JP2013171925A - 荷電粒子線装置、それを用いた物品の製造方法 - Google Patents
荷電粒子線装置、それを用いた物品の製造方法 Download PDFInfo
- Publication number
- JP2013171925A JP2013171925A JP2012034066A JP2012034066A JP2013171925A JP 2013171925 A JP2013171925 A JP 2013171925A JP 2012034066 A JP2012034066 A JP 2012034066A JP 2012034066 A JP2012034066 A JP 2012034066A JP 2013171925 A JP2013171925 A JP 2013171925A
- Authority
- JP
- Japan
- Prior art keywords
- charged particle
- particle beam
- radiation source
- radiation
- electron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/18—Vacuum control means
- H01J2237/182—Obtaining or maintaining desired pressure
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012034066A JP2013171925A (ja) | 2012-02-20 | 2012-02-20 | 荷電粒子線装置、それを用いた物品の製造方法 |
| US13/771,388 US8981323B2 (en) | 2012-02-20 | 2013-02-20 | Charged particle beam apparatus, and article manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012034066A JP2013171925A (ja) | 2012-02-20 | 2012-02-20 | 荷電粒子線装置、それを用いた物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013171925A true JP2013171925A (ja) | 2013-09-02 |
| JP2013171925A5 JP2013171925A5 (enExample) | 2015-04-09 |
Family
ID=48982524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012034066A Abandoned JP2013171925A (ja) | 2012-02-20 | 2012-02-20 | 荷電粒子線装置、それを用いた物品の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8981323B2 (enExample) |
| JP (1) | JP2013171925A (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2231352B1 (en) | 2008-01-03 | 2013-10-16 | Arcam Ab | Method and apparatus for producing three-dimensional objects |
| WO2011008143A1 (en) | 2009-07-15 | 2011-01-20 | Arcam Ab | Method and apparatus for producing three-dimensional objects |
| WO2013098135A1 (en) | 2011-12-28 | 2013-07-04 | Arcam Ab | Method and apparatus for manufacturing porous three-dimensional articles |
| WO2013098054A1 (en) | 2011-12-28 | 2013-07-04 | Arcam Ab | Method and apparatus for detecting defects in freeform fabrication |
| CN104428866A (zh) | 2012-05-14 | 2015-03-18 | 迈普尔平版印刷Ip有限公司 | 带电粒子光刻系统和射束产生器 |
| US11348756B2 (en) | 2012-05-14 | 2022-05-31 | Asml Netherlands B.V. | Aberration correction in charged particle system |
| US10586625B2 (en) | 2012-05-14 | 2020-03-10 | Asml Netherlands B.V. | Vacuum chamber arrangement for charged particle beam generator |
| GB2522388B (en) | 2012-12-17 | 2017-08-23 | Arcam Ab | Additive manufacturing method and apparatus |
| US9550207B2 (en) | 2013-04-18 | 2017-01-24 | Arcam Ab | Method and apparatus for additive manufacturing |
| US9676031B2 (en) | 2013-04-23 | 2017-06-13 | Arcam Ab | Method and apparatus for forming a three-dimensional article |
| US9676033B2 (en) | 2013-09-20 | 2017-06-13 | Arcam Ab | Method for additive manufacturing |
| US10434572B2 (en) | 2013-12-19 | 2019-10-08 | Arcam Ab | Method for additive manufacturing |
| US9802253B2 (en) | 2013-12-16 | 2017-10-31 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US10130993B2 (en) | 2013-12-18 | 2018-11-20 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US9789563B2 (en) | 2013-12-20 | 2017-10-17 | Arcam Ab | Method for additive manufacturing |
| US9789541B2 (en) | 2014-03-07 | 2017-10-17 | Arcam Ab | Method for additive manufacturing of three-dimensional articles |
| US20150283613A1 (en) | 2014-04-02 | 2015-10-08 | Arcam Ab | Method for fusing a workpiece |
| US9837254B2 (en) | 2014-08-12 | 2017-12-05 | Lam Research Corporation | Differentially pumped reactive gas injector |
| US9341467B2 (en) | 2014-08-20 | 2016-05-17 | Arcam Ab | Energy beam position verification |
| US20160052056A1 (en) * | 2014-08-22 | 2016-02-25 | Arcam Ab | Enhanced electron beam generation |
| US20160052079A1 (en) * | 2014-08-22 | 2016-02-25 | Arcam Ab | Enhanced additive manufacturing |
| US9406535B2 (en) * | 2014-08-29 | 2016-08-02 | Lam Research Corporation | Ion injector and lens system for ion beam milling |
| US10825652B2 (en) | 2014-08-29 | 2020-11-03 | Lam Research Corporation | Ion beam etch without need for wafer tilt or rotation |
| US9536748B2 (en) | 2014-10-21 | 2017-01-03 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
| US20160167303A1 (en) | 2014-12-15 | 2016-06-16 | Arcam Ab | Slicing method |
| US9721755B2 (en) | 2015-01-21 | 2017-08-01 | Arcam Ab | Method and device for characterizing an electron beam |
| US11014161B2 (en) | 2015-04-21 | 2021-05-25 | Arcam Ab | Method for additive manufacturing |
| US10807187B2 (en) | 2015-09-24 | 2020-10-20 | Arcam Ab | X-ray calibration standard object |
| US10583483B2 (en) | 2015-10-15 | 2020-03-10 | Arcam Ab | Method and apparatus for producing a three-dimensional article |
| US10525531B2 (en) | 2015-11-17 | 2020-01-07 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US10610930B2 (en) | 2015-11-18 | 2020-04-07 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US9779955B2 (en) | 2016-02-25 | 2017-10-03 | Lam Research Corporation | Ion beam etching utilizing cryogenic wafer temperatures |
| US11247274B2 (en) | 2016-03-11 | 2022-02-15 | Arcam Ab | Method and apparatus for forming a three-dimensional article |
| US11325191B2 (en) | 2016-05-24 | 2022-05-10 | Arcam Ab | Method for additive manufacturing |
| US10549348B2 (en) | 2016-05-24 | 2020-02-04 | Arcam Ab | Method for additive manufacturing |
| US10525547B2 (en) | 2016-06-01 | 2020-01-07 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US10792757B2 (en) | 2016-10-25 | 2020-10-06 | Arcam Ab | Method and apparatus for additive manufacturing |
| US10987752B2 (en) | 2016-12-21 | 2021-04-27 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US11059123B2 (en) | 2017-04-28 | 2021-07-13 | Arcam Ab | Additive manufacturing of three-dimensional articles |
| US11292062B2 (en) | 2017-05-30 | 2022-04-05 | Arcam Ab | Method and device for producing three-dimensional objects |
| US20190099809A1 (en) | 2017-09-29 | 2019-04-04 | Arcam Ab | Method and apparatus for additive manufacturing |
| US10847374B2 (en) | 2017-10-31 | 2020-11-24 | Lam Research Corporation | Method for etching features in a stack |
| US10529070B2 (en) | 2017-11-10 | 2020-01-07 | Arcam Ab | Method and apparatus for detecting electron beam source filament wear |
| US11072117B2 (en) | 2017-11-27 | 2021-07-27 | Arcam Ab | Platform device |
| US10821721B2 (en) | 2017-11-27 | 2020-11-03 | Arcam Ab | Method for analysing a build layer |
| US11517975B2 (en) | 2017-12-22 | 2022-12-06 | Arcam Ab | Enhanced electron beam generation |
| US12350754B2 (en) | 2017-12-22 | 2025-07-08 | Arcam Ab | Electron beam source and the use of the same |
| US10361092B1 (en) | 2018-02-23 | 2019-07-23 | Lam Research Corporation | Etching features using metal passivation |
| US11267051B2 (en) | 2018-02-27 | 2022-03-08 | Arcam Ab | Build tank for an additive manufacturing apparatus |
| US10800101B2 (en) | 2018-02-27 | 2020-10-13 | Arcam Ab | Compact build tank for an additive manufacturing apparatus |
| US11400519B2 (en) | 2018-03-29 | 2022-08-02 | Arcam Ab | Method and device for distributing powder material |
| CN113519071B (zh) | 2019-02-28 | 2025-04-22 | 朗姆研究公司 | 利用侧壁清洁的离子束蚀刻 |
| US11177114B1 (en) * | 2020-09-15 | 2021-11-16 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Electrode arrangement, contact assembly for an electrode arrangement, charged particle beam device, and method of reducing an electrical field strength in an electrode arrangement |
| WO2025201803A1 (en) * | 2024-03-28 | 2025-10-02 | Asml Netherlands B.V. | Charged particle-optical module |
| DE102024204310A1 (de) * | 2024-05-08 | 2025-11-13 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Strahlbearbeitung einer optischen Komponente |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003211559A1 (en) * | 2002-03-01 | 2003-09-16 | Nikon Corporation | Projection optical system adjustment method, prediction method, evaluation method, adjustment method, exposure method, exposure device, program, and device manufacturing method |
| JP3834271B2 (ja) | 2002-07-16 | 2006-10-18 | キヤノン株式会社 | マルチ荷電ビームレンズ及びこれを用いた荷電粒子線露光装置ならびにデバイス製造方法 |
| JP2010155367A (ja) | 2008-12-26 | 2010-07-15 | Yamaha Motor Co Ltd | 真空成形機および真空成形品の製造方法 |
-
2012
- 2012-02-20 JP JP2012034066A patent/JP2013171925A/ja not_active Abandoned
-
2013
- 2013-02-20 US US13/771,388 patent/US8981323B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8981323B2 (en) | 2015-03-17 |
| US20130216959A1 (en) | 2013-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150220 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150220 |
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| A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20151105 |