JP2013143510A - 放熱部材とその製造法並びに放熱部材を備えた半導体応用電子デバイス及びその製造法 - Google Patents

放熱部材とその製造法並びに放熱部材を備えた半導体応用電子デバイス及びその製造法 Download PDF

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JP2013143510A
JP2013143510A JP2012003610A JP2012003610A JP2013143510A JP 2013143510 A JP2013143510 A JP 2013143510A JP 2012003610 A JP2012003610 A JP 2012003610A JP 2012003610 A JP2012003610 A JP 2012003610A JP 2013143510 A JP2013143510 A JP 2013143510A
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heat dissipation
layer
dissipation member
manufacturing
electronic device
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JP2013143510A5 (https=
Inventor
Tadahiro Omi
忠弘 大見
Masashi Kitano
真史 北野
Tetsuya Goto
哲也 後藤
Minoru Tawara
稔 田原
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Tohoku University NUC
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Tohoku University NUC
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JP2012003610A 2012-01-11 2012-01-11 放熱部材とその製造法並びに放熱部材を備えた半導体応用電子デバイス及びその製造法 Pending JP2013143510A (ja)

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JP2012003610A JP2013143510A (ja) 2012-01-11 2012-01-11 放熱部材とその製造法並びに放熱部材を備えた半導体応用電子デバイス及びその製造法

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JP2012003610A JP2013143510A (ja) 2012-01-11 2012-01-11 放熱部材とその製造法並びに放熱部材を備えた半導体応用電子デバイス及びその製造法

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JP2013143510A true JP2013143510A (ja) 2013-07-22
JP2013143510A5 JP2013143510A5 (https=) 2015-03-05

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62202064A (ja) * 1985-11-05 1987-09-05 Nippon Telegr & Teleph Corp <Ntt> 表面処理を施したマグネシウムまたはマグネシウム合金およびその表面処理方法
JP2009024928A (ja) * 2007-07-19 2009-02-05 Tohoku Univ 環境制御室の構成部材、環境制御室の構成部材の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62202064A (ja) * 1985-11-05 1987-09-05 Nippon Telegr & Teleph Corp <Ntt> 表面処理を施したマグネシウムまたはマグネシウム合金およびその表面処理方法
JP2009024928A (ja) * 2007-07-19 2009-02-05 Tohoku Univ 環境制御室の構成部材、環境制御室の構成部材の製造方法

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