CN103383483A - Parallel optical emission assembly based on 45-degree fiber array and manufacturing method thereof - Google Patents
Parallel optical emission assembly based on 45-degree fiber array and manufacturing method thereof Download PDFInfo
- Publication number
- CN103383483A CN103383483A CN2013103073349A CN201310307334A CN103383483A CN 103383483 A CN103383483 A CN 103383483A CN 2013103073349 A CN2013103073349 A CN 2013103073349A CN 201310307334 A CN201310307334 A CN 201310307334A CN 103383483 A CN103383483 A CN 103383483A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- vcsel laser
- laser array
- fiber arrays
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a parallel optical emission assembly based on a 45-degree fiber array and a manufacturing method thereof. The parallel optical emission assembly comprises the 45-degree fiber array with an MT connector, a ceramic substrate and a VCSEL laser device array, wherein an electrode and a bonding pad are arranged on the ceramic substrate, the VCSEL laser device array is fixedly bonded on the electrode of the ceramic substrate, a bonding pad of a chip of the VCSEL laser device array is connected with the bonding pad of the ceramic substrate in a gold wire bonding mode, the 45-degree optical reflection surface of the 45-degree fiber array with the MT connector is in one-to-one aligned coupling with the VCSEL laser device array, and the 45-degree fiber array with the MT connector is fixed on the ceramic substrate. During usage, a user only needs to bond the ceramic substrate on a printed circuit board (PCB) of the user, driving signals of the VCSEL laser device array are connected with the bonding pad on the ceramic substrate in a routing mode, high-speed signals can demodulate and drive the VCSEL laser device array, parallel electric signals can be converted into parallel optical signals, and the parallel optical signals can be output to the standard MT connector through direct coupling of the 45-degree fiber array to be connected with the outside.
Description
Technical field
The present invention relates to parallel light emitting module and manufacture method thereof in the technical field such as parallel light transceiving module, active optical cable in optical communication technique.
Background technology
Along with the rapid growth of the mankind to communication requirement, existing communication system faces more challenges.Its medium-rate and energy consumption are two very crucial factors.People are desirably under less space, lower energy consumption condition larger bandwidth are provided.Therefore the research of parallel optical transceiver module has obtained research widely.
Among the telecommunication lasers commonly used such as LD laser instrument, VCSEL laser instrument, the VCSEL laser instrument has higher conversion efficiency, the lower advantages such as threshold value, therefore the laser instrument of its other kinds of power dissipation ratio is little, the VCSEL laser instrument is the surface launching mode simultaneously, be easy to realize array, volume is small and exquisite, is fit to very much be applied in the fields such as parallel light transmission and parallel optical interconnecting.
The emergent light of VCSEL laser instrument is perpendicular to the circuit board surface of installing, and this encapsulation and application for device is all not quite convenient.The simplest optical interface is that optical fiber is docked with the VCSEL laser instrument, and the emergent light of laser instrument directly enters optical fiber, and without other intermediary element, such coupling scheme are called vertical coupled.
Vertical coupled due to reflection of light causes speed can not be too high, in addition, owing to being vertical coupled, optical fiber becomes perpendicular shape with PCB, causes the volume of optical module to increase.
In order to solve the vertical coupled problem of bringing, can adopt the form of light path corner to realize the coupling of VCSEL laser instrument and fiber array.A kind of is the mode that adopts microlens array; Also having a kind of mode is exactly that fiber array is ground 90 ° of corners that catoptron at 45 ° is realized light signal.
With regard to the parallel module of short distance data communication, one of core technology is exactly fiber coupling technique.In parallel module, generally adopt the OM2/OM3 multimode band fiber array of core diameter 50/125 μ m.Light source adopts GaAs vertical cavity surface light emitting (VCSEL) laser array of light-emitting area diameter 7-9 μ m, and detector (PD) array adopts accepts face diameter 60-70 μ m GaAs detector array.Due to the core diameter of sensitive surface diameter 60-70 μ m greater than optical fiber, detector chip is easier to the coupling fiber ratio.
Technical difficult points is VCSEL laser instrument and coupling fiber problem.Be multimode VCSEL laser instrument due to what adopt, the angle of divergence is large (angle of divergence is approximately 26 °), and direct-coupled method needs to control accurately the distance of optical fiber and VCSEL laser instrument light-emitting area.Method relatively commonly used is active active coupling method, namely lights the VCSEL laser instrument, and by adjusting the distance of fiber end face and VCSEL laser instrument, the position of high coupling efficiency is sought in angle and displacement.The module that walks abreast manufacturer does not generally possess this ability, has therefore hindered research and development and the production of parallel light transceiving module.
Summary of the invention
In order to advance the development of parallel module, the purpose of patent of the present invention overcomes this problem exactly, 45 ° of fiber arrays and VCSEL laser array are coupled, and the parallel light emitting module that provides a kind of interface class to be similar to traditional light emission component.
The invention discloses a kind of parallel optical emitting module based on 45 ° of fiber arrays, comprise: with 45 ° of fiber arrays, ceramic substrate and the VCSEL laser array of MT connector, electrode and pad are arranged on ceramic substrate, the VCSEL laser array is adhesively fixed on the ceramic substrate electrode, the pad of VCSEL laser array chip is connected with the pad of ceramic substrate by the gold wire bonding mode, 45 ° of optical reflection faces with 45 ° of fiber arrays of MT connector are aimed at coupling one by one with the VCSEL laser array, and 45 ° of fiber arrays are fixed on substrate.
Form a parallel light emitting module after fixing, this assembly provides high speed pads for user interface, do not need the user again to be coupled, thereby parallel optical module is subdivided into optical assembly part and circuit part, optical assembly can be regarded an element in parallel optical module as.
Adopt less pad to be connected with the pad routing of VCSEL laser array, go between extremely short, be convenient to realize the transmission of high speed signal.
Preferably, patent of the present invention adopts thermal characteristics and the good pottery of mechanical property as the substrate of carrying VCSEL laser array, and be etched with circuit on ceramic substrate, and described circuit comprises electrode and pad, the VCSEL laser array bonds together by conductive silver glue and electrode.
With the pottery of thermal property and the satisfactory mechanical property carrier as carrying VCSEL laser array, good heat conductivity, high frequency characteristics is good, thermal expansivity is little, is convenient to integrate with user's high speed circuit board.
Preferably, 45 ° of fiber arrays with the MT connector that patent of the present invention adopts comprise standard MT joint, band fibre and V groove, and wherein the head of the end band fibre that is not connected with standard MT joint of V groove is to shell into bare fibre and grind optical reflection face at 45 °.
Fiber array is ground 90 ° of corners that catoptron at 45 ° is realized light signal, be conducive to solve the vertical coupled problem of bringing.
The invention discloses a kind of manufacturing based on the method for the parallel optical emitting module of 45 ° of fiber arrays, comprise the following steps:
Step 1 provides a kind of 45 ° of fiber arrays with the MT joint, and described fiber array comprises the V groove, and the head of the band fibre of the end that described V groove is not connected with described MT joint is shelled into bare fibre and ground optical reflection face at 45 °;
Step 2 forms electrode and pad by being etched on ceramic substrate;
Step 3 sticks on the VCSEL laser array on the electrode of ceramic substrate by conductive silver glue;
Step 4 by the mode of gold wire bonding, is connected with the pad of ceramic substrate one by one with the pad of spun gold with the VCSEL laser array chip;
Step 5 is introduced drive current by probe and is made the VCSEL laser array luminous;
Step 6, the standard MT joint 110 of 45 ° of fiber arrays 100 is connected with the interface of multi-channel power meter;
Step 7 is put into 6 dimension adjustment racks with 45 ° of fiber arrays, makes 45 ° of optical reflection faces of fiber array be positioned at the top of VCSEL laser array;
Step 8 changes the optical reflection face of 45 ° of fiber arrays and distance, angle and the displacement of VCSEL laser array by adjusting 6 dimension adjustment racks, monitors simultaneously the coupling efficiency of each passage by Multichannel optical power meter;
Step 9 when reaching optimistic coupling efficiency, bonds together 45 ° of fiber arrays 100 and ceramic substrate 101, the adhesive curing of some adhesive curing point.
Structure of the present invention is small and exquisite, can embed according to user's request user's circuit board, produces various parallel light transceiving module or active optical cable.
Description of drawings
Fig. 1 is 45 ° of fiber array schematic diagram with the MT connector;
The ceramic substrate schematic diagram of Fig. 2 has been etching electrode and pad;
Fig. 3 the has been bonding fixed ceramic substrate schematic diagram of VCSEL laser array and spun gold nation;
Fig. 4 is the structural representation based on an embodiment of parallel optical emitting module of 45 ° of fiber arrays.
In accompanying drawing, the list of parts of each label representative is as follows:
100, with 45 ° of fiber arrays of MT interface, 110, standard MT joint, 120, band is fine, 121,45 ° of optical reflection faces of fiber array, 130, V groove, 200, ceramic substrate, 210, ceramic bases, 220, electrode, 230, pad, 201, the bonding fixed ceramic substrate of VCSEL laser array and spun gold nation, 240, the VCSEL laser array, 250, spun gold.
Embodiment
Below in conjunction with accompanying drawing, principle of the present invention and feature are described, example only is used for explaining the present invention, is not be used to limiting scope of the present invention.
as Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, wherein, Fig. 4 is the structural representation based on an embodiment of parallel optical emitting module of 45 ° of fiber arrays, Fig. 1 is that described embodiment is a kind of based on the 45 ° of fiber array schematic diagram of band MT connector in the parallel optical emitting module of 45 ° of fiber arrays, Fig. 2 is that described embodiment is a kind of based on the ceramic substrate schematic diagram that is etched with electrode and pad in the parallel optical emitting module of 45 ° of fiber arrays, Fig. 3 is that described embodiment is a kind of based on the bonding fixed ceramic substrate schematic diagram of VCSEL laser array and spun gold nation in the parallel optical emitting module of 45 ° of fiber arrays.
In this embodiment, a kind of parallel optical emitting module based on 45 ° of fiber arrays comprises 45 ° of fiber arrays 100 of band MT connector, ceramic substrate 200 and VCSEL laser array 240; Electrode 220 and pad 230 are arranged on described ceramic substrate 200, VCSEL laser array 240 is adhesively fixed on ceramic substrate electrode 220 by conductive silver glue, and the pad of VCSEL laser array 240 chips is connected with pad 230 on ceramic substrate 200 one by one by the gold wire bonding mode;
45 ° of fiber arrays 100 of described band MT connector comprise that standard MT joint 110, band are fine 120, V groove 130, and wherein the head of the end band fibre that is not connected with standard MT joint 110 of V groove 130 is to shell into bare fibre and grind optical reflection face at 45 °; Described 45 ° of optical reflection faces 121 are aimed at coupling one by one with VCSEL laser array 240, and 45 ° of fiber arrays 100 of described band MT connector are fixed on described substrate 200.
The invention also discloses above-mentioned manufacturing based on the method for the parallel optical emitting module of 45 ° of fiber arrays, comprise the following steps:
Step 1 as shown in Figure 1, provides one with 45 ° of fiber arrays 100 of MT interface, and this fiber array 100 comprises standard MT joint 110, band fibre 120, V groove 130; The head of the band fibre of the end that wherein said V groove is not connected with standard MT joint 110 is shelled into bare fibre and is ground optical reflection face at 45 °.
Step 2, etching electrode 220 and pad 230 on ceramic bases shown in Figure 2 210, the ceramic substrate 200 of consisted of etching electrode and pad.
Step 3, on the electrode of ceramic substrate 200, the coated with conductive elargol sticks on the VCSEL laser array on electrode and is heating and curing.Like this, when VCSEL laser array energising work, ceramic substrate has good thermal conductivity, and the heat of VCSEL laser array is distributed.When bonding VCSEL laser array, guarantee that as far as possible the VCSEL laser array is positioned at the central authorities of electrode 220, and parallel with the edge of electrode.In addition, the light-emitting area that also needs to guarantee the VCSEL laser array is surperficial parallel with ceramic substrate 200 as far as possible.
Step 4 on the basis in the 3rd step, by the mode of gold wire bonding, is connected with the pad 230 of ceramic substrate 200 with the pad of spun gold 250 with the VCSEL laser array chip one by one.So just formed a bonding fixed ceramic substrate 201 of VCSEL laser array and spun gold nation.
Step 5, the bonding fixed ceramic substrate 201 of VCSEL laser array and spun gold nation that the 4th step was made is placed on an optical table, guarantees the level of this ceramic substrate 201 as far as possible.
Step 6, the end that probe is sharp-pointed contacts with pad 230, and the other end of probe connects the VCSEL laser driving chip.Give the power supply of VCSEL laser driving chip, drive current just imports VCSEL laser array 240 by probe makes it luminous.
Step 7 is connected the standard MT joint 110 of 45 ° of fiber arrays 100 with the interface of multi-channel power meter.
Step 8 is put into 6 dimension adjustment racks with 45 ° of fiber arrays 100, makes 45 ° of optical reflection faces 121 of fiber array be positioned at the top of VCSEL laser array 240.
Step 9, adjust 6 dimension adjustment racks, change distance, angle and the displacement of 45 ° of optical reflection faces of fiber array 121 and VCSEL laser array 240, monitor simultaneously the coupling efficiency of each passage by Multichannel optical power meter, in the situation that reach optimistic coupling efficiency, 45 ° of fiber arrays 100 and ceramic substrate 101 are bonded together, the some adhesive curing.
Remove probe, take off the parallel light emitting module, then be solidified to form a parallel light emitting module, as shown in Figure 4.
The parallel light emitting module that is made like this has two kinds of interfaces, and a kind of is standard MT joint 110 with the intercommunication of ambient light interface inter-link; Another is exactly to drive with the user pad 230 that chip is connected.The user only needs the design circuit plate, the pad of the VCSEL laser driving chip mode by gold wire bonding is connected with the pad 230 of parallel light emitting module, can develop parallel light transceiving module and need not consider the coupling of complicated parallel light passage, thereby can greatly improve research and development and the speed of production of product.
The above implementation step and method have only been expressed one embodiment of the present invention, and description is comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Under the prerequisite that does not break away from patent design of the present invention, the distortion of doing and improvement should all belong to the protection domain of patent of the present invention.
Claims (4)
1. parallel optical emitting module based on 45 ° of fiber arrays, comprise 45 ° of fiber arrays with the MT connector, ceramic substrate and VCSEL laser array, it is characterized in that: electrode and pad are arranged on described ceramic substrate, described VCSEL laser array is adhesively fixed on described ceramic substrate electrode, the pad of described VCSEL laser array chip is connected with the pad of described ceramic substrate by the gold wire bonding mode, 45 ° of optical reflection faces of described 45 ° of fiber arrays with the MT connector are aimed at coupling one by one with described VCSEL laser array, described 45 ° of fiber arrays with the MT connector are fixed on described ceramic substrate.
2. parallel optical emitting module according to claim 1, it is characterized in that: described ceramic substrate comprises ceramic bases, be etched with circuit on described ceramic bases, described circuit comprises described electrode and pad, and described VCSEL laser array bonds together by conductive silver glue and described electrode.
3. parallel optical emitting module according to claim 1, it is characterized in that: described 45 ° of fiber arrays with the MT connector comprise standard MT joint, band fibre and V groove, and wherein the head of the end band fibre that is not connected with standard MT joint of V groove is to shell into bare fibre and grind optical reflection face at 45 °.
4. a manufacturing based on the method for the parallel optical emitting module of 45 ° of fiber arrays, is characterized in that: comprise the following steps:
Step 1 provides a kind of 45 ° of fiber arrays with the MT joint, and described fiber array comprises the V groove, and the head of the band fibre of the end that described V groove is not connected with described MT joint is shelled into bare fibre and ground optical reflection face at 45 °;
Step 2 forms electrode and pad by being etched on ceramic substrate;
Step 3 sticks on the VCSEL laser array on the electrode of ceramic substrate by conductive silver glue;
Step 4 by the mode of gold wire bonding, is connected with the pad of ceramic substrate one by one with the pad of spun gold with the VCSEL laser array chip;
Step 5 is introduced drive current by probe and is made the VCSEL laser array luminous;
Step 6 is connected the standard MT joint of 45 ° of fiber arrays with the interface of multi-channel power meter;
Step 7 is put into 6 dimension adjustment racks with 45 ° of fiber arrays, makes 45 ° of optical reflection faces of 45 ° of fiber arrays be positioned at the top of VCSEL laser array;
Step 8 changes the optical reflection face of 45 ° of fiber arrays and distance, angle and the displacement of VCSEL laser array by adjusting 6 dimension adjustment racks, monitors simultaneously the coupling efficiency of each passage by Multichannel optical power meter;
Step 9 when reaching optimistic coupling efficiency, bonds together 45 ° of fiber arrays and ceramic substrate, the some adhesive curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103073349A CN103383483A (en) | 2013-07-19 | 2013-07-19 | Parallel optical emission assembly based on 45-degree fiber array and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103073349A CN103383483A (en) | 2013-07-19 | 2013-07-19 | Parallel optical emission assembly based on 45-degree fiber array and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103383483A true CN103383483A (en) | 2013-11-06 |
Family
ID=49491318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103073349A Pending CN103383483A (en) | 2013-07-19 | 2013-07-19 | Parallel optical emission assembly based on 45-degree fiber array and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103383483A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103984067A (en) * | 2014-06-03 | 2014-08-13 | 苏州洛合镭信光电科技有限公司 | Optical device allowing multi-channel light beam splitting to be achieved |
| CN104597567A (en) * | 2015-01-22 | 2015-05-06 | 中国科学院半导体研究所 | Optical switch array module and chamfered optical fiber array packaging method |
| CN104749710A (en) * | 2015-03-23 | 2015-07-01 | 华为技术有限公司 | Optical fiber and chip aimed packaging structure and optical fiber aiming method |
| CN104767561A (en) * | 2014-01-03 | 2015-07-08 | 上海光维通信技术股份有限公司 | Multi-channel laser output device and testing device for MPO (Maximum Power Output) optical fiber connector |
| CN105549163A (en) * | 2016-02-02 | 2016-05-04 | 武汉电信器件有限公司 | Optical interconnection assembly |
| CN106501908A (en) * | 2016-12-28 | 2017-03-15 | 华进半导体封装先导技术研发中心有限公司 | A kind of manufacture method of optical-electric module |
| CN107065085A (en) * | 2017-05-25 | 2017-08-18 | 中国科学院半导体研究所 | Photoelectric conversion device |
| CN107623248A (en) * | 2017-07-25 | 2018-01-23 | 昂纳信息技术（深圳）有限公司 | The method for packing and array laser device of a kind of array laser device |
| CN110048778A (en) * | 2019-03-19 | 2019-07-23 | 北京航天时代光电科技有限公司 | A kind of high-speed multiple channel parallel light transceiving module and test device based on BGA package |
| CN110474688A (en) * | 2019-08-16 | 2019-11-19 | 武汉光迅信息技术有限公司 | A kind of optical module |
| CN113009647A (en) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11927818B2 (en) | 2019-12-20 | 2024-03-12 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04361210A (en) * | 1991-06-10 | 1992-12-14 | Fujitsu Ltd | Connecting device for light emitting element aray of light receiving element array and optical fiber array and its mounting method |
| CN2625916Y (en) * | 2003-05-23 | 2004-07-14 | 华中科技大学 | Parallel optical fibre array coupling assembly |
| CN1704779A (en) * | 2004-06-02 | 2005-12-07 | 松下电器产业株式会社 | Non-mechanical adjustment of an optical fiber to an optical output port |
| JP2006010891A (en) * | 2004-06-24 | 2006-01-12 | Sony Corp | Optical coupler and its mounting structure |
| CN101907753A (en) * | 2009-06-03 | 2010-12-08 | 中国科学院微电子研究所 | Method for assembling multiple paths of parallel photoelectric modules |
| CN202995099U (en) * | 2012-12-31 | 2013-06-12 | 深圳市易飞扬通信技术有限公司 | Vertical-cavity surface-emitting laser 45 DEG optical fiber coupling component |
-
2013
- 2013-07-19 CN CN2013103073349A patent/CN103383483A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04361210A (en) * | 1991-06-10 | 1992-12-14 | Fujitsu Ltd | Connecting device for light emitting element aray of light receiving element array and optical fiber array and its mounting method |
| CN2625916Y (en) * | 2003-05-23 | 2004-07-14 | 华中科技大学 | Parallel optical fibre array coupling assembly |
| CN1704779A (en) * | 2004-06-02 | 2005-12-07 | 松下电器产业株式会社 | Non-mechanical adjustment of an optical fiber to an optical output port |
| JP2006010891A (en) * | 2004-06-24 | 2006-01-12 | Sony Corp | Optical coupler and its mounting structure |
| CN101907753A (en) * | 2009-06-03 | 2010-12-08 | 中国科学院微电子研究所 | Method for assembling multiple paths of parallel photoelectric modules |
| CN202995099U (en) * | 2012-12-31 | 2013-06-12 | 深圳市易飞扬通信技术有限公司 | Vertical-cavity surface-emitting laser 45 DEG optical fiber coupling component |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104767561A (en) * | 2014-01-03 | 2015-07-08 | 上海光维通信技术股份有限公司 | Multi-channel laser output device and testing device for MPO (Maximum Power Output) optical fiber connector |
| CN103984067A (en) * | 2014-06-03 | 2014-08-13 | 苏州洛合镭信光电科技有限公司 | Optical device allowing multi-channel light beam splitting to be achieved |
| CN103984067B (en) * | 2014-06-03 | 2016-08-17 | 苏州洛合镭信光电科技有限公司 | Realize the optical device of multichannel light beam splitting |
| CN104597567A (en) * | 2015-01-22 | 2015-05-06 | 中国科学院半导体研究所 | Optical switch array module and chamfered optical fiber array packaging method |
| CN104749710A (en) * | 2015-03-23 | 2015-07-01 | 华为技术有限公司 | Optical fiber and chip aimed packaging structure and optical fiber aiming method |
| CN105549163A (en) * | 2016-02-02 | 2016-05-04 | 武汉电信器件有限公司 | Optical interconnection assembly |
| CN106501908A (en) * | 2016-12-28 | 2017-03-15 | 华进半导体封装先导技术研发中心有限公司 | A kind of manufacture method of optical-electric module |
| CN107065085A (en) * | 2017-05-25 | 2017-08-18 | 中国科学院半导体研究所 | Photoelectric conversion device |
| CN107623248A (en) * | 2017-07-25 | 2018-01-23 | 昂纳信息技术（深圳）有限公司 | The method for packing and array laser device of a kind of array laser device |
| CN110048778A (en) * | 2019-03-19 | 2019-07-23 | 北京航天时代光电科技有限公司 | A kind of high-speed multiple channel parallel light transceiving module and test device based on BGA package |
| CN110474688A (en) * | 2019-08-16 | 2019-11-19 | 武汉光迅信息技术有限公司 | A kind of optical module |
| CN113009647A (en) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113009647B (en) * | 2019-12-20 | 2022-06-21 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11927818B2 (en) | 2019-12-20 | 2024-03-12 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103383483A (en) | Parallel optical emission assembly based on 45-degree fiber array and manufacturing method thereof | |
| US20210084754A1 (en) | Integrated packaged light engine and signal transmitting and receiving method thereof | |
| US10914903B2 (en) | Optical module | |
| JP4066665B2 (en) | Parallel transceiver module | |
| CN106405752B (en) | Optical element | |
| CN103257411B (en) | A kind of parallel light transceiver component for broadband high-speed transmission | |
| TW201716815A (en) | Photoelectric conversion assembly | |
| CN202837617U (en) | Parallel optical transceiving component used for broadband high speed transmission | |
| CN110048778B (en) | High-speed multichannel parallel optical transceiver module based on BGA packaging and testing device | |
| EP2242152A1 (en) | Optical module | |
| CN204028413U (en) | A kind of novel optical fiber side coupled fiber array | |
| WO2022142171A1 (en) | Mlg2.0 protocol-based single-mode optical module | |
| CN103278894A (en) | Coupling assembly, optical fiber array module using coupling assembly and optical transceiver engine module using coupling assembly | |
| CN112965183A (en) | Silicon optical module | |
| CN104049323B (en) | Optical module | |
| CN203786341U (en) | Optical module and optical communication device | |
| CN103257413B (en) | Parallel light transmit-receive component of mini serial SCSI broadband high-speed transmission | |
| TWI485455B (en) | Optoelectronic hybrid interconnect | |
| CN210347999U (en) | Multichannel optical transceiver module | |
| JP3890999B2 (en) | Optical transmission module | |
| CN203324522U (en) | Light engine micro-packaging structure used for high-speed parallel light transmitting-receiving module | |
| CN203259693U (en) | Parallel light transmission-reception assembly for broadband high-speed transmission | |
| CN102841413A (en) | Parallel optical transceiving component used for broadband high speed transmission | |
| CN102436042A (en) | Flexible-coupling high-speed photoelectric device | |
| CN203930139U (en) | The parallel light transceiver component of the broadband high-speed transmission of QFN encapsulation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 430000 Hubei city of Wuhan province East Lake hi tech Development Zone No. two Wu Da Yuan Hang domain Technology Park 2 Building 9 layer A1 Applicant after: WUHAN BOSHENG PHOTOELECTRIC TECHNOLOGY CO., LTD. Address before: 430223, Hubei, East Lake hi tech Development Zone, Wuhan hi tech Development Zone, innovation base, 16, block C, building 4 Applicant before: Wuhan Powerise Optoelectronical Technology Co., Ltd. |
|
| COR | Change of bibliographic data | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131106 |