JP2013110433A - Working system for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve convenience required for a working system for a substrate including a working device for a substrate.SOLUTION: A working system for a substrate comprises: (a) a working device for a substrate which is configured to be capable of attaching any selected one of plural working heads 21 in which any attached head is exchangeable with another head of the plural working heads; and (b) management devices 440, 442 which manage the working device for a substrate. In the management device, a head associated information external storage section 506 is provided for storing information on each of the plural working heads outside the working device for a substrate. Since the plural working heads are exchangeable to each other, and the information on each of the plural working heads is stored outside the working device for a substrate, the convenience of the working system for a substrate is improved.

Description

  The present invention relates to an on-board working system including an on-board working machine on which a work head for working on a circuit board is mounted.

  A substrate working machine is a working machine that works on a circuit board that constitutes an electronic circuit. And so on. As a type of substrate work machine, there is a work head that has a work head as a main work, and works by moving the circuit board and the head relative to each other. An adhesive application machine, a component mounting machine, an inspection work machine Etc. are assumed to be of such an embodiment. For example, a component mounting machine employs a mounting head as a work head, and the mounting head has a suction nozzle as a component holding device, and the component is taken out from the component supply device by this suction nozzle, and the surface of the circuit board. To be implemented. As a technique relating to the working head, for example, the following patent document discloses a technique for determining whether or not an attached nozzle is suitable for attachment of a replaceable suction nozzle.

JP-A-6-104596

  As described in the above-mentioned patent document, it is common practice to make components constituting the work head such as a suction nozzle detachable or replaceable. For example, regarding the replacement of the suction nozzle, if the various suction nozzles can be attached and detached according to the type of circuit board to be operated and the circuit components to be mounted, the versatility of the substrate working machine is enhanced. That is, if the components constituting the work head are made detachable or replaceable, the versatility required for the substrate work machine is improved. However, so far, no effective technique for making the work head itself detachable or replaceable has been disclosed. Therefore, the present invention has been made with an object of improving the convenience required for a substrate working system including a substrate working machine.

In order to solve the above-mentioned problem,
An anti-substrate work machine configured to be able to mount one arbitrarily selected from a plurality of work heads and replaceable with any other one of the plurality of work heads; ,
A board-to-board working system comprising a management device for managing the board-to-board working machine,
The management device is
A head related information external storage unit that stores information on each of the plurality of work heads outside the substrate work machine is provided.

  In the substrate work system according to the present invention, the mounted work head can be replaced with any of a plurality of work heads, and information on each of the work heads is stored on the outside of the work substrate work machine. By being stored in, the to-board working system of the present invention is highly convenient.

Aspects of the Invention

  In the following, some aspects of the invention that can be claimed in the present application (hereinafter sometimes referred to as “claimable invention”) will be exemplified and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is merely for the purpose of facilitating the understanding of the claimable inventions, and is not intended to limit the combinations of the constituent elements constituting those inventions to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

(1) A substrate working machine including a detachable working head and performing a preset work on a circuit board by operating the working head in a state in which the working head is mounted.

  The substrate working machine of the present invention is a substrate working machine having a work head, and the work head is configured to be detachable. The type of the substrate working machine is not particularly limited as long as it is a substrate working having a work head. For example, the present invention can be applied to various substrate working machines such as a component mounting machine having a mounting head, an adhesive application machine having a coating head, and an inspection working machine having an inspection head. Here, the “work head” is a component that performs the main work in the substrate working machine, and means, for example, one that is relatively moved with respect to the circuit board. When a relative movement device that relatively moves the work head and the circuit board is included, the work head that can be separated from the relative movement device is the work head in the present invention. In the present invention, the work head itself is detachable, and is distinguished from the fact that the components constituting the work head are detachable. “Removable” means that it can be easily mounted / removed, for example, can be mounted / removed without using a tool. Put simply, it means that it can be attached and removed with one touch. If the work head is detachable, the convenience of the substrate working machine can be improved, such as easy maintenance.

(2) The substrate working machine includes a substrate holding device that fixes and holds a circuit board and a component supply device that supplies circuit components, and the work head holds circuit components supplied from the component supply device. The mounting circuit component is mounted on the surface of the circuit board fixed and held by the board holding device, so that the on-board working machine functions as a component mounting machine (1) The board | substrate working machine as described in a term.

  The mode described in this section is a mode as a component mounter. In the case of a component mounting machine, a component holding device such as a suction nozzle is generally provided, and includes, for example, a mechanism for moving the device up and down, a mechanism for rotating the device, and the like. The substrate working machine of the present invention is particularly effective for a mounting head having such an elevating mechanism, a rotation mechanism and the like that can be attached and detached. This is because a mounting head having such a mechanism is precise and has a great advantage when it can be separated, for example, maintenance is often performed. The component mounter often includes an XY robot type head moving device that moves the work head along a single plane. When the present invention is applied to such a component mounter, the work head can be detached from the head moving device. It becomes a mode.

(3) The substrate work machine according to item (1) or (2), wherein one selected arbitrarily from a plurality of work heads can be mounted as the work head.

  A mode that can be exchanged with another working head is included in the mode described in this section. For example, considering maintenance, etc., when one work head is being maintained, it is possible to perform work by attaching another work head, which is advantageous not only in terms of convenience but also in work efficiency. is there. This mode includes a case where the work head can be replaced with a work head having the same configuration, and a case where the work head can be replaced with a work head having a different configuration.

(4) In the item (3), the plurality of work heads include ones having different configurations, and one work head arbitrarily selected from the work heads having different constituent components can be mounted as the work head. Anti-board work machine.

  The mode described in this section is a mode that can be replaced with a work head having a different configuration. For example, work heads of different work types can be exchanged. For example, between work heads such as a mounting head that performs component mounting work, an application head that performs adhesive application work, and an inspection head that performs inspection work. Can be interchangeable. In this way, if it is possible to replace a work head having a different configuration to the extent that the type of work to be performed can be changed, it is possible to give the substrate working machine a variety of target work, and the versatility of the substrate working machine. Is greatly improved. In addition, the aspect described in this section includes a work head that performs the same kind of work and can be replaced with a work head having a different configuration. For example, taking a mounting head as an example, the mounting head is the number of components holding devices such as suction nozzles attached, the mechanism for raising and lowering the component holding device, the difference in the shape and size of the target circuit component, the mounting speed, etc. There are different configurations depending on the purpose, such as the difference in. That is, there are mounting heads having different numbers of components, shapes, operations, functions, and the like. The aspect described in this section can be exchanged between work heads of the same type of work having different configurations as described above, and various work forms can be varied even in the same type of work. The versatility of the work machine is improved.

(5) The work head includes a unique information recording medium in which unique information regarding the work head is recorded, and the substrate work machine is information related to the mounted work head based on the unique information. The substrate working machine according to any one of (1) to (4), including a head related information recognition unit that recognizes head related information.

  In the case where the work head is detachable, if the work head is mounted and the configuration, state, etc. of the work head can be grasped, the convenience is further improved. As will be described in detail later, if the configuration content of the attached work head can be automatically recognized, for example, a process for preparing to use the head (hereinafter, referred to as a “head use preparing process”) may be used. Can be performed automatically. The head use preparation processing includes, for example, change of software for driving the head, calibration, etc., and determination of whether or not the working head is suitable for use. The aspect described in this section is an aspect suitable for automatically performing such a head use preparation process.

  The head related information in the aspect of this section includes head configuration specification information, head status information, and the like which will be described later. In the aspect described in this section, the work head itself has its own unique information. That is, the unique information referred to in this section is information recorded on the head itself and can be referred to as head storage information. This unique information includes information for obtaining head related information. For example, information such as work head ID information indicating the ID of the work head, head type information indicating the type of the work head, and the like are applicable. The unique information recording medium on which the unique information is recorded is not limited in type, for example, a memory element such as a ROM or a RAM, or a dip switch is electrically connected to acquire information to be recorded. It may be possible. Further, it may be a barcode, 2D code (also referred to as QR code (registered trademark)) or the like that can be recognized by visual or optical means, and information can be acquired, or wirelessly such as a tag chip. Various recording media such as a recording medium having a communication function and a recording medium using magnetism can be employed. Depending on the type of the unique information recording medium provided in the work head, means capable of acquiring or recognizing information from the recording medium may be provided on the work machine main body side.

  The head related information recognition unit recognizes the head related information based on the unique information. For example, the head-related information may be recognized based on the unique information by performing processing such as calculation by the user himself / herself. Information may be acquired and the information may be recognized as head related information. In addition, the specific information includes the head related information as it is, and includes an aspect in which the specific information is recognized only by acquiring the information. In this case, the work head has the head related information itself.

(6) The head related information recognition unit includes a configuration specification information recognition unit that recognizes head configuration specification information that is a specification related to the configuration of the mounted work head as the head related information. The substrate-to-board working machine described.

  The aspect described in this section is an aspect for recognizing specifications relating to the configuration of the head as the head related information information. The head configuration specifications are various factors related to the configuration of the working head, and include, for example, information on the type of the working head, information on the positions where various components provided in the working head are provided, and the like. If the mounting head is described as an example, the type information of the working head includes, for example, the name indicating the type, the number of suction nozzles attached, the shape and type of suction nozzles that can be attached, the mounting speed, and the like. It is information etc. which can specify. Further, the information on the component deployment position includes, for example, the height direction in the mounting head of the member that holds the suction nozzle, the arrangement position in the horizontal plane, and the like. As will be described later, these pieces of information include information for selecting a driver for operating the mounted work head, information for determining whether the mounted head is suitable for use, and a mounting head. Can be information for determining a reference position for operating the.

(7) The substrate work machine is
A driver storage unit that stores a work head driver that is software for enabling the attached work head to operate;
The driver storage unit includes a head corresponding unit that stores a work head driver corresponding to the mounted work head based on the head configuration specification information recognized by the configuration specification information recognition unit. The substrate work machine according to the item).

  In general, the operation of an on-board work machine is controlled by a control device mainly composed of a computer. Devices and devices such as work heads and feeders require special software called so-called drivers in order to be driven. A driver that operates a work head can be referred to as a work head driver, and a driver suitable for the work head exists for each type of work head. If the work head is not exchanged, that is, it is not a problem in the case of a conventional counter-to-substrate work machine that is provided in a fixed manner, the work head can be exchanged in a counter-to-board work machine that depends on the work head that is installed, Specifically, it is necessary to select a driver according to the configuration of the work head. In this case, the mode described in this section is a mode in which the driver can be automatically selected according to the work head, and the work head can be easily replaced. When preparing multiple types of work drivers, store various drivers inside the on-board work machine, or store them outside the on-board work machine, based on the selection results, What is necessary is just to make it transmit to an on-board working machine. The mode described in this section is a mode in which automation of the head use preparation process can be realized in a substrate working machine in which the work head is replaceable.

(8) Head configuration specification information in which the component work position recognition unit recognizes component position information, which is position information related to the work operation of the component of the mounted work head, by the configuration specification information recognition unit. The work apparatus for a substrate according to the item (6) or (7), including a position information acquisition unit that is acquired based on

  The working head is a precision device, but may include manufacturing errors and the like. In the substrate work machine in which the work head is not detached, the position of the work head and each component thereof is adjusted after the work head is assembled so that the error does not affect the work accuracy. However, in a substrate working machine in which the work head can be attached and detached, in particular, in a substrate working machine in which various work heads are exchanged and mounted, manufacturing errors of the work head itself and displacement of the work head mounting position are caused by work. Affects accuracy. The mode described in this section is a mode that makes it possible to perform position adjustment relating to the work head, which is performed in order to eliminate the influence of such errors, and so-called calibration processing. For example, based on the information on the recognized component elements, especially the information on the component deployment position, information on the mounted work head, the position of the component in the board work machine, etc. is acquired and acquired. Based on the information, the position adjustment corresponding to the attached work head is performed. Although the work head and the circuit board are moved relative to each other in the substrate work, the position adjustment includes correcting the command position in the relative movement. Taking the mounting head as an example, based on information such as the height direction in the mounting head of the member that holds the suction nozzle, which is a component of the mounting head, and the position in the horizontal plane, the relative position of the suction nozzle Processing for adjusting the movement command position, the relative movement command position of the mounting head, and the like can be performed.

(9) The head related information recognizing unit includes a status information recognizing unit for recognizing head status information which is information relating to a status of the mounted work head as the head related information. The substrate working machine according to any one of the above.

  The mode described in this section is a mode for recognizing information related to the state of the mounted work head based on the unique information of the work head. The status information includes, for example, a usage state of the work head, a state relating to work accuracy, and the like. This includes not only the state of the work head itself but also the state in relation to the mounted substrate work machine, such as compatibility. Specifically, for example, how long the work head has been operating, the date and time that has passed since the maintenance was performed, what is the defect rate of the work head, For example, what is the defective rate when it is mounted. The status information can be used for the determination about the suitability for use, which will be described later. The status information can be recognized by accessing and acquiring a database such as a production history and a maintenance history related to the work head based on unique information of the work head.

(10) The counter work apparatus according to (9), wherein the substrate work machine includes a head suitability determination unit that determines suitability of the mounted work head based on head status information recognized by the status information recognition unit. Board work machine.

  The mode described in this section is a mode in which the suitability of the work head is determined according to the state of the work head. The suitability of the work head means whether or not it is appropriate to perform work using the attached work head. For example, the state described in this section is used because the work head itself is in a bad state. In the case where the work head cannot be used, the work head and the mounted substrate working machine are not compatible with each other and it is inappropriate to use the working head on the mounted substrate working machine. Whether or not the attached work head can be used is also included in the head use preparation process. The aspect described in this section is an aspect in which the head use preparation process can be automated. In addition, although not the mode described in this section, the substrate working machine of the present invention can be implemented in a mode in which it is determined based on the head configuration specification information, not based on the head status information. Further, as one aspect in the aspect described in this section, it is possible to implement the aspect determined based on both the head status information and the head configuration specification information.

(11) The work machine for the substrate is
An X-direction moving device provided with a working head-mounted member on which the working head is mounted and moving the working head-mounted member in one direction, the X direction, and the X-direction moving device in one direction perpendicular to the X direction And a working head moving device for moving the working head in a plane parallel to the circuit board. Anti-board work machine.

(12) The substrate work machine according to (11), wherein in the state where the work head is mounted, the length in the X direction is 60 mm or less of the work head and the work head mounted member combined.

(13) The substrate work machine according to (11) or (12), wherein a weight of a combination of the work head and the work head attached member is 5 kg or less.

(14) A board imaging device capable of imaging a reference mark attached to a surface of a circuit board is provided on the work head mounted member at a position aligned with the mounted work head in the Y direction. Or the substrate working machine according to any one of (13).

  According to the aspects described in the above four items, a compact counter-to-substrate working machine and a counter-to-substrate working machine with a small burden on the work head moving device are realized. It should be noted that the modes described in the above four items can be applied to a substrate working machine in which the work head is not detachably provided, that is, the work head is fixedly provided.

(21) A work head for a substrate working machine, which is detachably provided on the substrate working machine, and is operated to perform a preset operation on the circuit board.

(22) The substrate working machine includes a substrate holding device that fixes and holds a circuit board and a component supply device that supplies circuit components, and the work head is supplied from the component supply device. The work head for a board work machine according to (21), wherein the work head is a mounting head for holding and taking out the component and mounting the held circuit component on the surface of the circuit board fixedly held by the board holding device.

(23) The work head for a substrate work machine according to (21) or (22), wherein the work head includes a unique information recording medium on which unique information regarding the work head is recorded.

  The various aspects relating to the working head for a substrate working machine of the present invention are working heads suitable for the substrate working machine of the various aspects of the present invention. Since these descriptions are the same as those described above, descriptions thereof are omitted here.

(31) A counter-to-board working system including a counter-to-board working machine that includes a detachable working head and operates the work head in a state where the working head is mounted to perform a preset work on the circuit board. There,
The mounted work head includes a unique information recording medium in which unique information about itself is recorded, and the system transmits head related information, which is information related to the head for each work head, to the outside of the substrate work machine And a head-related information recognition unit that acquires and recognizes head-related information about the mounted work head from the head-related information external storage unit based on the unique information. This is a board-to-board working system.

  A substrate working system according to the present invention is a system including a substrate working machine in which a work head is detachably provided, and obtains the head-related information described above from a device external to the substrate working machine. The description of the system described in this section will be omitted for parts that overlap the above description. The head related information external storage unit corresponds to, for example, a computer-based device that performs a database-like function. As described above, the head related information includes head configuration specification information, head status information, and the like, and the database can be properly used according to the type of the information. For example, a database that stores production histories related to the substrate work machine and the work head, an apparatus device database that stores various information related to devices, devices, and the like that constitute the substrate work machine are used. Therefore, the number of head related information external storage units is not limited to one and may be plural. Further, the head related information recognition unit may be provided in the substrate working machine, or may be provided in a device separate from the substrate working machine. In the case of being provided as a separate device, for example, when a management device mainly composed of a computer that plays a host role for controlling and managing a plurality of substrate work machines is arranged in the system, the management is performed. A device may function as the separate device, or a device that performs the database function may function as the separate device.

  The on-board working system of the present invention can be implemented in a mode in which the head related information recognition unit includes at least one of the configuration specification information recognition unit and the status information unit as described above. Moreover, it can also be implemented in a mode including any one or more of the above-described head suitability determination unit, head correspondence unit, and position information acquisition unit. In that case, each of those units may be provided in the substrate working machine, or may be provided in the separate apparatus. The system described in this section may be implemented in a mode in which the above-described work heads can be replaced, a mode in which the work heads of different configurations can be exchanged, or a mode in which the substrate work machine is limited to a component mounting machine. it can.

(41) Preparation for use of a work head for a substrate working machine that is detachably mounted on the substrate working machine and is operated to perform a preset operation on the circuit board. A program executed by a computer to perform processing for
A unique information reading step of reading unique information about the working head from the unique information recording medium provided in the mounted working head;
And a head-related information recognition step for recognizing head-related information, which is information related to the work head, based on the read unique information.

(42) In the paragraph (41), the head related information recognition step includes a configuration specification information recognition step of recognizing head configuration specification information which is a specification related to a configuration of the mounted work head as the head related information. The work head use preparation processing program for a to-substrate work machine as described.

(43) The head use preparation processing program is based on the recognized head configuration specification information in a driver storage unit in which a work head driver, which is software for enabling operation of the mounted work head, is stored. The work head use preparation processing program for a substrate work machine according to (42), further comprising a head corresponding step for storing a work head driver corresponding to the mounted work head.

(44) A position at which the head use preparation processing program acquires component position information, which is position information related to the work operation of the component of the mounted work head, based on the recognized head configuration specification information The work head use preparation processing program for a substrate work machine according to (42) or (43), including an information acquisition step.

(45) The head related information recognizing step includes a status information recognizing step of recognizing head status information which is information relating to a status of the mounted work head as the head related information. The work head use preparation processing program for a substrate working machine according to any one of the above.

(46) The head use preparation processing program includes a head suitability determination step for determining suitability of the mounted work head based on the recognized head status information. Work head use preparation processing program.

  The various aspects related to the work head use preparation processing program for a substrate working machine according to the present invention include a preparation process for performing a work using the attached work head in the work substrate using the work head that is detachable. It is the aspect regarding the program for automating. Since these descriptions are the same as those described above, descriptions thereof are omitted here. In addition, each said aspect is implemented in the aspect which can replace | exchange the above-mentioned work head, the aspect which can be exchanged between the work heads of a different structure, and the board | substrate work machine to a component mounting machine. You can also.

(51) Arranged side by side in the direction in which the circuit boards are transported, each as a work head for carrying out the substrate work, (a) an application head for carrying out the adhesive application work, (b) component mounting work A mounting head for performing the inspection, and (c) one of the inspection heads selected from the inspection heads for performing the inspection work can be mounted, and among the coating head, the mounting head, and the inspection head, A plurality of substrate work machines configured to be exchangeable with other ones,
Each of the plurality of substrate work machines sequentially performs a substrate operation corresponding to the work head mounted on each of the plurality of substrate work machines with respect to one conveyed circuit board. Work system.

(52) Arranged side by side in the direction in which the circuit boards are transported, each serving as a work head for carrying out the substrate work, (a) a coating head for carrying out the adhesive coating work, (b) component mounting work A mounting head for performing the inspection, and (c) one of the inspection heads selected from the inspection heads for performing the inspection work can be mounted, and among the coating head, the mounting head, and the inspection head, Using multiple anti-substrate work machines configured to be interchangeable with others,
The counter substrate is characterized by causing each of the plurality of counter substrate work machines to sequentially execute a counter substrate operation corresponding to the work head mounted on each of the plurality of counter substrate work machines. Work method.

It is a perspective view showing the whole composition of the substrate working machine which is an embodiment of the present invention. It is a perspective view which shows the structure of the work module which comprises a substrate working machine. It is a perspective view which shows the conveyor unit arrange | positioned by the work module. It is a perspective view which shows the board | substrate working apparatus arrange | positioned at the work module. It is a perspective view which shows some things of the mounting head which can be equipped with a substrate working apparatus. It is a perspective view which shows one of the mounting heads which can be equipped. It is a perspective view for demonstrating the mounting mechanism to the head moving apparatus of a mounting head. It is sectional drawing which shows the head fixing device for fixing a mounting head. The block diagram regarding control of the module control apparatus arrange | positioned at each work module is shown. It is a schematic diagram which shows a mode that the to-substrate working machine has been arrange | positioned in a factory. It is a flowchart which shows the head use preparation process program performed when a working head is mounted | worn. It is a flowchart which shows the head related information recognition process routine in a head use preparation process program. It is a flowchart which shows the head suitability determination processing routine in a head use preparation processing program. It is a flowchart which shows the calibration process routine in a head use preparation process program. It is a conceptual diagram for demonstrating the method to calculate the height position of the mounted mounting head. It is a conceptual diagram for demonstrating the measuring method of the rotation center of a mounting unit. It is a conceptual diagram for demonstrating the method of calculating the index rotation center of a mounting unit. It is a functional block diagram for demonstrating the function of the module control apparatus regarding a head use preparation process.

  Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. In addition to the embodiments described below, the present invention can be claimed in various aspects including various modifications and improvements based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. Can be implemented.

<Configuration of working machine for substrate>
FIG. 1 is an overall perspective view of a substrate working machine according to an embodiment of the present invention. The substrate work machine 1 includes a base module 10, a plurality (eight) of work modules 12 arranged on the base module 10 so as to be adjacent to each other and aligned, and the base module 10 and the work module 12 being separated from each other. And a control module 13 as a work machine control device. The work modules 12 have substantially the same configuration in hardware except for a work head described later, and the direction in which they are arranged is the direction in which the circuit boards are conveyed. In the description of the substrate work machine 1, the direction in which the work modules 12 are arranged is referred to as the left-right direction, and the direction orthogonal thereto is referred to as the front-rear direction. That is, the left front in the figure is the front, that is, the front side of the substrate work machine 1, and the right rear is the rear, that is, the back side. Further, the left side of the work machine 1 with respect to the substrate is the upstream side and the right side is the downstream side, and the circuit board is transported from the work module 12 located on the left side toward the work module 12 located on the right side. In turn, the work on the substrate in each work module 12 is executed.

  Each of the work modules 12 arranged on the substrate work machine 1 is assumed to have a function as a work machine for the board, and each of the work modules 12 is related to the present invention. However, in the present embodiment, the substrate working machine is handled as an assembly of work modules 12. Each work module 12 can also be equipped with work heads such as an adhesive application head and an inspection head. However, in order to simplify the description, in this embodiment, circuit parts such as electronic parts are used as work heads. Only a mounting head for mounting is mounted. Therefore, the work module 12 is a mounting module, and the substrate work machine 1 is a component mounting machine. In the following description, when focusing on component mounting, the on-board working machine 1 may be referred to as the component mounting machine 1 and the work module 12 may be referred to as the mounting module 12, and the names may be properly used.

  FIG. 2 is an enlarged view of a portion where the two mounting modules 12 are arranged, and the right mounting module 12 is shown with an exterior plate or the like removed. As shown in this figure, each mounting module 12 includes a frame 14 that functions as a module housing, and various devices and the like disposed on the frame 14. For example, a plurality of tape feeders (hereinafter sometimes abbreviated as “feeders”) 16 that are arranged side by side as component supply devices and each supply one circuit component at a predetermined component supply position. A conveyor unit 20 as a substrate holding device that fixes and holds a circuit board at a predetermined work position, and a work head 21. The work head 21 is moved in the work area and the work is performed. The substrate working apparatus 20 or the like that causes the head 21 to perform the substrate work. In the present embodiment, the work head 21 is a mounting head that holds and takes out the circuit components supplied from the feeder 16 and mounts the circuit components on a circuit board fixed to the conveyor unit 20. 22 functions as a mounting device. In the following description, when focusing on component mounting, the work head 21 may be referred to as the mounting head 21 and the substrate working apparatus 22 may be referred to as the mounting apparatus 22, and the names may be properly used.

  The mounting module 12 includes a component camera 24 (CCD) mainly functioning as a component imaging device between a group of a plurality of feeders 16 (hereinafter sometimes referred to as “feeder group”) 18 and a conveyor unit 20. A nozzle stocker 25 as a component holding device storage device for storing a suction nozzle, which is a component holding device described later, and a nozzle tip height detector 27 described later are provided. Furthermore, each mounting module 12 has a module control device 26 (see FIG. 9) for controlling itself, and the module control device 26 operates while controlling each of the above devices. Each of the mounting modules 12 is provided with an operation / display panel 28 as an input / output device in the upper portion, and this operation / display panel 28 is connected to the module control device 26, and an operator input for various commands, information, etc. And the display of information on the status of the mounting module 12 and its constituent elements.

  Each of the plurality of feeders 16 is roughly divided into a feed mechanism unit 40 and a reel holding unit 42. The reel holding unit 42 holds a reel 46 around which taping (which is called electronic component taping in the case of an electronic component), which is a taped circuit component, is wound. The feed mechanism section 40 has a drive source therein, and the taping extending from the reel 46 is fed by the feed mechanism section 40 at a component holding pitch corresponding to the operation of the mounting apparatus 22 and the cover tape is peeled off. Then, the circuit components are supplied one by one at the component supply position. Since the feeder 16 and the taping have a well-known mechanism and configuration, the description here is to this extent.

  As shown in FIG. 3, the conveyor unit 20 mainly includes a conveyor device, and includes two conveyor devices, a front conveyor 72 and a rear conveyor 74. Each of the front conveyor 72 and the rear conveyor 74 includes two opposed conveyor rails 76, 78, 80, and 82. The conveyor belts 76, 78, 80, and 82 are conveyor belts that are not shown in the figure. The circuit board 86 is supported by the conveyor belt and transported. The conveyor unit 20 is provided in each of the plurality of mounting modules 12, and each of the conveyor units 20 is arranged on a straight line in the component mounting machine 1. The conveyor units 20 of the respective mounting modules 12 can transport the circuit board in cooperation with each other. That is, these conveyor units 20 constitute a board transfer device in the component mounter 1. The conveyor rails 78, 80, and 82 other than the conveyor rail 76 can be moved in the front-rear direction by a conveyor width adjusting motor 88. The conveyor width can be freely adjusted, and the front conveyor 72, the rear conveyor 74, By using only one of these, it is possible to transport a circuit board having a large width.

  The circuit board 86 transferred to the work area by controlling and driving the conveyor motor 84 is stopped at the work position which is the set stop position. The conveyor unit 20 has a circuit board support plate (hereinafter sometimes abbreviated as “support plate”) 90 that can be moved up and down by a lifting device (not shown) at the lower portion. The support pin is omitted so that it can be changed to any position. When the support plate 90 is raised, the circuit board 86 is raised by being supported by the support pin, and the engagement with the conveyor belt is released. At the same time, the circuit board 86 is fixed at the working position by being sandwiched between a part of the conveyor rails 76, 78, 80 and 82 and the support pins 90. To release the fixation, the support plate 90 may be lowered. From such a configuration, the conveyor unit 20 functions as a substrate holding device in the mounting module 12.

  As shown in FIG. 4, the mounting apparatus 22 includes a mounting head 21 and a head moving device 102 (which functions as a mounting head moving device) that moves the mounting head 21 along substantially one plane in the work area. Composed. The head moving device is a kind of relative moving device that relatively moves the mounting head 21 and the circuit board held by the conveyor unit 20. The mounting head 21 will be described in detail later. The head moving device 102 is an XY robot type moving device, and a Y slide device 112 as a Y direction moving device for moving the mounting head 21 in the front-rear direction (Y direction), and an X for moving in the left-right direction (X direction). And an X slide device 114 as a direction moving device. The Y slide device 112 is provided on a beam 116 that forms a part of the frame 14, and moves the Y slide 120 along the Y guide 122 via a ball screw mechanism by driving a Y axis motor 118. The X slide device 114 is provided on the Y slide 120, and moves the X slide 128 along the X guide 130 via a ball screw mechanism by driving an X axis motor 126. The mounting head 21 is configured to be mounted on an X slide 128 as a work head mounted member. A mechanism relating to this mounting will also be described later. The mounting head 21 is moved across the feeder group 18 and the circuit board fixed in the conveyor unit 20 by the head moving device 102. The X slide 128 is provided with a mark camera 132 (which is a CCD camera) below the X slide 128. The mark camera 132 functions as a board imaging device and images a reference mark or the like attached to the surface of the circuit board. The mark camera 132 is moved together with the mounting head 21 by the head moving device 102.

<Work head configuration, removal method, etc.>
In the present embodiment, the mounting head 21 which is a work head can be attached to and detached from the head moving device 102, and can be selected and mounted from a plurality of members having different configurations. That is, the mounting apparatus 22 can replace the mounting head 21 with a different type. FIG. 5 shows three mounting heads 21a, 21b, and 21c as an example of the work head 21 that can be mounted. If each is demonstrated easily, the mounting head 21a shown to Fig.5 (a) is the mounting head 21 of the type which is equipped with the mounting unit 140 which generally makes a shaft shape, and rotates them by index rotation. Briefly describing the operation of the mounting head 21a, the mounting unit 140 has a suction nozzle 142 as a component holding device for sucking and holding components at the lower end thereof. With the mounting head 21a positioned above the feeder group 18, one of the mounting units 140 is lowered, and the suction nozzle 142 of the mounting unit 140 holds the circuit components supplied at the component supply position of the feeder 16. The circuit component is taken out. The mounting unit 140 is intermittently rotated, and each mounting unit 142 sequentially takes out the circuit components. With each mounting unit 140 holding circuit components, the mounting head 21 a is moved above the circuit board fixedly held by the conveyor unit 20. Above the circuit board, one mounting unit 140 located at a position lowered when the component is taken out is lowered, and the circuit parts held by the mounting unit 140 are placed on the surface of the circuit board. The mounting unit 140 is intermittently rotated, and the circuit components held by the mounting units 140 are sequentially placed on the circuit board. The mounting head 21a is a mounting head 21 that performs such an operation, and is a mounting head 21 suitable for high-speed mounting of relatively small circuit components. In addition, although illustration is abbreviate | omitted, the thing in which the number of mounting units 140 to equip as the mounting head 21 of the same format as the mounting head 21a differs exists.

  The mounting head 21c shown in FIG. 5C is the mounting head 21 equipped with one mounting unit 140. The mounting unit 140 is lowered above the feeder 16 and above the circuit board, so that the feeder 16 and the circuit board are mounted. One circuit component is mounted in one round trip. Although the mounting head 21c has a relatively slow mounting speed, the mounting head 21c can also be equipped with a relatively large suction nozzle 142, and can mount a large circuit component or a special-shaped circuit component. 21. The mounting head 21b shown in FIG. 5B is a mounting head having two mounting units 140, and is a mounting head 21 having intermediate characteristics between the mounting head 21a and the mounting head 21c. Of the two mounting units 140, the front mounting unit 140 has a plurality of suction nozzles 142 arranged radially around an axis perpendicular to the axis of the mounting unit 140. The nozzle to be used is selected by being rotated around its axis. The mounting module 12 can be mounted with one module arbitrarily selected from the mounting head 21 and the like described above according to the form of mounting work. The mounting head 21 mounted in FIGS. 2 and 4 is a mounting head 21a.

  A more detailed configuration of the mounting head 21 will be described with reference to FIG. 6, taking the mounting head 21a as an example. The mounting head 21a includes a head main body 280 that serves as a housing of the head, various components and components disposed at various positions of the head main body 280, and a head cover 282 (see FIG. 5) that covers these components. It is configured to include. FIG. 6 shows the head cover 282 removed.

  The mounting head 21a includes a plurality of, more specifically, eight mounting units 140, and each mounting unit 140 holds a suction nozzle 142 that is a circuit component holding device at the tip. Although not shown, each of the suction nozzles 142 is connected to negative pressure air and a positive pressure air passage via a positive / negative pressure selective supply device 292 (see FIG. 9), and the electronic component is brought to the tip by negative pressure. It has a structure in which the held electronic component is detached by being sucked and held and supplied with a slight positive pressure. The mounting unit 140 having a generally axial shape is held on the outer periphery of the unit holder 294 that rotates intermittently at an equiangular pitch so that the axial direction is the vertical direction. Each mounting unit 140 is capable of rotating and moving in the axial direction. The unit holding body 294 is driven by a unit holding body rotating device 298 having a holding body rotating motor 296 that is an electric motor (servo motor with encoder) as a driving source, and intermittently rotates by an angle equal to the arrangement angle pitch of the mounting unit 140. The mounting unit 140 is intermittently rotated by being (also referred to as index rotation). In a unit lifting / lowering station (station located at the foremost position) that is one stop position of the mounting unit 140 in intermittent rotation, the mounting unit 140 positioned at that station is a unit lifting / lowering motor 300 that is an electric motor (servo motor with encoder). Is lifted and lowered by a unit lifting and lowering device 302 having a drive source. The operation of taking out the electronic components from the feeder 16 and the operation of the electronic components on the circuit board held by the conveyor unit 20 are performed by the mounting unit 140 located at the lifting station. Be lowered. Further, each mounting unit 140 is rotated by a unit rotation device 306 having a unit rotation motor 304, which is an electric motor (servo motor with encoder), as a drive source for the purpose of adjusting the mounting direction of the suctioned and held circuit components. Be made. The plurality of mounting units 140 have a structure that can rotate all at once. The above is the main configuration of the mounting head 21a.

  The structures of the mounting heads 21b and 21c, which are the other mounting heads 21, are the same, but there is a difference in structure depending on the configuration. If only the difference is demonstrated, the mounting head 21c is a thing of the structure provided with only one mounting unit 140, and does not have the unit holding body rotating apparatus 298 of the roller with which the mounting head 21a is provided. Further, the mounting head 21b has two mounting units 140 and can be moved up and down independently, and thus has two unit lifting devices. Furthermore, in one mounting unit 140, the suction nozzle A nozzle selection device for selecting 142 is provided.

  As described above, the mounting head 21 is detachably attached to the X slide 128 and attached to the head moving device 102. Hereinafter, a mechanism related to mounting of the mounting head 21 will be described. FIG. 7 shows a perspective view from the back side of the mounting head 21 (FIG. 7A) and a perspective view from the front side of the X slide 128 (FIG. 7B).

  In the mounting head 21, the back surface portion 330 of the head main body 280 constitutes an attachment portion, and the front portion 332 of the X slide 128 constitutes an attachment portion. The back portion 330 of the head main body has two leg portions 334 at the lower portion and an engagement block 336 at the upper portion. On the other hand, the front part 332 of the X slide 128 has a leg support part 338 that supports the leg part 334 at the lower part, and two lower engaging rollers 340 slightly above the leg part support part 338. Yes. Further, a head fixing device 342 (see FIG. 4) is provided at the upper portion of the front portion 332 of the X slide 128 so as to hook and fix a part of the engagement block 336, and slightly below the head fixing device 342. Is provided with an engagement hole 346 that has two upper engagement rollers 344 and allows the engagement block 336 to enter. In a state where the mounting head 21 is mounted, the back surface portion 330 of the head main body 280 and the front surface portion 332 of the X slide 128 are made to fit almost exactly.

  The leg 334 has a wedge-shaped tip, and is fitted to a leg support 338 having a V shape. Thereby, the vertical position of the mounting head 21 is defined. In addition, the opposing side surfaces of the portion where the distance between the upper portions of the leg portions 334 is made to engage closely with the outer peripheral surfaces of the two lower engaging rollers 340, and both side surfaces of the engaging block 336 However, the position of the mounting head 21 in the left-right direction is defined by the two upper engaging rollers 344.

  FIG. 8 shows a cross section of the head fixing device 342. 8A is a cross section cut at the center in the left-right direction of the X slide 128, and FIG. 8B is a cross section taken along the plane AA in FIG. 8A. The head fixing device 342 has a structure in which a latching pin 362 is engaged with a latching roller 360 (see FIG. 7) provided on the upper part of the engagement block 336. More specifically, the head fixing device 342 includes a latch pin 362 that is supported by a pin hole 364 provided at the upper portion of the front portion 332 so as to be vertically movable, and a latch pin operating device 366 that moves the latch pin 362 up and down. It is comprised including. The latch pin actuating device 336 includes a slightly flexible rod 368, a disc-shaped cam plate 370 fixedly provided at one end of the rod 368 in an eccentric state with respect to the rod 368, a rod The rod 368 is configured to include a generally pipe-shaped rod support member 372 that rotatably supports 368 and a grip 374 that is fixedly provided at the other end of the rod 368 and rotates the rod 368. The latch pin actuating device 336 is attached to the upper portion of the front portion 332 of the X slide 128 in the rod support member 372 (see FIG. 7). A groove 376 having a width slightly larger than the outer diameter of the cam plate 370 is formed on the upper portion of the latch pin 362, and the cam plate 370 is engaged with the groove 376. When the grip 374 is rotated, the latch pin 362 operates up and down. Note that the latch pin actuating device 366 has a shape in which the rod support member 372 is bent so that the grip 374 is positioned downward in order to facilitate the operation of the grip 374.

  When mounting the mounting head 21, the grip 374 is rotated in one direction (in the present embodiment, counterclockwise when viewed from the front), and the back pin 330 of the mounting head 21 is moved upward. Is closely engaged with the front portion of the X slide 128, and in this state, the grip 374 is rotated in the opposite direction (clockwise as viewed from the front in this embodiment). By operating the grip 374, the latch pin 362 is lowered, and an inclined surface 378 formed on the lower end portion of the latch pin 362 is brought into contact with the outer periphery of the latch roller 360 before the lowest end. Further, by rotating the grip 374, the latch pin 362 latches the latch roller 360 in a state of pressing the mounting head 21 downward and pressing backward by the action of the inclined surface 378. The state is maintained by a frictional force generated between the outer periphery of the cam plate 370 and the lower surface of the groove 376. In order to maintain the state more reliably, the latch pin actuating device 336 includes a torsion spring 380. And the torsion spring 380 biases the rod 368 in the direction in which the latch pin 362 is directed downward. In order to detach the mounting head 21, the grip 374 may be rotated in the opposite direction.

  In the present embodiment, the work module 12 can be provided with various work heads 21, but any work head 21 has the same structure regarding the mounting mechanism, and the mounted work head 21. Can be detached with one touch, and any work head 21 can be attached with one touch. In addition, the work head 21 can be controlled by the module control device 26 in a mounted state. For this reason, power lines, control lines, and the like for driving each component included in the work head 21 are connected to the head moving device 102, but these wirings can also be connected with a connector that is not shown in one touch. Is called. Further, the work head 21 includes a memory chip 400 (see FIG. 5) as a unique information recording medium for recording its own unique information, and this memory chip 400 can also be connected to the module control device 26. . The memory chip 400 is a RAM chip backed up by a battery, and various information can be rewritten. Information recorded in the memory chip 400 and the use of the information will be described later.

<Specifications of work head, etc.>
The mounting head 21 of this embodiment is a miniaturized working head. In particular, the width dimension (the length in the substrate transport direction (X direction length) in the mounted state is called the width of the mounting head 21. x in FIG. 4) is small, and is 60 mm or less. Among the three types of mounting heads 21, the mounting head 21a which is an index rotation type mounting head is used for mounting relatively small circuit components. The mounting head 21a is arranged so that the suction nozzle 142 is centered on one circle, and the diameter of the circle is 40 mm or less. The width dimension of the X slide 128 to which the mounting head 21 is mounted is also the same as the width dimension of the mounting head 21. In this embodiment, the mark camera 132 which is a board imaging device is provided not on the mounting head 21 but on the X slide 128, but in a direction perpendicular to the width direction (Y direction, that is, movement of the X slide 128). In the direction perpendicular to the direction). This also contributes to reducing the width of the X slide 128. The mounting module 12 of the present embodiment has a relatively narrow length, that is, a width in the board conveyance direction. However, circuit components can be mounted by reducing the width dimensions of the mounting head 21 and the X slide. The range in the width direction is relatively large.

  Further, even the index rotation type mounting head 21a having the heaviest weight among the three types of mounting heads 21a, 21b, and 21c has a weight of about 2 kg. As described above, the separation of the mark camera 132 from the mounting head 21 also contributes to the weight reduction of the mounting head 21. On the other hand, the weight of the entire X slide 128 including the mark camera 132 is also about 2 kg. Therefore, in the head moving device 102 which is an XY robot type moving device, the X slide device 114 is an object to be moved. The weight of the combination of the mounting head 21 and the X slide 128 is 5 kg or less, and the load on the head moving device 102 is relatively small. As a result, the mounting head 21 can be moved at high speed, and the productivity of the mounting module 12 is high. Further, since the mounting head 21 and the like are reduced in weight, the mounting device 22 is reduced in vibration and energy saving.

<Control devices, etc.>
The substrate work machine 1 includes a module control device 26 provided in each work module 12 to control each work module 12, and a control module 13 as a work machine control apparatus that controls each work module 12 in an integrated manner. However, each module control device 26 has a central part for controlling the work. FIG. 9 is a block diagram relating to the control of the module control device 26, focusing on the portions closely related to the present invention.

  The module control device 26 is a control device having a computer 410 as a main component. The computer 410 includes a PU (processing unit) 412, a ROM 414, a RAM 416, an input / output interface 418, and a bus 420 that connects them to each other. Have. Each input / output interface 418 is connected to each feeder 16, the conveyor unit 20, and the head moving device 102 arranged as the feeder group 18 via each drive circuit 422. Further, the module control device 26 has a head drive circuit 424 for driving the work head 21, and the work head 21 is connected to the input / output interface 418 via the head drive circuit 424. In addition, the component camera 24 and the mark camera 132 are connected to the input / output interface 418 via the control circuit 426, and are captured via the image processing unit 428 that performs image processing on the imaging data obtained by them. . An operation / display panel 28 and an external storage device 430 mainly composed of a hard disk are also connected to the input / output interface 418. The substrate working machine 1 is configured such that each of the plurality of work modules 12 exchanges various signals and operates, so that the other work modules 12 are connected to the input / output interface 418 via the communication circuit 432. Is connected. In addition, the control module 13 serving as a host of the module control device 26 is also connected via the communication circuit 432, and communication of signals, information, and the like is possible between them. That is, each work module 12 and the control module 13 are connected to each other via the LAN 434. The external storage device 430 stores a basic operation program of the work module 12, application programs such as a mounting program corresponding to the circuit board, various data related to the circuit board, circuit components, etc. At this time, necessary ones of them are transferred to the RAM 416 and stored, and mounting work or the like is performed based on the stored contents of the RAM 416.

  The work head 12 will be described in detail. The block diagram of FIG. 9 shows a state in which the mounting head 21a is attached as the work head 12, and the head drive circuit 424 includes a positive / negative pressure selection and supply device 292, a holder rotation. The motor 296, the unit raising / lowering motor 300, the unit rotation motor 304, and the like are connected. Depending on the type of work head 12 to be mounted, the actuator, drive source, etc. connected to the head drive circuit 424 will be different. The same applies to the feeder 16, the conveyor unit 20, and the like, but the devices and devices such as the work head 12 are driven by a driver that is software for operating them. A dedicated driver is prepared according to the configuration of the device, device, or the like. The driver of the working head 12 is a working head driver, and there is a dedicated one for the mounting head 12a. The various drivers are stored in a driver storage unit that is a part of the external storage device 430. For example, when the mounting head 12a is mounted, a dedicated head driver is read out and the driver is transferred to the RAM 416. An operation program corresponding to the mounting head 12a is constructed. Further, the memory chip 400 included in the work head 12 is also connected to the input / output interface 418 so that information can be exchanged with the computer 410.

  The control module 13, which is a work machine control device, is omitted from the block diagram, but mainly includes a computer including a PU, a ROM, a RAM, an input / output interface, and the like. Etc., having a communication function for exchanging various signals and data with each work module 12, playing a role of managing each work module 12 in an integrated manner, and necessary for the substrate work machine 1 It also serves as a database for various types of data. A mounting program or the like for each work module 12 is distributed from the control module 13. Further, as will be described next, the control module 13 also has a function of performing communication between the substrate work machine 1 and the outside.

  FIG. 10 schematically shows a state in which the substrate working machine 1 is arranged in the factory. In the figure, three anti-substrate working machines 1 of the same type are arranged. Each on-board work machine 1 is connected so as to be able to exchange information with each other, and can also exchange information with various management computers having various database functions (in the figure, two of 440 and 442 are shown). It is connected to the. The substrate work machine 1 and the management computers 440 and 442 are also connected by the LAN 444. There are various types of management computers, such as those having a database function relating to work programs corresponding to circuit boards, and those having a database function for storing data relating to various circuit component specifications, as shown in FIG. In addition, the production device management 440 having a database function relating to the production history relating to each substrate work machine 1, and the device device management functioning as a database of information relating to devices, devices such as work heads and feeders, etc. A computer 442. From the viewpoint of exchanging the work head 21, these two management computers 440 and 442 store head related information, which is information related to the head for each work head 21, stored outside the substrate work machine 1. It functions as an information external storage unit. The production information of the substrate work machine 1 is sent to the production history management computer 440, which includes which work head 21 is used for the work. Also, the inspection result information of the worked circuit board is also sent to the production history management computer 440, and the defect rate for each work head 21 is managed as one of the production history. The production history management computer 440 and the device / device management computer 442 will be described in detail later.

<Component mounting work>
A component mounting operation by one mounting module 12 to which the mounting head 21a is mounted will be briefly described. The circuit board transferred from the upstream side is stopped by the conveyor unit 20 at a set work position in the work area. The stopped circuit board is fixed and held by the conveyor unit 20 when the circuit board support plate 90 is raised by the lifting device at that position. Next, the mark camera 132 is moved above the reference mark attached to the circuit board by the head moving device 102 and images the reference mark. A shift in the holding position of the held circuit board is detected from the imaging data.

  Next, the mounting head 21a is moved above the feeder group 18, and the circuit components are sucked and held by the suction nozzle 142 in accordance with the set extraction order. Specifically, the mounting unit 140 located at the lifting station is positioned above the component extraction position of the feeder 16 that supplies the circuit components to be held, and the mounting unit 140 is lowered at that position. Negative pressure is supplied to the suction nozzle 142 held at the tip, and the circuit component is sucked and held. Then, the mounting unit 140 is intermittently rotated, and a similar component extraction operation regarding the next mounting unit 140 is performed. In this manner, component extraction operations (in many cases, eight times) are sequentially performed on the mounting unit 140 included in the mounting head 21a.

  Next, the mounting head 21 a holding the circuit component is moved above the component camera 24. At that position, the component camera 24 images the held circuit component within one field of view. A shift in the holding position of each circuit component is detected from the obtained imaging data. Subsequently, the mounting head 21a is moved to above the circuit board, and the circuit components held on the surface of the circuit board are placed according to the set mounting order. Specifically, first, the mounting unit 140 located in the unit lifting / lowering station is positioned above an appropriate placement position. At this time, the movement position of the mounting head 26 is optimized based on the detected holding position deviation amount of the circuit board and the holding position deviation amount of the circuit component. At that position, the mounting unit 140 is lowered by a predetermined distance, positive pressure is supplied to the suction nozzle 142, and the held circuit component is placed on the surface of the circuit board. Subsequently, the mounting unit 140 is intermittently rotated, and a similar placement operation regarding the next mounting unit 140 is performed. In this manner, the component placement operation is sequentially performed on the mounting unit 140 that holds the circuit components. Prior to the lowering of the mounting unit 140 in the mounting operation of each mounting unit 140, the mounting direction set for the circuit component held by the mounting unit 140 and the detected circuit board holding position deviation amount Based on the amount of displacement of the holding position of the circuit component, it is rotated to an appropriate rotational position, thereby optimizing the placement direction of the circuit component.

  Until all the scheduled circuit components have been mounted, the mounting head 21a is reciprocated between the feeder group 18 and the circuit board, and the component extraction operation and the component placement operation are repeated. After the mounting of all circuit components is completed, the support plate 90 of the conveyor unit is lowered by the lifting device, and the fixed holding of the circuit board is released. The circuit board is transferred downstream by the conveyor unit 20. In this way, the component mounting work by the mounting module 12 scheduled on the circuit board is completed.

  In the component mounter 1 in which a plurality of such mounting modules 12 are arranged, the component mounting operation by all the mounted modules 12 is completed, and the component mounting by the component mounting machine 1 on one circuit board is completed. As described above, in the component mounter 1, the circuit boards are sequentially transported sequentially from the upstream side to the downstream side over each of the plurality of mounting modules 12, and each of the plurality of mounting modules 12 is mounted on each of the mounting modules 12. The parts are mounted by executing the work. Then, a plurality of circuit boards are successively carried into the upstream mounting module 12, so that each circuit board is successively mounted, and the circuit boards that have been mounted from the downstream mounting module 12 are successively installed. It is carried out to. In addition, the loading and unloading of the circuit board to and from the component mounting machine 1 are performed by placing a loading machine and a loading machine mainly composed of a conveyor device beside the mounting modules 12 on the most upstream side and the most downstream side, You can do that.

<Preparation process associated with mounting the work head>
As described above, the work module 12 can replace the work head 21. When the work head 21 is newly attached, the work module 12 prepares to use the work head 21. Hereinafter, the preparation process accompanying the mounting of the work head 21 will be described by taking as an example the case where the mounting head 21a is mounted.

  The preparatory work associated with the mounting is performed by the module control device 26 of the work module 12 to which the work head 21 is mounted. Specifically, the head use preparation processing program stored in the ROM 414 of the module control device 26 is stored in the computer 410. This is done by executing. FIG. 11 shows a flowchart of the head use preparation processing program. If the preparation process is described according to this flowchart, when the mounting head 21a is mounted, first, the mounting head 21a is recognized in Step 1 (hereinafter abbreviated as S1. The same applies to other steps). Specifically, the configuration of the mounting head 21a is recognized by recognizing head-related information such as head configuration specification information regarding the configuration specifications of the mounting head 21a and head status information regarding status. , The state is recognized. Next, in S2, whether or not the mounting head 21a is used is determined based on the recognized head related information. If it is determined that use is inappropriate, the operator is notified of this fact and the preparation process is terminated. If it is determined to be appropriate, a work head driver suitable for the mounting head 21a is selected in S3, and the mounting head 21a is made operable. Subsequently, in S4, an adjustment regarding the index rotation of the mounting unit 140 is performed based on the recognized head specification information. In S5, a predetermined suction nozzle 142 is attached to the tip of each mounting unit 140. After the suction nozzle 142 is attached, calibration is performed in S6. To put it simply, the calibration is a process for adjusting and fixing the position of the mounting head 21a in the work operation, specifically, the position command value, in order to deal with the mounting error of the mounting head 21a. The head use preparation process is performed according to the flow described above. Below, the detail of each process is demonstrated for every process.

i) Head Related Information Recognition The head related information recognition process in S1 is performed according to the head related information recognition process routine shown in the flowchart of FIG. First, in S11, the head storage information stored in the memory chip 400 provided in the mounting head 21a is read. That is, this step is a unique information reading step. The head storage information is unique information regarding the mounting head 21a. Specifically, in addition to head ID data indicating the ID of the head, head format data indicating the type of the head, and each mounting unit 140 included in the head. Arrangement angle pitch data (hereinafter also referred to as “unit arrangement angle data”), height data with respect to the reference position of the suction nozzle mounting portion of each mounting unit 140 (hereinafter referred to as “unit height data”). Etc.) are included. The unit arrangement angle data and the unit height data are a kind of information related to the arrangement positions of the components included in the mounting head 21a.

  Next, in S12, data relating to the mounting head 12a is read from the above-described device / device management computer 442 based on the head ID data read in S11. The device / device management computer stores various information related to various devices, devices, etc. existing in the factory in a database. The read head ID data is transmitted to the device / device management computer 442 via the control module 13. The device device management computer 442 searches for the head ID as a key, and transmits necessary information regarding the mounting head 21 a to the module control device 26 via the control module 13. In this way, necessary information is read out. Information acquired from the device / device management computer 442 includes unit arrangement angle data, unit height data, and the like, which are head configuration specification information. The device / device management computer 442 also stores maintenance related information of various devices and devices in association with the head ID. Specifically, it is data relating to the date and time of the last maintenance, data relating to the operation time of the device and device since the last maintenance (hereinafter sometimes referred to as “operation time after maintenance”), and the like. In S12, the post-maintenance operating time information for the mounted mounting head 12a is read as one of the head status information.

  Next, in S13, data relating to the mounting head 12a is read from the production history management computer 440 described above based on the head ID data read in S11. The production history management computer 440 stores production history information of various anti-substrate work machines existing in the factory in a database. This production history information includes data relating to the defect rate. In S <b> 13, the module control device 26 transmits the head ID data and the module ID data of the mounting module 12 to which the mounting head 21 a is mounted to the production history management computer 440 via the control module 13. The production management computer 440 uses the head ID as a key from the information stored in itself, and uses a defective rate in a period retroactive for a predetermined time from the present of the mounting head 21a (hereinafter referred to as “predetermined period defective rate”). Data related to the module predetermined period, which is a predetermined period defective rate when mounted on the mounting module 12, using the head ID and the module ID as keys. Then, the production history computer 440 transmits the created predetermined period failure rate data and the predetermined module failure rate data for the mounting head 21 a to the module control device 26 via the control module 13. In S13, predetermined period defect rate information and module predetermined period defect rate information, which are a kind of head status information, are read in this way.

  In subsequent S14, information relating to the head configuration specifications is recognized among the information read in S11 and S12. Specifically, first, the unit arrangement angle data and unit height data stored in the memory chip 400 and the data stored in the device / device management computer 442 are compared, and they are matched. It is confirmed that This is a measure of concern that the data has not been updated when adjustment, maintenance, etc. are performed while the mounting head 12a is not mounted. The data of the device / device management computer 442 is rewritten by the data stored in the memory chip 400. The confirmed unit arrangement angle data and unit height data are stored in the head configuration specification information storage unit, which is a predetermined area of the RAM 416, together with the head format data, etc., thereby completing the recognition of the head configuration specification information. To do. Subsequently, of the information read in S11 to S13, information related to the head status is recognized. Specifically, the post-maintenance operation time data read in S12, the predetermined period failure rate data and the module predetermined period failure rate data read in S13, are head status information storage that is a predetermined area of the RAM 416. Stored in the department. This completes the recognition of the head status information.

ii) Head Suitability Determination The head suitability determination process in S2 is performed by executing a head suitability determination process routine shown in the flowchart of FIG. First, in S21, determination based on the head type is performed. In the module control device 26, a mounting program related to component mounting work performed by the mounting module 12 is already stored in the mounting program storage unit, which is a predetermined area of the RAM 416. In S21, by comparing the stored head format data with the contents of the mounting program, it is determined whether or not the mounted mounting head 21a has a format suitable for execution of the mounting program. . If it is determined that the format is suitable, the next step S22 is executed. In S22, the mounting head 21a is determined based on the operation time after maintenance. Specifically, when the stored operation time after maintenance exceeds a predetermined use limit time, it is determined that maintenance is necessary, and it is inappropriate to stop using the mounting head 21a. A determination is made that there is. If it is within the use limit time, it is determined to be suitable to allow use.

  When it is determined in S22 that the use is permitted, in the subsequent S23, a determination based on the defect rate for a predetermined period is made. Specifically, when the stored defect rate for a predetermined period exceeds the limit defect rate set for the circuit board to be mounted, it is determined that the defect rate is inappropriate. If it is determined in S22 that it is suitable, a determination is made in S24 based on the failure rate for a predetermined period of time for the module. In other words, this determination can be said to determine the compatibility between the work module 12 and the work head 21. As in the case of S23, it is determined that the failure rate for the predetermined period of time for the module exceeds the limit failure rate set for the circuit board used for mounting. Here, the determinations of S23 and S24 are determined based on the limit defect rate set for the circuit board on which the mounting operation is performed, and the value is a value unique to the circuit board. For example, when high-precision work is required, the marginal defect rate is set low. This limit defect rate is described in a part of the mounting program and is read out from the mounting program data.

  If it is determined in S24 that it is suitable, the next S3 is executed, but if it is determined in any of S21 to S24 that it is inappropriate, the mounting head is determined in S25. The operator is notified that 21a is inappropriate. Specifically, the notification is made by displaying the fact that the operation / display panel 28 is inappropriate and the cause thereof. After the notification is made, the execution of the head use preparation processing program ends. Based on the notification, the operator can take a measure such as removing the mounting head 12a, preparing another mounting head 12 and mounting it.

iii) Driver selection, index rotation adjustment and nozzle installation In S3, a driver is selected. As described above, the external storage device 430 stores various drivers corresponding to the various work heads 21. In S3, the format of the mounted mounting head 12a, which has been recognized previously. Based on the data, a driver corresponding to the format is selected, transferred to the RAM 416, stored in the driver storage unit, and an operation program corresponding to the mounting head 12a is stored in the operation program area of the RAM 416. It is built. As a result, the operation of the mounting head 12a can be controlled.

  After the driver is selected, in S4, an adjustment regarding the index rotation of the mounting unit 140 is made. First, one mounting unit 140 set in advance as a reference unit is positioned at the position of a design lifting station. The rotation stop position of the unit holder 294 in this state is a stop position at which the reference unit is positioned at the lifting station. Next, the unit holding body 294 is rotated based on the recognized unit arrangement angle data, and the other mounting units 140 are sequentially positioned at the lifting station. The rotation stop position of the unit holding body 294 is detected in a state where each mounting unit 140 is located in the lifting station, and this rotation stop position is stored in the holding body rotation stop position storage unit which is a predetermined area of the RAM 416. When each mounting unit 140 is moved to the lifting station position, the unit holding body 294 is operated to stop the rotation at the stored rotation stop position. This adjustment is a measure for avoiding manufacturing errors occurring in each mounting head 21 from affecting the accuracy in the mounting operation, and adjusting the operating position of the mounting head 21a based on the head configuration specification information. It is one of. This index rotation position adjustment is also a kind of calibration process.

  In next S5, the suction nozzle 142 is attached to each mounting unit 140 of the mounting head 12a. Part of the mounting program describes the nozzle to be used, and the suction nozzle 142 to be attached is determined according to the description. After this determination, the mounting head 21a is moved above the nozzle stocker 25 described above, and the mounting units 140 are sequentially lowered while rotating the index, so that the suction nozzles 142 stored in a predetermined storage position are stored. Are attached to a predetermined mounting unit 140. The suction nozzle 142 is also managed by ID, and in S5, which suction nozzle 142 is attached to each mounting unit 140, that is, the nozzle ID data is stored in the attachment nozzle information storage section which is a predetermined area of the RAM 416. Remembered. In association therewith, length data (described later) of each attached suction nozzle 142 is also stored.

iv) Calibration The calibration in S6 is performed by executing a calibration processing routine shown in the flowchart of FIG. First, in S61, the position of the tip of the suction nozzle 142 attached to the reference unit which is one of the mounting units 140 is detected. As for the nozzle tip position, the mounting head 21a is moved to a position where the reference unit is located above the nozzle height detector 27 in a state where the reference unit is located at the lifting station. In this position, the reference unit is slowly lowered. The upper surface of the nozzle height detection tool 27 is a reference height position in the mounting module 12, and the detection tool 27 is configured to detect that the suction nozzle 142 is in contact with the upper surface. The reference unit is lowered until the tip of the suction nozzle 142 is positioned at the reference height position, and the downward stroke from the rising end of the reference unit is measured. That is, in this step, the descending stroke of the reference unit is used as a detection value for the nozzle tip position.

Next, in S62, the head height position, which is the height position where the mounting head 21a is mounted, is calculated. FIG. 15 is a conceptual diagram for calculating the head height position. The aforementioned reference height position is indicated by H ₀ , and the design mounting height position of the mounting head 21 a is indicated by H ₁ . As described above, the unit height data of each mounting unit 140 is already stored in the RAM 416. Unit height data, assuming the mounting head 21a is mounted on the mounting height position H ₁ of the design, the virtual reference nozzle (the nozzle length l _0: nozzle length from the suction nozzle mounting portion of the mounting unit Is stored as the lowering stroke L of the mounting unit 140 when the tip of the reference nozzle is positioned at the reference height position H ₀ . As shown in FIG. 15A, the reference unit is L ₁ . Further, as described above, the actual nozzle length l of the attached suction nozzle 142 is already stored in the RAM 416, and the length of the suction nozzle 142 attached to the reference unit is l ₁ . is there. As shown in FIG. 15B, when the mounting head 21a is mounted at the designed mounting height position, the measured downward stroke of the reference unit is L ₁ '= L ₁ − (l ₁ − l ₀ ). However, if the actually measured descending stroke is L ₁ ″, it can be seen that the mounting head 21a is displaced from the designed position by the mounting head 21a. According to FIG. It can be seen that the actual mounting height position 21a is H ₂ and there is a mounting error of ΔH = H ₂ −H ₁ = L ₁ ″ −L ₁ ′. In S62, the mounted head height position is calculated by calculating the mounting error ΔH. The calculated mounting error ΔH is stored in a head mounting height error storage unit that is a predetermined area of the RAM 416.

In subsequent S63, the mounting position of each mounting unit 140 is adjusted. The unit height data L _{1 to} L ₈ (subscripts 1 to 8 indicate the number of the mounting unit, the same shall apply hereinafter) of each mounting unit 140 that has already been stored, and the suction nozzle 142 attached to each of them. Based on the nozzle lengths l ₁ to l ₈ and the mounting error ΔH previously calculated, the command position for the subsequent raising / lowering of each mounting unit 140 is determined.

  Next, in S <b> 64, the rotation center of each mounting unit 140 is measured from the image data captured by the component camera 24. It is expected that the suction nozzle 142 is not coaxial with the rotation center of the mounting unit 140 due to bending or the like. Therefore, as conceptually shown in FIG. 16, the tip position N1 of the suction nozzle 142 at the rotation position that is the reference of the mounting unit 140 and the mounting unit 140 that are obtained as a result of imaging and the mounting unit 140 from the reference rotation position are 180 °. From the tip position N2 of the suction nozzle 142 at the rotated position, the rotation center R of the mounting unit 140 is obtained. Specifically, the midpoint of the line segment connecting N1 and N2 is recognized as the rotation center R. In S <b> 64, first, in order to fit all the mounting units 140 within one field of view of the component camera 24, the mounting head is positioned at a position where the center of the index rotation of the mounting unit 140 on the design is located on the optical axis of the component camera 24. 21a is moved. At that position, the mounting unit 140 located at the elevating station is rotated, and the rotation center R is measured by the method described above. While the position of the mounting head 21a is fixed, the mounting units 140 are sequentially index-rotated, and the rotation center of each mounting unit 140 is measured. At this time, the mounting position of each mounting unit 140 is adjusted so that the height of the tip of the suction nozzle 142 of each mounting unit 140 is set to the lowest position, and imaging is performed. Is called. Incidentally, the component camera 24 is arranged so that the tip height of the suction nozzle 142 at this time is near the deepest position in the depth of field range of the component camera 24.

Next, in S65, the position in the horizontal plane of the mounted mounting head 21a is calculated based on the measurement result of the rotation center R obtained in S64. Specifically, the center of index rotation of the mounting unit 140 is calculated. FIG. 17 is a conceptual diagram for explaining calculation of index rotation. As described above, the unit arrangement angle data θ _{1 to} θ ₈ is already stored, and based on the arrangement data θ _{1 to} θ ₈ , the measured rotation center R is developed on a single plane. Is possible. R _{1 to} R ₈ shown in FIG. 17 are rotation centers of the mounting units 140 developed on one plane, and the index rotation center O ′ is approximated from these rotation centers R _{1 to} R ₈ by geometric calculation. Is calculated automatically. Next, the calculated position of the index rotation center O ′ is compared with the position of the index rotation center O when the mounting head 21a is mounted at the designed position. In FIG. 17, it is shifted by ΔX in the left-right direction and shifted by ΔY in the front-rear direction. The mounting error (ΔX, ΔY) that is the amount of deviation is stored in the index rotation center position error storage unit of the RAM 416.

If the index rotation center O ′ is calculated, the rotation center of each mounting unit 140 based on the center O ′ is calculated. Deviations (Δx ₁ , Δy ₁ ) to (Δx ₈ , Δy ₈ ) of the actual rotation centers of the mounting units 140 from the calculated rotation centers are obtained. As will be described later, this deviation is also used for adjusting the movement position of the mounting head 21a.

Next, in S66, as in S64, another rotational center of each mounting unit 140 is measured by imaging with the component camera 24. The rotation center measured in S66 is a rotation center obtained based on data obtained by imaging the suction nozzle 142 at the tip height position different from that in S64. In S64, the suction nozzle 142 is positioned near the deepest part in the depth of field range of the component camera 24, and in S66, the image is captured near the shallowest part. That is, the imaging is performed at a position where the tip position of the suction nozzle 142 is lower than the previous position. Since the specific measurement method is the same as in S64, the description thereof is omitted. However, the rotation center of each mounting unit 140 having a different lift position is obtained by two measurements. As a result, in addition to the previous deviations (Δx ₁ , Δy ₁ ) to (Δx ₈ , Δy ₈ ) of each mounting unit 140, another deviation (Δx ₁ ′, Δy ₁ ′) in a state where the lift position is different is used. (Δx ₈ ′, Δy ₈ ′) is obtained.

  In S67, based on the error (ΔX, ΔY) of the index rotation center of the mounting unit 140 and the above two deviations (Δx, Δy), (Δx ′, Δy ′) of each mounting unit 140 (subscripts are omitted), The movement position of the mounting head 21a is adjusted. More specifically, the deviation at each of the different lift positions has already been obtained, and together with the deviation obtained here, the inclination of each mounting unit 140 can be estimated from those deviations. That is, even when each mounting unit 140 is moved up and down to an arbitrary lift position, the deviation from the theoretical position of the rotation center at the lift position can be estimated by a geometric method. Then, the mounting head 21a can be moved to an accurate movement position according to the lift position of the mounting unit 140 in consideration of the mounting error (ΔX, ΔY) that is the amount of deviation of the index rotation center position. Can be performed with high accuracy. Two deviations (Δx, Δy) and (Δx ′, Δy ′) of each mounting unit 140 are stored in a unit deviation storage unit which is a predetermined area of the RAM 416, and a subsequent movement position command of the mounting head 21a is based on them. The value is determined.

<Functional block of module control device>
In the present embodiment, the preparation process associated with the mounting of the work head 21 is performed by executing the head use preparation process program in the module control device 26 as described above. The configuration of the module control device 26 relating to this processing will be described from a functional aspect. FIG. 18 shows a functional block diagram of the module control device 26. In order to correspond to the above description, the following description will be given on the assumption that the mounting head 21a is mounted.

  The module control device 26 mainly has four processing units for the head use preparation process. One of them is a head-related information recognition unit 500, and the head-related information recognition unit 500 is configured to include a portion that performs the head-related information recognition process of S1. The head related information is recognized based on the information that the memory chip 400 as the unique information recording medium provided in the mounting head 21a has, that is, the unique information of the mounting head 21a as the head storage information. The head related information recognition unit 500 includes a configuration item information recognition unit 502 and a status information recognition unit 504. The configuration specification information recognition unit 502 is a portion that recognizes head configuration specification information such as head format data, unit arrangement angle data, and unit height data, and corresponds to a portion that executes S12, S14, and the like. Further, the status information recognition unit 504 is a part for recognizing head status information such as post-maintenance operation time data, predetermined period failure rate data, and module predetermined period failure rate data, and executes S12, S13, S15, and the like. The part corresponds. In the head related information recognition, necessary information is acquired from the information of the device device management computer 440 and the production history management computer 442 as the head related information external storage unit using the head ID as a key, and as a result, the head related information is obtained. It is recognized. Corresponding to the head related information recognition unit 500, a head configuration specification information storage unit 508 and a head status information storage unit 510 for storing the information are provided in the head related information area of the RAM 416.

  The module control device 26 includes a head suitability determination unit 512 as another one of the four processing units. The head suitability determination unit 512 is a part that determines whether or not the mounted mounting head 21a is suitable for use, and corresponds to a part that executes S2. Based on the recognition result of the head related information recognition unit 500, it is determined whether or not the mounting head 21a is suitable for use. The head suitability determination unit 512 can be broadly divided into two. One of them is a part that makes a determination based on the head format data that is the head configuration specification information and the contents of the mounting program stored in the mounting program storage unit 514 of the RAM 416, and the other is the head. This is a part for making a determination based on status information, that is, operation time data after maintenance, predetermined period failure rate data, and module predetermined period failure rate data.

  The module control device 26 includes a head corresponding unit 516 as another one of the four processing units. In short, the head corresponding unit 516 is a part that performs a preparation process for enabling control of the mounting head 21a corresponding to the mounted mounting head 21a, and the processing corresponding to the head depends on the mounting head 21a. The work head driver is stored in the driver storage unit 520 provided in the operation program area 518 of the RAM 416. The head corresponding unit 516 corresponds to a part that executes the above S3 and the like.

  The module control device 26 further includes a position information acquisition unit 522 as one of the four processing units. The position information acquisition unit 522 is a part that acquires component element position information, which is position information related to the work operation of the component of the mounting head 21a, based on the recognized head component specification information, so-called calibration or the like. It is a part to do. The position information acquisition unit 522 corresponds to a portion that executes S4, S6, and the like in the head use preparation process described above. Based on the nozzle length data relating to the attached suction nozzle 142 stored in the attached nozzle information storage unit 524 of the RAM 416, the unit arrangement angle data recognized previously, the unit height data, etc. Element position information is acquired. At that time, measurement results such as an imaging result by the component camera 24 and a detection result by the nozzle tip height detector 27 are used as needed. In the head use preparation process, as the component position information, the holder rotation stop position with respect to the index rotation of each mounting unit 140, the head mounting height error ΔH of the mounting head 21a, and the index rotation center position error (ΔX, ΔY). , Data such as the unit deviation (Δx, Δy) of each mounting unit 140 is acquired as the component position information. These acquired data are stored in the component position information area 526 of the RAM 416, the holder rotation stop position storage unit 528, the head mounting height error storage unit 530, the index rotation center position error storage unit 532, and the unit deviation storage. Each of them is stored in the unit 534 and the like, and is used in operation control of the mounting head 21a.

1: Board work machine (component mounting machine) 12: Work module (mounting module)
21: Work head (mounting head) 21a, 21b, 21c: Mounting head 22: Substrate work device (mounting device) 24: Component camera 26: Module control device 27: Nozzle height detector 28: Operation / display panel 102: Head moving device 112: Y slide device (Y direction moving device) 114: X slide device (X direction moving device) 128: X slide (work head mounted member) 132: Mark camera (substrate imaging device) 140: Mounting unit 142 : Adsorption nozzle 294: Unit holder 298: Unit holder rotation motor 302: Unit lifting device 306: Unit rotation device 330: Back surface (head body) 332: Front portion (X slide) 334: Leg portion 336: Engagement Joint block 338: Leg support 340: Lower engaging roller 342: Head fixing 344: Upper engaging roller 360: Latching roller 362: Latching pin 366: Latching pin actuator 400: Memory chip 410: Computer 416: RAM 424: Head drive circuit 440: Production history management computer (head related information outside) Storage unit) 442: Device device management computer (head related information external storage unit)
500: Head related information recognition unit 502: Configuration specification information recognition unit 504: Status information recognition unit 506: Head related information external storage unit 512: Head suitability determination unit 516: Head correspondence unit 520: Driver storage unit 522: Position information acquisition Part 526: Component position information area

In order to solve the above-mentioned problem,
A pair configured to be able to mount one arbitrarily selected from a plurality of different types of work heads and to be exchangeable with any other of the plurality of work heads. A substrate working machine,
A board-to-board working system comprising a management device for managing the board-to-board working machine,
A mounting unit in which the plurality of work heads include at least one or more mounting heads for performing a component mounting operation, and the one or more mounting heads have a component holding device for holding a component interchangeably at a lower end portion; A lifting device that lifts and lowers the mounting unit, and a rotating device that rotates the mounting unit.
The management apparatus includes a head-related information external storage unit that stores information on a work head mounted on the substrate work machine outside the substrate work machine.

In the substrate work system according to the present invention, the mounted work head can be replaced with any of a plurality of work heads . The plurality of work heads include the component holding device, the lifting device, and the rotation device. At least one mounting head provided is included, and information on the mounted work head is stored outside the work machine, so that the work system for a board of the present invention is convenient. It will be expensive.

Claims (7)

An anti-substrate work machine configured to be able to mount one arbitrarily selected from a plurality of work heads and replaceable with any other one of the plurality of work heads; ,
A board-to-board working system comprising a management device for managing the board-to-board working machine,
The management device is
An on-board work system comprising a head-related information external storage unit for storing information on each of the plurality of work heads outside the on-board work machine.   The on-board work system according to claim 1, wherein the management device functions as a database of information regarding each of the plurality of work heads.   The management device functions as a database of information related to the production history of the substrate work machine, and the head related information external storage unit indicates information indicating which of the plurality of work heads is used. The on-board work system according to claim 1 or 2, wherein the system is stored as information relating to a production history. The substrate work machine acquires work head ID information indicating the ID of the work head mounted, and sends the acquired work head ID information and production information related to production by the work head to the management device. Configured as
The head related information external storage unit is configured to store information related to each of the plurality of work heads in association with each ID based on the sent work head ID information and production information. The board | substrate working system of any one of Claim 1 thru | or 3.   5. The pair according to claim 1, wherein the head related information external storage unit stores information on the status of each of the plurality of work heads as information on each of the plurality of work heads. 6. Board work system.   The on-board work system according to claim 5, wherein the head related information external storage unit stores information on a defect rate of work by each of a plurality of work heads as information on the status. 7. The on-board work system according to claim 5, wherein the head related information external storage unit stores information related to an operation time of each of the plurality of work heads as information related to the status.

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