201216575 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種光纖連接裝置技術，特別是指一種 用於球格陣列（Ball Grid Array，BGA)封裝之光纖連接裝 置。 【先前技術】 以傳送光信號的光纖線路作為裝置之間或晶片之間的 # 連接傳輸媒介，已成為今後高速寬頻的數據傳輸或通信的 發展趨勢。透過光信號具有的速度及頻寬容量之傳輸優 勢，以及透過晶片裝設光纖連接埠，不僅可以移除晶片外 部光電轉換裝置或光收發模組（Optical Transceiver )，獲得 更小的設計體積’同時也可以降低更多相關的應用成本。； 例如，藉由光纖的光信號傳輸，可以比銅線增加減少更多 的尚頻傳輸頻寬、干擾’並減少電磁干擾（Electromagnetic Interference ’ EMI)以及傳輸耗能，使得晶片裝設光纖連接 -· 埠的設計具有非常好的競爭優勢。此種設計比起傳統的光 電轉換裝置方式^，可以獲得非常小體積，足以提供不同的 裝置使用，甚至要求輕薄短小的可攜式裝置，也非常的適 用，尤其未來的光纖傳輸連接方式，足以整合甚至取代現 在的各種連接技術或數據傳輸線，包括通用串列匯流排 (universal serial bus，USB)、高解析度多媒體介面 (High-Definition Multimedia Interface，HDMI )、顯示瑋 (DisplayPort)、Peripheral Component Interconnect Express (PCI-E)等，未來的市場發展具有相當的潛力。 201216575 現有的光電轉換裝置設置於晶片外部，複雜度及製造 成本較整合至晶片封裝内部高出許多，而光纖與光發射器 或光接收器在晶片的連接技術為尚待克服的困難所在，尤 其是陣列形式的光纖排線封裝。因此，體積小、成本低、 易製造、且使用簡便之光纖連接裝置及封裝技術，在現在 及未來都具有相當迫切的需求，尚待進一步的技術發展。 【發明内容】 有鑑於此，在本發明的一方面，第一實施例提供一種光 纖連接裝置，其設置於球格陣列封裝基板之上，用以耦合 光電元件晶粒至光纖之間的光信號，該裝置包含：一模組 構件，用以容置一光纖以傳輸該光電元件的光信號，其包 括：一置入孔，其形狀對應於該光纖之連接頭；一凸出部， 使該光纖連接頭之卡榫部能與該凸出部以卡榫機制而固定 接合，且該卡榫部對應於該凸出部；一反射器，用以改變 該光電元件的光信號方向，使光信號對準並耦合至該光 纖；及一第一驅動電路，用以驅動該光電元件，其係設置 於該球格陣列封裝基板内；其中該光纖連接頭的卡榫部係 為可撓性材質形成倒勾狀，用以增強其卡榫機制接合之強 韌性。 在本發明的另一方面，第二實施例提供一種光纖連接 裝置，其設置於球格陣列封裝基板之上，用以耦合光電元 件晶粒至光纖之間的光信號，該裝置包含：一模組構件， 用以容置一光纖以傳輸該光電元件的光信號，其包括：一 置入孔，其形狀對應於該光纖之連接頭；一凸出部，使該 201216575 光纖連接頭之卡榫部能與該凸出部以卡榫機制而固定接 合，且該卡榫部對應於該凸出部；一反射器，用以改變該 光電元件的光信號方向，使光信號對準並耦合至該光纖； 一第二容置構件，其係設置於該-球格陣列封裝基板之上， 用以容納並固定該光電元件晶粒、該反射器、及該模組構 件；及一第二驅動電路板，用以驅動該光電元件，其係設 置於該第二容置構件底部的上面及該光電元件晶粒的下 面；其中該光纖連接頭的卡榫部係為可撓性材質形成倒勾 狀，用以增強其卡榫機制接合之強韌性。 在本發明的又一方面，第三實施例提供一種光纖連接裝 置，其設置於球格陣列封裝基板之上，用以耦合光電元件 晶粒至光纖之間的光信號，該裝置包含：一模組構件，用 以容置一光纖以傳輸該光電元件的光信號，其包括：一置 入孔，其形狀對應於該光纖之連接頭；一凸出部，使該光 纖連接頭之卡榫部能與該凸出部以卡榫機制而固定接合， 且該卡榫部對應於該凸出部；一第三容置構件，其係設置 於該球格陣列封裝基板之上，用以容納並固定該光電元件 晶粒及該模組構件；及一第三驅動電路板，用以驅動該光 電元件，其係設置於該第三容置構件的側面上及該光電元 件晶粒的下面；其中，該光電元件的光信號對準並耦合至 該光纖，且該光纖連接頭的卡榫部係為可撓性材質形成倒 勾狀，用以增強其卡榫機制接合之強韌性。 【實施方式】 為了能對本發明之特徵、目的及功能有更進一步的認 201216575 知與瞭解，茲配合圖式詳細說明如後： 請參照圖1 ’為根據本發明第一實施例之光纖連接裝 置100的結構示意圖’本實施例包含：球格陣列封裝基板 110、光電元件晶粒120、模組構件13〇、反射器14〇、及 第一容置構件150 ;其中’該模組構件13〇包含一置入孔 132及一凸出部134。本發明適用於球格陣列球格陣列（Baii GddArray’BGA)封裝的應用，而球格陣列封裝技術現已 在筆記型電腦的記憶體、主機板晶片組等可攜式裝置的封 裝領域中廣泛使用；本實施例將結合球格陣列封裝及光電 傳輸的輕薄快速優勢，採用球格陣列封裝基板110做為本 實施例的光纖連接裝置1〇〇的建構基礎。 該光電元件晶粒120係設置於該球格陣列封裝基板 110之上，以作為高速積體電路之電信號與光纖傳輸之光 信號的光電轉換介面或機制，且該光電元件若作為光發射 器則採用垂直共振腔面射型雷射（Vertical-Cavity201216575 VI. Description of the Invention: [Technical Field] The present invention relates to a fiber optic connection device technology, and more particularly to a fiber optic connection device for a Ball Grid Array (BGA) package. [Prior Art] The optical fiber line for transmitting optical signals is used as a # connection transmission medium between devices or between wafers, and has become a trend of data transmission or communication of high-speed broadband in the future. Through the transmission advantages of the speed and bandwidth capacity of the optical signal, and the optical fiber connection through the chip, it is possible to remove the external photoelectric conversion device or the optical transceiver (Optical Transceiver) to obtain a smaller design volume. It can also reduce the cost of more related applications. For example, optical fiber transmission through optical fiber can reduce more frequent transmission bandwidth, interference, and reduce electromagnetic interference (Electromagnetic Interference 'EMI) and transmission energy consumption than copper wire, so that the chip is equipped with fiber connection - · 埠 design has a very good competitive advantage. Compared with the traditional photoelectric conversion device, this design can obtain a very small volume, which is sufficient for different devices, and even requires a portable device that is light and thin, and is also very suitable, especially in the future. Integrates or even replaces today's various connection technologies or data transmission lines, including universal serial bus (USB), High-Definition Multimedia Interface (HDMI), DisplayPort, and Peripheral Component Interconnect Express (PCI-E), etc., has considerable potential for future market development. 201216575 The existing photoelectric conversion device is disposed outside the wafer, and the complexity and manufacturing cost are much higher than the integration into the interior of the chip package, and the connection technology between the optical fiber and the optical transmitter or the optical receiver in the wafer is a difficult problem to be overcome, especially It is an optical fiber cable package in the form of an array. Therefore, the optical fiber connecting device and the packaging technology which are small in size, low in cost, easy to manufacture, and easy to use, have a very urgent need both now and in the future, and further technological development is yet to be obtained. SUMMARY OF THE INVENTION In view of this, in an aspect of the present invention, a first embodiment provides an optical fiber connection device disposed on a ball grid array package substrate for coupling optical signals between the optical element die and the optical fiber. The device includes: a module member for accommodating an optical fiber to transmit the optical signal of the photoelectric component, comprising: a insertion hole having a shape corresponding to the connector of the optical fiber; and a protruding portion The latching portion of the fiber connector can be fixedly engaged with the protruding portion by a latching mechanism, and the latching portion corresponds to the protruding portion; a reflector for changing the direction of the optical signal of the photoelectric component to make the light The signal is aligned and coupled to the optical fiber; and a first driving circuit is configured to drive the photoelectric component, and the light-emitting component is disposed in the ball grid array package substrate; wherein the latching portion of the fiber connector is a flexible material A barb shape is formed to enhance the toughness of the kneading mechanism. In another aspect of the present invention, a second embodiment provides a fiber optic connection device disposed on a ball grid array package substrate for coupling optical signals between the optoelectronic device die and the optical fiber, the device comprising: a module And a component for accommodating an optical fiber for transmitting the optical signal of the photoelectric component, comprising: a insertion hole having a shape corresponding to the connector of the optical fiber; and a protruding portion for latching the 201216575 optical fiber connector The portion can be fixedly engaged with the protruding portion by a locking mechanism, and the locking portion corresponds to the protruding portion; a reflector for changing the direction of the optical signal of the photoelectric element to align and couple the optical signal to a second receiving member disposed on the ball grid array package substrate for receiving and fixing the photovoltaic element die, the reflector, and the module member; and a second driving a circuit board for driving the photoelectric component, which is disposed on the bottom of the second accommodating member and below the die of the photovoltaic element; wherein the latch portion of the fiber connector is formed of a flexible material to form a barb Shape Strong Strong toughness of its tenon engaging mechanism. In still another aspect of the present invention, a third embodiment provides a fiber optic connection device disposed on a ball grid array package substrate for coupling optical signals between the photo-electric element die and the optical fiber, the device comprising: a mode And a component for receiving an optical fiber for transmitting the optical signal of the photoelectric component, comprising: a insertion hole having a shape corresponding to the connector of the optical fiber; and a protruding portion for the card portion of the optical fiber connector The protruding portion can be fixedly engaged with the protruding portion, and the locking portion corresponds to the protruding portion; a third receiving member is disposed on the ball grid array package substrate for receiving and Fixing the photovoltaic element die and the module member; and a third driving circuit board for driving the photoelectric component, which is disposed on a side of the third receiving member and below the die of the photovoltaic element; The optical signal of the optoelectronic component is aligned and coupled to the optical fiber, and the latching portion of the optical fiber connector is formed of a flexible material to form a barb shape to enhance the rigidity of the clamping mechanism. [Embodiment] In order to further understand the features, objects, and functions of the present invention, the following is a detailed description of the following: FIG. 1 is an optical fiber connecting device according to a first embodiment of the present invention. FIG. 100 is a schematic diagram of a structure comprising: a grid array package substrate 110, a photovoltaic element die 120, a module member 13A, a reflector 14A, and a first receiving member 150; wherein the module member 13〇 An insertion hole 132 and a protrusion 134 are included. The present invention is applicable to the application of a Baiji GddArray's (BGA) package, and the ball grid array packaging technology is now widely used in the packaging of portable devices such as a memory of a notebook computer, a motherboard chipset, and the like. In this embodiment, the ball grid array package substrate 110 is used as the construction foundation of the optical fiber connection device 1 of the present embodiment in combination with the light and thin advantages of the ball grid array package and the photoelectric transmission. The photo-electric element die 120 is disposed on the ball grid array package substrate 110 as a photoelectric conversion interface or mechanism of an electrical signal of the high-speed integrated circuit and an optical signal transmitted by the optical fiber, and the photoelectric element is used as a light emitter. Vertical cavity surface-emitting laser (Vertical-Cavity)
Surface-Emitting Laser，VCSEL)，若作為光接收器則採用 PIN光二極體；這主要是因為低成本及足夠的頻寬性能， 但不以此為限’亦可為發光二極體（light-emitting diode， LED)或累朋光電二極體（Avalanche photodiode，APD) 等其他的面射型光發射器或光接收器。 該模組構件130用以容置一光纖160以傳輸該光電元 件的光信號，該光纖160可以為石英系光纖、多組分玻璃 光纖、塑膠包層石英芯光纖、全塑膠光纖、或氟化物光纖， 但不以此為限。該模組構件丨3〇包含一置入孔132及一凸 出部134:該置入孔132的形狀對應於該光纖之連接頭 201216575 162 ’置入孔132為母槽而連接頭丨62為公頭，使該連接頭 162恰能契合的置入該置入孔132;及該凸出部134使得設 置於該光纖連接頭162之對應於該凸出部的一卡榫部164 能與該凸出部134以卡榫機制而固定接合，其中該卡榫部 164係為塑膠或其他可撓性材質形成倒勾狀，以増強其卡 榫機制接合之強勃性，其卡榫扣合機制涵蓋，上下扣合或 是左右扣合方式的設計。 該反射器140用以改變該光電元件120的光信號方向，使 光信號對準並耦合至該光纖160。該反射器140係為_反 射鏡，以將該光電元件的光信號方向偏折90度而耦合入該 光纖；但不以此為限，該反射器140亦可為介電質材料製 成的多層膜濾波'器，使特定波長的光信號達到反射的效 果，且該光信號方向亦可偏折80至100度而耦合入該光 纖。此外，為了提升光信號耦合至光纖的效率，在該光電 元件120與該光纖連接頭162之間可設置至少一微透鏡， 以將光信號或路徑加以適度的聚焦，以提升該光信號至光 纖的耦合效率；例如，本實施例在該光纖連接頭162與該 反射器140之間設置有第一微透鏡171，在該光電元件120 與該反射器140之間則設置第二微透鏡Π2。 該第一容置·構样15〇設置於該光電元件晶粒120之 上，用以容納並固定該反射器140及該模組構件130。此 外’ 一驅動電路形成於該球格陣列封裝基板内，以提供光 發射器或光接收器的驅動機制，及所偵測之光信號在光電 轉換後的微弱電信號，經由驅動機制做之放大機制；此實 施例在球格陣列封裝時，適合於側孔式的上蓋封裝或上蓋 201216575 塑模封裝。本實施例可以陣列的形式來實 的傳輸通道，以圖2為例，二個光電元件^日^個收發 模組構件130、及二個反射器140,係以陣列的 一個 且各個光電元件晶粒120分別在其光路徑上對庳：：列’ 組構件13。及反射器14〇。 对應各自的模 接著請參照圖3,為根據本發明第二實施 接裝置200的結構示意圖’本實施例包含 封 基板11G、M元件晶粒m、额構件⑽、^車器列^裝Surface-Emitting Laser (VCSEL), if used as a light receiver, PIN light diode; this is mainly because of low cost and sufficient bandwidth performance, but not limited to it, it can also be a light-emitting diode (light- Other surface-emitting light emitters or light receivers such as a singular diode (LED) or an Avalanche photodiode (APD). The module member 130 is configured to receive an optical fiber 160 for transmitting optical signals of the photoelectric component. The optical fiber 160 may be a quartz fiber, a multi-component glass fiber, a plastic-clad quartz fiber, an all-plastic fiber, or a fluoride. Optical fiber, but not limited to this. The module member 丨3〇 includes an insertion hole 132 and a protrusion 134. The insertion hole 132 has a shape corresponding to the fiber connector 201216575 162. The insertion hole 132 is a mother groove and the connection head 62 is a male connector that allows the connector 162 to fit into the insertion hole 132; and the projection 134 enables a latch portion 164 disposed on the fiber connector 162 corresponding to the projection The protruding portion 134 is fixedly engaged by a locking mechanism, wherein the locking portion 164 is made of plastic or other flexible material to form a barb shape, so as to strengthen the strong bouncing property of the clamping mechanism, and the locking mechanism of the locking mechanism Covers the design of the up and down snaps or the left and right snaps. The reflector 140 is used to change the direction of the optical signal of the optoelectronic component 120 to align and couple the optical signal to the optical fiber 160. The reflector 140 is a mirror, and is coupled to the optical fiber by deflecting the optical signal of the photoelectric element by 90 degrees. However, the reflector 140 may also be made of a dielectric material. The multilayer film filter enables the optical signal of a specific wavelength to achieve a reflection effect, and the direction of the optical signal can also be coupled to the optical fiber by being offset by 80 to 100 degrees. In addition, in order to improve the efficiency of coupling the optical signal to the optical fiber, at least one microlens may be disposed between the optical component 120 and the optical fiber connector 162 to appropriately focus the optical signal or path to enhance the optical signal to the optical fiber. For example, in the embodiment, a first microlens 171 is disposed between the optical fiber connector 162 and the reflector 140, and a second microlens Π2 is disposed between the photoelectric component 120 and the reflector 140. The first accommodating structure 15 is disposed on the photodiode die 120 for receiving and fixing the reflector 140 and the module member 130. In addition, a driving circuit is formed in the ball grid array package substrate to provide a driving mechanism of the light emitter or the light receiver, and a weak electrical signal of the detected optical signal after photoelectric conversion, and is amplified by a driving mechanism. Mechanism; this embodiment is suitable for the side-hole type upper cover package or the upper cover 201216575 mold package when the ball grid array is packaged. In this embodiment, the transmission channel can be realized in the form of an array. Taking FIG. 2 as an example, two photoelectric components, one transceiver module member 130, and two reflectors 140 are connected to one and each of the photovoltaic elements. The granules 120 respectively face the 庳:: column 'group member 13 in their light path. And the reflector 14〇. Corresponding to the respective modes, please refer to FIG. 3, which is a schematic structural view of the second embodiment of the device 200 according to the present invention. The present embodiment includes a sealing substrate 11G, an M component die m, a front member (10), and a vehicle assembly.
及第-容置構件250 ;其中，該模組構件13G包含一置入 孔132及一凸出部134。本實施例除了光電元件晶粒 及用以驅動該光電元件的驅動電路板18Q㈣置於該第二 容置構件25G内之外，其餘各個構成元件或料及其作用 或功能皆與第一實施例所述者類同或相似，請參考上述之 第-實施例的敘述’在此不再贅述。該第二容置構件25〇 係設置於該球格陣列封裝基板UG之上，用以容納並固定 該光電元件晶粒120、該反射器14〇、及該模組構件，And the accommodating member 250; wherein the module member 13G includes a receiving hole 132 and a protruding portion 134. In this embodiment, except for the photo-electric element die and the driving circuit board 18Q (4) for driving the photoelectric element, the other constituent elements or materials and their functions or functions are the same as those of the first embodiment. The descriptions are similar or similar, please refer to the description of the above-mentioned embodiments - and details are not described herein again. The second accommodating member 25 is disposed on the ball grid array package substrate UG for accommodating and fixing the photo-electric element die 120, the reflector 14A, and the module member.
且該光電τό件的驅動電路板18G係設置於該第二容置構件 250底部的上面及該光電元件晶粒m的下面；此實施例 在球格陣列封裝時，適合於側孔式的上蓋封裝或上蓋塑模 封裝。 、 接著請參照圖4’為根據本發明第三實_之用於球 格陣列封裝的光纖連縣置3⑼結構示㈣，本實施例包 含·光電元件晶粒120、模組構件13〇、第三容置構件35〇、 驅動電路板18G及；其中，該模組構件13()包含—置入孔 132及-凸出部134。本實施例的特徵在於該光電元件晶粒 201216575 no連同設置於其底面的心驅動該光電元 球格陣列封裝基板ug，藉由一機構 妾構件（圖綺不）或其他方式而將於該光電元件晶粒 二及該驅動電路板18。係固定於該第三容置構件350的 11〇貝而Γ光信號的方向平行於該球格陣列封裝基板 封不以此為限’該光信號的方向與該球格陣 =震基板的表面亦可形成小於1G度的失角，以利對準並 =至該光纖。為了使光信號對準並耗合至光纖⑽，本 =例的其他構成元件或單元及其作 施例所述者類同或相似，請 力-二、二： 述，在此不再贅述。 ^上义之第一貫施例的敘 子或發明的光纖連接裝置可作為各種電 之優勢，未來其5曰、.光電連結方式’而光纖高頻寬傳輸 線為單m可以整合並取代各種數據傳輸線或連接 明另—實施故極具發展潛力。此外，圖5為本發 圖5a及5b為側視卡=制的結構示意圖，其中 接頭的卡榫部 視圖，做為光纖160或光纖陣列連 134，圖5c及&木用上下扣合於該模組構件130之凸出部 視及上視圖貝J卡摔部採用左右扣合於凸出部134的側 接褒置的切^使錢連接魏ϋ錢合於該光纖連 唯以上實施例或參考，但並不以此為限。 之限制本發日月的杨’僅為本發明之較佳實施例’當不能以 之均等變化及体乾園即大凡依本發明申請專利範圍所做 離本發明之精二,I仍將不失本發明之要義所在，亦不脫 圍，故都應視為本發明的進一步實施 9 201216575 狀況。 201216575 【圖式簡單說明】 圖1根據本發明第一實施例之光纖連接裝置的結構示意 圖。 圖2以陣列形式實現同時多個收發傳輸通道的實施例示意 圖。 圖3根據本發明第二實施例之光纖連接裝置的結構示意 圖。 圖4 根據本發明第三實施例之光纖連接裝置的結構示意 φ 圖。 圖5本發明另一實施例之光纖連接頭卡榫機制的結構示意 圖，其中5a/b及5c/d分別為卡榫機制上下及左右扣合 的側視及上視圖。 【主要元件符號說明】 100第一實施例 110球格陣列封裝基板 * 120光電元件(晶粒） 130模組構件 132置入孔 134凸出部 140反射器 150第一容置構件 160光纖 162連接頭 11 201216575 164卡榫部 第一微透鏡171 第二微透鏡172 200第二實施例 250第二容置構件 180驅動電路板 300第三實施例 350第三容置構件 180驅動電路板The driving circuit board 18G of the photo-electrical component is disposed on the bottom of the bottom of the second accommodating member 250 and below the die m of the photo-electric element; this embodiment is suitable for the side-hole type upper cover when the ball grid array is packaged. Package or top cover molded package. Next, referring to FIG. 4', the optical fiber cascading 3 (9) structure (four) for the ball grid array package according to the third embodiment of the present invention, the present embodiment includes the photoelectric element die 120, the module member 13 〇, The three-receiving member 35A and the driving circuit board 18G; wherein the module member 13() includes a receiving hole 132 and a protruding portion 134. The feature of this embodiment is that the photo-electric element die 201216575 no, together with the core disposed on the bottom surface thereof, drives the photo-embedded cell array package substrate ug, which is to be used by a mechanism member (not shown) or other means. The element die 2 and the driving circuit board 18. The 11-channel is fixed to the third accommodating member 350 and the direction of the illuminating signal is parallel to the sealing of the grid array package substrate. The direction of the optical signal and the surface of the spheroidal array A corner angle of less than 1 G can also be formed to facilitate alignment and = to the fiber. In order to align and consume the optical signal to the optical fiber (10), the other constituent elements or units of the present example and the embodiments thereof are similar or similar, and the force is not described herein. ^The first instance of Shangyi or the invented fiber-optic connection device can be used as the advantage of various electric powers. In the future, the optical fiber high-frequency transmission line can be integrated and replace various data transmission lines or The connection is clear - implementation is extremely promising. In addition, FIG. 5 is a schematic structural view of the side view card=system according to the present invention, wherein the card portion of the joint is used as the fiber 160 or the fiber array 134, and the figure 5c and the The protruding portion of the module member 130 and the upper view of the J-card drop portion are cut and joined to the side joints of the protruding portion 134 to make the money connection. Or reference, but not limited to this. The invention is limited to the preferred embodiment of the present invention. 'When it is not possible to change equally, and the body of the body is the same as the scope of the patent application of the present invention, I will still not Loss of the essence of the invention is not left out, so it should be regarded as a further implementation of the present invention 9 201216575 situation. [Brief Description of the Drawings] Fig. 1 is a schematic view showing the configuration of an optical fiber connecting device according to a first embodiment of the present invention. Figure 2 is a schematic illustration of an embodiment of a plurality of transceiving transmission channels in an array. Fig. 3 is a view showing the configuration of an optical fiber connecting device in accordance with a second embodiment of the present invention. Fig. 4 is a view showing the structure of a fiber connecting device according to a third embodiment of the present invention. Fig. 5 is a schematic structural view showing the mechanism of the optical fiber connector chucking mechanism according to another embodiment of the present invention, wherein 5a/b and 5c/d are respectively a side view and a top view of the upper and lower sides of the latching mechanism. [Main component symbol description] 100 first embodiment 110 ball grid array package substrate * 120 photoelectric element (die) 130 module member 132 insertion hole 134 projection portion 140 reflector 150 first housing member 160 fiber 162 connection Head 11 201216575 164 cassette first microlens 171 second microlens 172 200 second embodiment 250 second accommodating member 180 drive circuit board 300 third embodiment 350 third accommodating member 180 drive circuit board