JP2013120762A - 蓋体、パッケージ、電子部品及びパッケージの製造方法 - Google Patents
蓋体、パッケージ、電子部品及びパッケージの製造方法 Download PDFInfo
- Publication number
- JP2013120762A JP2013120762A JP2011266539A JP2011266539A JP2013120762A JP 2013120762 A JP2013120762 A JP 2013120762A JP 2011266539 A JP2011266539 A JP 2011266539A JP 2011266539 A JP2011266539 A JP 2011266539A JP 2013120762 A JP2013120762 A JP 2013120762A
- Authority
- JP
- Japan
- Prior art keywords
- lid
- package
- sealing material
- recess
- ceramic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 17
- 239000003566 sealing material Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 18
- 238000005520 cutting process Methods 0.000 abstract description 3
- 239000000919 ceramic Substances 0.000 description 39
- 239000000463 material Substances 0.000 description 13
- 238000005219 brazing Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011266539A JP2013120762A (ja) | 2011-12-06 | 2011-12-06 | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011266539A JP2013120762A (ja) | 2011-12-06 | 2011-12-06 | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013120762A true JP2013120762A (ja) | 2013-06-17 |
| JP2013120762A5 JP2013120762A5 (enExample) | 2015-01-15 |
Family
ID=48773293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011266539A Withdrawn JP2013120762A (ja) | 2011-12-06 | 2011-12-06 | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013120762A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015130394A (ja) * | 2014-01-07 | 2015-07-16 | 株式会社デンソー | モールドパッケージ |
| CN118969638A (zh) * | 2024-07-30 | 2024-11-15 | 无锡中微高科电子有限公司 | 一种减少大尺寸平行缝焊盖板形变的方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529589U (enExample) * | 1978-08-18 | 1980-02-26 | ||
| JPH0267648U (enExample) * | 1988-10-18 | 1990-05-22 | ||
| JPH09270472A (ja) * | 1996-03-29 | 1997-10-14 | Miyota Kk | 表面実装用保持器 |
| JP2006100669A (ja) * | 2004-09-30 | 2006-04-13 | Kyocera Kinseki Corp | 電子部品容器 |
-
2011
- 2011-12-06 JP JP2011266539A patent/JP2013120762A/ja not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529589U (enExample) * | 1978-08-18 | 1980-02-26 | ||
| JPH0267648U (enExample) * | 1988-10-18 | 1990-05-22 | ||
| JPH09270472A (ja) * | 1996-03-29 | 1997-10-14 | Miyota Kk | 表面実装用保持器 |
| JP2006100669A (ja) * | 2004-09-30 | 2006-04-13 | Kyocera Kinseki Corp | 電子部品容器 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015130394A (ja) * | 2014-01-07 | 2015-07-16 | 株式会社デンソー | モールドパッケージ |
| CN118969638A (zh) * | 2024-07-30 | 2024-11-15 | 无锡中微高科电子有限公司 | 一种减少大尺寸平行缝焊盖板形变的方法 |
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