JP2013175542A5 - - Google Patents
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- JP2013175542A5 JP2013175542A5 JP2012038376A JP2012038376A JP2013175542A5 JP 2013175542 A5 JP2013175542 A5 JP 2013175542A5 JP 2012038376 A JP2012038376 A JP 2012038376A JP 2012038376 A JP2012038376 A JP 2012038376A JP 2013175542 A5 JP2013175542 A5 JP 2013175542A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- metal layer
- manufacturing
- plan
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038376A JP5987347B2 (ja) | 2012-02-24 | 2012-02-24 | 電子デバイスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038376A JP5987347B2 (ja) | 2012-02-24 | 2012-02-24 | 電子デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013175542A JP2013175542A (ja) | 2013-09-05 |
| JP2013175542A5 true JP2013175542A5 (enExample) | 2015-03-19 |
| JP5987347B2 JP5987347B2 (ja) | 2016-09-07 |
Family
ID=49268215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012038376A Expired - Fee Related JP5987347B2 (ja) | 2012-02-24 | 2012-02-24 | 電子デバイスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5987347B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018102998A1 (zh) * | 2016-12-07 | 2018-06-14 | 东莞市国瓷新材料科技有限公司 | 一种带镀铜围坝的陶瓷封装基板制备方法 |
| WO2022196097A1 (ja) * | 2021-03-19 | 2022-09-22 | Ｎｇｋエレクトロデバイス株式会社 | パッケージ |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151813A (ja) * | 1987-12-09 | 1989-06-14 | Seiko Electronic Components Ltd | 小型水晶振動子 |
| JP2004288737A (ja) * | 2003-03-19 | 2004-10-14 | Kyocera Corp | 電子部品搭載用基板およびそれを用いた電子装置 |
| JP2005079558A (ja) * | 2003-09-04 | 2005-03-24 | Miyota Kk | 圧電デバイスの製造方法 |
| JP2005216932A (ja) * | 2004-01-27 | 2005-08-11 | Kyocera Corp | 配線基板及びその製造方法並びに電気部品 |
| JP2012049252A (ja) * | 2010-08-25 | 2012-03-08 | Citizen Finetech Miyota Co Ltd | 電子部品パッケージ |
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2012
- 2012-02-24 JP JP2012038376A patent/JP5987347B2/ja not_active Expired - Fee Related