JP2013151638A5

JP2013151638A5 -

Info

Publication number: JP2013151638A5
Application number: JP2012170818A
Authority: JP
Filing date: 2012-08-01
Publication date: 2014-09-04

Description

上記目的を達成するために、本発明にかかるカバーレイフィルムは、配線層を保護するカバーレイフィルムであって、厚みが５〜５０μｍであるフィルム状の基材と、厚みが１０〜５０μｍである前記基材の主面に設けられた接着層と、を有し、基材は前記接着層より弾性率が大きい樹脂からなり、接着層は、オリゴフェニレンエーテルとスチレンブタジエン系のエラストマーを含有する合成樹脂からなり、カバーレイフィルムの熱膨張係数が、前記接着層および配線層を介して接合される少なくとも一つの接合面を有するベースフィルムの熱膨張係数と同一であることを特徴とする。 In order to achieve the above object, a coverlay film according to the present invention is a coverlay film that protects a wiring layer, and has a film-like substrate having a thickness of 5 to 50 μm and a thickness of 10 to 50 μm. An adhesive layer provided on the main surface of the base material, the base material is made of a resin having a higher elastic modulus than the adhesive layer, and the adhesive layer is a synthetic material containing oligophenylene ether and a styrene butadiene elastomer It is made of resin, and the thermal expansion coefficient of the coverlay film is the same as the thermal expansion coefficient of the base film having at least one bonding surface bonded through the adhesive layer and the wiring layer .

そして、本発明にかかるフレキシブル配線板は、液晶ポリマーあるいは液晶ポリマーを含むコンポジット系樹脂からなるベースフィルムの少なくとも一方の接合面に配線層が形成され、ベースフィルムおよび配線層に対して、カバーレイフィルムの接着層が一体接合していることを特徴とする。 In the flexible wiring board according to the present invention, a wiring layer is formed on at least one joint surface of a base film made of a liquid crystal polymer or a composite resin containing a liquid crystal polymer, and a coverlay film is formed on the base film and the wiring layer. The adhesive layer is integrally bonded.

また、本発明にかかるフレキシブル配線板の製造方法は、配線層が形成された樹脂基板に対して、カバーレイフィルムの接着層を熱ロールラミネート法により熱圧着し、その後の加熱処理によって、配線層および樹脂基板にカバーレイフィルムを接合一体化することを特徴とする。 In addition, the method for manufacturing a flexible wiring board according to the present invention includes a method in which a cover layer film adhesive layer is thermocompression bonded to a resin substrate on which a wiring layer is formed by a hot roll laminating method, and then subjected to a heat treatment to form a wiring layer. And a coverlay film is integrally joined to the resin substrate.

Claims

A coverlay film for protecting the wiring layer,
A film-like substrate having a thickness of 5 to 50 μm;
An adhesive layer provided on the main surface of the substrate having a thickness of 10 to 50 μm,
The base material is made of a resin having a larger elastic modulus than the adhesive layer,
The adhesive layer is made of a synthetic resin containing an oligophenylene ether and a styrene butadiene elastomer,
The cover lay film is characterized in that a thermal expansion coefficient of the cover lay film is the same as a thermal expansion coefficient of a base film having at least one bonding surface bonded through the adhesive layer and the wiring layer .

The cover lay film according to claim 1, wherein the base material is a low dielectric resin film having a relative dielectric constant of 3.5 or less at a frequency of 1 GHz.

2. The coverlay film according to claim 1 , wherein the base material has a relative dielectric constant of 3.5 or less and a dielectric loss tangent of 0.005 or less at a frequency of 1 GHz .

The low dielectric resin film is made of liquid crystal polymer, polyethylene naphthalate, syndiotactic polystyrene, polyphenylene sulfide, polyimide resin, polyetherimide, polyphenylene ether, or a composite resin of these. The coverlay film according to claim 2 or 3, characterized in that

The adhesive layer is made of a thermosetting resin and bonded to the base material in the form of an uncured film, and the adhesive layer has a glass transition point of the base material or a thermosetting temperature lower than the melting point of the thermoplastic resin. The coverlay film according to any one of claims 1 to 3, further comprising:

4. The coverlay film according to claim 1, wherein the base material has a tensile elastic modulus of 2 GPa to 20 GPa, and the adhesive layer has a tensile elastic modulus after thermosetting of 100 MPa to 1 GPa. 5.

The cover according to any one of claims 1 to 3, wherein the cover lay film has a relative dielectric constant of 3 or less and a dielectric loss tangent of 0.003 or less at a frequency of 1 GHz in which the base material and the adhesive layer are combined. Ray film .

The coverlay film according to claim 1, wherein a release material layer is provided on the adhesive layer side.

The wiring layer is formed on at least one joint surface of the base film made of a liquid crystal polymer or a composite resin containing a liquid crystal polymer, and the base film and the wiring layer are any one of claims 1 to 3. A flexible wiring board, wherein the adhesive layer of the cover lay film is integrally joined .

The flexible wiring board according to claim 9, wherein a base material of the base film and the coverlay film is a liquid crystal polymer .

The flexible substrate according to claim 10, wherein the base material, the adhesive layer, and the base film of the coverlay film have a relative dielectric constant of 3 or less and a dielectric loss tangent of 0.003 or less at a frequency of 1 GHz. Wiring board .

The adhesive layer of the coverlay film according to any one of claims 1 to 3 is thermocompression bonded to the resin substrate on which the wiring layer is formed by a hot roll laminating method, and then the wiring layer and the resin are subjected to a heat treatment. A method for producing a flexible wiring board, wherein the coverlay film is bonded and integrated to a substrate .