JP2013157341A - Ｌｅｄ照明装置 - Google Patents

Ｌｅｄ照明装置 Download PDF

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Publication number
JP2013157341A
JP2013157341A JP2013109794A JP2013109794A JP2013157341A JP 2013157341 A JP2013157341 A JP 2013157341A JP 2013109794 A JP2013109794 A JP 2013109794A JP 2013109794 A JP2013109794 A JP 2013109794A JP 2013157341 A JP2013157341 A JP 2013157341A
Authority
JP
Japan
Prior art keywords
film
emitting element
light emitting
flexible circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013109794A
Other languages
English (en)
Japanese (ja)
Inventor
Koji Uehara
浩治 上原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Components Inc
Original Assignee
Canon Components Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Components Inc filed Critical Canon Components Inc
Priority to JP2013109794A priority Critical patent/JP2013157341A/ja
Publication of JP2013157341A publication Critical patent/JP2013157341A/ja
Pending legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/041—Capsule endoscopes for imaging
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/06—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with illuminating arrangements
    • A61B1/0661—Endoscope light sources
    • A61B1/0684—Endoscope light sources using light emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2013109794A 2012-01-05 2013-05-24 Ｌｅｄ照明装置 Pending JP2013157341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013109794A JP2013157341A (ja) 2012-01-05 2013-05-24 Ｌｅｄ照明装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012000748 2012-01-05
JP2012000748 2012-01-05
JP2013109794A JP2013157341A (ja) 2012-01-05 2013-05-24 Ｌｅｄ照明装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012236025A Division JP2013157592A (ja) 2011-01-17 2012-10-25 発光素子実装用フレキシブル回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013270372A Division JP2014103406A (ja) 2012-01-05 2013-12-26 発光素子実装用フレキシブル回路基板およびｌｅｄ照明装置

Publications (1)

Publication Number Publication Date
JP2013157341A true JP2013157341A (ja) 2013-08-15

Family

ID=49052270

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013109794A Pending JP2013157341A (ja) 2012-01-05 2013-05-24 Ｌｅｄ照明装置
JP2013270372A Withdrawn JP2014103406A (ja) 2012-01-05 2013-12-26 発光素子実装用フレキシブル回路基板およびｌｅｄ照明装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013270372A Withdrawn JP2014103406A (ja) 2012-01-05 2013-12-26 発光素子実装用フレキシブル回路基板およびｌｅｄ照明装置

Country Status (1)

Country Link
JP (2) JP2013157341A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016048736A (ja) * 2014-08-27 2016-04-07 住友電工プリントサーキット株式会社 カバーレイ、フレキシブルプリント配線板及びｌｅｄモジュール
KR101618646B1 (ko) * 2013-10-31 2016-05-09 주식회사 토바 플렉시블 엘이디 모듈
KR101678337B1 (ko) * 2016-03-24 2016-11-22 주식회사 신일라이팅 Led용 방열 반사 기판

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016082141A (ja) * 2014-10-20 2016-05-16 日清紡ホールディングス株式会社 Ｌｅｄアレイ及びその製造方法
TWM579383U (zh) 2018-12-25 2019-06-11 同泰電子科技股份有限公司 具有高反射率的基板結構

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005070240A (ja) * 2003-08-22 2005-03-17 Tsujiden Co Ltd バックライト用の反射フイルム
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2007513520A (ja) * 2003-12-02 2007-05-24 スリーエム イノベイティブ プロパティズ カンパニー 発光ダイオードに基づく照明組立体
JP2008244285A (ja) * 2007-03-28 2008-10-09 Denka Agsp Kk 発光素子搭載基板及びその製造方法
JP2009111180A (ja) * 2007-10-30 2009-05-21 Panasonic Electric Works Co Ltd Ｌｅｄユニット
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板
JP2009188187A (ja) * 2008-02-06 2009-08-20 Sanyo Electric Co Ltd 電子部品及びその製造方法
WO2011118109A1 (ja) * 2010-03-23 2011-09-29 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005070240A (ja) * 2003-08-22 2005-03-17 Tsujiden Co Ltd バックライト用の反射フイルム
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
JP2007513520A (ja) * 2003-12-02 2007-05-24 スリーエム イノベイティブ プロパティズ カンパニー 発光ダイオードに基づく照明組立体
JP2008244285A (ja) * 2007-03-28 2008-10-09 Denka Agsp Kk 発光素子搭載基板及びその製造方法
JP2009111180A (ja) * 2007-10-30 2009-05-21 Panasonic Electric Works Co Ltd Ｌｅｄユニット
JP2009129801A (ja) * 2007-11-27 2009-06-11 Denki Kagaku Kogyo Kk 金属ベース回路基板
JP2009188187A (ja) * 2008-02-06 2009-08-20 Sanyo Electric Co Ltd 電子部品及びその製造方法
WO2011118109A1 (ja) * 2010-03-23 2011-09-29 株式会社朝日ラバー 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101618646B1 (ko) * 2013-10-31 2016-05-09 주식회사 토바 플렉시블 엘이디 모듈
JP2016048736A (ja) * 2014-08-27 2016-04-07 住友電工プリントサーキット株式会社 カバーレイ、フレキシブルプリント配線板及びｌｅｄモジュール
KR101678337B1 (ko) * 2016-03-24 2016-11-22 주식회사 신일라이팅 Led용 방열 반사 기판

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Publication number Publication date
JP2014103406A (ja) 2014-06-05

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