TWI639033B - Optical transceiver apparatus - Google Patents

Abstract

An optical transceiver device for connecting a set of optical fiber cables having at least one optical fiber to receive illuminating signals and electrical signals, comprising a housing and at least one set of optical transceiver modules for pluggable Connected to the optical fiber cable, the optical signal transceiver module is disposed in the housing and includes a circuit board for transmitting and receiving electrical signals, and is electrically connected to the circuit board and corresponding to the optical fiber of the one optical fiber. An optical component combination, and a heat dissipating member disposed in contact with the optical component, wherein the optical component is combined with the optical fiber to receive a illuminating signal, and the heat dissipating component is composed of a material having a thermal conductivity higher than the circuit board, and is not connected to the circuit board and The optical components are combined to form electrical conduction. The invention provides an optical transceiver for thermoelectric separation transmission, which improves the transmission performance of the optical signal.

Description

Optical transceiver

The present invention relates to an element for electrical communication technology, and more particularly to an optical transceiver for transmitting information signals by light.

Optical fiber network communication uses the mutual conversion of optical signals and electrical signals to transmit a large amount of data between the signal transmitting end and the signal receiving end in the form of light waves, because of its superior transmission loss, good data confidentiality and excellent anti-interference. Characteristics are already the main way of information transmission in modern times. Optical Transceiver is one of the key devices for converting optical signals into electrical signals and/or converting electrical signals into optical signals.

At present, the application of the Japanese Patent No. 101114926, for example, discloses an optical transceiver module that avoids uneven force caused by deformation or displacement of the soft board during insertion and removal, or, for example, Taiwan Patent No. 104217390 The disclosure discloses an optical transceiver with six optical signals to improve data transmission performance.

However, existing optical transceiver modules or optical transceivers have vertical cavity surface-emitting lasers (VCSELs) or photodiodes (PDs) for receiving illuminating signals, and for processing electrical signals. The driver ICs are directly packaged on the circuit board, so that there is a problem that the waste heat is not easily discharged and the signal transmission is affected.

Accordingly, it is an object of the present invention to provide an optical transceiver having super-transmission performance in which electric heating is separated and transmitted in different paths during operation.

Therefore, the optical transceiver device of the present invention is configured to connect a set of optical fiber cables having at least one optical fiber to receive the illuminating signal and the electrical signal, and includes a housing and at least one optical transceiver module.

The housing defines a receiving space including a connecting port for pluggably connecting the optical fiber cable.

The at least one set of optical signal transceiver modules is disposed in the receiving space, and includes a circuit board for transmitting and receiving electrical signals, and a light component combination electrically connected to the circuit board and corresponding to forming an optical path connection with the one optical fiber. And a heat dissipating member disposed in contact with the optical component, wherein the optical component combines a light-emitting signal through the optical fiber, the heat sink is composed of a material having a thermal conductivity higher than the circuit board, and is not combined with the circuit board and the optical component Electrical conduction is formed.

The effect of the invention is that the electrical signal is transmitted through the circuit board, and the heat of the optical component group is discharged from the optical component through the heat dissipating component to avoid the influence of waste heat on the stability, thereby effectively improving the conversion and transmission of the optical signal and the electrical signal. efficacy.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 1, FIG. 2, and FIG. 3, an embodiment of an optical transceiver device 2 of the present invention is used to connect a set of optical fiber cables 100 having at least one optical fiber 101 for receiving illuminating signals and electrical signals, including a housing. 3. At least one set of optical signal transceiver module 4 and one set of filter reflection module 5 are illustrated by two sets of optical signal transceiver modules 4 in this example and the figure.

The housing 3 defines a receiving space 302 including a connecting port 301 for pluggably connecting the fiber optic cable 100.

Referring to FIG. 3 and FIG. 4, each of the optical transceiver modules 4 is disposed in the receiving space 302 and includes a circuit board (PCB) 41, a set of optical component combinations 42, a heat sink 43, and at least one driving product. Driver IC 44. The circuit board 41 is configured to transmit an electrical signal. The optical component assembly 42 is disposed on the heat sink 43 in contact with the heat sink 43 of the driving integrated circuit 44. The optical component assembly 42 and the driving integrated circuit 44 The optical element combination 42 and the circuit board 41, the driving integrated circuit 44 and the circuit board 43 are electrically connected by, for example, a gold wire connection; the optical element combination 42 has at least one vertical cavity surface-emitting laser (VCSEL) 421, and / or at least one photodiode (PD) 422 for converting the electrical signal into an optical signal and/or converting the optical signal into an electrical signal. In this example, two driving integrated circuits 44, one vertical cavity surface-emitting laser 421, and one photodiode 422 are described. The heat dissipating member 43 is made of a material having a thermal conductivity higher than that of the circuit board 41, and does not form electrical conduction with the circuit board 41 and the optical element assembly 42. In this example, the heat conducting member 43 includes a piece embedded in the circuit. The plate 41 has a copper block 431 whose upper surface is substantially flush with the top surface of the circuit board 41.

The filter reflection module 5 is disposed in the accommodating space 302 for filtering and changing the traveling direction of the light. In this example, the filter reflection module 5 includes a reflector 51, and the vertical cavity surface is made. The light emitted by the projecting laser 421 is reflected into the optical fiber 101, and/or is reflected by the optical signal transmitted from the optical fiber 101 and received by the photodiode 422.

The optical signal is transmitted through the optical fiber 101, reflected by the reflector 51 of the filter reflection module 5, and then received and converted by the photodiode 422 of the optical component combination 42 and converted into an electrical signal by the driving integrated circuit 44. After the electrical signal is transmitted through the circuit board 41, the driving integrated circuit 44 drives the vertical cavity surface-emitting laser 421 corresponding to the optical component combination 42 to emit light (ie, an optical signal). The light is reflected by the reflector 51 of the filter reflection module 5 and then transmitted to the optical fiber 101.

In particular, when the vertical cavity surface type laser 421 of the optical element combination 42 and the photodiode 422 and the driving integrated circuit 44 are activated, the electrical signal is transmitted through the circuit board 41, and the waste heat generated by the operation is because The vertical cavity surface-emitting laser 421, the photodiode 422, and the driving integrated circuit 44 are respectively disposed on the copper block 431 contacting the copper block 431 of the heat sink 43 , and the heat sink 43 is The copper block 431 is composed of a material having a thermal conductivity higher than that of the circuit board 41, and is directly conducted through the copper block 431 of the heat sink 43 to be discharged from the vertical cavity surface-emitting laser 421, the photodiode 422, and the driving. The integrated circuit 44 further effectively avoids the operation stability problem of the vertical cavity surface-emitting laser 421, the photodiode 422, and the driving integrated circuit 44 due to heat, and substantially enhances the transmission of the optical transceiver 2. efficacy.

Referring to FIG. 5, another embodiment of an optical transceiver 2 of the present invention is similar to the above example, except that the circuit board 41 is a flexible print circuit (FPC) and has a through hole 411. The heat sink 43 has a piece of hard ceramic plate 432 connected to the bottom surface of the circuit board 41. The light element assembly 42 is disposed on the hard ceramic plate 432 in the hole 411 and in contact with the hard ceramic plate 432.

In summary, the optical transceiver device 2 of the present invention is electrically connected to the circuit board 41 by the optical component assembly 42 and is disposed on the heat dissipating member 43 directly contacting the heat dissipating member 43. The heat dissipating member 43 is discharged to stably maintain the transmission of the optical signal and the electric signal in the path of thermoelectric separation, and the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, and all the simple equivalent changes and modifications according to the scope of the patent application and the patent specification of the present invention are still Within the scope of the invention patent.

100‧‧‧Fiber optic cable

42‧‧‧Light component combination

101‧‧‧ fiber optic

421‧‧‧Vertical cavity surface-emitting laser

2‧‧‧Optical transceiver

422‧‧‧Photoelectric diode

3‧‧‧Shell

43‧‧‧ Heat sink

301‧‧‧Connecting port

431‧‧‧brass

302‧‧‧ Included space

432‧‧‧hard ceramic plate

4‧‧‧Optical transceiver module

44‧‧‧Drive integrated circuit

41‧‧‧ boards

5‧‧‧Filter reflection module

411‧‧‧Perforation

51‧‧‧ reflector

Other features and advantages of the present invention will be apparent from the embodiments of the appended drawings, wherein: Figure 1 is a perspective view illustrating an embodiment of the optical transceiver of the present invention; Figure 2 is a side of the embodiment FIG. 3 is a partial side elevational view of the embodiment, illustrating an optical transceiver module of the embodiment; FIG. 4 is a partial top plan view of the embodiment, illustrating an optical signal transmission and reception of the embodiment. Modules; and Figure 5 is a partial side elevational view of another embodiment of the optical transceiver of the present invention.

Claims (5)

An optical transceiver device for connecting a set of optical fiber cables having at least one optical fiber to receive illuminating signals and electrical signals, comprising: a housing defining a receiving space including a connecting port, wherein the connecting port is configured to be Plugging and connecting the optical fiber cable; and at least one set of optical signal transceiver modules disposed in the receiving space and including a circuit board for transmitting and receiving electrical signals, electrically connected to the circuit board and corresponding to the one The optical fiber is combined with the optical component that forms the optical path, a heat sink that is in contact with the optical component and is embedded in the circuit board, and at least one of the heat sink is disposed on the heat sink and is disposed in the same manner as the light component a driving integrated circuit electrically connected to the circuit board, wherein the optical component combines a light-emitting signal through the optical fiber, and the heat sink is composed of a material having a thermal conductivity higher than the circuit board, and is not associated with the circuit board and the optical component The combination forms electrical conduction. The optical transceiver of claim 1, wherein the heat sink has a copper block embedded in the circuit board and having an upper surface substantially flush with a top surface of the circuit board. The optical transceiver device of claim 1, wherein the circuit board has a through hole, and the heat sink has a piece of hard ceramic plate connected to a bottom surface of the circuit board, the light element combination being located at the through hole and contacting the hard ceramic plate Set on the hard ceramic plate. The optical transceiver of claim 1, wherein the optical component combination has at least one vertical cavity surface-emitting laser and/or at least one photodiode. The optical transceiver device of claim 1, further comprising a filter reflection module disposed between the optical component combination and the one of the optical fibers for filtering and changing a traveling direction of the light.