JP2013098463A - Photoelectric conversion module and optical connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric conversion module in which a clearance of neighboring lead frames can be set narrow and which comprises lead frames that can be mounted with respect to an arrangement pattern of various lead connecting parts that a circuit board includes.SOLUTION: A photoelectric conversion module 2 comprises a package part 31 which internally holds an electric circuit component 5 including a photoelectric conversion element 51, a plurality of first lead frames 41 of which one end is connected electrically with the electric circuit component 5 inside of the package part 31 and of which the other end extends outward from the inside of the package part 31 in one direction, and a plurality of second lead frames 42 of which one end is connected electrically with the electric circuit component 5 inside of the package part 31 and of which the other end is curved in the middle and extends in the same direction as the first lead frames 41 while extending outward from the inside of the package part 3 reversely to the first lead frames 41.

Description

  The present invention relates to a photoelectric conversion module and an optical connector.

  Today, optical communication using an optical fiber or the like is widely used. In optical communication, an electrical signal is converted into an optical signal using a light-emitting photoelectric conversion element such as a semiconductor laser or a light-emitting diode, and an optical signal is converted using a light-receiving photoelectric conversion element such as a photodiode. Conversion to electrical signals is performed.

  Further, as shown in Patent Document 1 and the like, a photoelectric conversion module in which the above-described photoelectric conversion element and peripheral circuits for operating the photoelectric conversion element are combined into one package is widely known. The photoelectric conversion module disclosed in Patent Document 1 includes a package-like main body having a photoelectric conversion element (optical element) and a plurality of lead frames drawn only downward from the main body. Adjacent lead frames are spread in the front-rear direction so as to be separated from each other, and the lead frames are arranged in a so-called zigzag pattern. The photoelectric conversion module provided with such a lead frame is mounted on an external circuit board in which lead connection portions (for example, through holes and footprints) are formed in a staggered manner.

JP 2010-181523 A

  As described above, when the lead frames of the photoelectric conversion module are arranged in a so-called zigzag pattern, the interval between the lead frames adjacent to each other on the circuit board (and the pitch between the lead connection portions) becomes large, which is problematic. It has become. This is because, in the photoelectric conversion module, a space for the other lead frame that extends to the rear side is always included between the lead frames that are adjacent to each other in a state of spreading to the front side. is there. Further, in the photoelectric conversion module, since the arrangement pattern of the lead connection portions on the circuit board to be mounted is limited to a so-called zigzag pattern, the degree of freedom of the circuit pattern on the circuit board is lowered, which is a problem. It has become.

  An object of the present invention is to provide a photoelectric conversion module including a lead frame that can be mounted on various arrangement patterns of lead connection portions of a circuit board, in which the interval between adjacent lead frames can be set narrow. And an optical connector comprising the photoelectric conversion module.

  A photoelectric conversion module according to the present invention includes a package unit that internally holds an electric circuit component including a photoelectric conversion element, one end electrically connected to the electric circuit component in the package unit, and the other end from the package unit. A plurality of first lead frames extending outward along one direction, one end electrically connected to the electric circuit component in the package portion, and the other end extending in the opposite direction from the package portion to the first lead frame. A plurality of second lead frames that are bent in the middle and extend along the same direction as the first lead frame.

  In the photoelectric conversion module, the one direction is preferably a direction intersecting an optical axis direction of the photoelectric conversion element.

  In the photoelectric conversion module, it is preferable that the high-frequency signal line is assigned only to the first lead frame among the high-frequency signal line and the low-frequency signal line connected to the electric circuit component.

  The photoelectric conversion module includes a housing portion made of a synthetic resin that accommodates the package portion, and a metal shield member that covers an outer side of the housing portion, and the second lead frame includes an inner wall of the housing portion. It is preferable that they are in contact.

  The optical connector which concerns on this invention is equipped with the said photoelectric conversion module.

  According to the present invention, it is possible to set a gap between adjacent lead frames narrowly, and a photoelectric conversion module including a lead frame that can be mounted on various arrangement patterns of lead connecting portions of a circuit board, And an optical connector provided with the said photoelectric conversion module can be provided.

Sectional drawing which represented typically the cross-sectional structure along the optical axis direction of the optical connector which concerns on Embodiment 1. FIG. Explanatory diagram schematically showing the internal structure of the photoelectric conversion module Sectional drawing which represented typically the cross-sectional structure along the optical axis direction of the optical connector which concerns on Embodiment 2. FIG.

<Embodiment 1>
(Optical connector 1)
Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view schematically showing a cross-sectional configuration along the optical axis L direction of the optical connector 1 according to the first embodiment. The optical connector 1 according to the present embodiment is attached to an external circuit board 60 in which a conductive path (not shown) is formed by a printed wiring technique. The optical connector 1 mainly includes a photoelectric conversion module 2 (hereinafter sometimes simply referred to as a module 2), a housing portion 7, and a shield member 8. In the following description, the upper side in FIG. 1 is the upper side of the optical connector 1 and the like, and the lower side is the lower side. Further, the left side in FIG. 1 is assumed to be the front, and the right side in FIG. 1 is assumed to be the rear. The external circuit board 60 is formed with a plurality of through holes 61, 62, and 63 penetrating vertically. An annular land (not shown) formed by a printed wiring technique is formed at the hole edge of each through hole 61 or the like. In addition, conductive paths that are continuous with the lands are formed on the inner peripheral surfaces of the through holes 61, 62, and 63. The through holes (lead connection portions) 61 and 62 formed in the external circuit board 60 form a regular arrangement pattern in a matrix (so-called lattice shape).

(Housing 7)
The housing portion 7 is formed of a synthetic resin molded product having an insulating property, and has a box shape with an open front. The housing portion 7 is mainly provided with an opening 74 in the front, a substantially rectangular parallelepiped main body portion 71 for accommodating the module 2 inside, and the inside of the main body portion 71 is partitioned in the front-rear direction, and the tip portion of the module 2 And a holding wall 72 for holding the. Of the inside of the main body 71, the rear part (the part behind the holding wall 72) is a place for accommodating most of the module 2. Two through holes 73 into which the two protruding tip portions of the module 2 are inserted are provided in a substantially central portion of the holding wall 72. In FIG. 1, only one through hole 73 is shown. In addition, a front portion (a portion in front of the holding wall 72) of the inside of the main body 71 is a portion that fits with a tip portion of a mating connector (not shown) inserted from the front opening 74. ing. The mating connector holds an optical fiber 6 having a ferrule (not shown) attached to the tip. When the mating connector is fitted to the main body portion 71 of the optical connector 1, the distal end portion of the optical fiber 6 is inserted into a cylindrical hole 32 a provided in the distal end portion of the module 2, and the optical fiber 6 is Optically connected to the module 2 (photoelectric conversion element 51).

(Shield member 8)
The shield member 8 is formed by pressing a metal plate material into a predetermined shape, and as a whole, has a box shape in which the front and lower sides are opened. The shield member 8 is externally fitted to the housing part 7 so as to cover the outer surface of the housing part 7. The shield member 8 is in close contact with the housing portion 7. A plurality of connecting leg portions 81 projecting downward are formed at the lower end of the rear side of the housing portion 7. The connection leg 81 is connected to the conductive path of the external circuit board 60 by soldering (solder 64) while being inserted into the through hole 63 of the external circuit board 60. The shield member 8 has a function of electromagnetically shielding other surfaces except the front surface and the lower surface of the housing portion 7.

(Photoelectric conversion module 2)
The module 2 has a function of converting an optical signal received via an optical fiber 6 included in a counterpart optical connector into an electrical signal and outputting the electrical signal, and an optical fiber 6 by converting the input electrical signal into an optical signal. And a function of transmitting to other devices via the network. The module 2 is a synthetic resin main body mainly composed of two cylindrical portions 32 into which the tip end portions of the optical fibers 6 are inserted and one package portion 31 extending behind the cylindrical portions 32. 3, an electric circuit component 5 held inside the package unit 31, a first lead frame 41, and a second lead frame 42.

  As shown in FIG. 1, the main body portion 3 is accommodated in the housing portion 7 with the cylindrical portion 32 disposed in front of the housing portion 7 and the package portion 31 disposed in the rear thereof. Yes. There are two cylindrical portions 32, each having a light emitting side and a light receiving side. The cylindrical portion 32 is held in a state in which the distal end surface thereof faces the opening 74 of the housing portion 7 at the front and is inserted into the through hole 73 of the holding wall 72. Each cylindrical portion 32 is provided with a cylindrical bottomed hole 32a extending in the front-rear direction, and each of the two optical fibers 6 included in the mating connector is provided in the hole 32. The tip portions are respectively inserted.

  A lens (not shown) formed to bulge rearward is formed as a part of the main body portion 3 at the rear end portion of the cylindrical portion 32. A photoelectric conversion element 51 included in the electric circuit component 5 held in the package unit 31 is disposed behind the lens. That is, the lens is disposed on the optical path located between the cylindrical portion 32 and the photoelectric conversion element 51. Therefore, on the light emitting side, the light output emitted from the photoelectric conversion element 51 (51a) is condensed on the lower end surface of the optical fiber 6 by the lens, and on the light receiving side, the light output emitted from the optical fiber 6 is the lens. Thus, the light is condensed on the photoelectric conversion element 51 (51b).

  The package part 31 has a rectangular parallelepiped shape as a whole, and is housed in the housing part 7 in a state where it stands up with respect to the external circuit board 60. The package portion 31 holds the electric circuit component 5 therein and also holds the rear end portions (root portions) of the lead frames 41 and 42. The electric circuit components 5 are arranged in a state of being scattered in the vertical direction and the horizontal direction in the rear portion in the package portion 31. Further, the rear end portions (root portions) of the lead frames 41 and 42 are electrically connected to the electric circuit component 5. A plurality of first lead frames 41 are drawn to the outside of the package part 31 from the lower end of the rectangular parallelepiped package part 31. On the other hand, a plurality of second lead frames 42 are drawn out of the package part 31 from the upper end of the package part 31. The main body 3 such as the package 31 is integrally formed with the lead frames 41, 42, etc. by insert molding.

  The electric circuit component 5 includes a photoelectric conversion element 51 and components 52 (52a, 52b) and 53 (53b) that constitute peripheral circuits related to the operation of the photoelectric conversion element 51. The photoelectric conversion element 51 includes a light emitting side photoelectric conversion element (hereinafter referred to as light emitting element) 51a and a light receiving side photoelectric conversion element (hereinafter referred to as light receiving element) 51b. In the case of the present embodiment, the light emitting element 51a is composed of a VCSEL (Vertical Cavity Surface Emitting LASER), and the light receiving element 51b is composed of a photodiode. The light emitting direction (optical axis) of the light emitting element 51 a and the light incident direction (optical axis) of the light receiving element 51 b are both parallel to the plate surface of the external circuit board 60 and are along the front-rear direction of the optical connector 1. It has become a direction.

  FIG. 2 is an explanatory diagram schematically showing the internal configuration of the photoelectric conversion module 2. FIG. 2 schematically shows a cross-sectional configuration of the package part 31 cut along the left-right direction, and the electric circuit component 5 arranged on the rear side of the package part 31 is viewed from the front. It is shown. The light-emitting side electric circuit component 5 is assigned to the left side of the boundary line M extending in the vertical direction shown in FIG. 2, and the light-receiving side electric circuit component 5 is assigned to the right side of the boundary line M. Assigned. Further, as shown in FIG. 2, the interior of the rear end side of the package portion 31 has a rectangular shape that is long in the left-right direction, and the electrical circuit component 5, the first lead frame 41, and the second lead frame are formed therein. 42 are respectively held.

  The first lead frame 41 is made of metal, and has a plate shape that is elongated substantially. In the case of this embodiment, as shown in FIG. 2, eight first lead frames 41 are used. Of these first lead frames 41, five first lead frames 41 (41a, 41b, 41c, 41d, 41e) are electrically connected to the electric circuit component 5 on the light emitting side, and the remaining three lead frames 41 The first lead frame 41 (41f, 41g, 41h) is electrically connected to the electric circuit component 5 on the light receiving side. One end of each first lead frame 41 is thus electrically connected to each electric circuit component 5 in this way. Further, the other end of each first lead frame 41 extends straight in one direction from the lower end of the package portion 31 toward the outside (see FIG. 1). In the case of this embodiment, the first lead frame 41 extends straight along the direction intersecting with the optical axis L and the plate surface of the external circuit board 60, respectively. As shown in FIG. 2, the adjacent first lead frames 41 are kept at a predetermined interval. The leading end portion of the first lead frame 41 penetrates the lower portion of the main body portion 71 of the housing portion 7 and is exposed in a state of protruding from the housing portion 7.

  Similar to the first lead frame 41, the second lead frame 42 is made of metal and has a plate shape extending substantially elongated. However, the total length of the second lead frame 42 (the length of the portion protruding outward from the upper end of the package portion 31) is the total length of the first lead frame 41 (the length of the portion protruding outward from the lower end of the package portion 31). (See FIG. 1). In the case of this embodiment, as shown in FIG. 2, eight second lead frames 42 are used. Of these second lead frames 42, three second lead frames 42 (42a, 42b, 42c) are electrically connected to the electric circuit component 5 on the light emitting side, and the remaining five second leads. The frame 42 (42d, 42e, 42f, 42g, 42h) is electrically connected to the electric circuit component 5 on the light receiving side. One end of each second lead frame 42 is electrically connected to each electric circuit component 5 in this way. In addition, the other end of each second lead frame 42 extends straight from the upper end of the package portion 31 to the outside in a direction opposite to the first lead frame 41, and is approximately 90 ° at two points in the middle. After being bent, it extends straight along the same direction as the first lead frame (see FIG. 1). The second lead frame 42 is bent at about 90 ° at the first point from the front to the rear, and further bent at about 90 ° at the second point from the top to the bottom. As shown in FIG. 2, the adjacent second lead frames 42 are kept at a predetermined interval. Further, the leading end portion of the second lead frame 42 is exposed in a state of penetrating the lower portion of the main body portion 71 of the housing portion 7 and protruding from the housing portion 7. As shown in FIG. 2, the middle part of the second lead frame 42 is bent so as to pass from the upper side to the lower side of the module 2 (package part 31). That is, the second lead frame 42 is partially disposed between the module 2 (package portion 31) and the rear end portion of the housing portion 7 (main body portion 71), and the second lead The frame 42 is arranged so as to cover the back of the module 2 (package part 31) in a state where a predetermined interval is maintained with respect to the back of the module 2 (package part 31).

  As shown in FIG. 2, some of the first lead frames 41 and the second lead frames 42 are directly connected integrally. Specifically, on the light emitting side, the two first lead frames 41c and 41e and the two second lead frames 42b and 42c are connected to each other via metal plate-like portions 44 and 45 processed into a predetermined shape. Directly connected. A light emitting element 51a is mounted on the plate-like portion 44, and a component (IC chip) 52a constituting a peripheral circuit related to the operation of the light-emitting element 51a is mounted on the plate-like portion 45. Between the light emitting element 51a and the component 52a, between the component 52a and the first lead frame 41a, between the component 52a and the first lead frame 41b, between the component 52a and the first lead frame 41d, and between the component 52a and Wires 54 are arranged between the second lead frame 42 a and are electrically connected to each other using these wires 54. In addition, the above-described lens (not shown) disposed on the rear end side of the light emitting side cylindrical portion 32 is disposed in front of the light emitting element 51a.

  On the light receiving side, one first lead frame 41f and one second lead frame 42e are directly connected to each other through metal plate portions 46 and 47 processed into a predetermined shape. . A light receiving element 51b is mounted on the plate-like portion 46, and a component (IC chip) 52b constituting a peripheral circuit related to the operation of the light-receiving element 51b is mounted on the plate-like portion 47. Further, another component (electronic component) 53b is mounted across the adjacent second lead frame 42e and second lead frame 42f. Between the light receiving element 51b and the component 53b, between the component 53b and the first lead frame 41g, between the component 53b and the first lead frame 41h, between the component 53b and the second lead frame 42g, and between the component 53b and Wires 54 are respectively disposed between the second lead frame 42h and are electrically connected to each other using these wires 54. In addition, the above-described lens (not shown) disposed on the rear end side of the light receiving side cylindrical portion 32 is disposed in front of the light receiving element 51b.

  The first lead frame 41a on the light emission side is used as a signal line (high frequency signal line) for transmitting a high frequency signal input from the outside to the component 52a. The first lead frame 41b is also used as a signal line (high frequency signal line) for transmitting a high-frequency reverse phase signal to the first lead frame 41a. Of the other first lead frames 41 on the light emitting side, the first lead frames 41c and 41e are for ground (GND), and the remaining first lead frame 41d is for power supply (VCC). On the other hand, the second lead frame 41a on the light emitting side is used as a signal line (low frequency signal line) for transmitting the ON / OFF signal (low frequency signal) of the transmitter to the component 52a. The remaining two second lead frames 42b and 42c are both for ground (GND).

  The first lead frame 41g on the light receiving side is used as a signal line (high frequency signal line) for transmitting a high frequency signal output from the component 52b to the outside. The first lead frame 41h is also used as a signal line (high-frequency signal line) for transmitting a high-frequency reverse-phase signal to the first lead frame 41g. The remaining first lead frame 41f on the light receiving side is for ground (GND). On the other hand, the second lead frame 42h on the light receiving side is used as a signal line (low frequency signal line) for detecting a low frequency reception signal. Of the remaining second lead frames 42, the second lead frame 42e is for ground (GND), and the second lead frame 42f is for power supply (VCC). The second lead frame 42d and the second lead frame 42g are both electrically connected to other electric circuit components not shown, and both are used as low frequency signal lines and the like.

  The leading end portion (the other end portion) of each first lead frame 41 extends straight downward, and is inserted into the through hole 61 and soldered (solder 64) by soldering (solder 64). Connected to the conductive path. Similarly to the first lead frame 41, the leading end portion (the other end portion) of each second lead frame 42 also extends straight downward, and is soldered while being inserted into the through hole 62. (Solder 64) is connected to the conductive path of the external circuit board 60. As shown in FIG. 1, the position of the tip portion of the first lead frame 41 in the vertical direction) and the position of the tip portion of the second lead frame 42 (position in the vertical direction) are aligned with each other.

  The module 2 is supported in the housing portion 7 by a first lead frame 41 extending from the lower end of the package portion 31 and a second lead frame 42 extending from the upper end of the package portion 31 and bent so as to be folded halfway. Yes. Further, the module 2 is supported in the housing part 7 by an internal structure (not shown) of the housing part 7 other than the holding wall 72.

  In the photoelectric conversion module 2 having the above-described configuration, the interval between the adjacent first lead frames 41 and the interval between the adjacent second lead frames 42 are set to be narrower than those in the related art. It is possible. This is because it is not necessary to secure a space for forming the second lead frame 42 between the adjacent first lead frames 41. In addition, it is not necessary to secure a space for forming the first lead frame 41 between the adjacent second lead frames 42.

  In addition, the photoelectric conversion module 2 (optical connector 1) of the present embodiment can be mounted on the through holes (lead connection portions) 61 and 62 having a matrix arrangement pattern on the external circuit board 60. ing. The module 2 of the present embodiment appropriately arranges the arrangement (circuit) pattern of the lead frames 41 and 42 (the interval between the first lead frames 41, the interval between the second lead frames 42, etc.) as necessary. By changing it, it is possible to mount on an external circuit board having a lead connection portion having a so-called staggered arrangement pattern. Further, the module 2 can be mounted on an external circuit board having other lead connection portion arrangement patterns by appropriately setting the arrangement (circuit) patterns of the lead frames 41 and 42. Therefore, the photoelectric conversion module 2 of the present embodiment has a structure that can be mounted on an external circuit board having various lead connection portion arrangement patterns, and the arrangement patterns of the lead frames 41 and 42 (each lead The circuit pattern formed by the frames 41 and 42 has a high degree of freedom.

  In the module 2 and the optical connector 1 of the present embodiment, the high-frequency signal line is assigned only to the first lead frame 41 (41a, 41b, 41g, 41h). The second lead frame is assigned a low-frequency signal line and a power supply wiring (DC wiring, VCC, GND) that are wiring that does not generate high-frequency noise. The total length of the first lead frame 41 (the length from the lower end of the package portion 31 to the through hole 61) is shorter than the total length of the second lead frame 42 (the length from the upper end of the package portion 31 to the through hole 62). It is set (see FIG. 1). By assigning a high-frequency signal line to the first lead frame 41 having such a short overall length, generation of high-frequency noise due to the high-frequency signal line is suppressed. Further, by setting the high-frequency signal line to be short, it is difficult to be affected by external noise. In the present embodiment, a signal of 50 Mbps or higher is a high frequency signal, and a signal of less than 50 Mbps is a low frequency signal.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view schematically showing a cross-sectional configuration along the optical axis L direction of the optical connector 1A according to the second embodiment. The basic configuration of the optical connector 1A of the present embodiment is the same as that of the first embodiment. For this reason, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the optical connector 1A of the present embodiment, the shape of the second lead frame 42A that protrudes outward from the upper end of the photoelectric conversion module 2A is different from that of the first embodiment. Specifically, as shown in FIG. 3, the middle portion of the second lead frame 42 </ b> A is configured to contact the inner wall 71 a of the main body portion 71 in the housing portion 7. Similarly to the first embodiment, the second lead frame 42 </ b> A is drawn outward from the upper end of the package portion 31 in the direction opposite to the first lead frame 41. And like Embodiment 1, each is bent about 90 degree | times at two places in the middle. However, in the present embodiment, a portion (a second portion disposed in parallel with the plate surface of the external circuit board 60) disposed between the first bent portion and the second bent portion. The portion of the lead frame 42A) is set longer than that of the first embodiment, and the portion of the second lead frame 42A that extends straight downward from the top is in close contact with the inner wall 71a of the main body 71. Has been.

  When the second lead frame 42A is partially in close contact with the housing portion 7 as in the module 2A of the present embodiment, heat generated with the operation of the electric circuit component 5 is generated by the second lead frame. It moves to the housing part 7 through 42A, and further moves to the metal shield member 8 attached to the housing part 7, and finally discharged to the outside. In the present embodiment, the shield member 8 is positively functioned as a heat radiating member in addition to functioning as an electromagnetic shield. In this way, by bringing the second lead frame 42A into contact with the inner wall 71a of the housing part 7 (main body part 71), heat generated from the electric circuit component 5 can be easily transferred to the shield member 8, and The cooling efficiency (heat dissipation) of the module 2A (and the optical connector 2A) may be enhanced by positively using the attached metal shield member 6 as a heat dissipation member.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the first embodiment, the photoelectric conversion module 2 includes, as the photoelectric conversion element 51, one light-emitting element (light-emitting element 51a) and one light-receiving element (light-receiving element 51b). there were. In other embodiments, for example, the photoelectric conversion module may include only one of the light emitting element and the light receiving element, or may include three or more photoelectric conversion elements 51. Also good.

  (2) In the first embodiment, some low-frequency signal lines and power wiring (power supply, GND) are assigned to the plurality of first lead frames 41 together with the high-frequency signal lines. In this embodiment, for example, a configuration may be adopted in which a high-frequency signal line is allocated only to the first lead frame 41 and a low-frequency signal line and a power supply wiring are allocated only to the second lead frame 42. .

  (3) In the first embodiment, as shown in FIG. 1, each second lead frame 42 wraps around the rear side (back) of the package unit 31 so as to cover the rear side of the package unit 31. However, in other embodiments, it may be arranged so as to cover the front side of the package unit 31 by covering the front side of the package unit 31. That is, contrary to the case of the first embodiment, there may be a portion that is bent so as to extend from the rear to the front in the middle from the base side portion of the second lead frame 41 to the front side. The shape of the second lead frame 42 is not limited to the case where it extends from the upper side to the lower side behind the package portion 31, and is appropriately set as necessary.

  (4) In the first embodiment, the lead connection portion provided on the external circuit board 60 is a through hole. However, in other embodiments, other lead connection portions (for example, pad-like footprints) ).

  (5) In Embodiment 1 described above, the second lead frame 42 is bent by approximately 90 ° at two points in the middle thereof, so that the leading end portion of the second lead frame 42 extends downward from above. However, in other embodiments, for example, the second lead frame 42 is bent into a U shape in the middle thereof, so that the tip portion of the second lead frame 42 extends from the top to the bottom. May be. That is, the portion of the second lead frame 42 that protrudes outward from the upper end of the package unit 17 may finally extend along the same direction as the first lead frame 41. Then, the front end portion of the second lead frame 42 is mounted together with the first lead frame 41 so that the optical axis of the module 2 is parallel to the plate surface of the external circuit board 60 with respect to the predetermined external circuit board 60. It only has to be done.

  (6) In the first embodiment, one end of each of the lead frames 41 and 42 is electrically connected to the predetermined electric circuit component 5, but in another embodiment, one end is connected to the electric circuit component 5. A plate-like member that is not electrically connected and has the same shape as the lead frames 41 and 42 may be provided in the package portion 17. Such a plate-shaped member may improve the supporting strength of the photoelectric conversion module 2, or the plate-shaped member may be used to electromagnetically connect the electric circuit component 5 held in the package unit 17. It may be used to shield.

  (7) In the first embodiment, a signal of 50 Mbps or more is a high-frequency signal, and a signal of less than 50 Mbps is a low-frequency signal. However, the high-frequency signal and the low-frequency signal are not limited to these.

  (8) In the first embodiment, the photoelectric conversion module 2 uses a VCSEL (Vertical Cavity Surface Emitting Laser) as a light emitting element (light emitting element 51a). In other embodiments, for example, an LED A configuration using a light emitting element such as (Light Emitting Diode), RCLED (Resonant Cavity Light Emitting Diode), or LD (Laser Diode) may be used.

  DESCRIPTION OF SYMBOLS 1,1A ... Optical connector, 2, 2A ... Photoelectric conversion module, 3 ... Main-body part, 31 ... Package part, 32 ... Cylindrical part, 32a ... Hole, 41 (41a-41h) ... 1st lead frame, 42 (42a- 42h) ... second lead frame, 5 (51, 52, 53) ... electric circuit component, 51a ... light emitting element, 51b ... light receiving element, 6 ... optical fiber, 7 ... housing part, 8 ... shielding member, 60 ... external circuit Substrate, 61, 62, 63 ... through hole (lead connection part), 64 ... solder

Claims (5)

A package part for holding an electric circuit component including a photoelectric conversion element inside;
A plurality of first lead frames having one end electrically connected to the electrical circuit component in the package portion and the other end extending outward in one direction from the package portion;
One end of the first lead frame is electrically connected to the electrical circuit component in the package portion, and the other end extends outward from the package portion along the opposite direction to the first lead frame, and is bent in the middle. And a plurality of second lead frames extending along the same direction.   The photoelectric conversion module according to claim 1, wherein the one direction is a direction intersecting with an optical axis direction of the photoelectric conversion element.   3. The photoelectric conversion module according to claim 1, wherein among the high-frequency signal line and the low-frequency signal line connected to the electric circuit component, the high-frequency signal line is assigned only to the first lead frame. A housing portion made of synthetic resin for housing the package portion;
A metal shield member covering the outside of the housing part,
The photoelectric conversion module according to any one of claims 1 to 3, wherein the second lead frame is in contact with an inner wall of the housing portion.   An optical connector comprising the photoelectric conversion module according to any one of claims 1 to 4.

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