CN102590959A - Optical fiber connector - Google Patents
Optical fiber connector Download PDFInfo
- Publication number
- CN102590959A CN102590959A CN2011100057612A CN201110005761A CN102590959A CN 102590959 A CN102590959 A CN 102590959A CN 2011100057612 A CN2011100057612 A CN 2011100057612A CN 201110005761 A CN201110005761 A CN 201110005761A CN 102590959 A CN102590959 A CN 102590959A
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- modular structure
- beam steering
- order
- splicing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses an optical fiber connector, which is arranged on a ball grid array-packaging substrate and used for coupling an optical signal between a photoelectric element chip and an optical fiber. The optical fiber is provided with a connector, the connector is provided with a fastening part, the optical fiber connector comprises a module component which is used for containing the optical fiber in order to transmit the optical signal, the module component comprises an insert hole and a protruded part, the shape of the insert hole corresponds to the shape of the connector, the fastening part can be fixedly connected with the protruded part by way of a fastening mechanism, and corresponds to the protruded part, wherein the fastening part is made of flexible material and shaped like a barb.
Description
Technical field
The present invention relates to a kind of optical fiber splicing device technology, particularly a kind of sphere grid array (Ball Grid Array, BGA) optical fiber splicing device of encapsulation of being used for.
Background technology
As the connection transmission medium between the device or between the chip, the data transmission of high-speed wideband or the development trend of communication have been become from now on the fibre circuit that transmits light signal.The speed that has through light signal and the transmission advantage of frequency range capacity; And through chip installing optical fiber connectivity port; Not only can remove chip exterior photoelectric conversion device or optical transceiver module (Optical Transceiver); Obtain littler design volume, also can reduce the application cost of more heterogeneous pass simultaneously.For example; Optical signal transmission through optical fiber; Can increase more high-frequency transmission frequency range and reduce electromagnetic interference (EMI) that (Electromagnetic Interference EMI) and transmission power consumption, makes the design of chip installing optical fiber connectivity port have extraordinary competitive edge than copper cash.This kind design is compared with traditional photoelectric conversion device mode; Can obtain very small size; The device that is enough to provide different uses, even requires compact portable apparatus, also being suitable for very; Especially following Optical Fiber Transmission connected mode; Be enough to integrate even replace present various interconnection techniques or data line, comprise USB (universal serial bus, USB), high resolution multimedia interface (High-Definition Multimedia Interface; HDMI), display port (DisplayPort), Peripheral Component Interconnect Express (PCI-E) etc., following market development has suitable potentiality.
Existing photoelectric conversion device is arranged at the SOC chip exterior; It is high that complexity and manufacturing cost are integrated into Chip Packaging inside; And optical fiber and optical transmitting set or optical receiver are the where the shoe pinches that waits to overcome in the interconnection technique of chip, the especially optical fiber winding displacement of array format encapsulation.Therefore, volume is little, cost is low, be prone to manufacturing and optical fiber splicing device and encapsulation technology easy to use, reaches now all to have quite urgent demand future, waits further technical development.
Summary of the invention
In view of this, in one aspect of the invention, first embodiment provides a kind of optical fiber splicing device; It is arranged on the sphere grid array base plate for packaging; In order to the light signal of coupling between optoelectronic device chip to the optical fiber, this device comprises: a modular structure, in order to a ccontaining optical fiber to transmit the light signal of this photovalve; It comprises: one inserts the hole, and its shape is corresponding to the connector of this optical fiber; One protuberance, make this fiber connector pawl part can with this protuberance with trip mechanism fixed engagement, and this pawl part is corresponding to this protuberance; One beam steering device in order to change the light signal direction of this photovalve, makes light signal aim at and be coupled to this optical fiber; And a first circuit board, in order to drive this photovalve, it is arranged in this sphere grid array base plate for packaging; Wherein the pawl part of this fiber connector is that flexible materials forms the overhead kick shape, in order to strengthen the obdurability that its trip mechanism engages.
In another aspect of this invention; Second embodiment provides a kind of optical fiber splicing device, and it is arranged on the sphere grid array base plate for packaging, in order to the light signal between coupling optoelectronic device chip to the optical fiber; This device comprises: a modular structure; To transmit the light signal of this photovalve, it comprises in order to a ccontaining optical fiber: one inserts the hole, and its shape is corresponding to the connector of this optical fiber; One protuberance, make this fiber connector pawl part can with this protuberance with trip mechanism fixed engagement, and this pawl part is corresponding to this protuberance; One beam steering device in order to change the light signal direction of this photovalve, makes light signal aim at and be coupled to this optical fiber; One second ccontaining member, it is arranged on this sphere grid array base plate for packaging, in order to hold and fixing this optoelectronic device chip, this beam steering device, and this modular structure; And a second circuit board, in order to fixing this photovalve, its be arranged at this second ccontaining member bottom top and this optoelectronic device chip below; Wherein the pawl part of this fiber connector is that flexible materials forms the overhead kick shape, in order to strengthen the obdurability that its trip mechanism engages.
In still another aspect of the invention; The 3rd embodiment provides a kind of optical fiber splicing device, and it is arranged on the sphere grid array base plate for packaging, in order to the light signal between coupling optoelectronic device chip to the optical fiber; This device comprises: a modular structure; To transmit the light signal of this photovalve, it comprises in order to a ccontaining optical fiber: one inserts the hole, and its shape is corresponding to the connector of this optical fiber; One protuberance, make this fiber connector pawl part can with this protuberance with trip mechanism fixed engagement, and this pawl part is corresponding to this protuberance; One the 3rd ccontaining member, it is arranged on this sphere grid array base plate for packaging, in order to hold and fixing this optoelectronic device chip and this modular structure; And a tertiary circuit plate, in order to fixing this photovalve, its be arranged on the side of the 3rd ccontaining member and this optoelectronic device chip below; Wherein, the light signal of this photovalve is aimed at also and is coupled to this optical fiber, and the pawl part of this fiber connector is that flexible materials forms the overhead kick shape, in order to strengthen the obdurability that its trip mechanism engages.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is according to the structural representation of the optical fiber splicing device of first embodiment of the invention;
Fig. 2 A, Fig. 2 B realize the embodiment synoptic diagram of a plurality of transmitting-receiving transmission channels simultaneously with array format;
Fig. 3 is according to the structural representation of the optical fiber splicing device of second embodiment of the invention;
Fig. 4 is according to the structural representation of the optical fiber splicing device of third embodiment of the invention;
Fig. 5 is according to another example of the optical fiber splicing device of first embodiment of the invention, but the beam steering device is realized with pliability optical fiber;
Fig. 6 is according to another example of the optical fiber splicing device of second embodiment of the invention, but the beam steering device is realized with pliability optical fiber;
The structural representation of the fiber connector trip mechanism of Fig. 7 A, Fig. 7 B, Fig. 7 C and Fig. 7 D another embodiment of the present invention, wherein 7A, Fig. 7 B, Fig. 7 C and Fig. 7 D are respectively side-looking and the vertical view that fastens about trip mechanism reaches up and down.
Wherein, Reference numeral
100 first embodiment
110 sphere grid array base plate for packaging
120 photovalves (chip)
130 modular structures
132 insert the hole
134 protuberances
140 beam steering devices
141 pliability optical fiber
150 first ccontaining members
160 optical fiber
162 connectors
164 pawl part
200 second embodiment
250 second ccontaining members
180 circuit boards
300 the 3rd embodiment
350 the 3rd ccontaining members
180 circuit boards
Embodiment
In order further cognition and understanding to be arranged to characteristic of the present invention, purpose and function, conjunction with figs. specifies as the back now:
Please with reference to Fig. 1; Be the structural representation according to the optical fiber splicing device 100 of first embodiment of the invention, present embodiment comprises: sphere grid array base plate for packaging 110, optoelectronic device chip 120, modular structure 130, beam steering device 140, and the first ccontaining member 150; Wherein, this modular structure 130 comprises and inserts a hole 132 and a protuberance 134.The present invention is applicable to sphere grid array (Ball Grid Array, the BGA) application of encapsulation, and the sphere grid array encapsulation technology has been widely used at present in the encapsulation field of portable apparatus such as the memory body of mobile computer, motherboard chipset; Present embodiment will combine the frivolous quick advantage of sphere grid array encapsulation and photoelectricity transmission, adopt the construction basis of sphere grid array base plate for packaging 110 as the optical fiber splicing device 100 of present embodiment.
This optoelectronic device chip 120 is to be arranged on this sphere grid array base plate for packaging 110; With opto-electronic conversion interface or mechanism as the light signal of the electric signal of high speed integrated circuit and Optical Fiber Transmission; And this photovalve is if then adopt vcsel (Vertical-Cavity Surface-Emitting Laser as optical transmitting set; VCSEL), if then adopt the PIN optical diode as optical receiver; This mainly is because low-cost and enough frequency range performances; But not as limit; Also can be light emitting diode (light-emitting diode, LED) or tired avalanche photo diode (Avalanche photodiode APD) waits other wall emission optical transmitting set or optical receiver.
To transmit the light signal of this photovalve, this optical fiber 160 can be optical fiber, multicomponent glass optical fiber, PCS plastic-clad silica core fibre, all-plastic optical fiber or fluoride fiber for quartz to this modular structure 130 in order to a ccontaining optical fiber 160, but not as limit.This modular structure 130 comprises inserts a hole 132 and a protuberance 134: this inserts the connector 162 of the shape in hole 132 corresponding to this optical fiber, inserts hole 132 for female groove connector 162 is public head, and what make that this connector 162 be able to agree with inserts this and insert hole 132; And this protuberance 134 make be arranged at this fiber connector 162 corresponding to a pawl part 164 of this protuberance can with this protuberance 134 with trip mechanism fixed engagement; Wherein this pawl part 164 is to be plastics or other flexible materials formation overhead kick shape; To strengthen the obdurability that its trip mechanism engages; Its trip fastening mechanism contains, and fastens up and down or the design of left and right sides manner.
This beam steering device 140 makes light signal aim at and be coupled to this optical fiber 160 in order to change the light signal direction of this photovalve 120.This beam steering device 140 can be the multi layer film filter that a catoptron or dielectric material are processed, and the light signal that makes specific wavelength is through reflex, and light signal direction deviation 80 to 100 degree of this photovalve are coupled into this optical fiber; But not as limit, for example this beam steering device 140 also can be pliability optical fiber or optical waveguide, directly with the coupling of this light signal and conduct in this optical fiber.In addition,, between this photovalve 120 and this fiber connector 162, at least one lenticule can be set, with the in addition focusing of appropriateness of light signal or path, to promote the coupling efficiency of this light signal to optical fiber in order to promote the efficient that light signal is coupled to optical fiber; For example, present embodiment is provided with first lenticule 171 between this fiber connector 162 and this beam steering device 140, between this photovalve 120 and this beam steering device 140, second lenticule 172 is set then.
This first ccontaining member 150 is arranged on this optoelectronic device chip 120, in order to hold and fixing this beam steering device 140 and this modular structure 130.In addition, one drive circuit is formed in this sphere grid array base plate for packaging, so that the driving mechanism of optical transmitting set or optical receiver to be provided, and the ultra-weak electronic signal of light signal after opto-electronic conversion that is detected, and the amplification mechanism of manufacturing via driving machine; This embodiment is suitable for the loam cake encapsulation or the loam cake mold encapsulation of side-hole-type when sphere grid array encapsulates.Present embodiment can array form realize the transmission channel of a plurality of transmitting-receivings simultaneously; With Fig. 2 A is example; Two optoelectronic device chips 120, two modular structures 130, and two beam steering devices 140; Be to arrange with the form of array, and each optoelectronic device chip 120 corresponding modular structure 130 and beam steering device 140 separately on its light path respectively.In addition, for the fiber array of winding displacement formula, then can be shown in Fig. 2 B and sharing module member 130 or beam steering device 140, and cost of manufacture is further reduced.
Then please with reference to Fig. 3; Be the structural representation according to the optical fiber splicing device 200 of second embodiment of the invention, present embodiment comprises: sphere grid array base plate for packaging 110, optoelectronic device chip 120, modular structure 130, beam steering device 140, and the second ccontaining member 250; Wherein, this modular structure 130 comprises and inserts a hole 132 and a protuberance 134.Present embodiment except the circuit board 180 of optoelectronic device chip 120 and this photovalve be arranged in this second ccontaining member 250; All the other each composed components or unit and effect thereof or function all with described first embodiment roughly the same or similar; Please refer to the narration of the first above-mentioned embodiment, repeat no more at this.This second ccontaining member 250 is to be arranged on this sphere grid array base plate for packaging 110; In order to holding and fixing this optoelectronic device chip 120, this beam steering device 140, and this modular structure 130, and the circuit board 180 of this photovalve be arranged at these second ccontaining member, 250 bottoms top and this optoelectronic device chip 120 below; This embodiment is suitable for the loam cake encapsulation or the loam cake mold encapsulation of side-hole-type when sphere grid array encapsulates.In addition, as previously mentioned, this beam steering device 140 can be a pliability optical fiber 141, and directly with the coupling of this light signal and conduct in this optical fiber; This with respect to the example of first and second embodiment also please respectively with reference to Fig. 5 and Fig. 6.
Then please with reference to Fig. 4; Be optical fiber splicing device 300 structural representations that are used for the sphere grid array encapsulation according to third embodiment of the invention, present embodiment comprises: the ccontaining member of optoelectronic device chip 120, modular structure the 130, the 3rd 350, drive circuit board 180 and; Wherein, this modular structure 130 comprises and inserts a hole 132 and a protuberance 134.Present embodiment is characterised in that this optoelectronic device chip 120 is perpendicular to a sphere grid array base plate for packaging 110 together with the circuit board 180 in order to fixing this photovalve that is arranged at its bottom surface; Through mechanism's connecting elements (Fig. 4 does not illustrate) or alternate manner and will be fixed on the medial surface of the 3rd ccontaining member 350, and make the direction of light signal be parallel to the surface of this sphere grid array base plate for packaging 110 in this optoelectronic device chip 120 and this circuit board 180; But not as limit, the surface of the direction of this light signal and this sphere grid array base plate for packaging also can form the angle less than 10 degree, in order to aiming at and be coupled to this optical fiber.In order to make light signal aim at and be coupled to optical fiber 160, other composed component of present embodiment or unit and effect thereof or function all with described first embodiment roughly the same or similar, please refer to the narration of the first above-mentioned embodiment, repeat no more at this.
Aforesaid optical fiber splicing device according to the present invention can be used as the photoelectricity mode of connection of the chip of various electronics or communicator; And the advantage of the high frequency range transmission of optical fiber; Following even can integrate and replace various data lines or connecting line is single signal line, so have development potentiality.In addition; Fig. 7 A to Fig. 7 D is the structural representation of the fiber connector trip mechanism of another embodiment of the present invention; Wherein Fig. 7 A and Fig. 7 B are side-looking and vertical view; As the pawl part of optical fiber 160 or fiber array connector, adopt the protuberance 134 that is fastened on this modular structure 130 up and down, Fig. 7 C and Fig. 7 D then are fastened on the side-looking and the vertical view of protuberance 134 about the pawl part employing; Only as make fiber connector can fixed engagement in the embodiment or the reference of the trip mechanism of this optical fiber splicing device, but not as limit.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. an optical fiber splicing device is arranged on the sphere grid array base plate for packaging, in order to a light signal that is coupled between optoelectronic device chip to an optical fiber; This optical fiber has a connector; This connector has a pawl part, it is characterized in that, this optical fiber splicing device comprises:
One modular structure, to transmit this light signal, this modular structure comprises in order to ccontaining this optical fiber:
One inserts the hole, and this shape of inserting the hole is corresponding to this connector; And
One protuberance, make this pawl part and this protuberance with trip mechanism fixed engagement, and this pawl part is corresponding to this protuberance;
Wherein, this pawl part is that flexible materials forms the overhead kick shape.
2. optical fiber splicing device according to claim 1 is characterized in that, this photovalve is light emitting diode, a vcsel, a PIN optical diode of a wall emission, or a tired avalanche photo diode.
3. optical fiber splicing device according to claim 1 is characterized in that, this optical fiber is that quartz is optical fiber, multicomponent glass optical fiber, PCS plastic-clad silica core fibre, all-plastic optical fiber and fluoride fiber.
4. optical fiber splicing device according to claim 1 is characterized in that, also comprises: a beam steering device, this beam steering device make this light signal aim at and be coupled to this optical fiber in order to change this light signal direction.
5. optical fiber splicing device according to claim 4 is characterized in that, this beam steering device is a catoptron or a dielectric medium multi layer film filter, and this beam steering device is in order to be coupled into this optical fiber with these light signal direction deviation 80 to 100 degree.
6. optical fiber splicing device according to claim 4 is characterized in that, this beam steering device is a pliability optical fiber or an optical waveguide.
7. optical fiber splicing device according to claim 4 is characterized in that, this modular structure also comprises:
One first ccontaining member is arranged on this optoelectronic device chip, in order to hold and fixing this beam steering device and this modular structure; And
One first circuit board is provided with on this sphere grid array base plate for packaging, in order to fixing this photovalve.
8. optical fiber splicing device according to claim 4 is characterized in that, also comprises:
One second ccontaining member is arranged on this sphere grid array base plate for packaging, in order to hold and fixing this optoelectronic device chip, this beam steering device, and this modular structure; And
One second circuit board, be arranged at this second ccontaining member bottom top and this optoelectronic device chip below, in order to fixing this photovalve.
9. optical fiber splicing device according to claim 4; It is characterized in that; Also comprise a plurality of optoelectronic device chips, a plurality of modular structure, reach a plurality of beam steering devices; These a plurality of optoelectronic device chips, these a plurality of modular structures, and these a plurality of beam steering devices arrange with the form of array, and each optoelectronic device chip respectively on its light path corresponding to separately beam steering device and modular structure.
10. optical fiber splicing device according to claim 4 is characterized in that, this modular structure also comprises one first lenticule, and this first lenticule is arranged between this connector and this beam steering device.
11. optical fiber splicing device according to claim 10 is characterized in that, this modular structure also comprises one second lenticule, and this second lenticule is arranged between this photovalve and this beam steering device.
12. optical fiber splicing device according to claim 1 is characterized in that, this modular structure also comprises:
One the 3rd ccontaining member is arranged on this sphere grid array base plate for packaging, in order to hold and fixing this optoelectronic device chip and this modular structure; And
One tertiary circuit plate, be arranged on the side of the 3rd ccontaining member and this optoelectronic device chip below, in order to fixing this photovalve;
Wherein, the surperficial formed angle of the direction of this light signal and this sphere grid array base plate for packaging is spent less than 10, and aims at and be coupled to this optical fiber.
13. optical fiber splicing device according to claim 12 is characterized in that, this modular structure also comprises a lenticule, and this lenticule is arranged between this photovalve and this connector.
14. optical fiber splicing device according to claim 12; It is characterized in that; Also comprise a plurality of optoelectronic device chips and a plurality of modular structure; These a plurality of optoelectronic device chips and this a plurality of modular structures are arranged with the form of array, and each optoelectronic device chip respectively on its light path corresponding to separately modular structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100057612A CN102590959A (en) | 2011-01-07 | 2011-01-07 | Optical fiber connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100057612A CN102590959A (en) | 2011-01-07 | 2011-01-07 | Optical fiber connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102590959A true CN102590959A (en) | 2012-07-18 |
Family
ID=46479854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100057612A Pending CN102590959A (en) | 2011-01-07 | 2011-01-07 | Optical fiber connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102590959A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104459925A (en) * | 2013-09-17 | 2015-03-25 | 富士康(昆山)电脑接插件有限公司 | Lens module |
| CN104482498A (en) * | 2014-11-10 | 2015-04-01 | 华南理工大学 | Sunlight panel light system for underground garage |
| CN104678512A (en) * | 2013-11-30 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Multimedia data transmission device |
| CN104995538A (en) * | 2012-10-09 | 2015-10-21 | 康宁光电通信有限责任公司 | Optical fiber connectors and methods of forming optical fiber connectors |
| CN107209332A (en) * | 2015-02-05 | 2017-09-26 | 索尼公司 | Optical sending apparatus, optical receiving device and optical cable |
| CN109104796A (en) * | 2018-10-09 | 2018-12-28 | 西安中科华芯测控有限公司 | A kind of the chip assembly locating fixture and method of super-radiance light emitting diode |
| CN109104246A (en) * | 2018-10-29 | 2018-12-28 | 深圳市易飞扬通信技术有限公司 | universal serial bus active optical cable circuit |
| WO2020237706A1 (en) * | 2019-05-30 | 2020-12-03 | 上海新微技术研发中心有限公司 | Method for packaging silicon optical module, and silicon optical module |
| CN113050235A (en) * | 2019-12-26 | 2021-06-29 | 讯芯电子科技（中山）有限公司 | Optical communication module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4439006A (en) * | 1981-05-18 | 1984-03-27 | Motorola, Inc. | Low cost electro-optical connector |
| US4767179A (en) * | 1982-12-20 | 1988-08-30 | Molex Incorporated | Fiber optic connector assembly |
| US20030180012A1 (en) * | 2000-11-14 | 2003-09-25 | National Semiconductor Corporation | Multi-format connector module incorporating chip mounted optical sub-assembly |
| US6945712B1 (en) * | 2003-02-27 | 2005-09-20 | Xilinx, Inc. | Fiber optic field programmable gate array integrated circuit packaging |
| US20060280410A1 (en) * | 2005-05-25 | 2006-12-14 | Fujikura Ltd. | Optical connector |
| CN101147088A (en) * | 2005-02-16 | 2008-03-19 | 应用材料股份有限公司 | Optical coupling to IC chip |
| CN101473258A (en) * | 2006-05-05 | 2009-07-01 | 里夫莱克斯光子公司 | Optically-enabled integrated circuit package |
-
2011
- 2011-01-07 CN CN2011100057612A patent/CN102590959A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4439006A (en) * | 1981-05-18 | 1984-03-27 | Motorola, Inc. | Low cost electro-optical connector |
| US4767179A (en) * | 1982-12-20 | 1988-08-30 | Molex Incorporated | Fiber optic connector assembly |
| US20030180012A1 (en) * | 2000-11-14 | 2003-09-25 | National Semiconductor Corporation | Multi-format connector module incorporating chip mounted optical sub-assembly |
| US6945712B1 (en) * | 2003-02-27 | 2005-09-20 | Xilinx, Inc. | Fiber optic field programmable gate array integrated circuit packaging |
| CN101147088A (en) * | 2005-02-16 | 2008-03-19 | 应用材料股份有限公司 | Optical coupling to IC chip |
| US20060280410A1 (en) * | 2005-05-25 | 2006-12-14 | Fujikura Ltd. | Optical connector |
| CN101473258A (en) * | 2006-05-05 | 2009-07-01 | 里夫莱克斯光子公司 | Optically-enabled integrated circuit package |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104995538A (en) * | 2012-10-09 | 2015-10-21 | 康宁光电通信有限责任公司 | Optical fiber connectors and methods of forming optical fiber connectors |
| US9529162B2 (en) | 2012-10-09 | 2016-12-27 | Corning Optical Communications LLC | Optical fiber connectors and methods of forming optical fiber connectors |
| CN104459925A (en) * | 2013-09-17 | 2015-03-25 | 富士康(昆山)电脑接插件有限公司 | Lens module |
| CN104678512A (en) * | 2013-11-30 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Multimedia data transmission device |
| CN104482498A (en) * | 2014-11-10 | 2015-04-01 | 华南理工大学 | Sunlight panel light system for underground garage |
| CN104482498B (en) * | 2014-11-10 | 2016-07-06 | 华南理工大学 | A kind of sunlight flat lamp system of underground parking garage |
| CN107209332A (en) * | 2015-02-05 | 2017-09-26 | 索尼公司 | Optical sending apparatus, optical receiving device and optical cable |
| CN107209332B (en) * | 2015-02-05 | 2019-12-17 | 索尼公司 | Optical transmission apparatus, optical reception apparatus, and optical cable |
| CN109104796A (en) * | 2018-10-09 | 2018-12-28 | 西安中科华芯测控有限公司 | A kind of the chip assembly locating fixture and method of super-radiance light emitting diode |
| CN109104796B (en) * | 2018-10-09 | 2023-09-22 | 西安中科华芯测控有限公司 | Chip assembly positioning fixture and method for super-radiation light-emitting diode |
| CN109104246A (en) * | 2018-10-29 | 2018-12-28 | 深圳市易飞扬通信技术有限公司 | universal serial bus active optical cable circuit |
| WO2020237706A1 (en) * | 2019-05-30 | 2020-12-03 | 上海新微技术研发中心有限公司 | Method for packaging silicon optical module, and silicon optical module |
| CN112103275A (en) * | 2019-05-30 | 2020-12-18 | 上海新微技术研发中心有限公司 | Packaging method of silicon optical module and silicon optical module |
| CN112103275B (en) * | 2019-05-30 | 2022-04-12 | 上海新微技术研发中心有限公司 | Packaging method of silicon optical module and silicon optical module |
| CN113050235A (en) * | 2019-12-26 | 2021-06-29 | 讯芯电子科技（中山）有限公司 | Optical communication module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102590959A (en) | Optical fiber connector | |
| US8939657B2 (en) | Optical connector with sloped surface | |
| JP5777355B2 (en) | System and method | |
| TWI529438B (en) | Optical transceiver module | |
| US20120241795A1 (en) | Optoelectronic Module | |
| JP5681566B2 (en) | Signal transmission module having optical waveguide structure | |
| CN102402710B (en) | Usb optical thin card structure | |
| US9297969B2 (en) | Optical engine assembly and transceiver using the same | |
| CN103278894A (en) | Coupling assembly, optical fiber array module using coupling assembly and optical transceiver engine module using coupling assembly | |
| US9448361B2 (en) | Photoelectric wiring module | |
| CN103248425A (en) | Transmission method and transmission system | |
| TW201346362A (en) | Optical fiber module | |
| US11927817B2 (en) | Optical module | |
| TW201608293A (en) | Bidirectional optical sub-assembly | |
| US8837881B2 (en) | Optical connector having high coupling precision | |
| TW201216575A (en) | Support structure of display apparatus | |
| US9146154B2 (en) | Photoelectric conversion device and optical fiber coupling connector | |
| CN102436042A (en) | Flexible-coupling high-speed photoelectric device | |
| US20140341507A1 (en) | Optical-electric coupling element and optical connector using same | |
| KR20110070036A (en) | A photoelectric conversion module using an interposer | |
| JP2013195445A (en) | Optical structure for optical reception, image display device module, and electronic apparatus having the same | |
| US20130004124A1 (en) | Optical fiber connector and optical fiber coupling assembly having same | |
| TWI515464B (en) | Three - dimensional structure of high - speed miniaturized ceramic substrate optical device | |
| US8777495B2 (en) | Optical connector with sloped surface | |
| KR101477379B1 (en) | Optical Interconnection Module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120718 |