JP2013161850A5 - - Google Patents

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Publication number
JP2013161850A5
JP2013161850A5 JP2012020668A JP2012020668A JP2013161850A5 JP 2013161850 A5 JP2013161850 A5 JP 2013161850A5 JP 2012020668 A JP2012020668 A JP 2012020668A JP 2012020668 A JP2012020668 A JP 2012020668A JP 2013161850 A5 JP2013161850 A5 JP 2013161850A5
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JP
Japan
Prior art keywords
resin
substrate
molding
tape
sealing
Prior art date
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Application number
JP2012020668A
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English (en)
Japanese (ja)
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JP6087507B2 (ja
JP2013161850A (ja
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Priority claimed from JP2012020668A external-priority patent/JP6087507B2/ja
Priority to JP2012020668A priority Critical patent/JP6087507B2/ja
Priority to TW102100216A priority patent/TWI527273B/zh
Priority to KR1020130004818A priority patent/KR101432423B1/ko
Priority to MYPI2013000198A priority patent/MY173863A/en
Priority to CN201310022344.8A priority patent/CN103247739B/zh
Publication of JP2013161850A publication Critical patent/JP2013161850A/ja
Publication of JP2013161850A5 publication Critical patent/JP2013161850A5/ja
Publication of JP6087507B2 publication Critical patent/JP6087507B2/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical

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JP2012020668A 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法 Active JP6087507B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012020668A JP6087507B2 (ja) 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法
TW102100216A TWI527273B (zh) 2012-02-02 2013-01-04 Method and apparatus for sealing resin sealing of semiconductor wafer and apparatus for preventing edge of resin
KR1020130004818A KR101432423B1 (ko) 2012-02-02 2013-01-16 반도체 칩의 압축 수지 밀봉 성형 방법 및 장치와 수지 버어 방지용 테이프
MYPI2013000198A MY173863A (en) 2012-02-02 2013-01-18 Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape
CN201310022344.8A CN103247739B (zh) 2012-02-02 2013-01-22 半导体芯片的压缩树脂密封成型方法和装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012020668A JP6087507B2 (ja) 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法

Publications (3)

Publication Number Publication Date
JP2013161850A JP2013161850A (ja) 2013-08-19
JP2013161850A5 true JP2013161850A5 (zh) 2014-12-11
JP6087507B2 JP6087507B2 (ja) 2017-03-01

Family

ID=49173889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012020668A Active JP6087507B2 (ja) 2012-02-02 2012-02-02 半導体チップの圧縮樹脂封止成形方法及び樹脂封止された半導体チップの生産方法

Country Status (1)

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JP (1) JP6087507B2 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5247376A (en) * 1975-10-13 1977-04-15 Mitsubishi Electric Corp Process for production of resin sealed type semiconductor device
JPS60242017A (ja) * 1984-05-17 1985-12-02 Fuji Plant Kogyo Kk パリ発生のない樹脂モ−ルド方法
JPS6444026A (en) * 1987-08-11 1989-02-16 Michio Osada Resin-seal formation of component to be sealed and heat resistant sheet member used therefor
US7709853B2 (en) * 2007-02-12 2010-05-04 Cree, Inc. Packaged semiconductor light emitting devices having multiple optical elements
JP2008207450A (ja) * 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法

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