JP2013102626A - プリント基板積層体 - Google Patents
プリント基板積層体 Download PDFInfo
- Publication number
- JP2013102626A JP2013102626A JP2011245111A JP2011245111A JP2013102626A JP 2013102626 A JP2013102626 A JP 2013102626A JP 2011245111 A JP2011245111 A JP 2011245111A JP 2011245111 A JP2011245111 A JP 2011245111A JP 2013102626 A JP2013102626 A JP 2013102626A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- insulating plate
- printed
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 230000008878 coupling Effects 0.000 abstract 3
- 238000010168 coupling process Methods 0.000 abstract 3
- 238000005859 coupling reaction Methods 0.000 abstract 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 9
- 238000005476 soldering Methods 0.000 description 8
- 230000005484 gravity Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920006694 PBT-G Polymers 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
- Combinations Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】二枚のプリント基板12,14に介在される絶縁板16に、複数の連結壁20が公差されてなる格子状部22を設けると共に、該連結壁20から前記二枚のプリント基板12,14の少なくとも一方に向けて突出する複数の支持リブ26a,26b,26cによって、前記連結壁20を前記二枚のプリント基板12,14に対して隙間64a,64bを隔てて位置するようにした。
【選択図】図1
Description
Claims (5)
- 二枚のプリント基板が絶縁板を介して積層されていると共に、夫々に半田付けされた複数の基板間端子で相互に接続されているプリント基板積層体において、
前記絶縁板には、複数の連結壁が交差されてなる格子状部が設けられていると共に、該連結壁から少なくとも一方の前記プリント基板に向けて突出する複数の支持リブによって、前記連結壁が前記二枚のプリント基板に対して隙間を隔てて位置されている
ことを特徴とするプリント基板積層体。 - 前記複数の支持リブのそれぞれが、前記二枚のプリント基板の何れか一方のみに向けて突出されている
請求項1に記載のプリント基板積層体。 - 前記複数の連結壁の断面積が異ならされている
請求項1又は2に記載のプリント基板積層体。 - 前記格子状部における前記連結壁の間に、前記二枚のプリント基板の一方に設けられたリレーが収容されている
請求項1〜3の何れか1項に記載のプリント基板積層体。 - 前記絶縁板に、前記基板間端子を挿通して支持する台座が一体形成されている
請求項1〜4の何れか1項に記載のプリント基板積層体。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011245111A JP5748177B2 (ja) | 2011-11-09 | 2011-11-09 | プリント基板積層体 |
US13/652,088 US9036356B2 (en) | 2011-11-09 | 2012-10-15 | Printed circuit board laminate |
CN201210448090.1A CN103108488B (zh) | 2011-11-09 | 2012-11-09 | 印刷电路板层压体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011245111A JP5748177B2 (ja) | 2011-11-09 | 2011-11-09 | プリント基板積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013102626A true JP2013102626A (ja) | 2013-05-23 |
JP5748177B2 JP5748177B2 (ja) | 2015-07-15 |
Family
ID=48223529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011245111A Active JP5748177B2 (ja) | 2011-11-09 | 2011-11-09 | プリント基板積層体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9036356B2 (ja) |
JP (1) | JP5748177B2 (ja) |
CN (1) | CN103108488B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015115565A (ja) * | 2013-12-16 | 2015-06-22 | 住友電装株式会社 | マイコン実装用プリント基板及びそれを用いた制御装置 |
JP2019201529A (ja) * | 2018-05-18 | 2019-11-21 | 本田技研工業株式会社 | 電力変換装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10561039B2 (en) * | 2016-08-22 | 2020-02-11 | Woodward, Inc. | Frame for printed circuit board support in high vibration |
CN109041406B (zh) * | 2018-08-21 | 2024-07-02 | 新乡市荣泰电器有限公司 | 空间紧凑型大电流线路板模组及运输车辆用保险丝盒 |
JP7163812B2 (ja) * | 2019-02-15 | 2022-11-01 | 住友電装株式会社 | コネクタ |
CN111083899B (zh) * | 2019-12-19 | 2021-08-06 | 远峰科技股份有限公司 | 车载娱乐主机箱及车载娱乐主机 |
GB2628604A (en) * | 2023-03-30 | 2024-10-02 | Rolls Royce Deutschland Ltd & Co Kg | Holding down construction for a printed circuit board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297562A (ja) * | 1994-04-15 | 1995-11-10 | Whitaker Corp:The | ジャンクションボックス及びその基板組立体 |
WO2006104037A1 (ja) * | 2005-03-28 | 2006-10-05 | The Furukawa Electric Co., Ltd. | メタルコア基板の補強構造及び電気接続箱 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4721363B2 (ja) | 2007-07-17 | 2011-07-13 | 住友電装株式会社 | 基板と端子材の接続構造 |
JP5212019B2 (ja) * | 2008-10-28 | 2013-06-19 | 住友電装株式会社 | 電気接続箱および該電気接続箱の組立方法 |
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2011
- 2011-11-09 JP JP2011245111A patent/JP5748177B2/ja active Active
-
2012
- 2012-10-15 US US13/652,088 patent/US9036356B2/en active Active
- 2012-11-09 CN CN201210448090.1A patent/CN103108488B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297562A (ja) * | 1994-04-15 | 1995-11-10 | Whitaker Corp:The | ジャンクションボックス及びその基板組立体 |
WO2006104037A1 (ja) * | 2005-03-28 | 2006-10-05 | The Furukawa Electric Co., Ltd. | メタルコア基板の補強構造及び電気接続箱 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015115565A (ja) * | 2013-12-16 | 2015-06-22 | 住友電装株式会社 | マイコン実装用プリント基板及びそれを用いた制御装置 |
WO2015093232A1 (ja) * | 2013-12-16 | 2015-06-25 | 住友電装株式会社 | マイコン実装用プリント基板及びそれを用いた制御装置 |
JP2019201529A (ja) * | 2018-05-18 | 2019-11-21 | 本田技研工業株式会社 | 電力変換装置 |
Also Published As
Publication number | Publication date |
---|---|
US20130114217A1 (en) | 2013-05-09 |
US9036356B2 (en) | 2015-05-19 |
JP5748177B2 (ja) | 2015-07-15 |
CN103108488B (zh) | 2015-11-04 |
CN103108488A (zh) | 2013-05-15 |
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