013/054950 WO2013129389A1 (ja) | 2012-02-29 | 2013-02-26 | マイクロフォン |
US14/377,707 US20150003638A1 (en) | 2012-02-29 | 2013-02-26 | Sensor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012043381A JP5741487B2 (ja) | 2012-02-29 | 2012-02-29 | マイクロフォン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013183164A true JP2013183164A (ja) | 2013-09-12 |
JP5741487B2 JP5741487B2 (ja) | 2015-07-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012043381A Expired - Fee Related JP5741487B2 (ja) | 2012-02-29 | 2012-02-29 | マイクロフォン |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150003638A1 (ja) |
JP (1) | JP5741487B2 (ja) |
WO (1) | WO2013129389A1 (ja) |
Cited By (7)
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KR101417018B1 (ko) | 2007-11-01 | 2014-07-08 | 엘지전자 주식회사 | 마이크로폰 및 그의 제조 방법 |
JP2015035730A (ja) * | 2013-08-09 | 2015-02-19 | オムロン株式会社 | マイクロフォン、音響センサ及び音響センサの製造方法 |
WO2017169070A1 (ja) * | 2016-03-29 | 2017-10-05 | パナソニックIpマネジメント株式会社 | マイクロフォン |
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US10917728B2 (en) | 2018-08-30 | 2021-02-09 | Tdk Corporation | MEMS microphone |
CN113784266A (zh) * | 2020-06-09 | 2021-12-10 | 通用微(深圳)科技有限公司 | 硅基麦克风装置及电子设备 |
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JP2022535229A (ja) | 2019-05-31 | 2022-08-05 | シュアー アクイジッション ホールディングス インコーポレイテッド | 音声およびノイズアクティビティ検出と統合された低レイテンシオートミキサー |
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- 2012-02-29 JP JP2012043381A patent/JP5741487B2/ja not_active Expired - Fee Related
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2013
- 2013-02-26 US US14/377,707 patent/US20150003638A1/en not_active Abandoned
- 2013-02-26 WO PCT/JP2013/054950 patent/WO2013129389A1/ja active Application Filing
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KR100737726B1 (ko) * | 2006-07-10 | 2007-07-10 | 주식회사 비에스이 | 멤스 마이크로폰 패키징 구조체 |
WO2010045107A2 (en) * | 2008-10-14 | 2010-04-22 | Knowles Electronics, Llc | Microphone having multiple transducer elements |
JP2012506211A (ja) * | 2008-10-14 | 2012-03-08 | ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー | 複数の変換器素子を含むマイクロフォン |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101417018B1 (ko) | 2007-11-01 | 2014-07-08 | 엘지전자 주식회사 | 마이크로폰 및 그의 제조 방법 |
JP2015035730A (ja) * | 2013-08-09 | 2015-02-19 | オムロン株式会社 | マイクロフォン、音響センサ及び音響センサの製造方法 |
DE102014116129B4 (de) | 2013-11-06 | 2023-03-09 | Infineon Technologies Ag | MEMS mit zwei Wandlerelementen |
WO2017169070A1 (ja) * | 2016-03-29 | 2017-10-05 | パナソニックIpマネジメント株式会社 | マイクロフォン |
JP2017183911A (ja) * | 2016-03-29 | 2017-10-05 | パナソニックIpマネジメント株式会社 | マイクロフォン |
CN108370464A (zh) * | 2016-03-29 | 2018-08-03 | 松下知识产权经营株式会社 | 麦克风 |
US10362378B2 (en) | 2016-03-29 | 2019-07-23 | Panasonic Intellectual Property Management Co., Ltd. | Microphone |
CN108370464B (zh) * | 2016-03-29 | 2020-04-07 | 松下知识产权经营株式会社 | 麦克风 |
US10687149B2 (en) | 2018-08-30 | 2020-06-16 | Tdk Corporation | MEMS microphone |
US10917728B2 (en) | 2018-08-30 | 2021-02-09 | Tdk Corporation | MEMS microphone |
US11350221B2 (en) | 2018-08-30 | 2022-05-31 | Tdk Corporation | MEMS microphone module |
CN113784266A (zh) * | 2020-06-09 | 2021-12-10 | 通用微(深圳)科技有限公司 | 硅基麦克风装置及电子设备 |
Also Published As
Publication number | Publication date |
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WO2013129389A1 (ja) | 2013-09-06 |
JP5741487B2 (ja) | 2015-07-01 |
US20150003638A1 (en) | 2015-01-01 |
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