JP2013102160A - コイル部品の製造方法 - Google Patents
コイル部品の製造方法 Download PDFInfo
- Publication number
- JP2013102160A JP2013102160A JP2012244185A JP2012244185A JP2013102160A JP 2013102160 A JP2013102160 A JP 2013102160A JP 2012244185 A JP2012244185 A JP 2012244185A JP 2012244185 A JP2012244185 A JP 2012244185A JP 2013102160 A JP2013102160 A JP 2013102160A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic layer
- manufacturing
- coil component
- external electrode
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 64
- 238000005498 polishing Methods 0.000 claims abstract description 38
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 14
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- 239000002002 slurry Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000003113 alkalizing effect Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
【解決手段】フェライト基板101、該フェライト基板に設けられた導体ライン110,120及び該導体ラインの電気的な外部接続のための外部電極141,142を備えるコイル部品の製造方法であって、外部電極を覆うように磁性層130をコーティングするステップと、該外部電極に磁性層の一部が残留するように、磁性層の表面を機械研磨方式で平坦化するステップと、該残留された磁性層を化学研磨方式で除去して該外部電極を露出させるステップとを含む。
【選択図】図3a
Description
102 絶縁層
105 フォトレジスト層
110 第1の導体ライン
120 第2の導体ライン
130 磁性層
131 残留磁性層
141 第1の外部電極
142 第2の外部電極
150 研磨部材
160 研磨容器
165 エッチング液
Claims (8)
- フェライト基板、該フェライト基板に設けられた導体ライン及び該導体ラインの電気的な外部接続のための外部電極を備えるコイル部品の製造方法であって、
前記外部電極を覆うように磁性層をコーティングするステップと、
前記外部電極に前記磁性層の一部が残留するように、前記磁性層の表面を機械研磨方式で平坦化するステップと、
前記残留された磁性層を化学研磨方式で除去して、前記外部電極を露出させるステップ
とを含むコイル部品の製造方法。 - 前記機械研磨方式によって前記外部電極に残留する磁性層は、前記外部電極の表面から1〜2μmの厚さを有する、請求項1に記載のコイル部品の製造方法。
- 前記機械研磨方式は、セラミックスバフ及びブラッシュバフのうちの少なくともいずれか一つを回転させて前記磁性層の表面を研磨する、請求項1または2に記載のコイル部品の製造方法。
- 前記回転の速度は、1800RPMである、請求項3に記載のコイル部品の製造方法。
- 前記化学研磨方式は、前記残留された磁性層をエッチング液にディッピングして行われる、請求項1に記載のコイル部品の製造方法。
- 前記ディッピングは、10〜30minの時間間行われる、請求項5に記載のコイル部品の製造方法。
- 前記エッチング液は、過マンガン酸カリウムを含む、請求項5または6に記載のコイル部品の製造方法。
- 前記磁性層は、フェライト、エポキシ及びポリイミドのうちのいずれか一つのポリマ材料を含む複合材料から成る、請求項1に記載のコイル部品の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0115191 | 2011-11-07 | ||
KR1020110115191A KR20130050057A (ko) | 2011-11-07 | 2011-11-07 | 코일 부품의 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013102160A true JP2013102160A (ja) | 2013-05-23 |
Family
ID=48223004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012244185A Pending JP2013102160A (ja) | 2011-11-07 | 2012-11-06 | コイル部品の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130112651A1 (ja) |
JP (1) | JP2013102160A (ja) |
KR (1) | KR20130050057A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017076735A (ja) * | 2015-10-16 | 2017-04-20 | Tdk株式会社 | コイル部品及びその製造方法、並びに、コイル部品が実装された回路基板 |
US10937589B2 (en) | 2017-03-29 | 2021-03-02 | Tdk Corporation | Coil component and method of manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014207636A1 (de) | 2014-04-23 | 2015-10-29 | Würth Elektronik eiSos Gmbh & Co. KG | Verfahren zum Herstellen eines Induktionsbauteils und Induktionsbauteil |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208936A (ja) * | 1999-01-13 | 2000-07-28 | Ngk Spark Plug Co Ltd | プリント配線板の製造方法 |
JP2000232016A (ja) * | 1999-02-10 | 2000-08-22 | Nissin Kohki Co Ltd | 磁気印加装置及びその製造方法 |
JP2001284125A (ja) * | 2000-03-29 | 2001-10-12 | Kawasaki Steel Corp | 平面磁気素子 |
JP2005109083A (ja) * | 2003-09-30 | 2005-04-21 | Tdk Corp | コイル部品 |
JP2007305982A (ja) * | 2006-05-09 | 2007-11-22 | Samsung Electro Mech Co Ltd | 微細回路形成のためのプリント基板の製造方法 |
JP2011091097A (ja) * | 2009-10-20 | 2011-05-06 | Tdk Corp | コイル部品 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0793406B1 (en) * | 1996-02-29 | 2005-12-28 | Tokyo Ohka Kogyo Co., Ltd. | Process for producing multilayer wiring boards |
TW200507218A (en) * | 2003-03-31 | 2005-02-16 | North Corp | Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module |
US7250114B2 (en) * | 2003-05-30 | 2007-07-31 | Lam Research Corporation | Methods of finishing quartz glass surfaces and components made by the methods |
DE112007001172T5 (de) * | 2006-05-15 | 2009-07-02 | Mitsubishi Plastics, Inc. | Laminiertes Material für ein metallisches Tasten-Sheet, metallisches Tasten-Sheet und metallisches Tastenfeld |
US8451083B2 (en) * | 2010-05-31 | 2013-05-28 | Tdk Corporation | Coil component and method of manufacturing the same |
-
2011
- 2011-11-07 KR KR1020110115191A patent/KR20130050057A/ko not_active Application Discontinuation
-
2012
- 2012-11-06 JP JP2012244185A patent/JP2013102160A/ja active Pending
- 2012-11-07 US US13/670,991 patent/US20130112651A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000208936A (ja) * | 1999-01-13 | 2000-07-28 | Ngk Spark Plug Co Ltd | プリント配線板の製造方法 |
JP2000232016A (ja) * | 1999-02-10 | 2000-08-22 | Nissin Kohki Co Ltd | 磁気印加装置及びその製造方法 |
JP2001284125A (ja) * | 2000-03-29 | 2001-10-12 | Kawasaki Steel Corp | 平面磁気素子 |
JP2005109083A (ja) * | 2003-09-30 | 2005-04-21 | Tdk Corp | コイル部品 |
JP2007305982A (ja) * | 2006-05-09 | 2007-11-22 | Samsung Electro Mech Co Ltd | 微細回路形成のためのプリント基板の製造方法 |
JP2011091097A (ja) * | 2009-10-20 | 2011-05-06 | Tdk Corp | コイル部品 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017076735A (ja) * | 2015-10-16 | 2017-04-20 | Tdk株式会社 | コイル部品及びその製造方法、並びに、コイル部品が実装された回路基板 |
US10937589B2 (en) | 2017-03-29 | 2021-03-02 | Tdk Corporation | Coil component and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US20130112651A1 (en) | 2013-05-09 |
KR20130050057A (ko) | 2013-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3645528B2 (ja) | 研磨方法及び半導体装置の製造方法 | |
CN102656110B (zh) | 简化铜-铜键结 | |
JP2000091280A (ja) | 半導体研磨装置及び半導体基板の研磨方法 | |
KR20000016516A (ko) | 전자장치의 화학 기계적 평탄화 방법 및 장치 | |
JPH11111656A (ja) | 半導体装置の製造方法 | |
KR100222186B1 (ko) | 반도체장치의 제조방법 및 반도체제조장치 | |
JP2013102160A (ja) | コイル部品の製造方法 | |
TW201904720A (zh) | 化學機械研磨系統與方法 | |
KR20020022522A (ko) | 연마 장치 및 이 연마 장치에서 이용되는 연마 패드, 및연마 방법 | |
JP2013004910A (ja) | 埋め込み銅電極を有するウエーハの加工方法 | |
JP2013214558A (ja) | 配線基板およびその製造方法、並びに半導体装置およびその製造方法 | |
US7189155B2 (en) | Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method | |
CN107914213B (zh) | 一种化学机械研磨方法 | |
JP2008066601A (ja) | 基板処理方法、基板処理装置及び半導体装置 | |
CN105810649B (zh) | 半导体装置键合结构及其键合方法 | |
JP2021190642A (ja) | 電極形成方法 | |
JPH08323614A (ja) | 化学的機械研磨方法および装置 | |
JP2010278448A (ja) | シリコン・ポリシリコン表面の制御的パッシベーションのための研磨プラーテンリンス | |
TW200837824A (en) | Substrate polishing method, semiconductor device and fabrication method therefor | |
US20060219572A1 (en) | Abrasive Electrolyte | |
JPH09123059A (ja) | 研磨方法 | |
CN108068004B (zh) | 衬底研磨装置及方法 | |
KR100379552B1 (ko) | 반도체 소자의 화학적 기계적 평탄화 방법 | |
JPH0324730A (ja) | 絶縁膜の表面平坦化方法 | |
US20090305501A1 (en) | Method of fabricating semiconductor device using a chemical mechanical polishing process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20131204 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151016 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160715 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160726 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161025 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170214 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170919 |