JP2013120762A - 蓋体、パッケージ、電子部品及びパッケージの製造方法 - Google Patents

蓋体、パッケージ、電子部品及びパッケージの製造方法 Download PDF

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JP2013120762A
JP2013120762A JP2011266539A JP2011266539A JP2013120762A JP 2013120762 A JP2013120762 A JP 2013120762A JP 2011266539 A JP2011266539 A JP 2011266539A JP 2011266539 A JP2011266539 A JP 2011266539A JP 2013120762 A JP2013120762 A JP 2013120762A
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lid
package
sealing material
recess
ceramic base
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JP2013120762A5 (enExample
Inventor
Masayuki Kikushima
正幸 菊島
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Seiko Epson Corp
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Seiko Epson Corp
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JP2011266539A 2011-12-06 2011-12-06 蓋体、パッケージ、電子部品及びパッケージの製造方法 Withdrawn JP2013120762A (ja)

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JP2011266539A JP2013120762A (ja) 2011-12-06 2011-12-06 蓋体、パッケージ、電子部品及びパッケージの製造方法

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JP2011266539A JP2013120762A (ja) 2011-12-06 2011-12-06 蓋体、パッケージ、電子部品及びパッケージの製造方法

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JP2013120762A5 JP2013120762A5 (enExample) 2015-01-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015130394A (ja) * 2014-01-07 2015-07-16 株式会社デンソー モールドパッケージ
CN118969638A (zh) * 2024-07-30 2024-11-15 无锡中微高科电子有限公司 一种减少大尺寸平行缝焊盖板形变的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529589U (enExample) * 1978-08-18 1980-02-26
JPH0267648U (enExample) * 1988-10-18 1990-05-22
JPH09270472A (ja) * 1996-03-29 1997-10-14 Miyota Kk 表面実装用保持器
JP2006100669A (ja) * 2004-09-30 2006-04-13 Kyocera Kinseki Corp 電子部品容器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529589U (enExample) * 1978-08-18 1980-02-26
JPH0267648U (enExample) * 1988-10-18 1990-05-22
JPH09270472A (ja) * 1996-03-29 1997-10-14 Miyota Kk 表面実装用保持器
JP2006100669A (ja) * 2004-09-30 2006-04-13 Kyocera Kinseki Corp 電子部品容器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015130394A (ja) * 2014-01-07 2015-07-16 株式会社デンソー モールドパッケージ
CN118969638A (zh) * 2024-07-30 2024-11-15 无锡中微高科电子有限公司 一种减少大尺寸平行缝焊盖板形变的方法

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