JP2013175542A5 - - Google Patents
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- JP2013175542A5 JP2013175542A5 JP2012038376A JP2012038376A JP2013175542A5 JP 2013175542 A5 JP2013175542 A5 JP 2013175542A5 JP 2012038376 A JP2012038376 A JP 2012038376A JP 2012038376 A JP2012038376 A JP 2012038376A JP 2013175542 A5 JP2013175542 A5 JP 2013175542A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- metal layer
- manufacturing
- plan
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- 238000002844 melting Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Claims (9)
前記基板と共に前記電子部品を収容して、前記金属層と前記接合材が重なるように蓋体を配置する工程と、
前記接合材を溶融することにより、前記基板と前記蓋体とを接合する工程と、
を含むことを特徴とする電子デバイスの製造方法。 A lid having a bonding material disposed on one surface and a metal layer disposed in an annular shape with a recess, and an electronic component disposed in a region surrounded by the metal layer in plan view A step of preparing a substrate ;
Wherein together before Symbol substrate accommodating an electronic component, placing the lid so that the bonding material and the metal layers overlap,
By melting the bonding material, a step of bonding the cover member and the substrate,
The manufacturing method of the electronic device characterized by the above-mentioned.
ことを特徴とする請求項１または２に記載の電子デバイスの製造方法。 3. The method of manufacturing an electronic device according to claim 1, wherein the metal layer is provided with unevenness by the recess along the periphery of the electronic component.
電子デバイスの製造方法。 The method for manufacturing an electronic device according to claim 1, wherein the bonding material is silver solder.
いる電子デバイスであって、
前記接合部には、凹部を有する金属層と、前記凹部内に一部が配置されている接合材とが積層されていることを特徴とする電子デバイス。 An electronic device containing electronic components in an internal space composed of a lid and a substrate joined at a joint,
An electronic device , wherein a metal layer having a concave portion and a bonding material partially disposed in the concave portion are laminated on the joint portion .
平面視で前記金属層に囲まれている領域に電子部品を搭載するための電極と、
を備えていることを特徴とする配線基板。 A metal layer having a recess and arranged annularly in plan view;
An electrode for mounting an electronic component in a region surrounded by the metal layer in plan view;
A wiring board comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038376A JP5987347B2 (en) | 2012-02-24 | 2012-02-24 | Manufacturing method of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012038376A JP5987347B2 (en) | 2012-02-24 | 2012-02-24 | Manufacturing method of electronic device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013175542A JP2013175542A (en) | 2013-09-05 |
| JP2013175542A5 true JP2013175542A5 (en) | 2015-03-19 |
| JP5987347B2 JP5987347B2 (en) | 2016-09-07 |
Family
ID=49268215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012038376A Expired - Fee Related JP5987347B2 (en) | 2012-02-24 | 2012-02-24 | Manufacturing method of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5987347B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018102998A1 (en) * | 2016-12-07 | 2018-06-14 | 东莞市国瓷新材料科技有限公司 | Method for preparing ceramic package substrate with copper plating dams |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151813A (en) * | 1987-12-09 | 1989-06-14 | Seiko Electronic Components Ltd | Small sized crystal resonator |
| JP2004288737A (en) * | 2003-03-19 | 2004-10-14 | Kyocera Corp | Substrate for mounting electronic component and electronic device employing it |
| JP2005079558A (en) * | 2003-09-04 | 2005-03-24 | Miyota Kk | Method of fabricating piezoelectric device |
| JP2005216932A (en) * | 2004-01-27 | 2005-08-11 | Kyocera Corp | Wiring board and its manufacturing method and electrical part |
| JP2012049252A (en) * | 2010-08-25 | 2012-03-08 | Citizen Finetech Miyota Co Ltd | Electronic component package |
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2012
- 2012-02-24 JP JP2012038376A patent/JP5987347B2/en not_active Expired - Fee Related