CN102436042A - Flexible-coupling high-speed photoelectric device - Google Patents
Flexible-coupling high-speed photoelectric device Download PDFInfo
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- CN102436042A CN102436042A CN2011103360005A CN201110336000A CN102436042A CN 102436042 A CN102436042 A CN 102436042A CN 2011103360005 A CN2011103360005 A CN 2011103360005A CN 201110336000 A CN201110336000 A CN 201110336000A CN 102436042 A CN102436042 A CN 102436042A
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- high speed
- semiconductor laser
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Abstract
The invention discloses a flexible-coupling high-speed photoelectric device. The flexible-coupling high-speed photoelectric device comprises a module circuit board, a flexible circuit board mounted on the module circuit board, a substrate mounted on the flexible circuit board and a reverse-mounted semiconductor laser chip or a receiver chip array mounted on the substrate by virtue of bonding, wherein a high-speed via-hole array is arranged on the substrate. Compared with the prior art, the flexible-coupling high-speed photoelectric device disclosed by the invention has a simple structure and is convenient in assembly; and the optical coupling part is an independent optical sub-component and can be electrically connected with the module circuit board flexibly.
Description
Technical field
The present invention relates to the high speed optoelectronic device of a kind of photoelectric device, particularly a kind of flexible coupling.
Background technology
Optical fiber and transmitted at high speed acceptance technology are widely used in data communication, high-performance computer interconnects and the high-speed peripheral of consumption electronic product is interconnected.In these devices, need be with light emitting devices or receiving device and optical fiber coupling.And light emitting devices or receiving device have two kinds of structures.First kind is waveguide type, for example waveguide side emitting semiconductor laser and waveguide type photodiode, and its light emitting surface or receiving plane are in vertical plane with electrode.Another kind is a plane, for example Vertical Cavity Surface Emitting Semiconductor Lasers (VCSEL) and planar-type semiconductor photodiode (planar photodiode), and its light emitting surface or receiving plane are in same or parallel plane with electrode.For waveguide devices; Planar device has low cost and is easy to advantages such as encapsulation; Use very extensive, for example in active optical cable, often adopt Vcsel as optical signal transmitter and planar photodiode as optical receiver.
Yet, because in the application scenario of planar device, light signal is vertical coupled to light emitting surface or receiving plane, this means that optically-coupled direction and electrode plane are vertical.And usually because the restriction of structure and size, the optically-coupled direction is parallel with circuit board in the module that photoelectric device belongs to.If photoelectric device is welded in parallel on the module board, adopt catoptron that coupled light beam is turned to 90 degree usually.Yet, but this technical costs is high, complex process, is unfavorable for assembling production.
Therefore, need a kind of new technical scheme to address the above problem.
Summary of the invention
To above-mentioned existing in prior technology problem and shortage, the purpose of this invention is to provide a kind of high speed optoelectronic device of flexible coupling simple in structure, easy to assembly.
For realizing above-mentioned purpose, the present invention's high speed optoelectronic device of coupling flexibly can adopt following technical scheme:
A kind of high speed optoelectronic device of flexible coupling; Comprise module board, be installed on flexible PCB on the module board, be installed on the substrate on the flexible PCB and be installed on suprabasil anti-dress semiconductor laser chip or receiver chip array through bonding, said substrate is provided with the high speed arrays of vias.
The present invention is compared with prior art: simple in structure, be convenient to assembling, and optically-coupled partly becomes an independent optical sub-assembly, and can be electrically connected with module board neatly.
Description of drawings
Fig. 1 is the structural representation of the high speed optoelectronic device of the flexible coupling of the present invention.
Embodiment
Below in conjunction with accompanying drawing and embodiment; Further illustrate the present invention; Should understand following embodiment only be used to the present invention is described and be not used in the restriction scope of the present invention; After having read the present invention, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the present invention.
Please combine shown in Figure 1; The present invention discloses a kind of high speed optoelectronic device 100 of flexible coupling; Comprise module board 20, be installed on flexible PCB 30 on the module board 20, be installed on the substrate 40 on the flexible PCB 30 and be installed on anti-dress semiconductor laser chip 50 or receiver chip array 50 in the substrate 40 through bonding; Said substrate 40 is substrate of glass or ceramic bases, and substrate 40 is provided with high speed arrays of vias 41.Bonding mode between said substrate 40 and anti-dress semiconductor laser chip 50 or the receiver chip array 50 is gold solder, golden soldering, indium weldering altogether.If what install in the substrate 40 is anti-dress semiconductor laser chip 50, then should be provided with launch site 51 by anti-dress semiconductor laser chip 50, the optically-coupled direction of this launch site 51 and at least one optical fiber 60 is relative; If what install in the substrate 40 is receiver chip array 50, then this receiver chip array 50 is provided with reception area 51, and the optically-coupled direction of this reception area 51 and at least one optical fiber 60 is relative.Wherein, the every other device except that module board 20 is formed an optical sub-assembly (optical sub-assembly or OSA).Optical fiber and launch site 51 or reception area 51 can be single, also can be the forms of array.Compared with prior art, the present invention separates light beam coupling with being electrically connected, and its advantage is:
1, optically-coupled partly becomes an independent optical sub-assembly, can be electrically connected with module board neatly.
2, the via hole of pottery or glass substrate and soft board can guarantee the bandwidth that 10Gbps is above.
3, pottery or glass substrate can be wafer form, therefore are convenient to adopt the chip bonding mode on the wafer to produce, and have improved productive rate greatly, have reduced cost.
Claims (4)
1. flexible high speed optoelectronic device of coupling; It is characterized in that: comprise module board, be installed on flexible PCB on the module board, be installed on the substrate on the flexible PCB and be installed on suprabasil anti-dress semiconductor laser chip or receiver chip array through bonding, said substrate is provided with the high speed arrays of vias.
2. the high speed optoelectronic device of a flexible coupling as claimed in claim 1 is characterized in that: said substrate.
3. the high speed optoelectronic device of a flexible coupling according to claim 1 or claim 2 is characterized in that: the bonding mode between said substrate and anti-dress semiconductor laser chip or the receiver chip array is gold solder, golden soldering, indium weldering altogether.
4. the high speed optoelectronic device of a flexible coupling as claimed in claim 1; It is characterized in that: as if the anti-dress semiconductor laser chip of installing in the substrate that is; Then should be provided with the launch site by anti-dress semiconductor laser chip, the optically-coupled direction of this launch site and at least one optical fiber is relative; If what install in the substrate is the receiver chip array, then this receiver chip array is provided with reception area, and the optically-coupled direction of this reception area and at least one optical fiber is relative.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103360005A CN102436042A (en) | 2011-10-28 | 2011-10-28 | Flexible-coupling high-speed photoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103360005A CN102436042A (en) | 2011-10-28 | 2011-10-28 | Flexible-coupling high-speed photoelectric device |
Publications (1)
| Publication Number | Publication Date |
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| CN102436042A true CN102436042A (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103360005A Pending CN102436042A (en) | 2011-10-28 | 2011-10-28 | Flexible-coupling high-speed photoelectric device |
Country Status (1)
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| CN (1) | CN102436042A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018082117A (en) * | 2016-11-18 | 2018-05-24 | 住友電工デバイス・イノベーション株式会社 | Optical module |
| CN108873193A (en) * | 2018-06-25 | 2018-11-23 | 青岛海信宽带多媒体技术有限公司 | Light-receiving secondary module and optical module |
| CN111555811A (en) * | 2020-04-22 | 2020-08-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (7)
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| US20020085784A1 (en) * | 2000-12-06 | 2002-07-04 | Reimer Ernest M. | Integrated lightguide-optoelectronic devices |
| US20040161208A1 (en) * | 2003-02-15 | 2004-08-19 | Marco Scofet | Low cost optical module |
| CN1639837A (en) * | 2001-06-29 | 2005-07-13 | 美莎诺普有限公司 | Optical chip packaging via through hole |
| CN1667440A (en) * | 2004-03-10 | 2005-09-14 | 富士通株式会社 | Optical module, manufacturing method therefor, protective component for a light guide, and protective component having electric wiring |
| CN101002123A (en) * | 2004-06-09 | 2007-07-18 | 日本电气株式会社 | Optical waveguide module |
| CN101452096A (en) * | 2007-12-03 | 2009-06-10 | 新光电气工业株式会社 | Optical interconnection device |
| CN201903673U (en) * | 2010-11-04 | 2011-07-20 | 浙江彩虹鱼通讯技术有限公司 | Optical module, interface and optical fiber transmission line |
-
2011
- 2011-10-28 CN CN2011103360005A patent/CN102436042A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020085784A1 (en) * | 2000-12-06 | 2002-07-04 | Reimer Ernest M. | Integrated lightguide-optoelectronic devices |
| CN1639837A (en) * | 2001-06-29 | 2005-07-13 | 美莎诺普有限公司 | Optical chip packaging via through hole |
| US20040161208A1 (en) * | 2003-02-15 | 2004-08-19 | Marco Scofet | Low cost optical module |
| CN1667440A (en) * | 2004-03-10 | 2005-09-14 | 富士通株式会社 | Optical module, manufacturing method therefor, protective component for a light guide, and protective component having electric wiring |
| CN101002123A (en) * | 2004-06-09 | 2007-07-18 | 日本电气株式会社 | Optical waveguide module |
| CN101452096A (en) * | 2007-12-03 | 2009-06-10 | 新光电气工业株式会社 | Optical interconnection device |
| CN201903673U (en) * | 2010-11-04 | 2011-07-20 | 浙江彩虹鱼通讯技术有限公司 | Optical module, interface and optical fiber transmission line |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018082117A (en) * | 2016-11-18 | 2018-05-24 | 住友電工デバイス・イノベーション株式会社 | Optical module |
| CN108072943A (en) * | 2016-11-18 | 2018-05-25 | 住友电工光电子器件创新株式会社 | Optical module |
| JP7014367B2 (en) | 2016-11-18 | 2022-02-01 | 住友電工デバイス・イノベーション株式会社 | Optical module |
| CN108873193A (en) * | 2018-06-25 | 2018-11-23 | 青岛海信宽带多媒体技术有限公司 | Light-receiving secondary module and optical module |
| CN111555811A (en) * | 2020-04-22 | 2020-08-18 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Application publication date: 20120502 |