JP2013161850A5 - - Google Patents
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- JP2013161850A5 JP2013161850A5 JP2012020668A JP2012020668A JP2013161850A5 JP 2013161850 A5 JP2013161850 A5 JP 2013161850A5 JP 2012020668 A JP2012020668 A JP 2012020668A JP 2012020668 A JP2012020668 A JP 2012020668A JP 2013161850 A5 JP2013161850 A5 JP 2013161850A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- molding
- tape
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012020668A JP6087507B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法 |
TW102100216A TWI527273B (zh) | 2012-02-02 | 2013-01-04 | Method and apparatus for sealing resin sealing of semiconductor wafer and apparatus for preventing edge of resin |
KR1020130004818A KR101432423B1 (ko) | 2012-02-02 | 2013-01-16 | 반도체 칩의 압축 수지 밀봉 성형 방법 및 장치와 수지 버어 방지용 테이프 |
MYPI2013000198A MY173863A (en) | 2012-02-02 | 2013-01-18 | Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape |
CN201310022344.8A CN103247739B (zh) | 2012-02-02 | 2013-01-22 | 半导体芯片的压缩树脂密封成型方法和装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012020668A JP6087507B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013161850A JP2013161850A (ja) | 2013-08-19 |
JP2013161850A5 true JP2013161850A5 (zh) | 2014-12-11 |
JP6087507B2 JP6087507B2 (ja) | 2017-03-01 |
Family
ID=49173889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012020668A Active JP6087507B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6087507B2 (zh) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5247376A (en) * | 1975-10-13 | 1977-04-15 | Mitsubishi Electric Corp | Process for production of resin sealed type semiconductor device |
JPS60242017A (ja) * | 1984-05-17 | 1985-12-02 | Fuji Plant Kogyo Kk | パリ発生のない樹脂モ−ルド方法 |
JPS6444026A (en) * | 1987-08-11 | 1989-02-16 | Michio Osada | Resin-seal formation of component to be sealed and heat resistant sheet member used therefor |
US7709853B2 (en) * | 2007-02-12 | 2010-05-04 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
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2012
- 2012-02-02 JP JP2012020668A patent/JP6087507B2/ja active Active
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