JP2013115080A - Method for manufacturing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing device for a printed wiring board capable of easily and inexpensively aligning a base material and a coverlay, and to provide a manufacturing method therefor.SOLUTION: A method for manufacturing a printed wiring board comprises the steps of: forming a wiring pattern 40 on a principal surface of a base material 10 on which a conductive layer is formed; and laminating a coverlay 60 so as to cover at least a part of the wiring pattern 40. The step of forming the wiring pattern 40 further includes the steps of: forming a plating layer on the principal surface of the base material 10; and forming an etching resist layer on the principal surface of the base material 10 using a photomask 20 including a first mask pattern 21 corresponding to the wiring pattern 40 and a second mask pattern 22 corresponding to a guide pattern 50 disposed along at least a part of an outer edge of the coverlay 60.

Description

  The present invention relates to a method for manufacturing a printed wiring board.

  When the coverlay is bonded to the base material, the mark is observed by the imaging means, the positional deviation between them is measured, and the positioning is performed by adjusting the position in the θ-axis direction that is the X axis, the Y axis, and the rotation axis. A technique is known (Patent Document 1).

JP 2004-319688 A

  However, the apparatus according to the prior art is expensive, and it takes time to prepare for apparatus introduction, and there is a problem that a large space must be prepared because the apparatus is large.

  The problem to be solved by the present invention is to provide a printed wiring board manufacturing method capable of aligning a base material and a cover lay by a simple method without increasing cost.

  The present invention provides a printed wiring board comprising: a step of forming a wiring pattern on a main surface of a substrate on which a conductive layer is formed; and a step of laminating a cover lay so as to cover at least a part of the wiring pattern. In the method, the step of forming the wiring pattern includes a plating step of forming a plating layer on the main surface of the base material, a first mask pattern corresponding to the wiring pattern, and at least part of an outer edge of the coverlay. And a resist forming step of forming an etching resist layer on the main surface of the base material using a photomask including a second mask pattern corresponding to the guide pattern arranged in a manner as described above. This solves the above problem.

  Further, the present invention is a printed wiring board comprising: a step of forming a wiring pattern on a main surface of a substrate on which a conductive layer is formed; and a step of laminating a cover lay so as to cover at least a part of the wiring pattern. In the manufacturing method, the step of forming the wiring pattern includes a first mask pattern corresponding to the wiring pattern and a second mask corresponding to a guide pattern arranged along at least a part of the outer edge of the coverlay. A resist forming step of forming a plating resist layer on the main surface of the base material using a photomask including a pattern, and plating the main surface of the base material on which the plating resist layer is formed, and the wiring by the plating layer The above-described problems are solved by providing a method of manufacturing a printed wiring board including a pattern and a plating step for forming the guide pattern.

  In the above invention, the second mask pattern may include a linear pattern along two directions perpendicular to each other.

  In the above invention, in the step of laminating the cover lay, the second mask pattern is line symmetric with respect to the center line of the laminated cover lay or point symmetric with respect to the center of the laminated cover lay. It can be made linear.

  In the above invention, the second mask pattern can be arranged in a region along the outer edge of the base material other than a region where the first mask pattern corresponding to the wiring pattern is formed.

  In the above invention, in the step of laminating the cover lay, the cover lay may be laminated on the substrate such that a side surface along the outer edge of the cover lay faces a side surface along the inner edge of the guide pattern. it can.

  According to the present invention, since the wiring pattern and the guide pattern are formed on the main surface of the base material using the photomask including the first mask pattern and the second mask pattern, when laminating the coverlay on the base material, By abutting the outer edge of the coverlay against the inner edge of the guide pattern, the position of the coverlay relative to the substrate can be determined. As a result, the position of the cover lay with respect to the substrate can be determined with high accuracy by a simple and inexpensive method without using an expensive and large-sized position adjusting device equipped with an imaging device.

It is process drawing which shows the process of the manufacturing method of the printed wiring board which concerns on embodiment of this invention. It is a top view which shows a photomask. It is a top view of the printed wiring board in which the wiring pattern and the guide pattern were formed. It is sectional drawing which follows the IVA-IVA line | wire shown in FIG. FIG. 4 is a cross-sectional view taken along the line IVB-IVB shown in FIG. 3. It is a top view of the printed wiring board with which the coverlay was laminated | stacked. It is sectional drawing which follows the VIA-VIA line shown in FIG. It is sectional drawing which follows the VIB-VIB line | wire shown in FIG. It is another process drawing of the manufacturing method of the printed wiring board concerning the embodiment of the present invention. It is another process drawing of the manufacturing method of the printed wiring board which concerns on embodiment of this invention.

<First Embodiment>
Hereinafter, a method for manufacturing a printed wiring board according to a first embodiment of the present invention will be described with reference to the drawings. In the present embodiment, an example in which the printed wiring board manufacturing method according to the present invention is applied to a printed wiring board manufacturing apparatus including at least an exposure apparatus that performs exposure processing on a substrate using a photomask will be described. Note that the printed wiring board manufacturing apparatus of the present embodiment can include a plating apparatus, an etching apparatus, a thermal vacuum press apparatus, and the like depending on the mode of the process.

  FIG. 1 is a process diagram showing a method for manufacturing a printed wiring board according to the present embodiment. As shown in FIG. 1, the printed wiring board manufacturing method of the present embodiment according to the present invention includes a process A for forming a wiring pattern on the main surface of a substrate and a coverlay so as to cover at least a part of the wiring pattern. The process B which laminates | stacks.

  Although not particularly limited, in the present embodiment, a method for manufacturing a printed wiring board when a so-called subtractive panel plating method is employed will be described as an example.

  First, in step S101, a commercially available copper clad laminate material (CCL) in which a copper foil is pasted on both principal surfaces of an insulating base material such as polyimide is prepared. The copper clad laminate material (CCL) can be subjected to electroless copper plating by forming holes for through holes and performing desmear treatment or the like as necessary.

  In this embodiment, the copper foil currently formed in both surfaces of the insulating base material functions as a conductive layer in the present invention. The copper foil as the conductive layer can be formed by electroless copper plating or the like.

  In subsequent step S102, electrolytic copper plating, so-called panel plating, is performed on the entire main surface of the copper clad laminate material (CCL).

  Before and after Step S102, a photomask used for photolithography processing is prepared. The photomask used in the method for manufacturing a printed wiring board according to the present embodiment includes a first mask pattern corresponding to a desired wiring pattern and a second mask pattern corresponding to a guide pattern. In the present embodiment, the guide pattern is a pattern for alignment of the coverlay disposed at a position along at least a part of the outer edge of the coverlay laminated in step B.

  An example of the photomask 20 used in this embodiment is shown in FIG. In this example, in order to perform a large number of pieces for producing a plurality of products from one base material, a plurality of first mask patterns 21 corresponding to the same wiring pattern are provided on the photomask 20. It is laid out on the surface. As shown in FIG. 2, the plurality of first mask patterns 21 are formed within a predetermined region K. Further, a second mask pattern 22 corresponding to one or a plurality of guide patterns is laid out in a region outside the predetermined region K of the photomask 20. Incidentally, the predetermined region K where the first mask pattern 21 is formed is a region including or coincident with the planned layout region 60A of the coverlay 60 in the coverlay stacking step B. The first mask pattern 21 shown in FIG. 2 conceptually shows a region where a fine mask pattern corresponding to the wiring pattern is drawn, and the specific diagram of the first mask pattern 21 is not particularly limited. .

  Although not particularly limited, the second mask pattern 22 of the present embodiment includes a linear pattern along two directions perpendicular to each other. As shown in FIG. 2, the second mask pattern 22 of the present embodiment may be a key-shaped or L-shaped pattern including a linear pattern along the x direction in the drawing and a linear pattern along the y direction in the drawing. Alternatively, a linear second mask pattern 22x along the x direction in the drawing or a linear second mask pattern 22y along the y direction in the drawing may be used. In addition, the photomask 20 may include only one of the shapes of the second mask patterns 22, 22x, and 22y (hereinafter sometimes collectively referred to as the second mask pattern 22) of these shapes. Alternatively, a combination of any two or more of the second mask patterns 22, 22x, and 22y may be included.

  By using such a mask pattern, a key-shaped or L-shaped guide pattern including a linear shape along the x direction in the figure and a linear shape along the y direction in the figure, a straight line along the x direction in the figure A guide pattern having a shape or a linear guide pattern along the y direction in the figure can be formed. By the way, since a general coverlay is rectangular, if a guide pattern with such a shape is formed, the outer edge of the coverlay is used as the inner edge of the guide pattern (the layout of the coverlay) in the coverlay lamination process. The outer edge of the planned region 60A side).

  Although not particularly limited, in the present embodiment, as shown in FIG. 2, the second mask pattern 22 of the present embodiment is a center line of the planned coverlay placement region 60 </ b> A in the coverlay stacking process to be performed later. It is arranged at a line-symmetrical position with respect to H and / or P, or at a point-symmetrical position with respect to the center Q of the coverlay arrangement planned area 60A. As described above, by arranging the second mask pattern 22 at the line-symmetrical and / or point-symmetrical position, the guide pattern can be formed at the same line-symmetrical and / or point-symmetrical position, so that the coverlay is laminated. In the process, it is possible to prevent the position of the coverlay from being biased to be shifted to the left, right, up or down (xy direction).

  Further, in the present embodiment, the second mask pattern 22 is a region along the outer edge of the base material 10 and is disposed in a region outside the predetermined region K where the first mask pattern 21 corresponding to the wiring pattern is formed. Has been. That is, as shown in FIG. 2, in this embodiment, in the belt-shaped region at a distance Ta1 from the left outer edge along the y-axis direction of the substrate 10 and in the belt-shaped region of Ta2 from the right outer edge, and the x of the substrate 10 A second mask pattern 22 is formed in a belt-like region at a distance Tb1 from the upper outer edge along the axial direction and in a belt-like region at Tb2 from the lower outer edge. A region outside the first mask pattern 21 where the second mask pattern 22 is formed is a trimming portion (scrap portion) that is discarded after cutting the product including the wiring pattern. As described above, the second mask pattern 22 is formed in the trimming portion that is finally discarded, so that the layout of the first mask pattern 21 that is a product is not affected.

  Returning to FIG. 1, in step S <b> 104, an etching resist layer is formed on the main surface of the substrate 10 using the photomask 20 shown in FIG. 2. In this process, an etching resist layer is formed by using a general photoresist technique in which a photosensitive dry film is laminated on the substrate 10 and development is performed by irradiation with light. The photomask 20 of the present embodiment includes a first mask pattern 21 corresponding to the wiring pattern and a second mask pattern 22 corresponding to the guide pattern along at least a part of the outer edge of the cover lay. An etching resist layer for the wiring pattern and an etching resist layer for the guide pattern are formed.

  Next, in step S105, an etching process is performed to remove the panel plating layer and the conductive layer in a region not covered with the etching resist layer. The type of etchant and the etching conditions can be set appropriately using a technique known at the time of filing.

  In subsequent step S106, the etching resist layer is removed using an alkaline solution or the like. The type of the resist layer solution and the dissolution conditions can also be set by appropriately using a technique known at the time of filing.

  Through the above processing, a wiring pattern and a guide pattern are formed on the main surface of the substrate 10 in step S107.

  FIG. 3 shows an example of the wiring pattern 40 and the guide pattern 50 formed on the main surface of the substrate 10. The shape and position of the wiring pattern 40 correspond to the first mask pattern 21 of the photomask 20, and the shape and position of the guide pattern 50 correspond to the second mask pattern 22 of the photomask 20. Note that the wiring pattern 40 shown in FIG. 3 conceptually shows a region in which a fine diagram corresponding to a desired wiring pattern is drawn, and the specific diagram of the wiring pattern 40 is not particularly limited.

  As shown in FIG. 3, the guide pattern 50 of the present embodiment is a key-shaped or L-shaped pattern including a linear pattern along the x direction in the drawing and a linear pattern along the y direction in the drawing, and the x direction in the drawing. And a linear line pattern along the y direction in the figure. Of course, the guide pattern 50 may have any one shape or a combination of any two or more according to the form of the second mask pattern 22.

  Further, as shown in FIG. 3, the guide pattern 50 of the present embodiment has a position symmetrical with respect to the center line H and / or P of the layout area 60A of the coverlay to be laminated in a later process, or is laminated. The coverlay is arranged at a point-symmetrical position with respect to the center Q of the planned layout area 60A. In this way, by arranging the guide patterns 50 at line-symmetrical and / or point-symmetrical positions, it is possible to prevent the coverlay from being shifted to the left, right, up, down (xy direction) in the coverlay stacking step. be able to.

  Further, as shown in FIG. 3, the guide pattern 50 of the present embodiment includes a belt-like region at a distance Ta1 from the left outer edge along the y-axis direction of the base material 10 and a belt-like region of Ta2 from the right outer edge. The material 10 is formed in a belt-like region at a distance Tb1 from the upper outer edge along the x-axis direction and also in a belt-like region Tb2 from the lower outer edge. A region outside the wiring pattern 40 where the guide pattern 50 is formed is a trimming portion (scrap portion) that is discarded after a product including the wiring pattern 40 is cut. Thus, by forming the guide pattern 50 in the trimming portion that is finally discarded, the layout of the wiring pattern 40 that is a product is not affected.

  4A shows a cross section taken along line IVA-IVA shown in FIG. 3, and FIG. 4B shows a cross section taken along line IVB-IVB shown in FIG. As shown in FIGS. 4A and 4B, the guide pattern 50 has a side wall 50W having a height h from the main surface of the substrate 10 along the z direction in the drawing. Since the side wall 50W faces the arrangement area 60A side of the cover lay 60, the side wall 50W can be brought into contact with the outer edge of the cover lay 60 in the cover lay 60 stacking step described later.

  Returning to FIG. 1, in step S <b> 108, the coverlay 60 is laminated so as to cover at least a part of the wiring pattern 50. In the step of laminating the cover lay 60 on the substrate 10, the position of the guide pattern 50 is used as a mark, and the side surface along the outer edge of the cover lay 60 is abutted against the side wall W of the guide pattern 50 shown in FIGS. 4A and 4B. The position where the coverlay 60 is laminated is determined.

  FIG. 5 shows a state in which a coverlay 60 is laminated on a printed wiring board 100 (including semi-finished products, the same applies hereinafter) in which a wiring pattern 40 and a guide pattern 50 are formed on the main surface of the substrate 10. Although not shown in the figure, the coverlay 60 is formed with a defect (notch, hole) according to the form of the wiring pattern 40 and covers at least a part of the wiring pattern 40.

  Further, as shown in the figure, a rectangular cover lay 60 is disposed in an area surrounded by the guide pattern 50, and the outer edge of the cover lay 60 extends along the inner side wall of the guide pattern 50. .

  6A and 6B are cross-sectional views in a state where the coverlay 60 is laminated on the substrate 10, FIG. 6A shows a cross-section taken along the line VIA-VIA shown in FIG. 5, and FIG. 6B shows a VIB- The section of VIB line is shown. Since the coverlay 60 is a sheet-like material having a thickness, side surfaces exist along the outer edges thereof. 6A and 6B, the side surface along the outer edge of the cover lay 60 laminated on the base material 10 is in contact (surface contact) with the side surface 50W along the inner edge of the guide pattern 50. As shown in FIG.

  As described above, the position where the cover lay 60 is laminated can be determined by bringing the side surface along the outer edge of the cover lay 60 into contact (surface contact) with the side wall W of the guide pattern 50. The ray 60 can be placed in the correct position. In addition, since only the second mask pattern 22 is included in the photomask 20, no new cost is generated.

  Although it does not specifically limit, the coverlay 60 of this embodiment is a thin sheet-like material about 12.5 micrometers-50 micrometers in thickness with which the adhesive bond layer was formed in the main surface of insulating materials, such as a polyimide. In general, since the coverlay 60 is a thin and soft material, the handleability is poor and the dimensional stability is also poor. Moreover, it is easy to move by external force, is easy to wrinkle, and is easily damaged. Further, generally, an opening is formed in accordance with the coverlay 60 wiring pattern, and the waist is further free. It is not easy to stack such a coverlay 60 at an accurate position with respect to the base material 10.

  After the cover lay 60 is laminated, post-processing steps such as vacuum hot pressing, outer shape processing (product removal), and protective layer formation, gold plating treatment, component mounting, and multilayer lamination are performed as necessary.

  As described above, according to the method for manufacturing a printed wiring board of the present embodiment, in the stacking process of the coverlay 60, the side surface along the outer edge of the coverlay 60 is brought into contact with the side wall W of the guide pattern 50, Therefore, it is possible to align the base material and the coverlay by a simple method without cost.

  As in the prior art, an apparatus for aligning a cover lay using an imaging device is expensive, and startup work and condition setting at the time of introduction require a great time and money. Moreover, since the apparatus itself is large, it is necessary to secure a wide space, which increases the operation cost of the line. On the other hand, the printed wiring board manufacturing method of the present embodiment only needs to include a mask pattern for the guide pattern in the photomask, so that the cover layout can be performed by a simple method without generating new costs. Can be accurately aligned.

Second Embodiment
In the second embodiment, a printed wiring board manufacturing method in the case where a so-called semi-additive method, which is one of wiring pattern forming methods, is employed will be described as an example. Here, in order to avoid duplicated explanation, explanation will be made mainly on different points, and explanations in the first embodiment will be cited for common parts.

  FIG. 7 is a process diagram showing a method for manufacturing a printed wiring board according to the present embodiment. As shown in FIG. 7, the printed wiring board manufacturing method of the present embodiment according to the present invention includes a process A for forming a wiring pattern on the main surface of a substrate and a coverlay so as to cover at least a part of the wiring pattern. The process B which laminates | stacks.

  As shown in FIG. 7, in the method for manufacturing a printed wiring board according to the present embodiment, first, in step S201, an insulating base material such as polyimide is prepared, and through holes are formed as necessary. Surface and catalyze. In step S202, electroless copper plating is performed to form a conductive layer.

  In step S203, as in the first embodiment, a photomask 20 including a first mask pattern 21 corresponding to the wiring pattern shown in FIG. 2 and a second mask pattern 22 corresponding to the guide pattern is prepared.

  Subsequently, in step S204, a plating resist layer for a wiring pattern and a plating resist layer for a guide pattern are formed using the prepared photomask 20.

  In step S205, the main surface of the base material 10 on which the plating resist layer is formed is subjected to a plating process such as electrolytic copper plating to form a plating layer in a portion not covered with the plating resist layer.

  In step S206, the plating resist layer is removed, and in step S207, the wiring pattern 40 and the guide pattern 50 shown in FIGS. 3 and 4 are formed as in the first embodiment.

  In the next step S208, as in the first embodiment, as shown in FIG. 5, the side surface along the outer edge of the cover lay 60 is brought into contact with the side wall W of the guide pattern 50, and the position where the cover lay 60 is laminated is determined. Decide. At this time, as shown in FIGS. 6A and 6B, the side surface along the outer edge of the coverlay 60 laminated on the base material 10 faces the side surface 50 </ b> W along the inner edge of the guide pattern 50.

  As described above, the printed wiring board manufacturing method of the present embodiment exhibits the same operations and effects as the printed wiring board manufacturing method of the first embodiment even when the semi-additive method is used.

  Furthermore, since the semi-additive method is used in this embodiment, the guide pattern 50 can be formed by a plating process such as electrolytic copper plating. As a result, the side surface 50W along the inner edge of the guide pattern 50 shown in FIG. 4A can be formed substantially perpendicular to the main surface of the substrate 10, so that the side surface along the outer edge of the cover lay 60 and the guide pattern The side surface 50 </ b> W along the inner edge of 50 can be brought into contact along a surface perpendicular to the main surface of the substrate 10. As a result, alignment can be performed with higher accuracy than when the side surface 50W along the inner edge of the guide pattern 50 is inclined with respect to the main surface of the substrate 10.

<Third Embodiment>
In the third embodiment, a printed wiring board manufacturing method in the case where a so-called subtractive pattern plating method, which is one of wiring pattern forming methods, is employed will be described as an example. Here, in order to avoid duplicated explanation, explanation will be made mainly on different points, and explanations in the first embodiment will be cited for common parts.

  FIG. 8 is a process diagram showing a method for manufacturing a printed wiring board according to the present embodiment. As shown in FIG. 8, the printed wiring board manufacturing method of the present embodiment according to the present invention includes a process A for forming a wiring pattern on the main surface of a substrate and a coverlay so as to cover at least a part of the wiring pattern. The process B which laminates | stacks.

  As shown in FIG. 8, in the method for manufacturing a printed wiring board according to the present embodiment, first, in step S301, a copper clad laminate material (CCL) in which copper foil is pasted on both main surfaces of an insulating base material such as polyimide. Prepare. The copper foil formed on both surfaces of this insulating substrate functions as a conductive layer in the present invention. If necessary, through holes are formed, desmeared, etc., and electroless copper plating is applied.

  In step S303, as in the first embodiment, the photomask 20 including the first mask pattern 21 corresponding to the wiring pattern shown in FIG. 2 and the second mask pattern 22 corresponding to the guide pattern is prepared.

  Subsequently, in step S304, a plating resist layer for a wiring pattern and a plating resist layer for a guide pattern are formed in step S204 using the prepared photomask 20. Specifically, a photosensitive dry film is attached, irradiated with light, and the uncured dry film is removed to form a plating resist layer.

  In step S305, a plating layer is formed on the main surface of the substrate 10 on which the plating resist layer is formed by electrolytic copper plating or the like on a portion not covered with the plating resist layer, and pattern plating is performed.

  If necessary, resist metal plating is performed in step S306 so that the pattern is not dissolved in the next etching. Tin or lead can be used as the resist metal.

  In step S307, the plating resist is removed, and in step S308, an etching process is performed. Moreover, the resist plating layer formed with the resist metal is peeled off as necessary.

  Thereby, in step S309, the wiring pattern 40 and the guide pattern 50 shown in FIGS. 3 and 4 are formed as in the first embodiment.

  In the subsequent step S310, as in the first embodiment, the side surface along the outer edge of the cover lay 60 is brought into contact with the side wall W of the guide pattern 50 as shown in FIG. Also in this embodiment, as shown in FIGS. 6A and 6B, the side surface along the outer edge of the cover lay 60 laminated on the base material 10 faces the side surface 50 </ b> W along the inner edge of the guide pattern 50. .

  As described above, in the method for manufacturing a printed wiring board according to the present embodiment, even when the subtractive pattern plating method is used, the same operations and effects as those of the method for manufacturing a printed wiring board according to the first embodiment are obtained. Play.

  Furthermore, since the subtractive pattern plating method is used in this embodiment, the guide pattern 50 can be formed by a plating process such as electrolytic copper plating. 4A, the side surface 50W along the inner edge of the guide pattern 50 shown in FIG. 4A can be formed perpendicular to the main surface of the base material 10, and therefore, the side surface along the outer edge of the cover lay 60 and the guide pattern 50 Since the side surface 50W along the inner edge of the guide pattern 50 can be opposed to the main surface of the base material 10 along the surface perpendicular to the main surface of the base material 10, the side surface 50W along the inner edge of the guide pattern 50 is the main surface of the base material 10. On the other hand, alignment can be performed with higher accuracy than in the case of being inclined.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  Each member, base material 10, photomask 20, resist layer (dry film), metal for plating, and coverlay 60 used in carrying out the method for manufacturing the printed wiring board 100 of the embodiment described above are printed circuit boards. The member currently utilized at the time of application for manufacture can be used suitably.

DESCRIPTION OF SYMBOLS 100 ... Semi-finished product of printed wiring board and printed wiring board 10 ... Base material 11 ... Conductive layer 20 ... Photomask 21 ... 1st mask pattern (mask pattern for wiring patterns)
22 ... 2nd mask pattern (mask pattern for guide patterns)
DESCRIPTION OF SYMBOLS 30 ... Resist layer 31 ... Etching resist layer 32 ... Plating resist layer 40 ... Wiring pattern 50 ... Guide pattern 50W ... (Guide pattern) side wall 60 ... Coverlay 60A ... Coverlay arrangement plan area

Claims (6)

In a method for manufacturing a printed wiring board, comprising a step of forming a wiring pattern on a main surface of a base material on which a conductive layer is formed, and a step of laminating a cover lay so as to cover at least a part of the wiring pattern.
The step of forming the wiring pattern includes:
A plating step of forming a plating layer on the main surface of the substrate;
A main mask of the substrate using a photomask including a first mask pattern corresponding to the wiring pattern and a second mask pattern corresponding to a guide pattern arranged along at least a part of an outer edge of the coverlay. And a resist forming step for forming an etching resist layer on the surface. In a method for manufacturing a printed wiring board, comprising a step of forming a wiring pattern on a main surface of a base material on which a conductive layer is formed, and a step of laminating a cover lay so as to cover at least a part of the wiring pattern.
The step of forming the wiring pattern includes:
A main mask of the substrate using a photomask including a first mask pattern corresponding to the wiring pattern and a second mask pattern corresponding to a guide pattern arranged along at least a part of an outer edge of the coverlay. A resist forming step of forming a plating resist layer on the surface;
A method of manufacturing a wiring pattern, comprising: plating a main surface of the substrate on which the plating resist layer is formed, and forming the wiring pattern and the guide pattern by a plating layer.   3. The method of manufacturing a wiring pattern according to claim 1, wherein the second mask pattern includes a linear pattern along two directions perpendicular to each other. 4.   In the step of laminating the coverlay, the second mask pattern is linear with respect to the center line of the laminated coverlay or point-symmetrical with respect to the center of the laminated coverlay. The manufacturing method of the wiring pattern as described in any one of Claims 1-3 characterized by these.   The second mask pattern is a region along an outer edge of the base material, and is disposed in a region other than a region where a first mask pattern corresponding to the wiring pattern is formed. The manufacturing method of the wiring pattern as described in any one of 1-4. In the step of laminating the coverlay,
The said cover lay is laminated | stacked on the said base material so that the side surface in alignment with the outer edge of the said cover lay may oppose the side surface in alignment with the inner edge of the said guide pattern, The any one of Claims 1-5 characterized by the above-mentioned. The manufacturing method of the wiring pattern as described in 2.

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